CN109671646B

CN109671646B - Semiconductor manufacturing apparatus and method for manufacturing semiconductor device

Info

Publication number: CN109671646B
Application number: CN201811201411.1A
Authority: CN
Inventors: 高野晴之; 牧浩
Original assignee: Fasford Technology Co Ltd
Current assignee: Fasford Technology Co Ltd
Priority date: 2017-10-16
Filing date: 2018-10-15
Publication date: 2023-03-24
Anticipated expiration: 2038-10-15
Also published as: TWI734030B; KR102190697B1; TW201923964A; KR20190042445A; KR102329117B1; JP7033878B2; JP2019075446A; KR20200107905A; CN109671646A

Abstract

The invention provides a semiconductor manufacturing device, which is provided with a collet check part capable of checking the shape and the installation state of a collet. The semiconductor manufacturing apparatus includes a header that sucks and picks up a bare chip by a collet, a collet inspection unit that checks and inspects the collet, and a control device that controls the header and the collet inspection unit. The collet inspection unit includes a shape detection sensor. The control means reads the shape of the collet via the shape detection sensor.

Description

Semiconductor manufacturing apparatus and method for manufacturing semiconductor device

Technical Field

The present disclosure relates to a semiconductor manufacturing apparatus, and is applicable to, for example, a chip mounter including a collet inspection unit.

Background

In a part of the manufacturing process of a semiconductor device, there are a process of mounting a semiconductor chip (hereinafter, referred to simply as a bare chip) on a wiring board, a lead frame, or the like (hereinafter, referred to simply as a board) and assembling and packaging the semiconductor chip, and in a part of the process of assembling and packaging, there are a process of dividing a bare chip from a semiconductor wafer (hereinafter, referred to simply as a wafer) (dicing process) and a mounting process of mounting the divided bare chip on a board. The semiconductor manufacturing apparatus used in the mounting process is a chip mounter.

The die mounter is a device that mounts (mounts and bonds) a bare chip onto a substrate or a mounted bare chip using solder, gold plating, or resin as a bonding material. In a die mounter which mounts a bare chip on a surface of a substrate, for example, the following operations (operations) are repeated: the bare chips are sucked and picked up from the wafer using a suction nozzle called a collet, conveyed onto a substrate, and applied with a pressing force, and the bonding material is heated to be mounted. The collet is a holder having an adsorption hole and adsorbing and holding the bare chip by sucking air, and has a size approximately equal to that of the bare chip.

In such a chip mounter, it is necessary to replace the collet depending on the type (die size, etc.), or to replace the collet in contact with the surface of the bare chip after each use for a certain period of time in order to prevent damage or contamination of the surface of the bare chip. After the collet chuck is replaced, the collet chuck needs to be set in an appropriate position and in an appropriate posture (for example, patent document 1).

Documents of the prior art

Patent document

Patent document 1: japanese laid-open patent publication No. 2016-139629

In patent document 1, projections to which a plurality of portions of a collet are brought into contact are provided on a moving path of a bare chip moving mechanism (a pickup head or a mounting head) provided with the collet, and the inclination of the collet is determined based on the height at the time of contact of the collet. However, although the inclination can be discriminated, the shape abnormality of the collet cannot be known.

Disclosure of Invention

The present disclosure addresses the problem of providing a semiconductor manufacturing apparatus including a collet confirmation inspection unit that can confirm the shape and mounting state of a collet.

Other objects and novel features will become apparent from the description of the specification and the drawings.

A brief summary of representative aspects of the disclosure is as follows.

That is, the semiconductor manufacturing apparatus includes a header that sucks and picks up a bare chip by a collet, a collet inspection unit that checks and inspects the collet, and a control device that controls the header and the collet inspection unit. The collet inspection unit includes a shape detection sensor. The control means reads the shape of the collet via the shape detection sensor.

Effects of the invention

According to the semiconductor manufacturing apparatus, the shape and the mounting state of the collet can be confirmed.

Drawings

Fig. 1 is a diagram illustrating a configuration example of a chip mounter.

Fig. 2 is a diagram illustrating a structure of the chip mounter of fig. 1.

Fig. 3 is a diagram illustrating a structure of the bare chip supply section of fig. 1.

Fig. 4 is a diagram illustrating a main part of the bare chip supply section of fig. 3.

