CN100447996C - Physical quantity sensor, lead frame, and manufacturing method therefor - Google Patents
Physical quantity sensor, lead frame, and manufacturing method therefor Download PDFInfo
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- CN100447996C CN100447996C CNB200510103844XA CN200510103844A CN100447996C CN 100447996 C CN100447996 C CN 100447996C CN B200510103844X A CNB200510103844X A CN B200510103844XA CN 200510103844 A CN200510103844 A CN 200510103844A CN 100447996 C CN100447996 C CN 100447996C
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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Abstract
A physical quantity sensor is constituted using a lead frame having at least one stage and a plurality of leads whose bases are arranged in the same plane, wherein at least one physical quantity sensor chip having a plurality of electrode pads is mounted on the stage and is inclined so that the electrode pads are disposed in the inclination direction and are connected to the leads by use of wires whose lengths substantially match distances between the electrode pads and leads. This prevents the leads and wires from being unexpectedly broken, and it is possible to avoid the occurrence of separation of the leads from the physical quantity sensor chip. In addition, the tip ends of the leads are disposed along the surface of the inclined stage before wire bonding; hence, it is possible to easily connect the tip ends of the leads to the physical quantity sensor chip.
Description
The application requires the priority of Japanese patent application No.2004-263881 and 2004-374105, and its full content is hereby incorporated by.
Technical field
The present invention relates to be used to survey such as the orientation (bearing) of magnetic force, pressure, acceleration and magnetic force and gravity and the physical quantity transducer of direction.The invention still further relates to the lead frame that is used for physical quantity transducer, and the manufacture method that is used to make the physical quantity transducer that uses lead frame.
Background technology
Recently, (for example, cell phone) portable terminal has been equipped with GPS function (GPS representative " global positioning system " here), is used to survey user position information, and this positional information is presented on the screen of display such as portable phone.The GPS function can with the associating of other functions, be used for accurately surveying telluric magnetic force and acceleration, thus can be in directional bearing (or azimuth) in by the three dimensions of the portable terminal of user's handling, direction and motion.
In order to make portable terminal have above-mentioned functions, be necessary the physical quantity transducer such as Magnetic Sensor and acceleration transducer is attached in the portable terminal.In order in three dimensions, to realize detection for orientation and acceleration, be necessary to use physical quantity sensor chip, this chip is incorporated in the portable terminal and its pedestal should tilt at a predetermined angle.
Various types of physical quantity transducers been have have been researched and developed with above-mentioned functions.One type of known physical quantity transducer is Magnetic Sensor, and it surveys magnetic force but its pedestal does not tilt.Constitute this Magnetic Sensor by first magnetic sensor chip and second magnetic sensor chip, wherein first magnetic sensor chip is installed on the surface of substrate and for the magnetic factor (magnetic factor) sensitivity that is in the external magnetic field on the both direction (being X-axis and Y direction), this magnetic factor along substrate surface each other with right-angle crossing, second magnetic sensor chip be installed on the surface of substrate and for the vertical vertically direction (being Z-direction) of substrate surface on the magnetic factor sensitivity of external magnetic field.In other words, Magnetic Sensor is with reference to measuring in three dimensions the earth magnetism factor as vector by the magnetic factor that a pair of magnetic sensor chip detected respectively.
Above-mentioned Magnetic Sensor is arranged in such a way, and promptly second magnetic sensor chip stands on the surface of substrate vertically.This has increased the gross thickness (that is the height on Z-direction) of Magnetic Sensor.Because this gross thickness should be reduced as much as possible, so preferably use the physical quantity transducer of the aforementioned type of its basement tilt, for example, such transducer is disclosed among the open No.2004-125778 of Japanese unexamined patent, the open No.2004-128473 of Japanese unexamined patent, the open No.2002-156204 of Japanese unexamined patent and the open No.H09-292408 of Japanese unexamined patent.
Wherein the physical quantity transducer of physical quantity sensor chip inclination has outstanding advantage, promptly can reduce its gross thickness, and can guarantee gratifying sensitivity simultaneously.For example, the open No.H09-292408 of Japanese unexamined patent discloses a kind of acceleration transducer (or physical quantity transducer) with one-sided girder construction, and wherein acceleration sensor chip (or physical quantity sensor chip) is in advance with respect to substrate tilting; Therefore, though on the surface of substrate sensor installation when encapsulation, also can upwards guarantee high sensitivity, thereby reduce in other sensitivity on axially that comprise along the direction of substrate surface with the predetermined shaft of incline direction coupling.
As mentioned above, wherein the physical quantity transducer that inclines towards each other of physical quantity sensor chip can become following mainstream technology, because it can reduce gross thickness as much as possible, and its inclination owing to chip has multiple advantage.
Figure 12 shows an example of the physical quantity transducer (or Magnetic Sensor) that physical quantity sensor chip wherein inclines towards each other.More specifically, the Magnetic Sensor 50 of Figure 12 is made of following: a pair of magnetic sensor chip (or physical quantity sensor chip) 51 and 52, be used for that magnetic sensor chip 51 and 52 is electrically connected to a plurality of leads 53 of external device (ED) and be used for resin molded encapsulation 54 with they overall fixed. Magnetic sensor chip 51 and 52 all tilts with respect to lower surface (or bottom) 54a of resin molded encapsulation 54.
In the manufacture method of Magnetic Sensor 50, magnetic sensor chip 51 and 52 is attached to respectively on platform (stage) 55 and 56; Then, for magnetic sensor chip 51 and 52 and 53 the wirings that carry out to use wires 57 that go between.After wiring is finished, platform 55 and 56 is tilted.
In Magnetic Sensor 50, set essentially identical length for wire 57, and and lead-in wire 53 and the surperficial 51a of magnetic sensor chip 51 and 52 and the range-independence between the 52a.Herein, the surperficial 51a of reference leads 53 and magnetic sensor chip 51 and 52 and the short distance between the 52a and carry out bonding (bonding) basically.In this case, when platform 55 and 56 was tilted, disadvantageous load can be applied to and be used for the long relatively wire of distance between them.This may unexpectedly make wire 57 fractures and might cause wire 57 and the surperficial 51a and the 52a of magnetic sensor chip 51 and 52 to break away from.On the contrary, when the surperficial 51a of reference leads 53 and magnetic sensor chip 51 and 52 basically and the long distance between the 52a and execute key is fashionable, thereby wire 57 can relax and may contact with each other and cause short circuit, and wherein wire 57 is exposed on the surface of resin molded encapsulation 54 probably.
Summary of the invention
An object of the present invention is to provide a kind of physical quantity transducer and manufacture method thereof, wherein lead-in wire is not easy to rupture and is not easy and breaks away from from the surface of physical quantity sensor chip.
Another object of the present invention provides the manufacture method of a kind of physical quantity transducer, its lead frame and this physical quantity transducer, wherein can easily avoid going between and physical quantity sensor chip between the generation of electrical connection fault.
In a first aspect of the present invention, constitute physical quantity transducer by a plurality of leads and at least one physical quantity sensor chip, the base portion of described a plurality of leads is arranged in the identical plane, and in described physical quantity sensor chip, be formed with a plurality of electrode pads (or bonding welding pad) and described physical quantity sensor chip with respect to described plane inclination, wherein said electrode pad is arranged on the incline direction of described physical quantity sensor chip and via wire and is connected respectively to described lead-in wire, and the distance between these length wiry and described electrode pad and the described lead-in wire is mated substantially.Owing to use the wire that the distance between its length and electrode pad and the lead-in wire is mated substantially that electrode pad and lead-in wire are linked together, use long relatively wire to connect long distance thus, use short relatively wire to connect short distance; Therefore, can reduce to be applied to load on the described wire.
More than, the tip of standing the described lead-in wire of metal wire bond have with the physical quantity transducer that tilts on the differing heights that mates substantially of the height of electrode pad.This makes wire can have suitable length; Therefore, can carry out the metal wire bond effectively.
A kind of manufacture method of physical quantity transducer comprises: the lead frame that is used to form lead frame forms step, at least one platform that this lead frame comprises frame part, centered on by described lead-in wire and being used for a plurality of interconnecting parts of described platform interconnect to described frame part; Be used for described physical quantity sensor chip is bonded to bonding step on the described platform; Be used to carry out the metal wire bond step of metal wire bond, this step utilizes wire that the distance between its length and described electrode pad and the described lead-in wire is mated substantially described lead-in wire to be connected to described electrode pad on the physical quantity sensor chip that is installed on the described platform; And the physical quantity sensor chip tilting step is used to make described platform to tilt at a predetermined angle to make described interconnecting parts distortion simultaneously with respect to described frame part with described physical quantity sensor chip.Herein, be bonded on the described platform of inclination in described physical quantity sensor chip before, suitably control described length wiry in response to the distance between described electrode pad and the described lead-in wire; Therefore, when described platform tilts with described physical quantity sensor chip, can reduce to be applied to the load on the described wire.In addition, on the moving direction of the electrode pad on the physical quantity sensor chip that tilts, use described wire to carry out the metal wire bond.This makes it possible to reduce in advance to be applied to the stress on the described wire; In other words, when described physical quantity sensor chip tilted, described physical quantity sensor chip moved on described bonding direction wiry; Therefore, can avoid described wire unexpectedly to rupture reliably.
More than, described physical quantity sensor chip can be before the metal wire bond, tilt with described platform, wherein, can introduce the lead-in wire procedure of processing in addition, in this step, thereby the height of wire tip is changed when described physical quantity sensor chip tilts and conforms to the position of described electrode pad.In other words, before described platform is by actual tilt, in response to the position that is attached to the electrode pad on the described physical quantity sensor chip that will tilt and change the height of described wire tip in advance.In such metal wire bond mode, can before tilting, described physical quantity sensor chip reduce to be applied to the stress on the described wire.
