CN109713092A - The encapsulating structure of UV LED and the packaging method of UV LED - Google Patents
The encapsulating structure of UV LED and the packaging method of UV LED Download PDFInfo
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- CN109713092A CN109713092A CN201811637497.2A CN201811637497A CN109713092A CN 109713092 A CN109713092 A CN 109713092A CN 201811637497 A CN201811637497 A CN 201811637497A CN 109713092 A CN109713092 A CN 109713092A
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- package
- box dam
- led
- die bond
- package substrate
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Abstract
This application provides the encapsulating structures of UV LED, UV LED chip including package substrate, on the upside of package substrate and the package for being located in UV LED chip and being tightly connected with package substrate, package include being tightly connected with package substrate and encapsulating the glass lens of box dam upper end around the encapsulation box dam of UV LED chip and melting sealed be set to.This application provides the packaging methods of UV LED, comprising the following steps: carries out die bond operation or die bond bonding wire operation to UV LED chip on package substrate；Glass lens is tightly connected by melting sealed mode and encapsulation box dam to form package；Package is covered at by being tightly connected in the UV LED chip of die bond operation or die bond bonding wire operation and with package substrate.Package be first pass through high-temperature fusion in advance by encapsulation box dam and glass lens and be sealed connected together to be formed, therefore need not on the package substrate for being equipped with UV LED chip high-temperature soldering glass lens, prevent high temperature from causing to damage to UV LED chip, guarantee product quality.
Description
[technical field]
This application involves the packaging methods of the encapsulating structure and UV LED of LED manufacture technology field more particularly to UV LED.
[background technique]
In existing UV LED encapsulation technology, due to the relationship of UV LED encapsulation structure, in order to guarantee packaging air tightness, glass
Glass lens need to be encapsulated in by way of high-temperature soldering on the carrier equipped with UV LED chip, but encapsulate by glass lens
During, the mode of high-temperature soldering is easy to damage UV LED chip, to be easy to influence the quality of product, or even can make product
It scraps, is unfavorable for improving the productivity effect of enterprise.
[summary of the invention]
To solve the above-mentioned problems, this application provides encapsulating the UV that will not cause damage when production to UV LED chip
The encapsulating structure of LED and the packaging method of UV LED.
The application is implemented by the following technical solutions:
The encapsulating structure of UV LED, UV LED chip including package substrate, on the upside of the package substrate and is provide with
The package being tightly connected in the UV LED chip and with the package substrate, the package include and the encapsulation base
Plate is tightly connected and around the encapsulation box dam of UV LED chip and the melting sealed glass for being set to the encapsulation box dam upper end
Lens.
The encapsulating structure of UV LED as described above, the encapsulation box dam and the package substrate are connected by glue sealing
It connects.
The upper end of the encapsulating structure of UV LED as described above, the encapsulation box dam is equipped with for being coupled the glass
The installation step of lens.
The encapsulating structure of UV LED as described above, the upside of the package substrate are equipped with the mutually independent die bond gold of muti-piece
Belong to block, the UV LED chip is set on the die bond metal block, and it is mutually independent that the downside of the package substrate is equipped with muti-piece
Bottom metal block, the package substrate are logical equipped with multiple installations communicated with the die bond metal block and the bottom metal block
Hole, the installation through-hole is interior to be equipped with the conductive column being connected with the die bond metal block and the bottom metal block.
The encapsulating structure of UV LED as described above, the encapsulation box dam are made of ceramics or metal.
The outer surface of the encapsulating structure of UV LED as described above, the encapsulation box dam is equipped with thermal expansion coefficient and the glass
The similar thermal expansion coefficient of glass lens or identical metal layer, the encapsulation box dam is by way of fusion weld and glass lens
It is tightly connected.
The encapsulating structure of UV LED as described above, the encapsulation box dam are made of glass, the encapsulation box dam with it is described
Glass lens forms the package by integrated molten sintering.
Present invention also provides the packaging methods of UV LED, comprising the following steps:
Die bond operation or die bond bonding wire operation are carried out to UV LED chip on package substrate；
Glass lens is tightly connected by melting sealed mode and encapsulation box dam to form package；
The package cover at by the UV LED chip of die bond operation or die bond bonding wire operation and and package substrate
It is tightly connected.