Fig. 5 is a diagram illustrating the structure of a collet holder used in the chip mounter of fig. 1.

Fig. 6 is a view illustrating the structure of the collet holder of fig. 5.

Fig. 7 is a view illustrating the collet of fig. 5.

Fig. 8 is a diagram illustrating the collet inspection unit of fig. 2.

Fig. 9 is a diagram illustrating the fingerprint sensor of fig. 8.

Fig. 10 is a diagram illustrating the detection of the inclination of the collet by the fingerprint sensor of fig. 8.

Fig. 11 is a diagram for explaining an example of a mounting method of the chip mounter in fig. 1.

Fig. 12 is a diagram for explaining an example of a mounting method of the chip mounter in fig. 1.

Fig. 13 is a flowchart showing a method of manufacturing a semiconductor device using the chip mounter of fig. 1.

Fig. 14 is a diagram illustrating a collet inspection unit according to a modification.

Fig. 15 is a diagram illustrating the detection of the inclination of the collet by the fingerprint sensor of fig. 14.

Fig. 16 is a diagram illustrating another example of the mounting method of the chip mounter in fig. 1.

Fig. 17 is a diagram illustrating another example of the mounting method of the chip mounter in fig. 1.

Description of the reference numerals

10. Chip mounter

1. Bare chip supply unit

2. Pickup part

21. Pick-up head

22. Collet clamp

25. Collet holder

3. Intermediate carrier part

31. Intermediate carrying platform

4. Mounting part

41. Mounting head

42. Collet clamp

5. Conveying part

51. Substrate carrying claw

8. Control unit

90. Collet inspection part

91. Fingerprint sensor

92. Support plate

93. Detection circuit

94. Cable with a protective layer

D bare chip

S substrate

P-type packaging region

Detailed Description

Hereinafter, the embodiments and modifications will be described with reference to the drawings. However, in the following description, the same components are denoted by the same reference numerals, and redundant description thereof may be omitted. In the drawings, the width, thickness, shape, and the like of each part are schematically shown in comparison with the actual embodiment in order to clarify the explanation, but the present invention is not limited to the examples.

Examples

Fig. 1 is a schematic plan view showing a chip mounter of the embodiment. Fig. 2 is a diagram illustrating the operation of the pick-up head and the mounting head when viewed from the direction of arrow a in fig. 1.

The chip mounter 10 generally has a supply section 1, a pickup section 2, an intermediate stage section 3, a mounting section 4, a conveying section 5, a substrate supply section 6, a substrate carrying-out section 7, and a control section 8 that monitors and controls the operations of the respective sections, and the supply section 1 supplies bare chips D mounted on a substrate S printed with one or more product areas (hereinafter referred to as package areas P) that will eventually become one package. The Y-axis direction is the front-rear direction of the chip mounter 10, and the X-axis direction is the left-right direction. The bare chip supply unit 1 is disposed on the front side of the chip mounter 10, and the mounting unit 4 is disposed on the inner side.

First, the bare chip supply section 1 supplies the bare chip D mounted on the package region P of the substrate S. The bare chip supply portion 1 includes a wafer holding stage 12 that holds a wafer 11, and a push-up unit 13 indicated by a broken line that pushes up the bare chip D from the wafer 11. The bare chip feeder 1 moves in the XY direction by a driving mechanism not shown, and moves the bare chip D to be picked up to the position of the push-up unit 13.

The pickup unit 2 includes a pickup head 21 for picking up the bare chip D, a Y drive unit 23 for moving the pickup head 21 in the Y direction, and drive units, not shown, for moving the collet 22 up and down, rotating, and moving in the X direction. The pickup head 21 has a collet 22 (see also fig. 2) that sucks and holds the pushed-up bare chip D to the tip, and picks up the bare chip D from the bare chip supply unit 1 and mounts it on the intermediate stage 31. The pickup head 21 includes driving units, not shown, for moving the collet 22 up and down, rotating, and moving in the X direction.

The intermediate stage unit 3 includes an intermediate stage 31 on which the bare chip D is temporarily placed, a stage recognition camera 32 for recognizing the bare chip D on the intermediate stage 31, and a collet inspection unit 90.