Thereby described manufacture method can be comprised by partly revising: the lead frame that is used to form lead frame forms step, at least one platform that this lead frame comprises frame part, centered on by described lead-in wire and being used for a plurality of interconnecting parts of described platform interconnect to described frame part; Be used for described physical quantity sensor chip is bonded to bonding step on the described platform; The physical quantity sensor chip tilting step is used to make described platform to tilt at a predetermined angle with respect to described frame part with described physical quantity sensor chip, makes described interconnecting parts distortion simultaneously; And, be used to carry out the metal wire bond step of metal wire bond, this step utilizes wire described lead-in wire to be connected to described electrode pad on the physical quantity sensor chip that is installed on the described platform, and the distance between these length wiry and described electrode pad and the described lead-in wire is mated substantially.Owing to after described physical quantity sensor chip tilts, carry out described metal wire bond, so the wire with suitable length can be provided.In addition, can form at described lead frame and introduce the lead-in wire procedure of processing between step and the described physical quantity sensor chip tilting step in addition, in this step, handle described lead-in wire make the electrode pad of its most advanced and sophisticated high response on the described physical quantity sensor chip that tilts the position and change.In other words, described lead-in wire is processed; Then, described physical quantity sensor chip is tilted; Afterwards, the lead-in wire that mates substantially for its height and the position of described electrode pad uses wire to carry out the metal wire bond.This has reduced distance and described length wiry between described electrode pad and the described lead-in wire; Therefore, can control wire, and can prevent reliably that described wire from unexpectedly rupturing with suitable length.In addition, can avoid taking place the disengaging of wire and electrode pad.
In a second aspect of the present invention, lead frame comprises and is used at least one platform that physical quantity sensor chip is mounted thereto, has the framework that is arranged on described platform a plurality of leads on every side, and be used for a plurality of interconnecting parts of described platform interconnect to described framework, wherein the base portion of the described lead-in wire that separates with described platform is substantially disposed in the predetermined plane, described platform tilts with respect to this predetermined plane, and the tip of described lead-in wire is along the surface setting of described platform.During fabrication, described physical quantity sensor chip is installed on the surface of described platform; Then, execution metal wire bond makes the tip of described lead-in wire be electrically connected to via wire and is formed on the lip-deep bonding welding pad of described physical quantity sensor chip.Afterwards, anchor leg framework and physical quantity sensor chip assembly between the metal pattern with the cavity (being that resin forms the space) that wherein injects molten resin are formed for the resin molded encapsulation with described lead frame and physical quantity sensor chip overall fixed thus.
More than, with the same level of the basic coupling in surface of described platform in the surface of described wire tip is set; Therefore, they be set to be installed in described platform on the bonding welding pad of physical quantity sensor chip parallel.So, be connected respectively on the described bonding welding pad via the tip of wire described lead-in wire thereby can easily carry out the metal wire bond.After finishing the metal wire bond, needn't change the tip of described lead-in wire and the distance between the described bonding welding pad; Therefore, can prevent that stress is applied on described wire and the described physical quantity sensor chip.
In the manufacture method of physical quantity transducer, in preparation process, metal sheet is processed into lead frame, and this lead frame comprises at least one platform of being used for installing physical quantity sensor chip thereon, have the framework that is arranged on a plurality of leads around the described platform and be used for a plurality of interconnecting parts of described platform interconnect to described framework; In the platform inclination step, described platform is tilted with respect to described framework, make described interconnecting parts distortion simultaneously; In the lead-in wire procedure of processing, described lead-in wire is processed to make on the incline direction that its tip is arranged on described platform; In the bonding step, described physical quantity sensor chip is bonded on the described platform; And in the wiring step, the tip of described lead-in wire is electrically connected to described physical quantity transducer, wherein carries out described platform inclination step and described lead-in wire procedure of processing in pressure processing.In other words, before bonding step and wiring step, described platform is tilted, and described lead-in wire is arranged on the incline direction of described platform, described therein thus lead-in wire is electrically connected under the condition attached to the physical quantity sensor chip on the platform via wire, and described platform can not move with respect to described framework; Therefore, when making physical quantity transducer, can prevent reliably that stress is applied to described physical quantity sensor chip and described wire.Owing to when pressure processing, carry out described platform inclination step and lead-in wire procedure of processing simultaneously, can be at short notice the tip of described lead-in wire be easily positioned on the predetermined altitude that the height with the bonding welding pad of described physical quantity sensor chip mates substantially.Because the tip of described lead-in wire is arranged on the platform inclination direction, so can make described lead-in wire and be attached to distance minimization between the surface of the physical quantity sensor chip on the described platform.Therefore, in the wiring step, can reduce to be used for described lead-in wire is electrically connected to the length described wiry of described physical quantity sensor chip.
More than, in bonding step and wiring step, provide the overall utensil that supports the back side of described platform, lead-in wire and framework under the condition that the tip of described therein platform and described lead-in wire remains on heeling condition respectively.In other words, in bonding step and wiring step, can prevent described platform and lead deformation reliably; Therefore, can described physical quantity sensor chip be bonded on the described platform, and can described lead-in wire be electrically connected on the described physical quantity sensor chip with stable manner with stable manner.
In addition, in preparation process, can form a plurality of platforms with respect to described lead frame; In the wiring step, make the tip of described lead-in wire be connected to the surface of described physical quantity sensor chip via wire thereby can carry out the metal wire bond; And in the wiring step, can also moving described lead frame, to make that capillary is oriented vertical substantially with the tip of each platform and described lead-in wire.In other words, in the wiring step, described lead frame is suitably tilted or is moved with the angle of inclination of each platform with conforming to, described capillary is oriented is basically perpendicular to each platform and each physical quantity sensor chip.This make it possible to easily to be used for the metal wire bond device set up the foundation that promptly described capillary is arranged.
In addition, use chip bonding to bring and carry out described bonding step, described at least two physical quantity sensor chip are bonded on the corresponding platform simultaneously with at least two physical quantity sensor chip.In other words, even these platforms have the different angle of inclination with respect to described framework, also can be simply by described chip bonding band being set on the continuous platform and easily carry out described bonding step, wherein can be easy to a plurality of physical quantity sensor chip are attached on a plurality of platforms simultaneously.Described chip bonding band provides good precision to be used for determining the relative position of a plurality of physical quantity sensor chip, and described a plurality of physical quantity sensor chip are attached to respectively with respect to described framework to be had on a plurality of platforms of differing tilt angles.
By metal sheet being processed into the lead frame that the frame section with flat surfaces assigns to be formed for making physical quantity transducer, a plurality of leads is inwardly outstanding towards physical quantity sensor chip from described frame part, the tip that the lead-in wire that surrounds described physical quantity sensor chip wherein is set is arranged in the predetermined plane, and this plane tilts at a predetermined angle with respect to described flat surfaces.Herein, described physical quantity sensor chip has and is used for setting up a plurality of projection electrodes that are electrically connected with the tip of described lead-in wire.In other words, simply by just described physical quantity sensor chip and described lead-in wire being interconnected on the surface that described projection electrode is attached to described lead-in wire.Since described physical quantity sensor chip its with situation that described lead-in wire contacts under with respect to described frame part inclination, be applied to described projection electrode so can prevent stress, at described projection electrode place, described physical quantity sensor chip is electrically connected to the tip of described lead-in wire.
When making physical quantity transducer, in preparation process, metal sheet is processed into lead frame, this lead frame comprises frame part, a plurality of leads is inwardly outstanding towards the physical quantity sensor chip that it has a plurality of projection electrodes from this frame part; In the lead-in wire procedure of processing, the tip that is connected to the described lead-in wire of described physical quantity sensor chip tilts along predetermined direction with respect to described frame part; And in bonding-wiring step, the tip of described lead-in wire is bonded on the projection electrode of described physical quantity sensor chip.In other words, contact with the tip of described lead-in wire by the projection electrode that makes described physical quantity sensor chip simply, can reliably described physical quantity sensor chip be tilted with respect to described frame part; Therefore, described lead-in wire can be electrically connected to described physical quantity sensor chip.Owing to before described bonding-wiring step described lead-in wire is arranged on the described incline direction, so be connected at described lead-in wire under the condition of described physical quantity sensor chip, the tip of described lead-in wire can not moved with respect to described frame part.Therefore, can prevent reliably that stress is applied on the described projection electrode, at described projection electrode place, described physical quantity sensor chip is connected to the tip of described lead-in wire.
More than, remain at the tip of described lead-in wire under the condition of heeling condition, the utensil that is used for totally supporting the back side of described lead-in wire and described frame part is provided in bonding-wiring step.This makes that in bonding-wiring step unexpected distortion can prevent to go between; Therefore, can realize being provided with and being electrically connected with respect to described physical quantity sensor chip with stable manner.
Description of drawings
Will be by being described in greater detail with reference to the attached drawings these and other purposes of the present invention, aspect and embodiment, wherein:
Fig. 1 is the plane graph that the general structure of the Magnetic Sensor of making according to first embodiment of the invention is shown;
Fig. 2 is the cross-sectional view of Magnetic Sensor shown in Figure 1;
Fig. 3 is the enlarged perspective that relation between the electrode pad that links together via wire and the lead-in wire is shown respectively;
Fig. 4 illustrates the plane graph that magnetic sensor chip wherein is installed in the Magnetic Sensor of the Fig. 1 on the lead frame;
Fig. 5 is the cross-sectional view of Magnetic Sensor shown in Figure 4;
Fig. 6 is the enlarged perspective that relation between the electrode pad that links together via wire and the lead-in wire is shown respectively;
Fig. 7 illustrates the cross-sectional view such as the Magnetic Sensor predetermined portions of platform and magnetic sensor chip that is maintained at pair of metal mould inside;
Fig. 8 is the cross-sectional view that Magnetic Sensor predetermined portions shown in Figure 7 is shown, and wherein platform tilts respectively at a predetermined angle when metal pattern closes up;
Fig. 9 illustrates the enlarged perspective that concerns between the electrode pad that links together via wire and the improved lead-in wire;
Figure 10 be diagrammatic the end view of the improvement example that is applied to the lead-in wire relevant with magnetic sensor chip is shown;
Figure 11 be diagrammatic another that be applied to the lead-in wire relevant with magnetic sensor chip be shown improve the end view of example;
Figure 12 is the end view of partial cross section of the structure of Magnetic Sensor, and the part of the structure of this Magnetic Sensor has been carried out the metal wire bond;
Figure 13 is the plane graph that lead frame structure is shown, and this lead frame is used to make the Magnetic Sensor according to second embodiment of the invention;
Figure 14 is the plane graph that metal sheet is shown, and has formed each all corresponding to a plurality of lead frames of lead frame shown in Figure 13 in this metal sheet;
Figure 15 is the perspective view that the lead frame that has carried out platform inclination step and lead-in wire procedure of processing is shown;
Figure 16 is the end view that the partial cross section of lead frame shown in Figure 15 is shown;
Figure 17 A illustrates the end view of partly being revised with the lead-in wire with recess;
Figure 17 B is illustrated in the lead-in wire procedure of processing end view of the lead-in wire of Figure 17 A afterwards;
Figure 18 is the sectional view that the metal sheet with a plurality of lead frames that is fixed to support unit is shown;
Figure 19 is the sectional view that the part of metal sheet is shown, thereby carries out bonding step and wiring step on the pre-fixed platform of this metal sheet inclination in being contained in lead frame;
Figure 20 is the sectional view that another part of metal sheet is shown, thereby carries out bonding step and wiring step on this metal sheet inclination other platforms in being contained in lead frame;
Figure 21 is the enlarged perspective that relation between the bonding welding pad that links together via wire and the lead-in wire is shown;
Figure 22 be diagrammatic the sectional view of the leadframe arrangement with platform is shown, described platform clamp is between metal pattern;
Figure 23 is the plane graph that the general structure of the Magnetic Sensor that uses lead frame manufacturing shown in Figure 13 is shown;
Figure 24 is the sectional view that the internal structure of the Magnetic Sensor that uses lead frame manufacturing shown in Figure 13 is shown;
Figure 25 is the amplification sectional view that is used to explain the bonding step, wherein utilizes the chip bonding band that magnetic sensor chip is bonded to by on the platform of the improved lead frame of part;
Figure 26 is the perspective view that chip bonding band shown in Figure 25 is shown;
Figure 27 illustrates the plane graph of comparing the structure of the lead frame that is modified with lead frame shown in Figure 13;
Figure 28 is the sectional view that the magnetic sensor chip on the lead frame that is attached to Figure 27 is shown.
