CN101242690B - 有机el装置、有机el装置的制造方法、和电子设备 - Google Patents
有机el装置、有机el装置的制造方法、和电子设备 Download PDFInfo
- Publication number
- CN101242690B CN101242690B CN2008100089861A CN200810008986A CN101242690B CN 101242690 B CN101242690 B CN 101242690B CN 2008100089861 A CN2008100089861 A CN 2008100089861A CN 200810008986 A CN200810008986 A CN 200810008986A CN 101242690 B CN101242690 B CN 101242690B
- Authority
- CN
- China
- Prior art keywords
- organic
- electrode
- pixel
- function layer
- pixel region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 42
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 238000000034 method Methods 0.000 claims description 32
- 230000015572 biosynthetic process Effects 0.000 claims description 24
- 238000000151 deposition Methods 0.000 claims description 13
- 238000001704 evaporation Methods 0.000 claims description 9
- 238000002955 isolation Methods 0.000 abstract 2
- 239000010410 layer Substances 0.000 description 74
- 238000002347 injection Methods 0.000 description 17
- 239000007924 injection Substances 0.000 description 17
- 239000000463 material Substances 0.000 description 17
- 238000012546 transfer Methods 0.000 description 17
- 101100214497 Solanum lycopersicum TFT5 gene Proteins 0.000 description 14
- 239000010408 film Substances 0.000 description 14
- 239000011229 interlayer Substances 0.000 description 12
- 239000003990 capacitor Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000004411 aluminium Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 230000008020 evaporation Effects 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 4
- 238000001259 photo etching Methods 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 241001597008 Nomeidae Species 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 150000002484 inorganic compounds Chemical class 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- SJCKRGFTWFGHGZ-UHFFFAOYSA-N magnesium silver Chemical compound [Mg].[Ag] SJCKRGFTWFGHGZ-UHFFFAOYSA-N 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- DGBWPZSGHAXYGK-UHFFFAOYSA-N perinone Chemical class C12=NC3=CC=CC=C3N2C(=O)C2=CC=C3C4=C2C1=CC=C4C(=O)N1C2=CC=CC=C2N=C13 DGBWPZSGHAXYGK-UHFFFAOYSA-N 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- BBEAQIROQSPTKN-UHFFFAOYSA-N pyrene Chemical compound C1=CC=C2C=CC3=CC=CC4=CC=C1C2=C43 BBEAQIROQSPTKN-UHFFFAOYSA-N 0.000 description 2
- -1 silicon-oxygen nitrides Chemical class 0.000 description 2
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 2
- KLCLIOISYBHYDZ-UHFFFAOYSA-N 1,4,4-triphenylbuta-1,3-dienylbenzene Chemical class C=1C=CC=CC=1C(C=1C=CC=CC=1)=CC=C(C=1C=CC=CC=1)C1=CC=CC=C1 KLCLIOISYBHYDZ-UHFFFAOYSA-N 0.000 description 1
- CFNMUZCFSDMZPQ-GHXNOFRVSA-N 7-[(z)-3-methyl-4-(4-methyl-5-oxo-2h-furan-2-yl)but-2-enoxy]chromen-2-one Chemical compound C=1C=C2C=CC(=O)OC2=CC=1OC/C=C(/C)CC1OC(=O)C(C)=C1 CFNMUZCFSDMZPQ-GHXNOFRVSA-N 0.000 description 1
- CAWXEEYDBZRFPE-UHFFFAOYSA-N Hexazinone Chemical class O=C1N(C)C(N(C)C)=NC(=O)N1C1CCCCC1 CAWXEEYDBZRFPE-UHFFFAOYSA-N 0.000 description 1
- 229910000733 Li alloy Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 229910001515 alkali metal fluoride Inorganic materials 0.000 description 1
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 150000001555 benzenes Chemical class 0.000 description 1
- 125000005605 benzo group Chemical group 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- GVEPBJHOBDJJJI-UHFFFAOYSA-N fluoranthrene Natural products C1=CC(C2=CC=CC=C22)=C3C2=CC=CC3=C1 GVEPBJHOBDJJJI-UHFFFAOYSA-N 0.000 description 1