The mounting unit 4 picks up the bare chip D from the intermediate stage 31 and mounts the bare chip D on the package region P of the substrate S conveyed to the mounting stage BS, or mounts the bare chip D stacked on the package region P of the substrate S. The mounting unit 4 includes a mounting head 41 including a collet 42 (see also fig. 2) for holding the bare chip D by suction at the tip, a Y drive unit 43 for moving the mounting head 41 in the Y direction, and a substrate recognition camera 44 for recognizing the mounting position by imaging a position recognition mark (not shown) of the package region P of the substrate S, as in the case of the pickup head 21.

With this configuration, the mounting head 41 picks up the bare chip D from the intermediate stage 31 by correcting the pickup position and the posture based on the imaging data of the stage recognition camera 32, and mounts the bare chip D on the substrate S based on the imaging data of the substrate recognition camera 44.

The transfer unit 5 includes a substrate transfer claw 51 for picking up and transferring the substrate S, and a transfer path 52 for moving the substrate S. The substrate S is moved in the X direction by driving a nut, not shown, of a substrate transport claw 51 provided on the transport path 52 by a ball screw, not shown, provided along the transport path 52.

With such a configuration, the substrate S moves from the substrate supply unit 6 to the mounting position along the conveyance path 52, moves to the substrate carry-out unit 7 after mounting, and delivers the substrate S to the substrate carry-out unit 7.

The control unit 8 includes a memory for storing a program (software) for monitoring and controlling the operation of each unit of the chip mounter 10, and a Central Processing Unit (CPU) for executing the program stored in the memory.

Next, the structure of the bare chip supply section 1 will be described with reference to fig. 3 and 4. Fig. 3 is a perspective view showing an external appearance of the bare chip supply section. Fig. 4 is a schematic cross-sectional view showing a main part of the bare chip supply section.

The bare chip supply unit 1 includes a wafer holding stage 12 that moves in a horizontal direction (XY direction), and a push-up unit 13 that moves in a vertical direction. The wafer holding stage 12 includes an extension ring 15 that holds the wafer ring 14, and a support ring 17 that positions a dicing tape 16 held by the wafer ring 14 and having a plurality of bare chips D bonded thereto in a horizontal direction. The push-up unit 13 is disposed inside the support ring 17.

The bare chip supply unit 1 lowers the extension ring 15 holding the wafer ring 14 when pushing up the bare chip D. As a result, the dicing tape 16 held by the wafer ring 14 is pulled, the interval between the bare chips D is expanded, and the bare chips D are pushed up from below by the push-up unit 13, thereby improving the pick-up performance of the bare chips D. In addition, as the thickness of the wafer is reduced, the adhesive for bonding the die to the substrate is changed from a liquid state to a film state, and a film-like adhesive material called a Die Attach Film (DAF) 18 is attached between the wafer 11 and the dicing tape 16. In the wafer 11 having the die attach film 18, dicing is performed on the wafer 11 and the die attach film 18. Therefore, in the peeling step, the wafer 11 and the die attach film 18 are peeled from the dicing tape 16. The bare chip adhesive sheet film 18 is cured by heating.

The die mounter 10 has a wafer recognition camera 24 that recognizes the posture of the bare chip D on the wafer 11, a stage recognition camera 32 that recognizes the posture of the bare chip D mounted on the intermediate stage 31, and a substrate recognition camera 44 that recognizes the mounting position on the mounting stage BS. The stage recognition camera 32 relating to the pickup by the mounting head 41 and the substrate recognition camera 44 relating to the mounting of the mounting head 41 to the mounting position are necessary to correct the positional misalignment between the recognition cameras.

Next, a collet and a collet holder for holding the collet will be described with reference to fig. 5 to 7. Fig. 5 to 7 are views for explaining a collet and a collet holder used in the chip mounter of fig. 1. FIG. 5 is a cross-sectional view of the pick head, collet holder, and collet. FIG. 6 is a top view of the collet holder. Fig. 7 is a bottom view of the collet. Hereinafter, the collet 22 of the pick-up head 21 will be described, but the same applies to the collet 42 of the mounting head 41.

The collet holder 25 includes a suction hole 25a communicating with the suction hole 21a of the pickup head 21 at the center, and a magnet 25b for fixing the collet 22. The collet holder 25 has cutouts (claw escape grooves) 251c near the centers of the four sides, and the collet replacement jig can hold the collet. The opening of the collet holder 25 is tapered so as to be larger downward, so that the magnet 25b attracts the collet 22 to mount the collet 22.