Embodiment
To the present invention be described in more detail by the mode with example with reference to the accompanying drawings.
1. first embodiment
The physical quantity transducer (or Magnetic Sensor) that passes through according to the manufacture method manufacturing of first embodiment of the invention is described with reference to Fig. 1 and 2.More specifically, Magnetic Sensor 1 is designed to survey the direction and the value (or intensity) of external magnetic field, and by a pair of magnetic sensor chip (or physics magnetic sensor chip) 2 and 3, a plurality of leads 4 and resin molded encapsulation 5 constitute, wherein magnetic sensor chip 2 and 3 has electrode pad (or bonding welding pad) 20a-20c in its surface, the end of a plurality of leads 4 (terminal end) is arranged in the identical plane, and this a plurality of leads 4 is electrically connected to the external device (ED) (not shown) with magnetic sensor chip 2 and 3, and resin molded encapsulation 5 is in the same place with 3 magnetic sensor chip 2 with the terminal overall fixed of lead-in wire 4.
In the magnetic sensor chip 2 and 3 each has the shape of similar rectangular slab in plane graph, wherein they are installed in respectively on platform 6 and 7. Magnetic sensor chip 2 and 3 is embedded in the resin molded encapsulation 5 by this way, makes them be set to be higher than the upper surface 5c of lead-in wire 4 and close resin molded encapsulation 5. Magnetic sensor chip 2 and 3 tilts with respect to the lower surface 5a of resin molded encapsulation 5 respectively, and this lower surface 5a is corresponding to the face that is used to be provided with lead-in wire 4.In addition, magnetic sensor chip 2 and 3 upper end 2b and 3b are towards the upper surface 5c of resin molded encapsulation 5.In addition, thereby the surperficial 2a of magnetic sensor chip 2 tilts to form the plane (being designated hereinafter simply as the A-B plane) that is positioned on the A-B direction, thereby the surperficial 3a of magnetic sensor chip 3 tilts to form the plane (being designated hereinafter simply as the C-D plane) that is positioned on the C-D direction simultaneously, wherein intersects with acute angle theta between A-B plane and the C-D plane.
More than, direction A and C are all parallel with an axle L1 (will in following description), and wherein direction A and C are reverse each other.Direction B is all vertical with axle L1 with D, and wherein direction B and D are reverse each other.
As shown in Figure 3, a plurality of electrode pad 20a, 20b and 20c are formed on the surperficial 2a of magnetic sensor chip 2, and are arranged on the direction of the inclination from the lower end 2c of magnetic sensor chip 2 to its upper end 2b.Magnetic sensor chip 2 tilts about the back shaft corresponding to its lower end 2c.
Lead-in wire each in 4 constitutes by the metal material such as copper, wherein goes between 4 back exposure on the lower surface 5a of resin molded encapsulation 5.The most advanced and sophisticated 4b of lead-in wire 4 is electrically connected on magnetic sensor chip 2 and 3 via wire 8, and wherein coupling part therebetween is embedded in the inside of resin molded encapsulation 5.More specifically, as shown in Figure 3, three lead-in wires 40a, 40b and 40c are arranged on the incline direction of magnetic sensor chip 2, and the 40a that wherein goes between is connected to electrode pad 20a via wire 8a; Lead-in wire 40b is connected on the electrode pad 20b via wire 8b; Lead-in wire 40c is connected on the electrode pad 20c via wire 8c.
Under the condition that magnetic sensor chip 2 tilts as shown in Figure 2, electrode pad 20c is arranged on from the 40c that goes between and forms on the position of longest distance therein.Distance between electrode pad and the lead-in wire reduces gradually according to the order of electrode pad 20b and 20a, and electrode pad 20b and 20a are connected respectively to lead-in wire 40b and 40a.Therefore, can determine under the tilt condition of magnetic sensor chip 2 with electrode pad 20a, 20b and 20c and lead-in wire 40a, 40b and 40c between the length of the wire 8 that conforms to of distance.In other words, use its length to carry out bonding according to the wire 8 that the order of wire 8c, 8b and 8a reduces; That is, wire 8c has the longest length.Distance between the length of wire 8a, 8b and 8c and electrode pad 20a, 20b and 20c and lead-in wire 40a, 40b and the 40c is basic identical.
Similar with magnetic sensor chip 2 (see figure 3)s that comprise electrode pad 20a, 20b and 20c and wire 8a, 8b and 8c, suitably determine to be connected the wire length between electrode pad and the lead-in wire, it is arranged on lower end 3c from magnetic sensor chip 3 to the incline direction of its upper end 3b.
Next, will the manufacture method of Magnetic Sensor 1 be described.
At first, prepare metal sheet and it is carried out pressure processing or etching, perhaps pressure processing and etching forms lead frame 10 thus, and wherein platform 6 and 7 is supported by framework 9, shown in Figure 4 and 5.
Framework 9 is made of rectangular frame part 11 and a plurality of leads 4 and 12, and rectangular frame part 11 forms the rectangular shape that surrounds platform 6 and 7 in plane graph, and a plurality of leads 4 and 12 extends internally from rectangular frame part 11.
Lead-in wire 12 is as the suspension lead-in wire that platform 6 and 7 is fixed to rectangular frame part 11, and wherein four lead-in wires 12 have four end 12a, and four end 12a are interconnected to the two ends of the first terminal 7a of the two ends of the first terminal 6a of platform 6 and platform 7 respectively.Herein, when platform 6 and 7 was provided with in a predetermined direction, the two ends of the first terminal 6a were positioned on the Width of the platform vertical with this predetermined direction 6, and the two ends of the first terminal 7a are positioned on the Width of the platform vertical with this predetermined direction 7.
Article four, each all has otch (for example recess) among four end 12a of lead-in wire 12 in its reservations office, and described predetermined portions is compared thickness with other parts of end 12a and reduced.This has formed the reverse part of can easy deformation and can reverse about axis L1, is connected the two ends of the first terminal 6a of platform 6 and 7 and 7a when 7 are tilted and the axis L1 that draws at platform 6.
Form a pair of excrescence 13 and make its second terminal 6b from platform 6 outstanding, wherein excrescence 13 is crooked at 6c place, the back side of platform 6.Similarly, form a pair of excrescence 14 and make its second terminal 7b from platform 7 outstanding, wherein excrescence 14 is crooked at 7c place, the back side of platform 7.Form these excrescences 13 and 14 for the purpose of sloping platform 6 and 7, wherein each all forms thin bar in the excrescence 13 and 14.In addition, the excrescence 13 of platform 6 extends relative to one another with the excrescence 14 of platform 7.
More specifically, in the second terminal 6b and the zone (or space) between the 7b of platform 6 and 7, a pair of excrescence 13 of platform 6 and a pair of excrescence 14 of platform 7 are set to have predetermined distance betwixt.This has been avoided being used to form the generation of the resin supply discontinuity of resin molded encapsulation reliably.For accurate inclination, preferably increase the distance between excrescence 13 and the excrescence 14 with stable manner implementation platform 6 and 7.
For the exposure of most advanced and sophisticated 13a on the lower surface of resin molded encapsulation that makes excrescence 13 minimizes, each all forms hemisphere with the most advanced and sophisticated 13a of excrescence 13.Similarly, for the exposure of most advanced and sophisticated 14a on the lower surface of resin molded encapsulation that makes excrescence 14 minimizes, each all forms hemisphere with the most advanced and sophisticated 14a of excrescence 14.
Compare with other parts of lead frame 10, by photoetch (photo-etching) thickness such as each predetermined portions of platform 6 and 7 is reduced, described platform 6 and 7 be arranged on have said structure lead frame 10 inside by in lead-in wire 4 interior zones that centered on.For example, the size of described predetermined portions reduces, thereby realizes that thickness is about half of thickness that other parts of lead frame 10 set.Metal sheet is being carried out carrying out photoetch before the pressure processing; Therefore, can avoid reliably going between 12 and the back side 6c of platform 6 and 7 and lower surface that 7c is exposed to resin molded encapsulation on.
Now, in lead frame formation step, provide above-mentioned lead frame 10; Then, in the bonding step, magnetic sensor chip 2 and 3 is bonded on the surperficial 6d and 7d of platform 6 and 7; And in metal wire bond (wire bonding) step via wire 8 with magnetic sensor chip 2 and 3 and go between and 4 be electrically connected.
About using the metal wire bond of wire 8, the travel path of capillary (capillary) (not shown) alters a great deal, make that wire 8a has the shortest length as shown in Figure 6, and the length of other wires 8b and 8c increases successively, and the supply that wherein increases wire 8 makes wire 8a, 8b and 8c be wired to lead-in wire 40a, 40b and 40c from electrode pad 20a, 20b and 20c respectively to carry out the metal wire bond.Herein, wire 8a, 8b and 8c close at the enterprising line unit of predetermined direction that the moving direction with electrode pad 20a, 20b and 20c mates substantially, and electrode pad 20a, 20b and 20c are owing to the inclination of magnetic sensor chip 2 and 3 is moved.
More than, the distance between the length of wire 8a, 8b and 8c and electrode pad 20a, 20b and 20c and lead-in wire 40a, 40b and the 40c is basic identical.This has guaranteed that thereby wire is controlled and has suitable length, can not cause after the following resin-sealed step that will describe, and wire partly is exposed on the surface (or back side) of resin.