The packaging method of UV LED as described above is covered in the package by die bond operation or die bond bonding wire work
In in the UV LED chip of industry and the step of sealed connection with package substrate, the package is sealed by glue and package substrate
Connection.
The packaging method of UV LED as described above passes through melting sealed mode and encapsulation box dam in the glass lens
Be tightly connected to form package the step of in, the package by glass lens by way of fusion weld with encapsulation box dam
Sealed connection is formed or is formed with encapsulation box dam by integrated molten sintering by glass lens.
Compared with prior art, the application has the following advantages:
In the encapsulating structure of this UV LED, since package is to first pass through high-temperature fusion in advance by encapsulation box dam and glass lens
The mode of sealing, which is sealed connected together, to be formed by, as long as and the encapsulating structure of this UV LED package is sealingly mounted at envelope
The packaging operation of glass lens can be completed on dress substrate, so height need not be passed through on the package substrate for being equipped with UV LED chip
The mode of temperature welding directly seals installation glass lens, effectively prevents to cause the bad existing of damage to UV LED chip due to high temperature
As so that the quality of production of product be effectively ensured, manufacturing scrap rate is effectively reduced and improve the productivity effect of enterprise.
[Detailed description of the invention]
In order to more clearly explain the technical solutions in the embodiments of the present application, make required in being described below to embodiment
Attached drawing is briefly described.
Fig. 1 is the schematic diagram of the encapsulating structure of UV LED；
Fig. 2 is the explosive decomposition schematic diagram one of Fig. 1；
Fig. 3 is the explosive decomposition schematic diagram two of Fig. 1.
[specific embodiment]
The encapsulating structure of UV LED as shown in Figure 1 to Figure 3, including package substrate 1, it is set to 1 upside of the package substrate
UV LED chip 2 and the package 3 that is located in the UV LED chip 2 and is tightly connected with the package substrate 1, it is described
Package 3 includes being tightly connected with the package substrate 1 and around the encapsulation box dam 31 of UV LED chip 2 and melting sealed setting
It is placed in the glass lens 32 of encapsulation 31 upper end of box dam.
In the encapsulating structure of this UV LED, since package is to first pass through high-temperature fusion in advance by encapsulation box dam and glass lens
The mode of sealing, which is sealed connected together, to be formed by, as long as and the encapsulating structure of this UV LED package is sealingly mounted at envelope
The packaging operation of glass lens can be completed on dress substrate, so height need not be passed through on the package substrate for being equipped with UV LED chip
The mode of temperature welding directly seals installation glass lens, effectively prevents to cause the bad existing of damage to UV LED chip due to high temperature
As so that the quality of production of product be effectively ensured, manufacturing scrap rate is effectively reduced and improve the productivity effect of enterprise.
For the ease of steadily package is sealingly mounted on package substrate, specifically, the encapsulation box dam 31 and institute
Package substrate 1 is stated to connect by glue sealing.Package will not be gone out by the connection type that glue is tightly connected with package substrate
The bad phenomenon of existing high-temperature damage UV LED chip, is further effectively ensured the quality of production of product.
Glass lens is placed on glass box dam for convenience, the upper end of the encapsulation box dam 31 is equipped with for cooperating peace
Fill the installation step 311 of the glass lens 32.
For the ease of lighting UV LED chip, the upside of the package substrate 1 is equipped with the mutually independent die bond metal of muti-piece
Block 4, the UV LED chip 2 are set on the die bond metal block 4, are additionally provided on the die bond metal block 4 for lighting UV
The lighting circuit of LED chip and including electronic components such as inductance, capacitor and thermal sensors, the package 3 is located at encapsulation
The electronic components such as die bond metal block 4, UV LED chip 2, lighting circuit and inductance, capacitor, thermal sensor are provide with when on substrate 1
In the inner.The downside of the package substrate 1 is equipped with the mutually independent bottom metal block 5 of muti-piece, and the package substrate 1 is equipped with more
A installation through-hole 11 communicated with the die bond metal block 4 and the bottom metal block 5, is equipped in the installation through-hole 11 and institute
State the conductive column 6 that die bond metal block 4 and the bottom metal block 5 are connected.