The collet 22 has stainless steel (SUS (magnetic)) 22b fused to the back surface of an elastic body 22a such as silicon rubber so as to be fixed by a magnet, four sides of which are held by a collet holder 25, and a plurality of suction holes 221 communicating with the suction holes 251a for sucking the bare chip D. The elastic body 22a has a holding portion 22c that is in contact with the bare chip D to hold the bare chip D on the surface. The holding portion 22c is formed integrally with the elastic body 22a and has a size approximately equal to that of the bare chip D.

The collet 22 is pressed when it lands on the surface of the bare chip D when picking up the bare chip D from the wafer 11. Then, the bare chip D sucked by the collet 22 is carried onto the intermediate stage 31 by the movement of the pickup head 21. The carried bare chip D is placed on the intermediate stage 31. The collet 42 picks up the bare chip D from the intermediate stage 31, and the bare chip D sucked by the collet 42 is carried onto the substrate S by the movement of the mounting head 41. The carried bare chip D is placed on the substrate S, and receives a load (several N to several tens N) for bonding from the mounting head 41 in the vertical direction. That is, the chip mounter repeats this process to mass-produce products.

Therefore, the elastic body 22a of the collet 22 made of silicone rubber or the like is gradually deformed (so-called crushed) by repeating the above-described steps, and needs to be replaced when a certain amount of production is achieved. When this replacement is performed, the collet alone or the collet holder is integrated, but in this case, an error (so-called "rattling") occurs in a joint portion between the newly replaced collet and the collet or a joint portion between the head and the holder.

In chip mounters, the collet needs to be replaced each time it is used for a period of time. In addition, after the collet has been replaced, it is necessary to dispose the collet in an appropriate manner at an appropriate position.

Next, a collet inspection unit for checking and inspecting a collet before or after replacement will be described with reference to fig. 8 to 10. Fig. 8 is a diagram illustrating the collet inspection unit, fig. 8 (a) is a schematic side view of the collet and the collet inspection unit, and fig. 8 (B) is a schematic perspective view of the fingerprint sensor. Fig. 9 is a diagram illustrating the fingerprint sensor of fig. 8. Fig. 10 is a diagram illustrating detection of the inclination of the collet by the fingerprint sensor of fig. 8. Hereinafter, the collet 22 of the pick-up head 21 will be described, but the same applies to the collet 42 of the mounting head 41.

The collet inspection unit 90 includes a fingerprint sensor 91 as a shape detection sensor, a support plate 92, and a detection circuit 93. The detection circuit 93 is connected to the fingerprint sensor 91 via a cable 94.

In general, the fingerprint sensor can detect fine irregularities of a contacted portion, and there are an optical system, a capacitance system, an electric field strength system, and the like. The fingerprint is formed by the irregularities on the surface of the finger, and the ridges are called ridges and the valleys are called valleys. The average fingerprint has a height of irregularities of about 50 μm and a mountain line interval of about 400 μm, and fingerprints are detected at about 50 μm intervals and converted into electric signals. For example, in the electrostatic capacitance system, the distance between the finger and the sensor changes according to the irregularities of the ridges or valleys of the fingerprint, and the electrostatic capacitance also changes.

In the embodiment, the fingerprint sensor 91 detects the shape (outer dimension, layout of vacuum suction holes and/or vacuum suction grooves, abrasion, foreign matter adhesion) of the collet instead of detecting the fingerprint. When the fingerprint sensor 91 uses, for example, the electrostatic capacitance method, as shown in fig. 9, electrostatic capacitance between the surface of the holding portion 22c of the collet 22 and the electrode 91b in the plate 91a of the fingerprint sensor 91 is detected, and the shape of the collet is imaged. The fingerprint sensor 91 may be a fingerprint sensor other than the electrostatic capacitance type.

The detection circuit 93 amplifies a signal input from the cable 94 with an amplifier (not shown), converts the signal into a digital signal with an a/D converter (not shown), and processes the digital signal with a signal processing circuit (not shown).

When the surface of the holding portion 22c of the collet 22 is worn and foreign matter adheres thereto, the shape of the collet is detected as a different shape.

