CN108401370A - A kind of processing method of metal blind slot - Google Patents
A kind of processing method of metal blind slot Download PDFInfo
- Publication number
- CN108401370A CN108401370A CN201810184817.7A CN201810184817A CN108401370A CN 108401370 A CN108401370 A CN 108401370A CN 201810184817 A CN201810184817 A CN 201810184817A CN 108401370 A CN108401370 A CN 108401370A
- Authority
- CN
- China
- Prior art keywords
- blind slot
- slot
- metal
- blind
- processing method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The embodiment of the invention discloses a kind of processing method of metal blind slot, blind slot can only be processed as internal all-metal or non-metallic technical problem by the processing method for solving the prior art.The blind slot of default specification is processed on plate the embodiment of the present invention includes S1, by process equipment；S2, metalized is carried out to blind slot, the cell wall of blind slot and slot bottom is metallized；S3, electroplating processes are carried out to the cell wall and slot bottom of blind slot, tin layers is plated in the layer on surface of metal of cell wall and slot bottom；S4, ablation is carried out to the tin layers on the slot bottom layer on surface of metal of blind slot with laser, removes tin layers；S5, the slot bottom layer on surface of metal of the blind slot after ablation is subjected to alkali etching, metal layer is removed.Tin layers are fallen using UV laser ablations in the present embodiment, expose the layers of copper of slot bottom.After alkali etching, the copper of eating away blind slot slot bottom, the production method for realizing special blind slot.
Description
Technical field
The present invention relates to product processing technique field more particularly to a kind of metal blind slot processing methods.
Background technology
According to current production technology, make blind slot there are two types of mode, one is before heavy copper first gong go out blind slot, then again
It carries out heavy process for copper to handle, blind slot at this time, on slot bottom and cell wall, can plate last layer copper.Another kind be after heavy copper again
Gong goes out blind slot, due to not handled by heavy process for copper, blind slot at this time, on slot bottom and cell wall, without copper.
If fruit according to above-mentioned technique, can only just produce the blind slot of all-metal or nonmetallic blind slot, can not
The existing metal of production department has nonmetallic blind slot again.
Therefore, a kind of important topic that the processing method of particulate metal blind slot is studied as this technology personnel is found.
Invention content
The embodiment of the invention discloses a kind of processing methods of metal blind slot, for solving the processing method of the prior art only
Blind slot can be processed as to internal all-metal or non-metallic technical problem.
An embodiment of the present invention provides a kind of processing methods of metal blind slot, including：
S1, the blind slot for processing default specification on plate by process equipment；
S2, metalized is carried out to blind slot, the cell wall of blind slot and slot bottom is metallized；
S3, electroplating processes are carried out to the cell wall and slot bottom of blind slot, tin layers is plated in the layer on surface of metal of cell wall and slot bottom；
S4, ablation is carried out to the tin layers on the slot bottom layer on surface of metal of blind slot with laser, removes tin layers；
S5, the slot bottom layer on surface of metal of the blind slot after ablation is subjected to alkali etching, metal layer is removed.
Optionally, the step S1 is specifically included：
The blind slot of default specification is processed on plate by gong bed.
Optionally, the step S2 is specifically included：
Blind slot is subjected to copper-coating, by the cell wall of blind slot and the upper layers of copper of slot bottom covering.
Optionally, the plating mode in the step S3 is graphic plating.
Optionally, the step S4 is specifically included：
Ablation is carried out according to preset track to the tin layers on the layers of copper surface of slot bottom using UV laser drills.
Optionally, the desired guiding trajectory is annular trace.
Optionally, the step S5 is specifically included：
The slot bottom layers of copper surface of blind slot after ablation is etched by ammonium hydroxide, layers of copper is removed.