Then, as shown in Figure 7, except 4 and 12 some part of going between, the above-mentioned part that is associated with framework 9 is held and is fixed between pair of metal mould E and the F.Metal pattern E and F only are used for magnetic sensor chip 2 and 3 is embedded in resin.
In framework 9 is sandwiched in maintenance step between metal pattern E and the F, the inwall F1 of lower metal mould F upwards pushes the most advanced and sophisticated 13a and the 14a of excrescence 13 and 14, make platform 6 about axis rotation along the first terminal 6a, the described first terminal 6a is supported by a pair of above-mentioned end 12a of lead-in wire 12, platform 7 is about the axis rotation along the first terminal 7a simultaneously, the described first terminal 7a is supported by a pair of above-mentioned end 12a of lead-in wire 12, and each that makes lead-in wire these ends 12a of 12 thus all is out of shape and is reversed.Therefore, as shown in Figure 8, in the magnetic sensor chip tilting step, magnetic sensor chip 2 and 3 and platform 6 and 7 tilt at a predetermined angle about the inwall F1 of lower metal mould F respectively.
In metal wire bond step, wire 8a, 8b and 8c are wired to lead-in wire 40a, 40b and 40c from electrode pad 20a, 20b and 20c respectively, wherein as shown in Figure 3, wire 8a, 8b and 8c have and electrode pad 20a, 20b and 20c and lead-in wire 40a, 40b and 40c between the distance suitable length of mating substantially.
Upwards push at the inwall F1 of lower metal mould F under the condition of the most advanced and sophisticated 13a of excrescence 13 and 14 and 14a, the resin of fusing is injected between metal pattern E and the F in formed space (or cavity), forms the resin molded encapsulation that magnetic sensor chip 2 and 3 is embedded in resin inside thus.Therefore, can in resin molded encapsulation, make magnetic sensor chip 2 and 3 keep reliably tilting mutually.
At last, excision is projected into the rectangular frame part 11 of resin molded encapsulation 5 outsides and the part that no longer needs of lead-in wire 12.Thus, just can finish the manufacturing of Magnetic Sensor shown in Figure 1.
The Magnetic Sensor 1 of present embodiment is characterised in that, use have and electrode pad 20a, 20b and 20c and lead-in wire 40a, 40b and 40c between wire 8a, 8b and the 8c of the suitable length that mates substantially of distance carry out bonding, make long distance by occupied than the bonding of length thus, short distance is occupied by the bonding of shorter length; Therefore, can reduce to be applied to load on the wire 8.
In the manufacture method of Magnetic Sensor 1, magnetic sensor chip 2 and 3 is bonded to respectively on platform 6 and 7; Then, before platform 6 and 7 is tilted, use wire 8a, 8b and 8c to carry out the metal wire bond, wire 8a, 8b and 8c increase on length successively, thereby have and electrode pad 20a, 20b and 20c and lead-in wire 40a, 40b and 40c between the distance suitable length of mating substantially, can reduce inclination owing to magnetic sensor chip 2 and 3 thus and be applied to load on the wire 8.
These two steps of step that can use metal pattern E and F to carry out the step that is used for sloping platform 6 and 7 and be used to form resin molded encapsulation 5; Therefore, can simplify whole manufacturing process.
Incidentally, the shape and size of excrescence 13 in the lead frame 10 and 14 can be suitably changed, the angle of inclination of platform 6 and 7 can be easily changed thus.In other words, can utilize same group of metal pattern E and F to make various types of Magnetic Sensors.
The present invention need not be confined to present embodiment; And present embodiment can change within the scope of the invention in every way.
For example, as shown in Figure 9, dissimilar lead-in wire 41,42 and 43 with curved shape is provided, the base portion of 41-43 of wherein going between is attached on the lower surface 5a of resin molded encapsulation 5, go between simultaneously 41,42 and 43 tip has surperficial 41a, 42b and the 43c that raises respectively, surface 41a, 42b and 43c have differing heights (measuring from the lower surface 5a of resin molded encapsulation 5), and electrode pad 20a, 20b on described differing heights and the magnetic sensor chip 2 that is attached to inclination (or the magnetic sensor chip 3 that tilts) and the height of 20c mate substantially.Improve in the example at this, be connected respectively to that each in height is controlled among surperficial 41a, the 42b at the lead-in wire 41,42 of electrode pad 20a, 20b and 20c and 43 tip and the 43c, make that surperficial 43c is the highest, and the height of other surperficial 42b and 41a reduces successively.Therein with wire 8 after electrode pad 20a, 20b and 20c are wired to the metal wire bond step of surperficial 41a, the 42b of lead-in wire 41,42 and 43 and 43c, magnetic sensor chip 2 is tilted.In this case, the wire of the surperficial 43c from electrode pad 20c to lead-in wire 43 is the longest, and shortens successively to the surperficial 42b of lead-in wire 42 and 41 and other wires of 41a from electrode pad 20b and 20a respectively.When using respectively from electrode pad 20a, 20b and 20c is wired to surperficial 41a, the 42b of lead-in wire 41,42 and 43 and the wire 8 of 43c is carried out the metal wire bond, can be that wire 8 is set suitable length; Therefore, can use wire 8 to carry out the metal wire bond effectively, and can prevent wire fracture unexpectedly reliably owing to the inclination of magnetic sensor chip 2 and 3.
In improvement shown in Figure 9, surperficial 41a, the 42b of lead-in wire 41,42 and 43 tip portion has different height (measuring from the lower surface 5a of resin molded encapsulation 5) with 43c, and electrode pad 20a, 20b on these different height and the surperficial 2b that is attached to magnetic sensor chip 2 and the height of 20c mate substantially.Herein, thus the height of surperficial 41a, 42b and 43c can change with half of the height of the electrode pad 20a, the 20b that measure from the lower surface 5a of resin molded encapsulation 5 and 20c and mates substantially.In this case, length wiry can further be reduced, thereby can easier execution metal wire bond for the operator.
Next, will the manufacture method of the Magnetic Sensor that has above-mentioned lead-in wire 41,42 and 43 as shown in Figure 9 be described.
In metal wire bond step (front has been described its content) before, the lead-in wire procedure of processing need be provided, wherein going between 41,42 is changed respectively with the position with electrode pad 20a, 20b and 20c with the height at 43 tip and conforms to, and the position of electrode pad 20a, 20b and 20c is when tilting magnetic sensor chip 2 and 3 and be determined.
In this manufacture method, before platform 6 and 7 is tilted, processing lead-in wire 41,42 and 43 makes its most advanced and sophisticated height be changed respectively with the position with electrode pad 20a, 20b and 20c to conform in advance, and the position of electrode pad 20a, 20b and 20c is when tilting magnetic sensor chip 2 and 3 and be determined., use wire 8 to carry out the metal wire bonds herein, electrode pad 20a, 20b and the 20c of wire 8 from the platform 6 (or platform 7) that is installed in level and keeps is wired to lead-in wire 41,42 with differing heights and 43 tip.This has reduced to be applied to the stress on the wire 8 greatly when magnetic sensor chip 2 and 3 tilts.
Incidentally, preferably before magnetic sensor chip 2 and 3 is bonded on the surperficial 6d of platform 6 and 7 and the 7d or just carry out the lead-in wire procedure of processing before this.
Thereby can revise this manufacture method order and carry out lead frame formation step, bonding step, magnetic sensor chip tilting step and metal wire bond step successively.The advantage of this modification is, can use the wire with suitable length to carry out the metal wire bond after magnetic sensor chip 2 and 3 tilts.
In addition, preferably form and insert the lead-in wire procedure of processing between step and the magnetic sensor chip tilting step at lead frame, in this lead-in wire procedure of processing, the height at lead-in wire 41,42 and 43 tip be changed respectively with the magnetic sensor chip 2 or 3 that is attached to inclination on electrode pad 20a, 20b and the position of 20c conform to.This modification allows after magnetic sensor chip 2 and 3 is tilted, utilize wire 8 to carry out the metal wire bond about 41,42 and 43 the tip of going between, this lead-in wire 41,42 has the differing heights that conforms to the position of electrode pad 20a, 20b and 20c with 43 tip.Herein, thereby because the distance between electrode pad and the lead-in wire reduces length wiry, so control length wiry that can be suitable also prevents that reliably wire from unexpectedly rupturing.
In Fig. 9, changed lead-in wire 41,42 and 43 respectively, make bonding position (corresponding to lead-in wire 41,42 and 43 most advanced and sophisticated 41a, 42b and the surface of 43c) be attached to electrode pad 20a, 20b on the magnetic sensor chip 2 and the height of 20c and mate substantially; That is to say, realize different bonding positions thereby the surface of lead-in wire 41,42 and 43 most advanced and sophisticated 41a, 42b and 43c in height changes respectively.Yet the reference line L2 that present embodiment need be connected between lead-in wire 44,45 and 46 the bonding position tilts at the incline direction of magnetic sensor chip 2, and as shown in figure 10, wherein magnetic sensor chip 2 tilts about the lower surface 5a of resin molded encapsulation 5.Under the situation of Fig. 9, the angle of inclination of reference line L2 and magnetic sensor chip 2 are about the angle of inclination coupling of the lower surface 5a inclination of resin molded encapsulation 5.Can further revise the relation between the lead-in wire 44,45 and 46, make reference line L2 with the inclined at inclination angles different with the angle of inclination of magnetic sensor chip 2.
In Figure 10 and 11, carry out the height of above-mentioned lead-in wire procedure of processing with the tip that changes lead-in wire 44,45 and 46, force it and be attached to electrode pad 20a, 20b on the magnetic sensor chip 2 and the height of 20c and mate substantially.Therefore, similar to the above embodiments, can avoid wire unexpectedly to be fractureed reliably.
By introducing above-mentioned lead-in wire procedure of processing, can suitably change the height at the tip of lead-in wire 44,45 and 46 for various types of Magnetic Sensors, the magnetic sensor chip of these Magnetic Sensors is with different inclined at inclination angles.This can eliminate the needs that change process value for the tip height that is adapted to various types of Magnetic Sensors change lead-in wires 44,45 and 46; Therefore, can reduce the whole manufacturing cost that is used to make Magnetic Sensor.