The fingerprint sensor 91 can confirm the mounting state (inclination) in addition to the shape of the collet. For example, as shown in fig. 10, when the collet 22 is inclined, only a part of the holding portion 22c of the collet 22 comes into contact with the fingerprint sensor 91, and thus the shape of the collet is detected as a different shape.

The speed immediately before the collet 22 comes into contact with the fingerprint sensor 91 is set to be slower than the speed when the collet 22 moves at a position sufficiently far from the fingerprint sensor 91. This has the advantage of damage to the collet 22, damage to the fingerprint sensor 91, and the burden on the Z drive unit due to collision when the collet 22 is brought into contact with the fingerprint sensor 91 immediately before the collet 22 comes into contact with the fingerprint sensor 91, as well as the following advantages: when the collet 22 is moved at a position sufficiently distant from the fingerprint sensor 91, the collet 22 can be moved at a speed higher than the speed immediately before the contact with the fingerprint sensor 91, and thus the position of the collet 22 can be measured quickly.

When the collet 22 is in contact with the fingerprint sensor 91, the contact can be detected with a certain force, for example, a force of 1N or less. This is only required to be able to accurately and highly accurately detect the contact between the collet 22 and the fingerprint sensor 91. However, the contact force may be configured not to be excessively strong so as not to break the collet 22 or the fingerprint sensor 91.

The collet inspection unit 90 is disposed in the intermediate stage unit 3 (in the vicinity of the intermediate stage 31), but may be disposed above the intermediate stage 31, or may be disposed at a position where both the mounting head 41 and the pickup head 21 can approach even outside the intermediate stage unit 3. That is, the inspection tool may be disposed at a position where both the collet chucks for inspecting the mounting head 41 and the pickup head 21 can be confirmed. The collet inspection unit 90 may be provided so as to be movable to a position where both the mounting head 41 and the pickup head 21 can be brought close to each other, and both the collets for inspecting the mounting head 41 and the pickup head 21 can be checked.

Next, mounting operation will be described with reference to fig. 11 and 12. Fig. 11 and 12 are flowcharts showing an example of a mounting method of the chip mounter in fig. 1. The terminal a of the flowchart of fig. 11 is connected to the terminal a of the flowchart of fig. 12, and the terminal B of the flowchart of fig. 12 is connected to the terminal B of the flowchart of fig. 11. Hereinafter, the collet 22 of the pick-up head 21 will be described, but the same applies to the collet 42 of the mounting head 41.

First, the control unit 8 performs initialization of mounting (step S1). Here, the control unit 8 reads and registers the shape of the collet 22 at the correct position as one of initialization processes such as initialization of the positions of the pickup head 21 and the mounting head 41, initialization of the positions of the wafer recognition camera 24, the stage recognition camera 32, and the substrate recognition camera 44, and the like. Specifically, the control unit 8 moves the collet 22 up to the collet inspection unit 90, contacts the fingerprint sensor 91, reads the shape of the holding portion 22c of the collet 22, and stores the shape in a storage means (not shown) such as a memory in the control unit 8.

Next, the control section 8 performs a mounting operation of picking up the bare chip D from the wafer 11 by the pick-up head 21, placing the bare chip D on the intermediate stage 31, picking up the bare chip D from the intermediate stage 31 by the mounting head 41, and mounting the bare chip D on the substrate S or the like (step S2). Next, the control unit 8 determines whether or not the mounting operation is performed a predetermined number of times (step S3). If the predetermined number of times is performed, the control unit 8 ends the process. If the predetermined number of times is not performed, the control unit 8 determines whether the performing operation exceeds a set confirmation value (whether the number of device productions or the device operating time exceeds a predetermined value) which is the number of times or the time required to confirm the collet 22 (step S4). Here, the confirmation setting of the collet 22 and the confirmation setting of the collet 42 may be different. If the confirmation set value is not exceeded, the procedure returns to step S2 to perform the installation operation. If the consumption level exceeds the confirmation setting value, the control unit 8 checks the collet in order to determine the consumption level of the holding portion 22c of the collet 22. That is, the control unit 8 moves the collet 22 to the collet checking unit 90 by the pick-up head 21 and the mounting head 41 (step S5), and reads the shape of the holding unit 22c of the collet 22 by the collet checking unit 90 (step S6). The control unit 8 determines whether or not the shape of the holding portion 22c of the collet 22 is the shape registered in advance in the initialization of step S1 (step S7). If so, the process returns to step S2 to perform the mounting operation. If no, the collet 22 is replaced (step S8).

