CN102110866B - Manufacturing process of waveguide slot - Google Patents
Manufacturing process of waveguide slot Download PDFInfo
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- CN102110866B CN102110866B CN 200910189330 CN200910189330A CN102110866B CN 102110866 B CN102110866 B CN 102110866B CN 200910189330 CN200910189330 CN 200910189330 CN 200910189330 A CN200910189330 A CN 200910189330A CN 102110866 B CN102110866 B CN 102110866B
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- waveguide slot
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Abstract
The invention provides a manufacturing process of a waveguide slot, which is suitable for the manufacturing field of a PCB board. In the manufacturing process provided by the invention, a tin coating which is disposed outside the bottom of a groove is burn off by laser while a copper coating inside the bottom of the groove is not removed due to the difference between the absorption rates of tine and copper to laser and the difference between the energy requirements for burning tin and copper with laser, so that the laser can be prevented from reaching to a core plate under the copper coating; then the copper coating inside the bottom of the groove is removed by etching, a tin coating disposed outside the side wall of the groove is removed by means of a common process method, a protection player is subsequently coated on a copper coating which is disposed inside the side wall of the groove, so that a waveguide slot of which the side walls are provided with metal layers (a copper coating and a protection layer) and the bottom does not have a metal layer. According to the invention, the manufacturing is simple, a liquid photoimageable (PLI) type printing ink step of the existing technology is replaced by a laser drilling step, the cost is relatively low, the position accuracy of the laser drilling machine is high, the quality of the waveguide slot can be ensured completely, so the volume production of the product can be carried out.
Description
Technical field
The invention belongs to pcb board and make the field, relate in particular to the non-metallic waveguide slot manufacture craft in a kind of side-wall metallicization bottom.
Background technology
In the pcb board manufacturing; the groove of waveguide slot for offering at pcb board, the sidewall of waveguide slot is copper plate and protective layer (being referred to as metal level), the bottom does not have metal level; the metal level of waveguide slot sidewall is used for the signal that components and parts send on the shielding pcb board; the loss of anti-stop signal, and bottom shielded signal not guarantees the normal propagation of signal; this structure of waveguide slot; can make signal produce resonance, therefore, this waveguide slot in industry will be used widely.
In the prior art field, the manufacturing process of waveguide slot is:
(1) machined grooves on pcb board;
(2) pcb board is immersed in the electrolytic copper plating solution electroplates, sidewall and the bottom electrical of groove plate layer of copper;
(3) the LPI photosensitive-ink that will have an anti-plating evenly is coated with bottom and the sidewall that is imprinted on groove;
(4) to after the exposure of LPI photosensitive-ink, solidifying, sidewall printing ink removes and the reservation of bottom photosensitive-ink, and bottom portion of groove just has anti-plating (being that bottom portion of groove is not electroplated metal);
(5) pcb board is immersed in electroplate in the tin liquor and electroplates, the sidewall of groove is electroplated last layer tin, because the bottom of groove has anti-plating, tin is electroplated not Shang in the bottom, remains photosensitive-ink bottom namely;
(6) remove the photosensitive-ink of bottom portion of groove with alkaline solution;
(7) remove the copper plate of bottom portion of groove with another kind of alkaline solution etching;
(8) with nitric acid or the outer field tin coating of nitric acid series solution removal sidewall;
(9) recess sidewall is carried out surface treatment, make recess sidewall be covered with protective layer.
Like this, just having made sidewall is that copper, bottom are nonmetallic waveguide slot.
By above description as can be known, the waveguide slot manufacture craft adopts LPI liquid photosensitive type printing ink, but manufacturing process complexity, be coated with seal, exposure, development, curing and the bottom land printing ink that relate to printing ink are removed, because printing ink is coated with and is imprinted in the groove, the exposure characteristics that adds Exposing Lamp is limit, and film figure shifts and very bad control is solidified in the printing ink exposure, so quality can not guarantee.
Summary of the invention
The object of the present invention is to provide and a kind ofly make simple, the waveguide slot manufacture craft that can guaranteed quality of flow process, thereby can realize the batch process of waveguide slot.
The present invention is achieved in that a kind of waveguide slot manufacture craft, the groove of described waveguide slot for offering at pcb board; the sidewall of described groove is metal level; the no metal level in bottom, described metal level is copper plate and protective layer, described waveguide slot manufacture craft comprises the steps:
(1) machined grooves on pcb board;
(2) pcb board is immersed in the electrolytic copper plating solution electroplates, make the sidewall of groove and bottom be covered with copper plate;
(3) pcb board is immersed in to electroplate in the tin liquor again and electroplates, make the sidewall of groove and bottom be covered with tin coating again;
(4) adopt laser drill, make the laser energy of laser drill generation 2～300mj, the outer field tin coating of burning-off bottom portion of groove, the copper plate of reservation bottom portion of groove internal layer;
(5) adopt the alkaline solution etching to remove the copper plate of bottom portion of groove internal layer;
(6) adopt acid solution to remove the tin coating of recess sidewall;
(7) copper plate to recess sidewall carries out surface treatment, makes copper plate be covered with protective layer.