As can be seen from the above technical solutions, the embodiment of the present invention has the following advantages：
Include S1 an embodiment of the present invention provides a kind of processing method of metal blind slot, added on plate by process equipment
Work goes out the blind slot of default specification；S2, metalized is carried out to blind slot, the cell wall of blind slot and slot bottom is metallized；S3, to blind slot
Cell wall and slot bottom carry out electroplating processes, plate tin layers in the layer on surface of metal of cell wall and slot bottom；S4, with laser to blind slot
Tin layers on slot bottom layer on surface of metal carry out ablation, remove tin layers；S5, the slot bottom layer on surface of metal by the blind slot after ablation
Alkali etching is carried out, metal layer is removed.Tin layers are fallen using UV laser ablations in the present embodiment, expose the layers of copper of slot bottom.It passes through again
After parlkaline etching, it is different to meet each user in market for the copper of eating away blind slot slot bottom, the production method for realizing special blind slot
Demand.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention without having to pay creative labor, may be used also for those of ordinary skill in the art
To obtain other attached drawings according to these attached drawings.
Fig. 1 is a kind of flow diagram of the processing method of the metal blind slot provided in the embodiment of the present invention；
Fig. 2 is a kind of concrete structure schematic diagram of the metal blind slot provided in the embodiment of the present invention；
Fig. 3 is the desired trajectory signal of the ablation in a kind of processing method of the metal blind slot provided in the embodiment of the present invention
Figure；
It illustrates：Cell wall 1；Slot bottom 2.
Specific implementation mode
The embodiment of the invention discloses a kind of processing methods of metal blind slot, for solving the processing method of the prior art only
Blind slot can be processed as to internal all-metal or non-metallic technical problem.
In order to enable those skilled in the art to better understand the solution of the present invention, with reference to the accompanying drawings and detailed description
The present invention is described in further detail.Obviously, described embodiments are only a part of the embodiments of the present invention, rather than
Whole embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Lower obtained every other embodiment, shall fall within the protection scope of the present invention.
Referring to Fig. 1, a kind of one embodiment of the processing method of the metal blind slot provided in the embodiment of the present invention includes：
Step S1, the blind slot of default specification is processed on plate by process equipment；
It should be noted that gong goes out the blind slot of default specification on plate using gong bed, the shape of blind slot can refer to Fig. 2；
Moreover, also needing to polish to it after blind slot molding, deburring promotes the whole smoothness of the blind slot, is also next
Process is ready.
Step S2, metalized is carried out to blind slot, the cell wall 1 of blind slot is metallized with slot bottom 2；
It should be noted that carry out metalized to blind slot specifically carries out copper-coating, by blind slot by blind slot
Cell wall 1 and the upper layers of copper of the covering of slot bottom 2；Wherein, copper-coating refers to electroless copper, needs to locate blind slot in advance before heavy copper
Reason, pretreatment include deburring, degrease, three steps such as roughening treatment.
Step S3, electroplating processes are carried out to the cell wall of blind slot 1 and slot bottom 2, is plated in the metal surface of cell wall 1 and slot bottom 2
Upper tin layers；
It should be noted that the inside of blind slot is electroplated by the way of graphic plating in the present embodiment, in blind slot
Cell wall 1 and slot bottom 2 plate last layer tin layers, for protecting the layers of copper in above-mentioned steps.
Step S4, ablation is carried out to the tin layers on 2 metal surface of slot bottom of blind slot with laser, removes tin layers；
It should be noted that using UV laser drills to the tin layers on the layers of copper surface of slot bottom 2 according to preset photograph
It penetrates track and carries out ablation, the tin layers on slot bottom 2 are all got rid of, expose the layers of copper at blind slot bottom 2；And cell wall 1 due to not by
To the ablation of UV laser, the tin layers on cell wall 1 are not damaged.
Further, it referring to Fig. 3, above-mentioned UV laser irradiations track is annular trace, can use up in this way
Possibly tin layers are got rid of.
Step S5,2 layer on surface of metal of slot bottom of the blind slot after ablation is subjected to alkali etching, metal layer is removed.
It should be noted that after blind slot carries out ablation by UV laser, expose the layers of copper of slot bottom 2, ammonium hydroxide is recycled to go to copper
Layer is etched, and layers of copper is removed, you can obtain nonmetallic slot bottom 2.