In the present embodiment, push the most advanced and sophisticated 13a of excrescence 13 and 14 and 14a and magnetic sensor chip 2 and 3 is tilted by the inwall F1 that utilizes lower metal mould F.Replace, the lead frame 10 of the preprocessing that platform 6 and 7 wherein tilts in advance can be provided.In this case, at first a back shaft (corresponding to interconnecting parts 12a) is carried out strain, thereby force platform 6 parallel with the lower surface of lead frame 10, magnetic sensor chip 2 and 3 is bonded on platform 6 and 7 by this back shaft with 7 surface.Afterwards, magnetic sensor chip 2 and 3 is bonded on platform 6 and 7; Then, this back shaft is made platform 6 and 7 get back to initial heeling condition by elastic recovery, can realize the inclination of magnetic sensor chip 2 and 3 with stable manner thus.
In addition, also can replace excrescence 13 and 14, realize the inclination of magnetic sensor chip 2 and 3 by utilizing from metal pattern E and the outstanding tilt pin (inclinationpins) of F.That is, when lead frame 10 was clipped between metal pattern E and the F, tilt pin was used to make platform 6 and 7 to tilt at cavity inside.
In the present embodiment, the end 12a of lead-in wire 12 is out of shape and reverses about axis L1, thereby platform 6 and 7 is tilted.Replace, by etching in advance half, the predetermined portions thickness corresponding to the lead frame 10 of axis L1 is reduced.
2 pairs of magnetic sensor chips are positioned at the magnetic factor sensitivity on the both direction of external magnetic field, and required be that magnetic sensor chip 2 is at least to the single magnetic factor sensitivity on the single direction that is positioned at the external magnetic field.Present embodiment has used two magnetic sensor chips 2 and 3; Yet the number of magnetic sensor chip need not be confined to two; Therefore, single magnetic sensor chip or three or more magnetic sensor chips can be attached in the Magnetic Sensor.
Basically design present embodiment and make two magnetic sensor chips 2 and 3 tilt about two axis L1 respectively, these two axis L1 are set parallel to each other.Can revise present embodiment and make two magnetic sensor chips 2 and 3 tilt about two back shafts respectively, these two back shafts are each other with right angle intersection.This makes two sensitive directions (direction A for example shown in Figure 1 and D) along the lower surface 5a of resin molded encapsulation 5, these two sensitive directions by two magnetic sensor chips 2 with 3 realize and be tilted with vertical mutually; Therefore, can measure the magnetic that is applied along the lower surface 5a of resin molded encapsulation 5 exactly.
The angle θ that required is between A-B plane and the C-D plane is greater than 0 ° and less than 90 °; In theory, as angle θ during, can measure the orientation of the earth magnetism in the three dimensions greater than 0 °.Yet in fact, preferably angle θ more preferably is that angle θ is greater than 30 ° greater than 20 °.
Present embodiment is suitable for surveying the Magnetic Sensor of magnetic force direction in three dimensions.Certainly, the application of present embodiment need not be confined to such Magnetic Sensor.In other words, present embodiment can provide can be in three dimensions various types of physical quantity transducers of directional bearing and direction.In addition, present embodiment can provide various acceleration transducers, and it has comprised the acceleration sensor chip of the value that is used to survey acceleration and direction but not magnetic sensor chip.
2. second embodiment
Next, the physical quantity transducer (that is Magnetic Sensor) of second embodiment of the invention is described with reference to Figure 13 to 22.Similar with first embodiment, the Magnetic Sensor of second embodiment is designed to by utilizing two magnetic sensor chips that tilt at a predetermined angle to measure the value of external magnetic field, wherein uses by carrying out pressure processing and the formed lead frame of etching is made described Magnetic Sensor on the metal sheet that is made of copper etc.
Figure 13 shows the structure of lead frame 101, this lead frame 101 is made of two platforms 107 and 109 (each all has rectangular shape in plane graph), framework 111 and lead-in wire (or interconnecting parts) 113, platform 107 and 109 is used for respectively that magnetic sensor chip (or physical quantity sensor chip) 103 and 105 is mounted thereto, framework 111 is used for support platform 107 and 109, lead-in wire 113 is used for platform 107 and 109 is interconnected with framework 111, wherein platform 107 and 109, framework 111 and interconnecting parts 113 formation integrally together.
By constituting framework 111 around the rectangular frame part 115 of platform 107 and 109 and from the inwardly outstanding a plurality of leads 117 and 119 of four limit 115a to 115d of rectangular frame part 115., be electrically connected, among the four limit 115a to 115d of rectangular frame part 115 each is provided with the lead-in wire 117 and 119 of predetermined number in order to set up with the bonding welding pad (not shown) of magnetic sensor chip 103 and 105 herein.
More than, from being parallel to both sides 115b and the outstanding lead-in wire 117 of 115d that the platform that two platforms 107 and 109 are set is provided with the rectangular frame part 115 of direction, with compare from other outstanding lead-in wires 119 of other both sides 115a of rectangular frame part 115 that direction is set perpendicular to platform and 115c, extend longlyer.
In addition, platform 107 and 109 has terminal 107b and 109b positioned opposite to each other respectively, and 107b and 109b place are interconnected platform 107 and 109 endways thereby wherein form two platform interconnect parts 121.Form platform interconnect part 121 in order to prevent platform 107 and 109 disadvantageous moving, wherein they are easily deformable.
Article four, interconnecting line 113 is inwardly outstanding towards other the terminal 107c and the 109c of platform 107 and 109 from four angle 115e, 115f, 115g and 115h of rectangular frame part 115, wherein be interconnected to the two ends of the terminal 107c of platform 107 respectively from two outstanding interconnecting lines 113 of two angle 115e and 115f, be interconnected to the two ends of the terminal 109c of platform 109 respectively from two angle 115g and two outstanding interconnecting lines 113 of 115h.Herein, the two ends of terminal 107c define the width of platform 107, and the two ends of terminal 109c define the width of platform 109.
Form four yielding parts 123 respectively at the tip near the interconnecting line 113 at the two ends of the two ends of terminal 107c and terminal 109c respectively.Herein, perpendicular to the thickness direction of rectangular frame part 115 respectively along terminal 107c and 109c two the reference line L1 that draw.Thereby the yielding part 123 that forms easy deformation changes the direction of platform 107 and 109 along reference line L1.Incidentally, reference line L1 is provided with direction perpendicular to the platform that is used for platform 107 and 109 and draws.
As shown in figure 14, by execution pressure processing and etching on the metal sheet 125 that constitutes by copper, and form a plurality of lead frames (each framework is all corresponding to lead frame 1) simultaneously.According to present embodiment, make a plurality of lead frames from the metal sheet 125 of monolithic, wherein the position of the number of lead frame and lead frame can be on demand by suitable change.Form a plurality of reach through holes 127 in the precalculated position, it passes the metal sheet 125 of each lead frame 1 periphery.
Then, the manufacture method of the Magnetic Sensor that uses lead frame 1 will be described in detail.
At first, in preparation process, provide lead frame 1 with said structure.In the platform inclination step, lead frame 1 is carried out pressure processing make platform 107 and 109 on direction, change also to tilt to rectangular frame part 115 about reference line L1 thus respectively, shown in Figure 15 and 16.Simultaneously, in the lead-in wire procedure of processing, lead-in wire 117 most advanced and sophisticated 117a is set respectively on the incline direction of platform 107 and 109, and described lead-in wire 117 is provided with the institute leaded 117 set on the direction chosen and be positioned near platform 107 and 109 from the platform that platform 107 and 109 are set.For simplicity, do not illustrate among Figure 15 along the set lead-in wire 117 of predetermined sides 115d of the rectangular frame part 115 relevant with platform 107 and 109; Yet in fact similar with the lead-in wire 117 that is provided with along another side 115b, lead-in wire 117 also is provided with along limit 115d.
In the platform inclination step, the yielding part 123 of interconnecting line 113 and platform interconnecting parts 121 suitable distortion owing to pressure processing; Therefore, platform 107 and 109 changes on direction respectively about reference line L1.In addition, compare with rectangular frame part 115, on the thickness direction of metal sheet 125, platform 107 and 109 terminal 107c and 109c move respectively on the position.
In the lead-in wire procedure of processing, the suitably bending owing to pressure processing of the mid portion of lead-in wire 117 makes most advanced and sophisticated 117a to be set up in a predetermined direction.
In order to make lead-in wire 117 more easily crooked in the pressure processing step, the lead-in wire 117 that preferably suitably is shaped shown in Figure 17 A and 17B, wherein forms recess 129 by photoetch at the front side and the rear side of the mid portion of lead-in wire 117.Selectively, for example, form recess 129 at the front side and the rear side of the yielding part 123 of interconnecting line 113 by photoetch.For example, can form at lead frame and carry out photoetch in the step, in this step, metal sheet 125 is configured as lead frame 101.
Shown in Figure 17 A and 17B, to compare with other parts of lead-in wire 117, recess 129 has reduced the relevant size of thickness with lead-in wire 117 mid portions that are bent.This has accurately set the height with respect to the most advanced and sophisticated 117a of the lead-in wire 117 of rectangular frame part 115.
Figure 15 and 16 shows the overall structure of the lead frame 1 of withstanding pressure processing, wherein the base portion 117b with lead-in wire 117 compares, on the thickness direction of rectangular frame part 115, the most advanced and sophisticated 117a of lead-in wire 117 moves on the position respectively, and the surperficial 117c that lead-in wire 117 most advanced and sophisticated 117a is set respectively is so that its rising, thereby platform 107 conforms to 109a with 109 surperficial 107a, and the surperficial 107a of platform 107 and 109 and 109a tilt for rectangular frame part 115 respectively at a predetermined angle.
After finishing platform inclination step and lead-in wire procedure of processing, as shown in figure 18, the metal sheet 125 that will have a plurality of lead frames 101 is fixed on the support unit 131.Support unit 131 comprises first utensil 133 and second utensil 135, and the metal sheet 125 that has a plurality of lead frames 101 in first utensil 133 is attached on the surperficial 133a, and second utensil 135 is used for the metal sheet 125 and first utensil 133 are fixed together.
On the surperficial 133a of first utensil 133, be formed with a plurality of platform support sections 137 and a plurality of excrescence 139, the number of platform support section 137 is corresponding to the number that is formed on the lead frame 101 on the metal sheet 125, and excrescence 139 is given prominence to and is inserted into respectively in the reach through hole 127 of metal sheet 125.
Each platform support section 137 has wedge-type shape, and this wedge shape has inclined-plane 137a and the 137b that is respectively arranged with platform 107 and 109 on it.Figure 18 accurately do not illustrate platform 107 and 109 and platform support section 137 between relation, wherein on the inclined-plane of platform support section 137 137a and 137b, also be provided with the most advanced and sophisticated 117a of the lead-in wire 117 that is provided with along the surperficial 107a of platform 107 and 109 and 109a.
By setting up wherein platform 107 and 109 and 117 states that are separately positioned on the platform support section 137 that go between, aspect position and gradient, can suitably keep platform 107 and 109 and 117 the most advanced and sophisticated 117a of going between.
On the surperficial 133a of the periphery 133b of first utensil 133, second utensil 135 is set, wherein locate second utensil 135 and make the tip coupling of itself and excrescence 139, the tip of described excrescence 139 is inserted in the reach through hole 127 among the periphery 125a that is formed at metal sheet 125, thereby has prevented that metal sheet 125 from unexpectedly getting loose from excrescence 139.First utensil 133 and second utensil 135 are used for betwixt fixedly metal sheet 125, and be wherein such as the fixture 138 of bolt that first utensil 133 and second utensil 125 is fixed with each other by using.
Shown in Figure 19 to 21, in the bonding step, magnetic sensor chip 103 and 105 is bonded to respectively on the surperficial 107a and 109a of platform 107 and 109 by using silver paste.In addition, in wiring step (wiring step), be electrically connected on the lead-in wire 117 and 119 via surperficial 103a and the bonding welding pad 141 on the 105a that wire 140 will be formed on magnetic sensor chip 103 and 105 thereby carry out the metal wire bond.By to causing inclination (or swing move) on the metal sheet 125 that is fixed to support unit 131, make the surperficial 109a maintenance level of surperficial 107a or platform 109 of platform 107, carry out above-mentioned bonding step and wiring step.
In the bonding step, chuck (collet) 143 is used for providing silver paste on the surperficial 107a of platform 107 and 109 and 109a.Chuck 143 is arranged in the vertical direction silver paste is provided downwards.In other words, in the bonding step, chuck 143 is orientated surperficial 107a and the 109a that is basically perpendicular to platform 107 and 109.Incidentally, carry out the bonding step based on the view data that produces by position cameras 145, thus adjust magnetic sensor chip 103 and 105 with platform 107 and 109 between the position concern.
In the wiring step, capillary 147 is used for the material that in the vertical direction provides wire 140 downwards.In other words, in the wiring step, capillary 147 is orientated surperficial 107a and the 109a that is basically perpendicular to platform 107 and 109.When the metal wire bond, capillary 147 moves between the bonding welding pad 141 of lead-in wire 117 and 119 most advanced and sophisticated 117a and 119a and magnetic sensor chip 103 and 105, via wire 140 magnetic sensor chip 103 and 105 is electrically connected to thus and goes between 117.Every wire 140 all has the fixing length irrelevant with the height (or vertical position) of bonding welding pad 141.
Use and the position cameras 145 similar preset devices that are used for the bonding step, carry out capillary 147, the most advanced and sophisticated 117a of lead-in wire 117 and the location adjustment between the bonding welding pad 141.Incidentally, position cameras 145 is installed in and comprises and be used for bonding step and the wiring chuck 143 of step and the same equipment of capillary 147.
Each surperficial 107a and 109a with respect to platform 107 and 109 carry out above-mentioned bonding step and wiring step independently.At first, as shown in figure 19, on the surperficial 107a of the platform 107 that is kept by level, carry out bonding step and wiring step.Afterwards, metal sheet 125 is tilted (or moving) thereby carries out the bonding step and the wiring step on the surperficial 109a of the platform 109 that is kept by level, as shown in figure 20.
Above-mentioned bonding step and wiring step can be owing to bonding or metal wire bond to magnetic sensor chip 103 and 105 cause heat and mechanical stress.For this reason, first utensil 133 of support unit 131 preferably by have for heat and mechanical stress enough repellences predetermined metal make.
After finishing bonding step and wiring step, take out metal sheet 125 from support unit 131; Then, as shown in figure 22, metal sheet 125 is clipped between the pair of metal mould E and F on the vertical direction.Lower metal mould E has flat surfaces E1, and this surface E1 is provided with rectangular frame part 115 and lead-in wire 119.Upper metal die F has a plurality of groove F2, and each groove caves in from surperficial F1.Therefore, the rectangular frame part 115 of metal sheet 125 is clipped under the condition between metal pattern E and the F therein, the fixing platform 107 of magnetic sensor chip 103 and 105, lead frame 101 and 109 and go between 117 and 119 respectively in the inside of groove F2.
Afterwards, the resin of fusing is injected into the resin that the flat surfaces E1 by the groove F2 of upper metal die F and lower metal mould E limited forms in the space (or cavity), wherein in molded step, will be formed for making magnetic sensor chip 103 and 105 to be embedded in wherein resin molded encapsulation.
In molded step, on the thickness direction of metal sheet 125, platform 107 and 109 moves on the position jointly with respect to rectangular frame part 115; Therefore, the resin of fusing is flowed towards the back side of platform 107 and 109 107d and 109d.As a result, can be at an easy rate fill gap between the flat surfaces E1 of the back side 107d of platform 107 and 109 and 109d and lower metal mould E with the resin of fusing.
Above-mentioned molded step has guaranteed that magnetic sensor chip 103 and 105 is fixed on the inside of resin molded encapsulation 149, and simultaneously magnetic sensor chip 103 and 105 tilts mutually with therebetween predetermined angular, shown in Figure 23 and 24.Here, thus preferably the material of high fluidity being used for resin makes the angle of inclination that sets for magnetic sensor chip 103 and 105 can be owing to resin flow changes.
At last, thus cutting rectangular frame part 115 separate interconnecting line 113 respectively and go between 117 and 119; Thus, can finish the manufacturing of Magnetic Sensor 150.
In the Magnetic Sensor of making as mentioned above 150, similar with above-mentioned rectangular frame part 115, resin molded encapsulation 149 has rectangular shape in plane graph.Herein, the back side 117d of lead-in wire 119 the back side and 117 the base portion 117b of going between is exposed on the lower surface 149a of resin molded encapsulation 149.In addition, the most advanced and sophisticated 117a of lead-in wire 117 is electrically connected on magnetic sensor chip 103 and 105 via wire 140, and wherein coupling part therebetween is embedded in the inside of resin molded encapsulation 149.
103 pairs of magnetic sensor chips are positioned at two magnetic factor sensitivities on the both direction of external magnetic field, realize two sensitive directions (being direction A and B) that are perpendicular to one another along the surperficial 103a of magnetic sensor chip 103 thus.
105 pairs of magnetic sensor chips are positioned at two magnetic factor sensitivities on the both direction of external magnetic field, realize two sensitive directions (being direction C and D) that are perpendicular to one another along the surperficial 105a of magnetic sensor chip 105 thus.
More than, direction A is parallel with the reference line L1 that is drawn about platform 107 and 109 with C, and wherein direction A and C are opposite each other.On the contrary, direction B is vertical with reference line L1 with D, and wherein direction B and D are opposite each other.
In addition, acute angle theta is formed between A-B plane and the C-D plane, and the A-B plane is limited by direction A and the B along the surperficial 103a of magnetic sensor chip 103, and the C-D plane is limited by direction C and the D along the surperficial 105a of magnetic sensor chip 105.
More than, be formed between A-B plane and the C-D plane angle θ greater than 0 ° but less than 90 °; In theory, as long as angle θ greater than 0 °, just can measure the orientation of the telluric magnetic force in the three dimensions.Yet, for the sensitivity sensing of minimum perpendicular to the telluric magnetic force vector on the direction on A-B plane or C-D plane and with littler Error Calculation telluric magnetic force vector, preferably angle θ is greater than 20 °.In order further to reduce the error of calculation, preferably angle θ is greater than 30 °.
Above-mentioned Magnetic Sensor 150 is installed in the portable terminal (not shown), and in this terminal equipment, Magnetic Sensor 150 is attached on plate or the analog.This portable terminal is designed on display floater to show the orientation by the measured telluric magnetic force of Magnetic Sensor 150.
According to the manufacture method of aforesaid lead frame 101 and Magnetic Sensor 150, before bonding step and wiring step, platform 107 and 109 is tilted in advance, and lead-in wire 117 is set on the incline direction of platform 107 and 109. Magnetic sensor chip 103 and 105 is bonded to respectively under the condition on platform 107 and 109 therein, and magnetic sensor chip 103 and 105 is electrically connected under the condition of lead-in wire on 117 via wire 140 therein, and this has guaranteed that platform 107 and 109 can unexpectedly not move with respect to framework 111.Therefore, when making Magnetic Sensor 150, can prevent reliably that disadvantageous stress is applied to magnetic sensor chip 103 and 105 and wire 140; Therefore, can easily avoid magnetic sensor chip 103 and 105 and lead-in wire 117 between the appearance of electrical connection fault.
In addition, lead-in wire 117 tip is parallel to the bonding wire 141 of the surperficial 107a that is installed in platform 107 and 109 and the magnetic sensor chip 103 on the 109a and 105 and is provided with.This has eliminated when the metal wire bond, about 117 needs that change the length of wire 140 respectively that go between.Therefore, can easily carry out the metal wire bond that is used for the tip of lead-in wire 117 is connected to bonding welding pad 140.
Can carry out platform inclination step and lead-in wire procedure of processing by pressure processing simultaneously; Therefore, can will go between at an easy rate at short notice 117 most advanced and sophisticated 117a is arranged on the predetermined altitude that the height with the bonding welding pad 141 of magnetic sensor chip 103 and 105 mates substantially.This has improved about the manufacturing efficient of Magnetic Sensor 150 and has reduced its manufacturing cost.
Because lead-in wire 117 most advanced and sophisticated 117a is arranged on the incline direction of platform 107 and 109, so can make lead-in wire 117 and be bonded to magnetic sensor chip 103 and 105 surperficial 103a and the distance minimization between the 105a on platform 107 and 109.In other words, in the wiring step, can reduce to be used for lead-in wire 117 is electrically connected to the length of the wire 140 of magnetic sensor chip 103 and 105; Therefore, can further reduce manufacturing cost about Magnetic Sensor 150.
In the present embodiment, metal sheet 125 is fixed to support unit 131, and is more specifically, all by the most advanced and sophisticated 117a and the framework 111 of first utensil, 133 overall support platforms 107 and 109, lead-in wire 117.The bonding step and the wiring step in, can prevent platform 107 and 109 and go between 117 unexpectedly the fracture; Therefore, can carry out from the bonding of magnetic sensor chip 103 and 105 on platform 107 and 109, and can will go between with stable manner and 117 and 119 be electrically connected on magnetic sensor chip 103 and 105 with stable manner.This make it possible to avoid reliably magnetic sensor chip 103 and 105 and lead-in wire 117 between the generation of electrical connection fault.In addition, magnetic sensor chip 103 and 105 can be remained on predetermined angle of inclination; Thus, can provide high-precision Magnetic Sensor 150.
In addition, in bonding step and wiring step, (or moving) metal sheet 125 that suitably tilts in response to the angle of inclination of platform 107 and 109 respectively, wherein chuck 143 and capillary 147 are oriented respectively perpendicular to the surperficial 107a of platform 107 and 109 and the surperficial 103a and the 105a of 109a and magnetic sensor chip 103 and 105.This makes it possible to carry out required configuration and adjustment in bonding step and the wiring step on preset device; More specifically, can easily settle and set up chuck 143 and capillary 147.For example, can make position cameras 145 focus on the surperficial 107a of platform 107 and 109 at an easy rate and 109a goes up and the surperficial 103a and 105a of magnetic sensor chip 103 and 105 on.
Present embodiment is designed such that carries out bonding step and wiring step respectively on the platform 107 and 109 of its surperficial 107a and 109a maintenance level.Can revise present embodiment and make and carrying out the bonding step, on platform 107 and 109, carry out the wiring step with after being bonded to magnetic sensor chip 103 and 105 on platform 107 and 109 respectively.
When using identical device to carry out bonding step and wiring step, preferably on platform 107, carry out bonding step and wiring step, then, on platform 109, carry out bonding step and wiring step.In this case, can reduce to make the number of times of metal sheet 125 inclinations (or moving); Therefore, can improve manufacturing efficient about Magnetic Sensor 150.
Present embodiment has been described in the bonding step, uses silver paste that magnetic sensor chip 103 and 105 is bonded on the surperficial 107a and 109a of platform 107 and 109.Certainly, present embodiment need not be confined to this mode.In other words, present embodiment only needs magnetic sensor chip 103 and 105 to be bonded on platform 107 and 109.
For example, in the bonding step, can utilize to be used for magnetic sensor chip 103 and 105 is bonded to bonding sheet on platform 107 and 109, i.e. chip bonding band 151 (seeing Figure 25 and 26).More specifically, can be with single bonding sheet, chip bonding band 151 promptly shown in Figure 26 is used for two platforms 107 and 109, and wherein two magnetic sensor chips 103 and 105 are attached on the surface of chip bonding band 151.
In chip bonding band 151, form pair of notches 153 in the zone line between magnetic sensor chip 103 and 105, wherein, be formed with preset distance between the pair of notches 153 being provided with perpendicular to platform on the direction of direction.When chip bonding band 151 is arranged on the position with platform 107 and 109 couplings, platform interconnect part 121 respectively with otch 153 engagements.In other words, when chip bonding band 151 was arranged on the position with platform 107 and 109 couplings, otch 153 played and set up the effect of locating between chip bonding band 151 and platform 107 and 109.
Incidentally, preferably before the bonding step, magnetic sensor chip 103 and 105 is bonded on the surface of chip bonding band 151.
Even platform 107 and 109 has different angles of inclination, also can be only it is conformed to 109a with 109 surperficial 107a with platform 107 and at an easy rate magnetic sensor chip 103 and 105 be set on platform 107 and 109 by positioning chip bonding tape 151.In addition, can accurately set up about waiting to be attached to magnetic sensor chip 103 on platform 107 and 109 and 105 mutual location.
Therefore, about Magnetic Sensor 150, can realize higher precision.Owing to magnetic sensor chip 103 and 105 easily can be set on platform 107 and 109, can improve manufacturing efficient about Magnetic Sensor 150.
Above-mentioned modification makes it possible to utilize otch 153 and platform interconnecting parts 121 that chip bonding band 151 and magnetic sensor chip 103 and 105 are accurately positioned about platform 107 and 109.This has eliminated and made the needs of metal sheet 125 with respect to first utensil, 133 inclinations (or moving) in the bonding step.
Present embodiment has been described and carried out platform inclination step and lead-in wire procedure of processing after preparation lead frame 101.Certainly, present embodiment need not be confined to this mode.In other words, platform inclination step and lead-in wire procedure of processing can be carried out simultaneously with the preparation of lead frame 101.
Present embodiment has been described surperficial 107a and the 109a setting of the surperficial 117c of the most advanced and sophisticated 117a of the lead-in wire 117 of suitable bending in the lead-in wire procedure of processing along platform 107 and 109.Present embodiment need not be confined to this mode.In other words, surperficial 117c can be arranged to be higher than surperficial 107a and 109a, and wherein preferably surperficial 117c is parallel to surperficial 107a and 109a and tilts.
More than, the surperficial 117c of 117 the most advanced and sophisticated 117a of can reducing to go between and be attached to magnetic sensor chip 103 on platform 107 and 109 and the distance between 105 the surface; Therefore, can further reduce length wiry.
Present embodiment can be modified shown in Figure 27 and 28, is wherein represented by identical Reference numeral corresponding to the part of above-mentioned part (being the part of lead frame 101 and Magnetic Sensor 150); Therefore, will omit detailed description.
In other words, in the improvement shown in Figure 27 and 28, provide a pair of magnetic sensor chip 155 and 156, wherein formed projection electrode on the formed pad on the surface of magnetic sensor chip 155 and 156.General structure according to this improved Magnetic Sensor can realize so-called surface installing type encapsulation, such as flip-chip and chip size packages (CSP).More specifically, form soldered ball (as projection electrode) 159 on the back side 155a of the magnetic sensor chip 155 that is provided with and 156 and the 156a at combined leads framework 157, each soldered ball 159 is all made by scolder is formed sphere.Soldered ball 159 is electrically connected on the lead-in wire 161 and 162 of lead frame 157.
On metal sheet, form a plurality of lead frames, each lead frame is all corresponding to the lead frame 157 with two magnetic sensor chips 155 and 156, wherein lead frame 157 is made of rectangular frame part 163 and framework 165, rectangular frame part 163 has rectangular shape in plane graph, and framework 165 has the inwardly outstanding a plurality of leads 161 and 162 from four limit 163a to 163d of rectangular frame part 163.Lead-in wire 161 and 162 most advanced and sophisticated 161a and 162a are set to respectively on the position to be complementary with the soldered ball 159 of magnetic sensor chip 155 and 156.
When make using the Magnetic Sensor of above-mentioned lead frame 157, in preparation process, provide lead frame 157 and two magnetic sensor chips 155 and 156; Then, in the lead-in wire procedure of processing,, lead frame 157 tilts at a predetermined angle with respect to the flat surfaces of rectangular frame part 163 thereby being carried out surface that pressure processing makes lead-in wire 161 and 162 most advanced and sophisticated 161a and 162a.Under this condition, the surface of the most advanced and sophisticated 161a of lead-in wire 161 is with respect to the surface tilt of the most advanced and sophisticated 162a of lead-in wire 162, the surface of the most advanced and sophisticated 161a of lead-in wire 161 is used to be provided with the soldered ball 159 of magnetic sensor chip 155, and the surface of the most advanced and sophisticated 162a of lead-in wire 162 is used to be provided with the soldered ball 159 of magnetic sensor chip 156.
As above in conjunction with second embodiment described, in the lead-in wire procedure of processing, lead-in wire 161 and 162 mid portion is crooked respectively, thereby makes described tip be arranged on and simultaneously with respect to the flat surfaces inclination of rectangular frame part 163 on identical the plane in.
After finishing the lead-in wire procedure of processing, lead frame 157 (seeing Figure 18) is installed on first utensil 133.Under this condition, on the surperficial 133a of first utensil 133, rectangular frame part 163 is set, the most advanced and sophisticated 161a and the 162a of lead-in wire 161 and 162 wherein are set respectively on the inclined surface 137a of platform support section 137 and 137b, make the most advanced and sophisticated 161a and the 162a of lead-in wire 161 and 162 be held in a predetermined position with under the heeling condition.
In the above conditions, in bonding-wiring step, the soldered ball 159 of magnetic sensor chip 155 and 156 is bonded on the most advanced and sophisticated 161a and 162a of lead-in wire 161 and 162.In bonding-wiring step, the surface of the initial lead-in wire 161 that tilts with respect to rectangular frame part 163 in a predetermined direction is held horizontally, and is connected to magnetic sensor chip 155 then.Afterwards, lead frame 157 tilts (or moving) with first utensil 133, makes the surface of the initial lead-in wire 162 that tilts with respect to rectangular frame part 163 on other direction be held horizontally, and is connected to magnetic sensor chip 156 then.
Afterwards, similar with second embodiment, be formed for magnetic sensor chip 155 and 156 is embedded in resin molded encapsulation in the resin thereby carry out molded step.At last, isolate lead-in wire 161 and 162 respectively, finish the manufacturing of Magnetic Sensor (not shown) thus thereby cut rectangular frame part 163.
In the manufacture method of the Magnetic Sensor of above-mentioned use lead frame 157, similar with second embodiment, before bonding-wiring step, a plurality of leads 161 and 162 are set on the incline direction of platform. Magnetic sensor chip 155 and 156 soldered ball 159 are bonded under the condition on the lead-in wire 161 and 162 therein, and this prevented from reliably to go between most advanced and sophisticated 161a and 162a of 161 and 162 unexpectedly move with respect to rectangular frame part 163.In other words, can prevent from stress is applied on the soldered ball 159, described soldered ball 159 as magnetic sensor chip 155 and 156 with 161 and 162 most advanced and sophisticated 161a and the coupling part between the 162a of going between; Therefore, can prevent reliably that soldered ball 159 and the most advanced and sophisticated 161a and the 162a of lead-in wire 161 and 162 from unexpectedly separating.In brief, may avoid magnetic sensor chip 155 and 156 and lead-in wire 161 and 162 between the generation of electrical connection fault.
Above-mentioned improved advantage shown in Figure 27 and 28 is, by simply magnetic sensor chip 155 and 156 being arranged on the lead frame 157, magnetic sensor chip 155 and 156 can be connected to fully lead-in wire 161 and 162.Therefore, compare with second embodiment, this improvement example does not need the bonding step of execution separately.Therefore, can further improve manufacturing efficient about Magnetic Sensor.
In addition, most advanced and sophisticated 161a by first utensil, 133 overall supporting wires 161 and 162 and 162a and rectangular frame part 163 are all.In bonding-wiring step, 161 and 162 distortion reliably can prevent to go between; Therefore, can carry out bonding with stable manner about magnetic sensor chip 155 and 156; And, can magnetic sensor chip 155 and 156 be electrically connected to lead-in wire 161 and 162 with stable manner.This avoided reliably magnetic sensor chip 155 and 156 and lead-in wire 161 and 162 between the generation of electrical connection fault. Magnetic sensor chip 155 and 156 can be remained on predetermined angle of inclination.Therefore, can use lead frame 157 to make high-precision Magnetic Sensor.
In addition, when the Magnetic Sensor that will comprise magnetic sensor chip 155 and 156 is sealed in the chip size packages, the advantage of this improvement example is, compares with the encapsulation that comprises the magnetic sensor chip 155 and 156 second embodiment, and the size of this Magnetic Sensor can reduce and extremely difficult being damaged.
In improving example, magnetic sensor chip 155 and 156 has soldered ball 159.Certainly, present embodiment need not be confined to this mode, wherein only needs the back side 155a and the 156a that make projection electrode be formed on magnetic sensor chip 155 and 156 to go up and make it to be electrically connected to lead-in wire 161 and 162.
As mentioned above, framework 111 has the rectangular frame part 115 or 157 of rectangular shaped in plane graph.Certainly, present embodiment need not be confined to this mode, wherein only needs framework 111 to have and can make lead-in wire 117 and 119 from its certain inwardly outstanding frame structure.In other words, this frame structure can form different shape, such as circle in the plane graph and 3D shape.
Present embodiment has been described platform 107 and 109 and all formed rectangle in plane graph, but is not limited thereto, and wherein only needs surperficial 107a and 109a suitably to be shaped to allow magnetic sensor chip 103 and 105 to be bonded on it.In other words, each platform 107 and 109 can be formed and rounded or oval in plane graph.Selectively, each platform 107 and 109 can form to has on thickness direction from its hole of passing, and perhaps forms netted shape.
Present embodiment has been described magnetic sensor chip (103,105,155 and 156), and lead-in wire (117,119,161 and 162) and platform (107 and 109) all integrally are fixed on the inside of resin molded encapsulation (149), but are not limited thereto.Replace, can use box-like encapsulation to unify to store and overall fixed magnetic sensor chip, lead-in wire and platform with inner space.
As mentioned above, present embodiment is applicable to the Magnetic Sensor of surveying magnetic force direction in three dimensions, but is not limited thereto.In other words, present embodiment can be used in the physical quantity transducer of measuring any kind of orientation and direction in three dimensions.Certainly, present embodiment can be used in the value of detection acceleration and the acceleration transducer that comprises acceleration sensor chip of direction.
With reference to the accompanying drawings by case description the present invention, but various modification and design variation will fall within the scope of the present invention.
Claims (11)
1. physical quantity transducer comprises:
A plurality of leads, the base portion of described a plurality of leads are arranged in the identical plane; And
At least one physical quantity sensor chip is formed with a plurality of electrode pads and described physical quantity sensor chip with respect to described plane inclination in described physical quantity sensor chip,
Wherein said a plurality of electrode pad is arranged on the incline direction of described physical quantity sensor chip and via many wire and is connected respectively to described a plurality of leads, the Distance Matching between the length of described many wire and its electrode pad that is connected and the described lead-in wire.
2. physical quantity transducer according to claim 1, the tip of wherein standing the described lead-in wire of metal wire bond has different height, the matched of passing through the connected electrode pad of wire on this height and the described physical quantity sensor chip that is arranged on inclination.
3. physical quantity transducer according to claim 1, wherein said physical quantity sensor chip is installed on the platform, and this platform is with respect to described plane inclination.
4. physical quantity transducer according to claim 1, wherein said tip of standing the lead-in wire of metal wire bond have the differing heights that is lower than the electrode pad on the described physical quantity sensor chip that is arranged on inclination, and described electrode pad links to each other with this lead-in wire.
5. the manufacture method of a physical quantity transducer, this physical quantity transducer comprises: a plurality of leads, the base portion of described a plurality of leads are arranged in the identical plane; And, at least one physical quantity sensor chip, in described physical quantity sensor chip, be formed with a plurality of electrode pads and described physical quantity sensor chip with respect to described plane inclination, wherein said a plurality of electrode pad is arranged on the incline direction of described physical quantity sensor chip and via many wire and is connected respectively to described a plurality of leads, Distance Matching between the length of described many wire and its electrode pad that is connected and the described lead-in wire, described manufacture method may further comprise the steps:
Form lead frame, this lead frame comprises frame part, at least one platform that is surrounded by described lead-in wire, and be used for a plurality of interconnecting parts of described platform interconnect to described frame part;
Described physical quantity sensor chip is bonded on the described platform;
Thereby carrying out the metal wire bond utilizes described wire described lead-in wire to be connected to electrode pad on the described physical quantity sensor chip that is installed on the described platform; And
Described platform is tilted with respect to described frame part at a predetermined angle with described physical quantity sensor chip, make described interconnecting parts distortion simultaneously.
6. the manufacture method of physical quantity transducer according to claim 5, the tip of wherein standing the described lead-in wire of described metal wire bond has different height, described height and the matched of passing through the connected electrode pad of wire that is arranged on the described physical quantity sensor chip of inclination.
7. the manufacture method of physical quantity transducer according to claim 5, wherein being provided with on the direction of the electrode pad on the described physical quantity sensor chip that tilts uses described wire to carry out described metal wire bond.
8. the manufacture method of physical quantity transducer according to claim 5, wherein before described metal wire bond, described physical quantity sensor chip is tilted with described platform, and, wherein process described lead-in wire and make the height at tip of described lead-in wire be changed, thereby the height at tip that makes described lead-in wire conforms to position by the connected described electrode pad of wire when described physical quantity sensor chip tilts.
9. the manufacture method of a physical quantity transducer, this physical quantity transducer comprises: a plurality of leads, the base portion of described a plurality of leads are arranged in the identical plane; And, at least one physical quantity sensor chip, in described physical quantity sensor chip, be formed with a plurality of electrode pads and described physical quantity sensor chip with respect to described plane inclination, wherein said a plurality of electrode pad is arranged on the incline direction of described physical quantity sensor chip and via many wire and is connected respectively to described a plurality of leads, Distance Matching between the length of described many wire and its electrode pad that is connected and the described lead-in wire, described manufacture method may further comprise the steps:
Form lead frame, this lead frame comprises frame part, at least one platform that is surrounded by described lead-in wire, and be used for a plurality of interconnecting parts of described platform interconnect to described frame part;
Described physical quantity sensor chip is bonded on the described platform;
Described platform is tilted with respect to described frame part at a predetermined angle with described physical quantity sensor chip, make described interconnecting parts distortion simultaneously;
Thereby carrying out the metal wire bond utilizes described wire described lead-in wire to be connected to electrode pad on the described physical quantity sensor chip that is installed on the described platform.
10. the manufacture method of physical quantity transducer according to claim 9, the tip of wherein standing the described lead-in wire of described metal wire bond has different height, the matched of passing through the connected electrode pad of wire on this height and the described physical quantity sensor chip that is arranged on inclination.
11. the manufacture method of physical quantity transducer according to claim 9, wherein after forming described lead frame and make before the described physical quantity sensor chip inclination, process described lead-in wire and make the height at tip of described lead-in wire be changed, thereby the position of passing through the connected described electrode pad of wire on the described physical quantity sensor chip of height and inclination at tip of described lead-in wire is conformed to.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP263881/04 | 2004-09-10 | ||
| JP2004263881A JP4487696B2 (en) | 2004-09-10 | 2004-09-10 | Physical quantity sensor and method of manufacturing physical quantity sensor |
| JP374105/04 | 2004-12-24 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810082013.2A Division CN101656242A (en) | 2004-09-10 | 2005-09-12 | Lead frame for physical quantity sensor, and manufacturing method therefor |
Publications (2)
| Publication Number | Publication Date |
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| CN1747164A CN1747164A (en) | 2006-03-15 |
| CN100447996C true CN100447996C (en) | 2008-12-31 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN200810082013.2A Pending CN101656242A (en) | 2004-09-10 | 2005-09-12 | Lead frame for physical quantity sensor, and manufacturing method therefor |
| CNB200510103844XA Expired - Fee Related CN100447996C (en) | 2004-09-10 | 2005-09-12 | Physical quantity sensor, lead frame, and manufacturing method therefor |
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| Application Number | Title | Priority Date | Filing Date |
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| CN200810082013.2A Pending CN101656242A (en) | 2004-09-10 | 2005-09-12 | Lead frame for physical quantity sensor, and manufacturing method therefor |
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| JP (1) | JP4487696B2 (en) |
| CN (2) | CN101656242A (en) |
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| JP5622347B2 (en) * | 2006-08-09 | 2014-11-12 | セイコーエプソン株式会社 | Inertial sensor device |
| US9121880B2 (en) | 2011-11-04 | 2015-09-01 | Infineon Technologies Ag | Magnetic sensor device |
| US9201123B2 (en) | 2011-11-04 | 2015-12-01 | Infineon Technologies Ag | Magnetic sensor device and a method for fabricating the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6035712A (en) * | 1997-03-14 | 2000-03-14 | Denso Corporation | Sensor device and method of producing the same using lead frame |
| US6115261A (en) * | 1999-06-14 | 2000-09-05 | Honeywell Inc. | Wedge mount for integrated circuit sensors |
| CN1490632A (en) * | 2002-07-29 | 2004-04-21 | ������������ʽ���� | Magnetic sensor producing method and lead wire frame |
-
2004
- 2004-09-10 JP JP2004263881A patent/JP4487696B2/en not_active Expired - Fee Related
-
2005
- 2005-09-12 CN CN200810082013.2A patent/CN101656242A/en active Pending
- 2005-09-12 CN CNB200510103844XA patent/CN100447996C/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6035712A (en) * | 1997-03-14 | 2000-03-14 | Denso Corporation | Sensor device and method of producing the same using lead frame |
| US6115261A (en) * | 1999-06-14 | 2000-09-05 | Honeywell Inc. | Wedge mount for integrated circuit sensors |
| CN1490632A (en) * | 2002-07-29 | 2004-04-21 | ������������ʽ���� | Magnetic sensor producing method and lead wire frame |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4487696B2 (en) | 2010-06-23 |
| CN101656242A (en) | 2010-02-24 |
| CN1747164A (en) | 2006-03-15 |
| JP2006080358A (en) | 2006-03-23 |
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