Particularly, in the step (4), described laser drill adopts CO2 infrared laser or UV Ultra-Violet Laser.
Preferably, in the step (4), the laser energy of described laser drill is 5～10mj.
Preferably, in the step (5), described alkaline solution is the solution that contains ammonium chloride, ammoniacal liquor and copper ion.
Preferably, in the step (6), described acid solution is salpeter solution.
Preferably, in the step (7), adopt chemical nickel and gold technology or chemical silver process, make recess sidewall be covered with protective layer.
Particularly, the thickness of the copper plate of described step (2) is more than the 18um.
Particularly, the thickness of the tin coating of described step (3) is 5um～10um.
Particularly, described pcb board is superposeed successively by central layer and prepreg and makes.
It is different that the present invention utilizes laser to burn the tin energy required with burning copper; adopt the outer field tin coating of laser burning-off bottom portion of groove; adopt the alkaline solution etching to remove the copper plate of bottom portion of groove internal layer afterwards; and then remove the outer field tin coating of sidewall with conventional method; next the copper plate at the recess sidewall internal layer is covered with protective layer, is the waveguide slot that copper plate and protective layer, bottom do not have metal level thereby make sidewall.Compared with prior art, it is simple that the present invention makes flow process, adopts laser driller order to replace LPI liquid photosensitive type printing ink operation of the prior art, cost is relatively low, and the positioning accuracy height of laser drill, the quality of waveguide slot can be guaranteed fully, thereby the batch process of product can be realized.
Description of drawings
Fig. 1 is that the sidewall of the waveguide slot that provides of the embodiment of the invention and bottom internal layer are copper plate, outerly are the schematic diagram of tin coating;
Fig. 2 is tin coating is removed in the bottom of the waveguide slot among Fig. 1 with laser drill schematic diagram;
Fig. 3 is the etched schematic diagram of copper plate of the bottom of the waveguide slot among Fig. 2;
Fig. 4 is the schematic diagram after the tin coating of the sidewall of the waveguide slot among Fig. 3 is removed.
Embodiment
In order to make purpose of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explaining the present invention, and be not used in restriction the present invention.
Shown in Fig. 1～4; a kind of waveguide slot manufacture craft that the embodiment of the invention provides; the groove 1 of described waveguide slot for offering at pcb board 2; the sidewall of described groove 1 is copper plate 11 and protective layer (not shown); the no metal level in bottom; described pcb board 2 is superposeed successively by central layer 21 and prepreg 22 and makes, and its manufacture craft comprises the steps:
(1) machined grooves 1 on pcb board 2, the processing technology of this groove 1 is existing very ripe technology, specific process is: mill the ability of (or gong) and the thickness of precision and central layer 21 and prepreg 22 deeply according to control, to wherein one deck or two layers of central layer 21 and prepreg 22 flutings, simultaneously, the size of the thickness of Kai Cao central layer 21 and prepreg 22 and fluting is made groove internal gasket (not shown) on demand, other are by normal flow processing, set type by stepped construction, pad is put into groove, and the pairing stack is back carries out pressing to pcb board, after mistake is milled the limit, do the sharp processing control and mill deeply, mill out required groove 1;
(2) pcb board 2 is immersed in the electrolytic copper plating solution electroplates, make the sidewall of groove 1 and bottom be covered with copper plate 11, electrolytic copper plating solution is to contain copper sulphate (CuSO
45H
2O), sulfuric acid (H
2SO
4), the aqueous solution of chloride ion (Cl+) and brightener, carry out direct current electrode position, copper ball is as anode, pcb board 2 is as negative electrode, by impressed current generation ion-exchange reactions, thereby make the sidewall of groove 1 and bottom electrical plate layer of even copper, thickness can be set, and the thickness of copper plate 11 is generally more than 18um;
(3) pcb board 2 is immersed in to electroplate in the tin liquor again and electroplates, make the sidewall of groove 1 and bottom be covered with tin coating 12 again, like this, just formed double layer of metal in sidewall and the bottom of groove 1, internal layer be copper plate 11, outer be tin coating 12 (as shown in Figure 1); Electroplating tin liquor is to contain STANNOUS SULPHATE CRYSTALLINE (SnSO
4), sulfuric acid (H
2SO
4), the aqueous solution of brightener and dispersant, carry out direct current electrode position, the tin ball is as anode, pcb board 2 is as negative electrode, by impressed current generation ion-exchange reactions, thereby make the sidewall of groove 1 and bottom electrical plate layer of even tin, the thickness of tin coating 12 is generally at 5um～10um;