Further, the encapsulation box dam 31 is made of ceramics or metal, in order to ensure glass lens 32 and encapsulation box dam
Welding airtightness between 31 satisfies the use demand, and the outer surface of the encapsulation box dam 31 is equipped with thermal expansion coefficient and the glass
The similar thermal expansion coefficient of lens 32 or identical metal layer, metal layer is differed with the thermal expansion coefficient of glass lens to be no more than
6%, such as molybdenum layer and tungsten layer.The encapsulation box dam 31 is tightly connected by way of fusion weld with glass lens 32.
In addition, the encapsulation box dam 31 can also be made of glass for the ease of processing, the encapsulation box dam 31 and the glass
Glass lens 32 form the package 3 by integrated molten sintering.
The present embodiment additionally provides the packaging method of UV LED, comprising the following steps:
Die bond operation or die bond bonding wire operation are carried out to UV LED chip 2 on package substrate 1；
Glass lens 32 is tightly connected by melting sealed mode and encapsulation box dam 31 to form package 3；
The package 3 cover at by the UV LED chip 2 of die bond operation or die bond bonding wire operation and with encapsulation base
Plate 1 is tightly connected.
Further, it covers in the package 3 by the UV LED chip 2 of die bond operation or die bond bonding wire operation
And in the step of being tightly connected with package substrate 1, the package 3 is tightly connected by glue and package substrate 1.
Further, it is tightly connected in the glass lens 32 by melting sealed mode and encapsulation box dam 31 to be formed
In the step of package 3, the package 3 is tightly connected by way of fusion weld with encapsulation box dam 31 by glass lens 32
It is formed or is formed with encapsulation box dam 31 by integrated molten sintering by glass lens 32.
The present embodiment working principle is as follows:
Due in the encapsulating structure of the UV LED of the present embodiment, encapsulate box dam and glass lens to first pass through high-temperature fusion in advance close
The mode of envelope is sealed connected together to form package, and package can be connected to package substrate by common sealed connection mode
Together, therefore without directly sealing installation glass is saturating by way of high-temperature soldering on the package substrate for being equipped with UV LED chip
Mirror effectively prevents the bad phenomenon for causing damage to UV LED chip due to high temperature, so that the quality of production of product is effectively ensured,
Manufacturing scrap rate is effectively reduced and improves the productivity effect of enterprise.
It is a kind of embodiment provided in conjunction with particular content as described above, does not assert the specific implementation office of the application
It is limited to these explanations.It is all approximate with the present processes, structure etc., identical, if or for being made under the application concept thereof
Dry technology deduction or replace, all should be considered as the protection scope of the application.
Claims (10)
- The encapsulating structure of 1.UV LED, which is characterized in that including package substrate (1), the UV being set on the upside of the package substrate (1) LED chip (2) and the package (3) for being located on the UV LED chip (2) and being tightly connected with the package substrate (1), The package (3) include with the package substrate (1) be tightly connected and around UV LED chip (2) encapsulation box dam (31) with And the melting sealed glass lens (32) for being set to described encapsulation box dam (31) upper end.
- 2. the encapsulating structure of UV LED according to claim 1, which is characterized in that the encapsulation box dam (31) and the envelope Substrate (1) is filled to connect by glue sealing.
- 3. the encapsulating structure of UV LED according to claim 1, which is characterized in that the upper end of encapsulation box dam (31) is set There is the installation step (311) for being coupled the glass lens (32).
- 4. the encapsulating structure of UV LED according to claim 1, which is characterized in that set on the upside of the package substrate (1) There is the mutually independent die bond metal block (4) of muti-piece, the UV LED chip (2) is set on the die bond metal block (4), the envelope The downside for filling substrate (1) is equipped with the mutually independent bottom metal block (5) of muti-piece, and the package substrate (1) is equipped with multiple and institute State the installation through-hole (11) that die bond metal block (4) and the bottom metal block (5) communicate, be equipped in the installation through-hole (11) with The conductive column (6) that the die bond metal block (4) and the bottom metal block (5) are connected.
- 5. the encapsulating structure of UV LED according to claim 1, which is characterized in that the encapsulation box dam (31) by ceramics or Metal is made.
- 6. the encapsulating structure of UV LED according to claim 5, which is characterized in that the outer surface of encapsulation box dam (31) Similar thermal expansion coefficient or identical metal layer equipped with thermal expansion coefficient and the glass lens (32), the encapsulation box dam (31) it is tightly connected by way of fusion weld with glass lens (32).