In the present embodiment, tin layers are fallen using UV laser ablations, expose the layers of copper of slot bottom 2.After alkali etching, eating away
The copper of blind slot slot bottom 2, the production method for realizing special blind slot meet the different demand of each user in market.
A kind of processing method of metal blind slot provided by the present invention is described in detail above, for this field
Those skilled in the art, the thought of embodiment according to the present invention, there will be changes in the specific implementation manner and application range,
In conclusion the content of the present specification should not be construed as limiting the invention.
Claims (7)
1. a kind of processing method of metal blind slot, which is characterized in that including：
S1, the blind slot for processing default specification on plate by process equipment；
S2, metalized is carried out to blind slot, the cell wall of blind slot and slot bottom is metallized；
S3, electroplating processes are carried out to the cell wall and slot bottom of blind slot, tin layers is plated in the layer on surface of metal of cell wall and slot bottom；
S4, ablation is carried out to the tin layers on the slot bottom layer on surface of metal of blind slot with laser, removes tin layers；
S5, the slot bottom layer on surface of metal of the blind slot after ablation is subjected to alkali etching, metal layer is removed.
2. the processing method of metal blind slot according to claim 1, which is characterized in that the step S1 is specifically included：
The blind slot of default specification is processed on plate by gong bed.
3. the processing method of metal blind slot according to claim 1, which is characterized in that the step S2 is specifically included：
Blind slot is subjected to copper-coating, by the cell wall of blind slot and the upper layers of copper of slot bottom covering.
4. the processing method of metal blind slot according to claim 1, which is characterized in that the plating mode in the step S3
For graphic plating.
5. the processing method of metal blind slot according to claim 3, which is characterized in that the step S4 is specifically included：
Ablation is carried out according to preset track to the tin layers on the layers of copper surface of slot bottom using UV laser drills.
6. the processing method of metal blind slot according to claim 5, which is characterized in that the desired guiding trajectory is circular rails
Mark.
7. the processing method of metal blind slot according to claim 5, which is characterized in that the step S5 is specifically included：
The slot bottom layers of copper surface of blind slot after ablation is etched by ammonium hydroxide, layers of copper is removed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810184817.7A CN108401370A (en) | 2018-03-06 | 2018-03-06 | A kind of processing method of metal blind slot |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810184817.7A CN108401370A (en) | 2018-03-06 | 2018-03-06 | A kind of processing method of metal blind slot |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108401370A true CN108401370A (en) | 2018-08-14 |
Family
ID=63091988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810184817.7A Pending CN108401370A (en) | 2018-03-06 | 2018-03-06 | A kind of processing method of metal blind slot |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108401370A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113507783A (en) * | 2021-07-06 | 2021-10-15 | 珠海市深联电路有限公司 | High aspect ratio metallized blind hole or blind groove, manufacturing method, circuit board and client |
| CN114340227A (en) * | 2022-01-10 | 2022-04-12 | 江西福昌发电路科技有限公司 | Laser blind slot process of multilayer circuit board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100049842A (en) * | 2008-11-04 | 2010-05-13 | 삼성전기주식회사 | Method of manufacturing printed circuit board |
| CN102110866A (en) * | 2009-12-24 | 2011-06-29 | 深南电路有限公司 | Manufacturing process of waveguide slot |
-
2018
- 2018-03-06 CN CN201810184817.7A patent/CN108401370A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100049842A (en) * | 2008-11-04 | 2010-05-13 | 삼성전기주식회사 | Method of manufacturing printed circuit board |
| CN102110866A (en) * | 2009-12-24 | 2011-06-29 | 深南电路有限公司 | Manufacturing process of waveguide slot |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113507783A (en) * | 2021-07-06 | 2021-10-15 | 珠海市深联电路有限公司 | High aspect ratio metallized blind hole or blind groove, manufacturing method, circuit board and client |
| CN114340227A (en) * | 2022-01-10 | 2022-04-12 | 江西福昌发电路科技有限公司 | Laser blind slot process of multilayer circuit board |
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Application publication date: 20180814 |