(4) the laser drill (not shown) that adopts the PCB industry to use, make laser brill program (being the laser drilling) according to the location hole of laser brill and position and the size of groove 1, the energy parameter of laser drill is set to 2～300mj, the preferential laser energy of recommending to adopt 5～10mj, laser facula (or light beam) improves laser by the higher value setting of laser drill and bores efficient, number of pulses is below 5, other parameters are set by the conventional parameter that laser bores, the tin coating 12 of burning-off groove 1 bottom exterior layer, because tin is different to the absorptivity of laser with copper, and laser burns tin and laser, and to burn the required energy of copper different, laser is the tin coating 12 of burning-off groove 1 bottom exterior layer fully, and the copper plate 11 of groove 1 bottom internal layer all or part of existence (as shown in Figure 2) still, thereby can stop laser to get into central layer 21 under the copper plate 11, protection pcb board 2 is not destroyed;
(5) adopt existing alkaline solution etching to remove the copper plate 11 of groove 1 bottom internal layer, in this area, the general employing of this alkaline solution contains ammonium chloride (NH
4Cl), ammoniacal liquor (NH
3.H
2O) and the solution of copper ion (Cu2+), because groove 1 sidewall skin is tin coating 12, tin coating 12 has the ability of alkali resistance solution corrosion, therefore, in alkaline etching liquid, the outer field tin coating 12 of groove 1 sidewall is not corroded (as shown in Figure 3), and the outer tin coating 12 of groove 1 sidewall can be protected the copper plate 11 of its internal layer;
(6) adopt existing acid solution to remove the outer field tin coating 12 of groove 1 sidewall, in this area, this acid solution often adopts nitric acid or nitric acid series solution, in the process that adopts these solution removal tin coatings 12, add oxidant and stabilizer simultaneously, oxidant is used for accelerating detin speed, and stabilizer can suppress copper plate 11 reactions of nitric acid and groove 1 sidewall;
(7) copper plate 11 to groove 1 sidewall carries out surface treatment; make the copper plate 11 of groove 1 sidewall be covered with protective layer; this protective layer can prevent copper plate 11 oxidation in air of groove 1 sidewall; this process of surface treatment is existing conventional technology; general this area common chemical nickel gold process that adopts (namely adopts chemical reaction to plate one deck nickel at the copper plate 11 of groove 1 sidewall earlier; and then at nickel dam deposition one deck gold); chemical tin technology (adopting chemical reaction at copper plate 11 deposition one deck tin of groove 1 sidewall) or chemical silver process (adopting chemical reaction at copper plate 11 deposition one deck silver of groove 1 sidewall), etc.
Like this, just having made sidewall is the waveguide slot (as shown in Figure 4) that metal level (copper plate 11 and protective layer), bottom do not have metal level.
The above only is preferred embodiment of the present invention, not in order to limiting the present invention, all any modifications of doing within the spirit and principles in the present invention, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (9)
1. waveguide slot manufacture craft; the groove of described waveguide slot for offering at pcb board, the sidewall of described groove is metal level, the bottom does not have metal level; described metal level is copper plate and protective layer, it is characterized in that: described waveguide slot manufacture craft comprises the steps:
(1) machined grooves on pcb board;
(2) pcb board is immersed in the electrolytic copper plating solution electroplates, make the sidewall of groove and bottom be covered with copper plate;
(3) pcb board is immersed in to electroplate in the tin liquor again and electroplates, make the sidewall of groove and bottom be covered with tin coating again;
(4) adopt laser drill, make the laser energy of laser drill generation 2～300mj, the outer field tin coating of burning-off bottom portion of groove, the copper plate of reservation bottom portion of groove internal layer;
(5) adopt the alkaline solution etching to remove the copper plate of bottom portion of groove internal layer;
(6) adopt acid solution to remove the tin coating of recess sidewall;
(7) copper plate to recess sidewall carries out surface treatment, makes copper plate be covered with protective layer.
2. waveguide slot manufacture craft as claimed in claim 1 is characterized in that: in the step (4), described laser drill adopts CO2 infrared laser or UV Ultra-Violet Laser.
3. waveguide slot manufacture craft as claimed in claim 1 or 2, it is characterized in that: in the step (4), the laser energy of described laser drill is 5～10mj.
4. waveguide slot manufacture craft as claimed in claim 1, it is characterized in that: in the step (5), described alkaline solution is the solution that contains ammonium chloride, ammoniacal liquor and copper ion.
5. waveguide slot manufacture craft as claimed in claim 1, it is characterized in that: in the step (6), described acid solution is salpeter solution.
6. waveguide slot manufacture craft as claimed in claim 1 is characterized in that: in the step (7), adopt chemical nickel and gold technology or chemical silver process, make recess sidewall be covered with protective layer.