- 7. the encapsulating structure of UV LED according to claim 1, which is characterized in that the encapsulation box dam (31) is by glass system At the encapsulation box dam (31) forms the package (3) by integrated molten sintering with the glass lens (32).
- The packaging method of 8.UV LED, which comprises the following steps:Die bond operation or die bond bonding wire operation are carried out to UV LED chip (2) on package substrate (1)；Glass lens (32) is tightly connected by melting sealed mode and encapsulation box dam (31) to form package (3)；The package (3) cover at by the UV LED chip (2) of die bond operation or die bond bonding wire operation and with encapsulation base Plate (1) is tightly connected.
- 9. the packaging method of UV LED according to claim 8, which is characterized in that the package (3) cover at through It is described in the step of crossing in the UV LED chip (2) of die bond operation or die bond bonding wire operation and being tightly connected with package substrate (1) Package (3) is tightly connected by glue and package substrate (1).
- 10. the packaging method of UV LED according to claim 8, which is characterized in that pass through in the glass lens (32) In the step of melting sealed mode and encapsulation box dam (31) is tightly connected to form package (3), the package (3) is by glass Glass lens (32) are tightly connected with encapsulation box dam (31) by way of fusion weld and are formed or by glass lens (32) and envelope Dress box dam (31) passes through integrated molten sintering and is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811637497.2A CN109713092A (en) | 2018-12-29 | 2018-12-29 | The encapsulating structure of UV LED and the packaging method of UV LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811637497.2A CN109713092A (en) | 2018-12-29 | 2018-12-29 | The encapsulating structure of UV LED and the packaging method of UV LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109713092A true CN109713092A (en) | 2019-05-03 |
Family
ID=66259788
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811637497.2A Pending CN109713092A (en) | 2018-12-29 | 2018-12-29 | The encapsulating structure of UV LED and the packaging method of UV LED |
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| Country | Link |
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| CN (1) | CN109713092A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111477733A (en) * | 2020-04-26 | 2020-07-31 | 深圳市环基实业有限公司 | Chip packaging method |
| CN114242870A (en) * | 2021-12-22 | 2022-03-25 | 鸿利智汇集团股份有限公司 | Wafer support, wafer support plate and wafer packaging method |
| CN114373847A (en) * | 2021-12-31 | 2022-04-19 | 泉州三安半导体科技有限公司 | LED packaging device |
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| CN104037316A (en) * | 2014-06-19 | 2014-09-10 | 广州市鸿利光电股份有限公司 | Inorganic LED packaging support and packaging method thereof |
| CN106848043A (en) * | 2017-03-28 | 2017-06-13 | 光创空间（深圳）技术有限公司 | The method for packing and LED component of a kind of LED component |
| CN107204334A (en) * | 2017-06-14 | 2017-09-26 | 厦门煜明光电有限公司 | A kind of encapsulating structure of UVLED lamps |
| CN108598072A (en) * | 2018-07-02 | 2018-09-28 | 江西科技师范大学 | A kind of UV-LED light source module preparation methods based on integrated bracket |
-
2018
- 2018-12-29 CN CN201811637497.2A patent/CN109713092A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104037316A (en) * | 2014-06-19 | 2014-09-10 | 广州市鸿利光电股份有限公司 | Inorganic LED packaging support and packaging method thereof |
| CN106848043A (en) * | 2017-03-28 | 2017-06-13 | 光创空间（深圳）技术有限公司 | The method for packing and LED component of a kind of LED component |
| CN107204334A (en) * | 2017-06-14 | 2017-09-26 | 厦门煜明光电有限公司 | A kind of encapsulating structure of UVLED lamps |
| CN108598072A (en) * | 2018-07-02 | 2018-09-28 | 江西科技师范大学 | A kind of UV-LED light source module preparation methods based on integrated bracket |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111477733A (en) * | 2020-04-26 | 2020-07-31 | 深圳市环基实业有限公司 | Chip packaging method |
| CN114242870A (en) * | 2021-12-22 | 2022-03-25 | 鸿利智汇集团股份有限公司 | Wafer support, wafer support plate and wafer packaging method |
| CN114373847A (en) * | 2021-12-31 | 2022-04-19 | 泉州三安半导体科技有限公司 | LED packaging device |
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Application publication date: 20190503 |
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