- 235000011194 food seasoning agent Nutrition 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 125000003454 indenyl group Chemical class C1(C=CC2=CC=CC=C12)* 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000001989 lithium alloy Substances 0.000 description 1
- GCICAPWZNUIIDV-UHFFFAOYSA-N lithium magnesium Chemical compound [Li].[Mg] GCICAPWZNUIIDV-UHFFFAOYSA-N 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 150000005255 pyrrolopyridines Chemical class 0.000 description 1
- MCJGNVYPOGVAJF-UHFFFAOYSA-N quinolin-8-ol Chemical compound C1=CN=C2C(O)=CC=CC2=C1 MCJGNVYPOGVAJF-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 150000004867 thiadiazoles Chemical class 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
- H10K59/1315—Interconnections, e.g. wiring lines or terminals comprising structures specially adapted for lowering the resistance
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
- H10K50/824—Cathodes combined with auxiliary electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
- H10K50/828—Transparent cathodes, e.g. comprising thin metal layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/081—Shaping or machining of piezoelectric or electrostrictive bodies by coating or depositing using masks, e.g. lift-off
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
Claims (6)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007026451 | 2007-02-06 | ||
JP2007026451A JP2008192477A (ja) | 2007-02-06 | 2007-02-06 | 有機el装置、有機el装置の製造方法、及び電子機器 |
JP2007-026451 | 2007-02-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101242690A CN101242690A (zh) | 2008-08-13 |
CN101242690B true CN101242690B (zh) | 2011-04-06 |
Family
ID=39675577
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008100089861A Active CN101242690B (zh) | 2007-02-06 | 2008-02-02 | 有机el装置、有机el装置的制造方法、和电子设备 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7719181B2 (zh) |
JP (1) | JP2008192477A (zh) |
KR (1) | KR20080073640A (zh) |
CN (1) | CN101242690B (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5315761B2 (ja) * | 2008-04-15 | 2013-10-16 | セイコーエプソン株式会社 | 有機エレクトロルミネッセンス装置 |
JP5157825B2 (ja) * | 2008-10-29 | 2013-03-06 | ソニー株式会社 | 有機elディスプレイの製造方法 |
KR101705822B1 (ko) * | 2010-10-27 | 2017-02-23 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
KR101784994B1 (ko) * | 2011-03-31 | 2017-10-13 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
US8848150B2 (en) * | 2011-09-23 | 2014-09-30 | Japan Display West Inc. | Liquid crystal display and electronic device |
JP5768167B2 (ja) * | 2013-02-04 | 2015-08-26 | 株式会社東芝 | 有機電界発光素子、照明装置及び照明システム |
CN104733470A (zh) * | 2013-12-20 | 2015-06-24 | 昆山国显光电有限公司 | 一种平板显示装置及其制备方法 |
TWI567971B (zh) * | 2014-04-22 | 2017-01-21 | 友達光電股份有限公司 | 發光裝置 |
CN204028524U (zh) * | 2014-06-23 | 2014-12-17 | 京东方科技集团股份有限公司 | 显示基板及显示装置 |
JP6487173B2 (ja) | 2014-10-08 | 2019-03-20 | 株式会社ジャパンディスプレイ | 表示装置及びその製造方法 |
KR102273654B1 (ko) * | 2014-10-08 | 2021-07-06 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
CN109728052B (zh) * | 2019-01-02 | 2021-01-26 | 京东方科技集团股份有限公司 | 显示基板的制作方法及显示基板、显示装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005050552A (ja) * | 2003-07-29 | 2005-02-24 | Dainippon Printing Co Ltd | 有機el表示装置 |
CN1808710A (zh) * | 2004-12-07 | 2006-07-26 | 三星电子株式会社 | 薄膜晶体管阵列面板及其制造方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3836946B2 (ja) | 1997-06-16 | 2006-10-25 | 出光興産株式会社 | 有機el表示装置 |
JP3809758B2 (ja) | 1999-10-28 | 2006-08-16 | ソニー株式会社 | 表示装置及び表示装置の製造方法 |