7. waveguide slot manufacture craft as claimed in claim 1, it is characterized in that: the thickness of the copper plate of described step (2) is more than the 18um.
8. waveguide slot manufacture craft as claimed in claim 1, it is characterized in that: the thickness of the tin coating of described step (3) is 5um～10um.
9. waveguide slot manufacture craft as claimed in claim 1, it is characterized in that: described pcb board is superposeed successively by central layer and prepreg and makes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910189330 CN102110866B (en) | 2009-12-24 | 2009-12-24 | Manufacturing process of waveguide slot |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910189330 CN102110866B (en) | 2009-12-24 | 2009-12-24 | Manufacturing process of waveguide slot |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102110866A CN102110866A (en) | 2011-06-29 |
| CN102110866B true CN102110866B (en) | 2013-08-28 |
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|---|---|---|---|
| CN 200910189330 Active CN102110866B (en) | 2009-12-24 | 2009-12-24 | Manufacturing process of waveguide slot |
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| CN (1) | CN102110866B (en) |
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| CN102361539A (en) * | 2011-10-18 | 2012-02-22 | 沪士电子股份有限公司 | Method for manufacturing groove-type printed wiring board |
| CN102548225B (en) * | 2012-02-13 | 2015-03-25 | 东莞森玛仕格里菲电路有限公司 | Manufacturing method for printed circuit board (PCB) |
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| CN105764237B (en) * | 2015-06-25 | 2019-03-05 | 生益电子股份有限公司 | A kind of production method and PCB of stepped groove PCB |
| US10944148B2 (en) * | 2016-02-04 | 2021-03-09 | Advantest Corporation | Plating methods for modular and/or ganged waveguides for automatic test equipment for semiconductor testing |
| CN107454759A (en) * | 2016-06-01 | 2017-12-08 | 北大方正集团有限公司 | The preparation method of waveguide slot |
| CN107770958B (en) * | 2016-08-17 | 2019-12-24 | 北大方正集团有限公司 | Waveguide groove of PCB (printed Circuit Board) and manufacturing method of waveguide groove of PCB |
| CN106739589B (en) * | 2016-12-27 | 2019-09-17 | 大族激光科技产业集团股份有限公司 | Printing and processing method |
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| CN107484361A (en) * | 2017-09-25 | 2017-12-15 | 生益电子股份有限公司 | The preparation method and High-Speed PCB of a kind of High-Speed PCB |
| CN107949176A (en) * | 2017-11-28 | 2018-04-20 | 东莞市鸿膜电子材料有限公司 | A kind of processing method of circuit board pattern transfer |
| CN108303767B (en) * | 2018-02-09 | 2019-12-31 | 苏州德睿电力科技有限公司 | Method for preparing concave mirror on optical waveguide |
| CN108401370A (en) * | 2018-03-06 | 2018-08-14 | 深圳市五株科技股份有限公司 | A kind of processing method of metal blind slot |
| CN113133215A (en) * | 2021-04-14 | 2021-07-16 | 深圳市深联电路有限公司 | PCB circuit forming method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1490857A (en) * | 2002-10-18 | 2004-04-21 | 景硕科技股份有限公司 | Structure of micro distance crystal covered carrier-board and manufacture thereof |
| CN1668167A (en) * | 2000-02-28 | 2005-09-14 | Stsatl公司 | A method of manufacturing an electronic component and electronic component thereof |
| CN101316025A (en) * | 2007-05-31 | 2008-12-03 | 中国科学院半导体研究所 | Production method for optical fiber coupling module of glow AlGaInP semiconductor laser |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ATE277207T1 (en) * | 2001-10-11 | 2004-10-15 | Franz Oberflaechentechnik Gmbh | COATING PROCESS FOR LIGHT METAL ALLOY SURFACES |
| WO2007058603A1 (en) * | 2005-11-18 | 2007-05-24 | Replisaurus Technologies Ab | Method of forming a multilayer structure |
-
2009
- 2009-12-24 CN CN 200910189330 patent/CN102110866B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1668167A (en) * | 2000-02-28 | 2005-09-14 | Stsatl公司 | A method of manufacturing an electronic component and electronic component thereof |
| CN1490857A (en) * | 2002-10-18 | 2004-04-21 | 景硕科技股份有限公司 | Structure of micro distance crystal covered carrier-board and manufacture thereof |
| CN101316025A (en) * | 2007-05-31 | 2008-12-03 | 中国科学院半导体研究所 | Production method for optical fiber coupling module of glow AlGaInP semiconductor laser |
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|---|---|
| CN102110866A (en) | 2011-06-29 |
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Owner name: SHENNAN CIRCUIT CO., LTD. Free format text: FORMER NAME: SHENZHEN SHENNAN CIRCUITS CO., LTD. |
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Address after: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |