Nothing Special   »   [go: up one dir, main page]

CN101556034B - Light source device - Google Patents

Light source device Download PDF

Info

Publication number
CN101556034B
CN101556034B CN2008103008705A CN200810300870A CN101556034B CN 101556034 B CN101556034 B CN 101556034B CN 2008103008705 A CN2008103008705 A CN 2008103008705A CN 200810300870 A CN200810300870 A CN 200810300870A CN 101556034 B CN101556034 B CN 101556034B
Authority
CN
China
Prior art keywords
light
electrode
supply apparatus
storage tank
light supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008103008705A
Other languages
Chinese (zh)
Other versions
CN101556034A (en
Inventor
张忠民
徐智鹏
王君伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhanjing Technology Shenzhen Co Ltd
Advanced Optoelectronic Technology Inc
Original Assignee
ADVANCED DEVELOPMENT PHOTOELECTRIC Co Ltd
Zhanjing Technology Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ADVANCED DEVELOPMENT PHOTOELECTRIC Co Ltd, Zhanjing Technology Shenzhen Co Ltd filed Critical ADVANCED DEVELOPMENT PHOTOELECTRIC Co Ltd
Priority to CN2008103008705A priority Critical patent/CN101556034B/en
Priority to US12/419,407 priority patent/US8067782B2/en
Publication of CN101556034A publication Critical patent/CN101556034A/en
Application granted granted Critical
Publication of CN101556034B publication Critical patent/CN101556034B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases

Landscapes

  • Led Device Packages (AREA)
  • Planar Illumination Modules (AREA)

Abstract

The invention relates to a light source device, which comprises an insulator, a heat conductor, a first plate electrode, a second plate electrode, a light-emitting diode chip and metal wires. The insulator is provided with an accommodation groove; the heat conductor is arranged in the insulator, is opposite to the accommodation groove, and is provided with a bearing part exposed at the bottom of the accommodation groove; the first plate electrode and the second plate electrode are embedded in the insulator respectively and extend into the accommodation groove, and are separated from the heat conductor; the light-emitting diode chip is directly arranged on the bearing part of the heat conductor; and the first plate electrode and the second plate electrode are electrically connected with thelight-emitting diode chip through the metal wires.

Description

Light supply apparatus
Technical field
The present invention relates to a kind of light supply apparatus, particularly a kind of light supply apparatus with solid-state light emitting elements such as light-emitting diode chip for backlight unit.
Background technology
Now, light emitting diode (Light Emitting Diode, LED) a lot of fields have been widely applied to, at this, a kind of novel light-emitting diode can be referring to people such as Daniel A.Steigerwald at document IEEE Journal on SelectedTopics in Quantum Electronics, Vol.8, No.2, IlluminationWith Solid State Lighting Technology one literary composition among the March/April 2002.Light emitting diode generally can send the light of specific wavelength, visible light for example, but the major part of light emitting diode institute received energy is converted into heat, and the energy of remainder is a luminous energy by true translation.Therefore, the heat that lumination of light emitting diode produced must be evacuated to guarantee the normal operation of light emitting diode.
As shown in Figure 1, a kind of light supply apparatus 10, it comprises 11, one light source modules 12 of a housing and a lampshade 13.This light source module 12 is arranged in this housing 11, and this lampshade 13 is arranged on the top of this light source module 12 to protect this light source module 12.This light source module 12 comprises: a printed circuit board (PCB) (Printed Circuit Board, PCB) 121, be arranged on a metallic circuit layer 122 and a plurality of light-emitting components 123 on this printed circuit board (PCB) 121 (as, and the packaging body 124 that covers this light-emitting component 123 light-emitting diode chip for backlight unit).These a plurality of light-emitting components 123 electrically connect with this metallic circuit layer 122.Yet the heat that these a plurality of light-emitting components 123 are produced can not be got rid of from this housing 11 timely and effectively, and then has reduced the luminous efficiency of these a plurality of light-emitting components 123.This shows, the light supply apparatus that provides a kind of radiating efficiency higher is provided.
Summary of the invention
Below will the light supply apparatus that a kind of radiating efficiency is higher be described with embodiment.
A kind of light supply apparatus with light-emitting diode chip for backlight unit, it comprises: an insulator, this insulator has a storage tank; A heat carrier, it is arranged in this insulator and is relative with this storage tank, and this heat carrier has a supporting part that is exposed to this storage tank bottom; Tabular first electrode and tabular second electrode, this first electrode and second electrode are embedded respectively in this insulator and all extend in this storage tank, and are separated with this heat carrier; A light-emitting diode chip for backlight unit, it is set directly on the supporting part of this heat carrier; And metal wire, this first electrode and second electrode form with this light-emitting diode chip for backlight unit by this metal wire respectively and are electrically connected.
Compared with prior art, light-emitting diode chip for backlight unit in this light supply apparatus is set directly on the supporting part of heat carrier and with heat carrier and forms good thermally coupled, so the heat that produces when light-emitting diode chip for backlight unit is luminous can be directly conducted to heat carrier, by heat carrier the heat that absorbs is conducted to extraneous air again, thereby reduced the temperature of light-emitting diode chip for backlight unit, improved the radiating efficiency of light supply apparatus, and the luminous efficiency of light-emitting diode chip for backlight unit and service life.In addition, this first electrode and second electrode are embedded respectively in this insulator and all extend in this storage tank, make the external circuit with this light supply apparatus electric connection be positioned at the top of this light supply apparatus; Light-emitting diode chip for backlight unit with its below hot connection of heat carrier, make the heat conduction of this light supply apparatus be directed downwards, thereby effectively avoided external circuit, and then reduced the thermal resistance of this light supply apparatus, improved its heat dissipation.
Description of drawings
Fig. 1 is a kind of schematic cross-section of existing light supply apparatus.
The schematic top plan view of the light supply apparatus that Fig. 2 provides for first embodiment of the invention.
Fig. 3 is along the schematic cross-section of III-III in the light supply apparatus shown in Figure 2.
Fig. 4 has the schematic cross-section of through hole for the bottom of the heat carrier of light supply apparatus shown in Figure 2.
Fig. 5 is the schematic cross-section that the heat carrier of light supply apparatus shown in Figure 2 has rectangular structure.
The schematic top plan view of the light supply apparatus that Fig. 6 provides for second embodiment of the invention.
Fig. 7 is along the schematic cross-section of VII-VII in the light supply apparatus shown in Figure 6.
The schematic cross-section of the light supply apparatus that Fig. 8 provides for third embodiment of the invention.
The schematic cross-sectional exploded view of the light supply apparatus that Fig. 9 provides for fourth embodiment of the invention.
The specific embodiment
The present invention is described in further detail below in conjunction with accompanying drawing.
See also Fig. 2 and Fig. 3, a kind of light supply apparatus 20 that first embodiment of the invention provides, it comprises insulator 21, heat carrier 22, the first electrodes 23, the second electrodes 24, light-emitting diode chip for backlight unit 25, and metal wire 26.
Insulator 21 comprises a support portion 210 and one and these support portion 210 integrated light-reflecting portion 212.This light-reflecting portion 212 is positioned at a side of this support portion 210, and in the present embodiment, light-reflecting portion 212 is positioned at the top of support portion 210.This light-reflecting portion 212 has a storage tank 2120, and the bottom of this storage tank 2120 extends to this support portion 210, and promptly this support portion 210 and this storage tank 2120 relative parts are exposed to the bottom of this storage tank 2120.This storage tank 2120 has a conical side wall 2102, on this conical side wall 2102 reflecting layer 2104 can be set.Insulator 21 material therefors can be plastics, and for example poly-terephthalate p-phenylenediamine (PPD) (Polyphthalamide, PPA), liquid crystal polymer (Liquid crystal polymer, LCP) etc.
Heat carrier 22 is embedded in the support portion 210 of insulator 21 and relative with this storage tank 2120 along the direction near this light-reflecting portion 212.Heat carrier 22 has a supporting part 220 and a bottom 221 relative with this supporting part 220 that is exposed to these storage tank 2120 bottoms, and this supporting part 220 is in order to carry this light-emitting diode chip for backlight unit 25.In the present embodiment, the width d of this supporting part 220 is less than the width D of this bottom 221.Heat carrier 22 material therefors can be the metal that copper, aluminium etc. have better heat conductivility, or conduction materials such as silica gel, pottery.
First electrode 23 and second electrode 24 are tabular, be that the two does not all have the bending place, thereby make it do the time spent and can not cause situation generations such as fracture more greatly being subjected to big external force, improved the reliability of first electrode 23 and second electrode 24 by himself STRESS VARIATION.One end of one end of first electrode 23 and second electrode 24 is embedded in the junction of the support portion 210 of this insulator 21 and light-reflecting portion 212 respectively and all extends in this storage tank 2120, and has the part that is exposed to these storage tank 2120 bottoms respectively.The other end of the other end of first electrode 23 and second electrode 24 all extends this storage tank 2120, in order to link to each other with external circuit (figure does not show).First electrode 23 and second electrode 24 all with heat carrier 22 electric insulations.In addition, first electrode 23 and second electrode 24 are separately positioned on the left and right sides of this light-emitting diode chip for backlight unit 25, at this, this light-emitting diode chip for backlight unit 25 forms with the part that is exposed to these storage tank 2120 bottoms of first electrode 23 and second electrode 24 respectively by two metal line 26 and is electrically connected.
Light-emitting diode chip for backlight unit 25 is arranged on the supporting part 220 of heat carrier 22, can form thermally coupled by bonding mode and heat carrier 22 at this light-emitting diode chip for backlight unit 25, for example between the supporting part 220 of light-emitting diode chip for backlight unit 25 and heat carrier 22, be provided with viscose glues such as elargol, conducting resinl.Be understandable that light-emitting diode chip for backlight unit 25 also can form thermally coupled, for example eutectic mode (Eutectic Bonding) by other modes and heat carrier 22.The light that light-emitting diode chip for backlight unit 25 sends penetrates via the opening of this storage tank 2120, the light that is incident on the sidewall 2102 of this storage tank 2120 can penetrate via 2104 reflections of the reflecting layer on this sidewall 2102 and from the opening of this storage tank 2120, thereby has improved the light extraction efficiency of light-emitting diode chip for backlight unit 25.
Light supply apparatus 20 also comprises a packaging body 27, and packaging body 27 is arranged in the storage tank 2120 of insulator 21 in order to covering luminousing diode chip 25 and metal wire 26, and is oxidized to avoid light-emitting diode chip for backlight unit 25 to contact with aqueous vapor with metal wire 26.The outer surface 270 of packaging body 27 can be convex surface or concave curved surface, changing light that light-emitting diode chip for backlight unit 25 the sends angle via outer surface 270 outgoing, thereby can change the range of exposures of light supply apparatus 20.Also can be provided with light wavelength conversion material, for example fluorescent material in the packaging body 27.If be doped with yellow fluorescent powder in the packaging body 27, the blue light that light-emitting diode chip for backlight unit 25 sends has the part blue light to be converted into gold-tinted during via packaging body 27 outgoing, the blue light that is not converted with will form white light after the gold-tinted that is converted to combines.Packaging body 27 material therefors are the transparent material of epoxy resin, silicones or other electric insulations.
In the present embodiment, heat carrier 22, first electrode 23 and second electrode 24 are to be arranged in the insulator 21 by embedded ejection forming technique (insert-molding), guaranteed to have the excellent electric insulating energy between first electrode 23 and second electrode 24 and the heat carrier 22, and had good heat-conductive characteristic between heat carrier 22 and the insulator 21.
Because being set directly on the supporting part 220 of heat carrier 22 and with heat carrier 22, light-emitting diode chip for backlight unit 25 forms good thermally coupled, so the heat that light-emitting diode chip for backlight unit 25 produces when luminous can be directly conducted to heat carrier 22, by heat carrier 22 heat that absorbs is conducted to extraneous air again, thereby reduced the temperature of light-emitting diode chip for backlight unit 25, improved the radiating efficiency of light supply apparatus 20, and the luminous efficiency of light-emitting diode chip for backlight unit 25 and service life.
In addition, first electrode 23 and second electrode 24 are positioned at the first half of light supply apparatus 20, and extend this storage tank 2120 to link to each other with external circuit (figure does not show), make external circuit be positioned at the top of this light supply apparatus 20; And light-emitting diode chip for backlight unit 25 with its below 22 hot connections of heat carrier, make the heat conduction of this light supply apparatus 20 be directed downwards, thereby effectively avoided external circuit, and then reduced the thermal resistance of this light supply apparatus 20, improved its heat dissipation.
See also Fig. 4, the bottom 221 of heat carrier 22 also can have a through hole 2210, can make the part-structure in this support portion 210 be covered with this through hole 2210 when making heat carrier 22 be arranged in the support portion 210 of insulator 21 by embedded ejection forming technique, the contact area that has improved heat carrier 22 and support portion 210 with contact reliability.The width H of the bottom 221 of heat carrier 22 has improved the radiating efficiency of heat carrier 22 effectively greater than the overall width h of this first electrode 23 and second electrode 24.
See also Fig. 5, heat carrier 22 has a rectangular structure, and it has part to be exposed to this storage tank 2120 bottoms, light-emitting diode chip for backlight unit 25 be arranged on the heat carrier 22 and with these heat carrier 22 thermally coupleds, at this, light-emitting diode chip for backlight unit 25 is positioned at the bottom of this storage tank 2120.
See also Fig. 6 and Fig. 7, a kind of light supply apparatus 30 that second embodiment of the invention provides, the light supply apparatus 20 that itself and above-mentioned first embodiment provide is basic identical, difference is: first electrode 33 and second electrode 34 are strip, the two is separately positioned on the relative both sides of light-emitting diode chip for backlight unit 25, all there is the part of the storage tank 310 that is exposed to insulator 31 at the middle part 330 of first electrode 33 and the middle part 340 of second electrode 34, and this storage tank 310 is extended at the two ends of the two ends of this first electrode 33 and this second electrode 34 respectively; The bottom 321 of heat carrier 32 is a T-shape structure, the contact area that has improved heat carrier 32 and insulator 31 with contact reliability.At this, this storage tank 310 is extended at the two ends of the two ends of this strip first electrode 33 and this strip second electrode 34 respectively, help and external circuits plate serial or parallel connection, improved the practicality of light supply apparatus 30 and the wires design flexibility of the circuit board that links to each other with this light supply apparatus 30.
See also Fig. 8, a kind of light supply apparatus 40 that third embodiment of the invention provides, the light supply apparatus 20 that itself and above-mentioned first embodiment provide is basic identical, and difference is:
The supporting part 420 of heat carrier 42 is provided with a heat conduction paster (Submount) 48, can engage by bonding mode or eutectic mode between this heat conduction paster 48 and this supporting part 420, these heat conduction paster 48 material therefors can be silicon, aluminium nitride, beryllium oxide, silica, class diamond (Diamond like Carbon), ceramic aluminium base (Ceramic Aluminim substrate) etc.;
Chip package (Flip chip) is on heat conduction paster 48 by the metal coupling 49 (for example golden projection, tin ball etc.) on two positive and negative electrodes that are formed on light-emitting diode chip for backlight unit 45 for light-emitting diode chip for backlight unit 45, and these two metal couplings 49 are connected with first electrode 43 and second electrode, 44 routings respectively.
See also Fig. 9, a kind of light supply apparatus 50 that fourth embodiment of the invention provides, it comprises a circuit board 500, the light supply apparatus 20 that a plurality of first embodiment provide, and a radiating fin 510.
Circuit board 500 has a plurality of through holes 501 and is arranged on these circuit board 500 1 sides and the metal connecting layer 502 between two adjacent through holes 501, and the light-reflecting portion 212 of each light supply apparatus 20 is located in respectively in these a plurality of through holes 501.First electrode 23 and second electrode 24 are electrically connected with the metal connecting layer 502 of this circuit board 500.
The side relative that radiating fin 510 is arranged on these a plurality of light supply apparatuses 20 with this circuit board 500, and with 22 hot connections of heat carrier of each light supply apparatus 20 in order to this light supply apparatus 20 is dispelled the heat.
Because these a plurality of light supply apparatuses 20 are arranged between this circuit board 500 and this radiating fin 510, first electrode 23 of each light supply apparatus 20 and second electrode 24 are electrically connected with the metal connecting layer 502 of this circuit board 500.So, this circuit board 500 is positioned at the top of these a plurality of light supply apparatuses 20, and the heat carrier 22 of each light supply apparatus 20 all with 510 hot connections of radiating fin, make the heat conduction of these a plurality of light supply apparatuses 20 be directed downwards, thereby effectively avoided this circuit board 500, and then reduced the thermal resistance of light supply apparatus 50, improved its heat dissipation.
Be understandable that the light supply apparatus that above-mentioned second, third embodiment provided can be applied among above-mentioned the 4th embodiment equally.
In addition, those skilled in the art also can do other variation in spirit of the present invention, as long as it does not depart from technique effect of the present invention, the variation that these are done according to spirit of the present invention all should be included within the present invention's scope required for protection.

Claims (11)

1. light supply apparatus with light-emitting diode chip for backlight unit, it comprises:
An insulator, this insulator has a storage tank;
A heat carrier, it is arranged in this insulator and is relative with this storage tank, and this heat carrier has a supporting part that is exposed to this storage tank bottom;
Tabular first electrode and tabular second electrode, this first electrode and second electrode are embedded respectively in this insulator and all extend in this storage tank, and are separated with this heat carrier;
A light-emitting diode chip for backlight unit, it is set directly on the supporting part of this heat carrier; And
Metal wire, this first electrode and second electrode form with this light-emitting diode chip for backlight unit by this metal wire respectively and are electrically connected.
2. light supply apparatus as claimed in claim 1, it is characterized in that: this insulator comprises a support portion and one and the integrated light-reflecting portion in this support portion, this light-reflecting portion is positioned at a side of this support portion, the bottom that this storage tank is arranged in this light-reflecting portion and this storage tank extends to this support portion, and an end of this first electrode and an end of second electrode are embedded in the junction of the support portion of this insulator and light-reflecting portion respectively and all extend in this storage tank.
3. light supply apparatus as claimed in claim 1 is characterized in that: this light supply apparatus also comprises a packaging body, and this packaging body is arranged in this storage tank in order to cover this light-emitting diode chip for backlight unit and this metal wire.
4. light supply apparatus as claimed in claim 1 is characterized in that: this heat carrier has a bottom relative with this supporting part, and the width of the supporting part of this heat carrier is less than the width of the bottom of this heat carrier.
5. light supply apparatus as claimed in claim 4 is characterized in that: the width of this bottom is greater than the overall width of this first electrode and second electrode.
6. light supply apparatus as claimed in claim 4 is characterized in that: this light supply apparatus also comprises a radiating fin, the bottom thermally coupled of this radiating fin and this heat carrier.
7. light supply apparatus as claimed in claim 1, it is characterized in that: this first electrode is strip with second electrode and is separately positioned on the relative both sides of this light-emitting diode chip for backlight unit, the middle part of the middle part of this first electrode and second electrode is exposed in this storage tank, and this storage tank is extended at the two ends of the two ends of this first electrode and second electrode respectively.
8. light supply apparatus as claimed in claim 1 is characterized in that: the inwall of this storage tank is provided with the reflecting layer, in order to reflect the light that this light-emitting diode chip for backlight unit sends.
9. light supply apparatus as claimed in claim 1 is characterized in that: this light-emitting diode chip for backlight unit is to be arranged on the supporting part of this heat carrier by bonding mode or eutectic mode.
10. light supply apparatus as claimed in claim 1 is characterized in that: this light-emitting diode chip for backlight unit be by the metal coupling chip package on the supporting part of this heat carrier, this metal coupling is connected with this first electrode and the second electrode routing.
11. light supply apparatus as claimed in claim 1, it is characterized in that: this light supply apparatus also comprises a circuit board, this circuit board comprises through hole and metallic circuit, and the storage tank of this insulator is located in this through hole, and this first electrode and second electrode are electrically connected with this metallic circuit.
CN2008103008705A 2008-04-08 2008-04-08 Light source device Expired - Fee Related CN101556034B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008103008705A CN101556034B (en) 2008-04-08 2008-04-08 Light source device
US12/419,407 US8067782B2 (en) 2008-04-08 2009-04-07 LED package and light source device using same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2008103008705A CN101556034B (en) 2008-04-08 2008-04-08 Light source device

Publications (2)

Publication Number Publication Date
CN101556034A CN101556034A (en) 2009-10-14
CN101556034B true CN101556034B (en) 2010-09-29

Family

ID=41174248

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008103008705A Expired - Fee Related CN101556034B (en) 2008-04-08 2008-04-08 Light source device

Country Status (1)

Country Link
CN (1) CN101556034B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102931329B (en) * 2011-08-08 2015-01-07 展晶科技(深圳)有限公司 Light emitting diode (LED) packaging structure
CN110071206B (en) * 2018-12-29 2021-09-17 博罗康佳精密科技有限公司 COB aluminum-based packaging plate and preparation process thereof

Also Published As

Publication number Publication date
CN101556034A (en) 2009-10-14

Similar Documents

Publication Publication Date Title
US8067782B2 (en) LED package and light source device using same
EP1928030B1 (en) Led lighting fixture
US7923831B2 (en) LED-based light source having improved thermal dissipation
US7276739B2 (en) Low thermal resistance light emitting diode
US7612386B2 (en) High power light emitting diode device
KR101451266B1 (en) Led light module
US8101966B2 (en) Light-emitting diode lamp with low thermal resistance
JP4122784B2 (en) Light emitting device
US20110175512A1 (en) Light emitting diode and light source module having same
US20110248616A1 (en) Light emitting diode and light source module incorporating the same
KR20080027355A (en) Light emitting device
TW200405593A (en) Optoelectronic component and component-module
TW200814362A (en) Light-emitting diode device with high heat dissipation property
US8373195B2 (en) Light-emitting diode lamp with low thermal resistance
JP4254470B2 (en) Light emitting device
US20110175511A1 (en) Light emitting diode and light source module having same
CN101740678A (en) Solid state light-emitting element and light source module
JP4674487B2 (en) Surface mount light emitting device
CN101586795B (en) Light source device
CN111180994A (en) LD light-emitting device and preparation method thereof
TWI385824B (en) Light source device
CN101556034B (en) Light source device
JP2009094213A (en) Light emitting device
KR100764461B1 (en) Semiconductor Package Having a Buffer Layer
US10784423B2 (en) Light emitting device

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee
CP01 Change in the name or title of a patent holder

Address after: 518033 A, Hua Qiang garden, Fu Hong Road, Shenzhen, Guangdong, Futian District, 16F

Co-patentee after: Advanced Optoelectronic Technology Inc.

Patentee after: Zhanjing Technology (Shenzhen) Co., Ltd.

Address before: 518033 A, Hua Qiang garden, Fu Hong Road, Shenzhen, Guangdong, Futian District, 16F

Co-patentee before: Advanced Development Photoelectric Co., Ltd.

Patentee before: Zhanjing Technology (Shenzhen) Co., Ltd.

C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100929

Termination date: 20140408