JP4434411B2 (ja) * | 2000-02-16 | 2010-03-17 | 出光興産株式会社 | アクティブ駆動型有機el発光装置およびその製造方法 |
JP2002215063A (ja) * | 2001-01-19 | 2002-07-31 | Sony Corp | アクティブマトリクス型表示装置 |
JP2005093074A (ja) * | 2001-09-03 | 2005-04-07 | Matsushita Electric Ind Co Ltd | 発光素子及びその製造方法、並びに、その発光素子を用いた表示装置及び照明装置 |
JP4627966B2 (ja) | 2002-01-24 | 2011-02-09 | 株式会社半導体エネルギー研究所 | 発光装置およびその作製方法 |
JP4089544B2 (ja) | 2002-12-11 | 2008-05-28 | ソニー株式会社 | 表示装置及び表示装置の製造方法 |
KR100552972B1 (ko) * | 2003-10-09 | 2006-02-15 | 삼성에스디아이 주식회사 | 평판표시장치 및 그의 제조방법 |
JP4664604B2 (ja) | 2004-02-18 | 2011-04-06 | Tdk株式会社 | 画像表示装置 |
JP4121514B2 (ja) * | 2004-07-22 | 2008-07-23 | シャープ株式会社 | 有機発光素子、及び、それを備えた表示装置 |
JP2006318910A (ja) * | 2005-05-11 | 2006-11-24 | Lg Electronics Inc | 電界発光素子及びその製造方法、電界発光表示装置及びその製造方法 |
JP4857688B2 (ja) * | 2005-09-29 | 2012-01-18 | カシオ計算機株式会社 | 表示装置及びその製造方法 |
JP5315761B2 (ja) * | 2008-04-15 | 2013-10-16 | セイコーエプソン株式会社 | 有機エレクトロルミネッセンス装置 |
-
2007
- 2007-02-06 JP JP2007026451A patent/JP2008192477A/ja active Pending
- 2007-12-13 US US11/956,013 patent/US7719181B2/en active Active
-
2008
- 2008-01-16 KR KR1020080004960A patent/KR20080073640A/ko not_active Application Discontinuation
- 2008-02-02 CN CN2008100089861A patent/CN101242690B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005050552A (ja) * | 2003-07-29 | 2005-02-24 | Dainippon Printing Co Ltd | 有機el表示装置 |
CN1808710A (zh) * | 2004-12-07 | 2006-07-26 | 三星电子株式会社 | 薄膜晶体管阵列面板及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20080185959A1 (en) | 2008-08-07 |
KR20080073640A (ko) | 2008-08-11 |
CN101242690A (zh) | 2008-08-13 |
JP2008192477A (ja) | 2008-08-21 |
US7719181B2 (en) | 2010-05-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101242690B (zh) | 有机el装置、有机el装置的制造方法、和电子设备 | |
US10892305B2 (en) | Touch structure, organic light emitting diode (OLED) display touch panel and touch display device | |
US11216101B2 (en) | Display device with integrated touch screen and method for fabricating the same | |
CN101567381B (zh) | 有机电致发光装置及电子设备 | |
CN101221974B (zh) | 有机电致发光显示装置 | |
CN100517795C (zh) | 有机发光二极管及包含其的显示面板与通讯装置 | |
CN109817672A (zh) | 有机电致发光显示基板及其制造方法、显示面板、装置 | |
CN105047609B (zh) | 有机发光二极管阵列基板及其制备方法、触控显示装置 | |
CN110047898A (zh) | 显示基板及其制造方法、显示装置 | |
CN102665308A (zh) | 带输入功能的有机场致发光装置及电子设备 | |
CN103488015B (zh) | 像素结构及具有此像素结构的显示面板 | |
US20190259975A1 (en) | Display device and manufacturing method thereof | |
CN104112758B (zh) | 发光二极管显示面板及其制作方法、显示装置 | |
CN105445969A (zh) | 显示面板 | |
CN101296539A (zh) | 有机场致发光装置 | |
CN105470196A (zh) | 薄膜晶体管、阵列基板及其制造方法、和显示装置 | |
CN105097825A (zh) | 显示装置 | |
CN112864217A (zh) | 显示面板和电子设备 | |
CN110416274B (zh) | 一种基板及其制备方法和oled显示面板 | |
CN116234373B (zh) | 像素结构、显示面板及显示面板制备方法 | |
CN1484477A (zh) | 有机电致发光显示器件及其制造方法 | |
CN107808638B (zh) | 一种显示面板和显示装置 | |
US20240161691A1 (en) | Display Substrate and Display Apparatus | |
US8284125B2 (en) | Active matrix organic electro-luminescence display panel and fabrication method thereof | |
CN204179081U (zh) | 薄膜晶体管基板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20190202 Address after: Tokyo, Japan, Japan Patentee after: EL Technology Fusion Co., Ltd. Address before: Tokyo, Japan Patentee before: Seiko Epson Corp. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220425 Address after: 05-15, bayeliba Plaza, 60 bayeliba Road, Singapore Patentee after: Element capital commercial Co. Address before: Tokyo, Japan Patentee before: El technology integration Co.,Ltd. |
|
TR01 | Transfer of patent right |