The collet 22 may be replaced manually by an operator or by an automated collet replacement technique.

Next, the control unit 8 moves the collet 22 onto the collet inspection unit 90 by the pickup head 21 to make contact therewith (step S9), and reads the shape of the collet 22 by the collet inspection unit 90 (step SA). It is determined whether or not the shape of the collet 22 is the shape registered in advance in the initialization of step S1 (step SB). If yes, the process returns to step S2 to perform the mounting operation. If not, the control unit 8 notifies an abnormality (step SC). In this case, for example, the controller 8 displays a collet image, and if the shape of the collet is a shape with a clean pattern, the operator determines that the collet type is wrong, and manually or automatically replaces the collet with an accurate collet. When the pattern does not form the shape of the collet, the operator determines that the collet is not properly mounted, such as tilted, and manually or automatically reattaches the collet 22 to the collet holder 25.

Next, a method for manufacturing a semiconductor device using the chip mounter of the embodiment will be described with reference to fig. 13. Fig. 13 is a flowchart illustrating a method of manufacturing a semiconductor device.

Step S11: the wafer ring 14 holding the dicing tape 16 on which the bare chips D separated from the wafer 11 are mounted is stored in a wafer cassette (not shown) and loaded into the die mounter 10. The control section 8 supplies the wafer ring 14 from the wafer cassette filled with the wafer ring 14 to the die supply section 1. Further, the substrate S is prepared and carried into the chip mounter 10. The controller 8 places the substrate S on the conveyance path 52 by the substrate supply unit 6.

Step S12: the control section 8 picks up the bare chip D from the dicing tape 16 held on the wafer ring 14.

Step S13: the control unit 8 mounts the picked-up bare chip D on the package region P of the substrate S or stacks the bare chip D on a mounted bare chip. More specifically, the control unit 8 mounts the bare chip D picked up from the dicing tape 16 on the intermediate stage 31, picks up the bare chip D again from the intermediate stage 31 by the mounting head 41, and mounts it on the package area P of the carried substrate S.

Step S14: the controller 8 moves the substrate S to the substrate carry-out section 7 by the substrate transfer claw 51, delivers the substrate S to the substrate carry-out section 7, and carries out the substrate S from the die mounter 10 (substrate unloading).

In the embodiment, by using a fingerprint sensor such as an optical fingerprint sensor or a capacitance type fingerprint sensor, it is possible to detect fine irregularities of a portion which is in contact with the fingerprint sensor, and it is possible to detect the shape (wear, adhesion of foreign matter) or the mounting state (inclination) of the collet with high accuracy. In addition, the shape of the collet can be easily registered as in the case of fingerprint registration. A plurality of kinds of collet chucks used for automatic replacement of the collet chucks can be registered by fingerprint recognition, and confirmation after the automatic replacement can be easily performed. The product defect caused by the abnormality of the collet can be prevented.

< modification example >

Hereinafter, some representative modifications will be described. In the following description of the modified examples, the same reference numerals as those of the above-described examples are used for portions having the same configurations and functions as those of the above-described examples. Moreover, the descriptions in the above embodiments can be appropriately applied to the extent that no technical contradiction is technically made with respect to the descriptions in this section. In addition, all or a part of the embodiments and the modifications can be suitably combined and applied within a range not technically contradictory.

Fig. 14 is a view for explaining a collet inspection unit according to a modification, fig. 14 (a) is a schematic side view of a collet and the collet inspection unit, and fig. 14 (B) is a schematic perspective view of an fingerprint sensor. Fig. 15 is a diagram illustrating detection of the inclination of the collet by the fingerprint sensor of fig. 14. Hereinafter, the collet 22 of the pick-up head 21 will be described, but the same applies to the collet 42 of the mounting head 41.

The collet check unit 90A includes

pressure sensors

95a, 95b, and 95c in addition to the fingerprint sensor 91, the support plate 92, and the detection circuit 93 of the collet check unit 90 according to the embodiment. The detection circuit 93A is connected to the fingerprint sensor 91 via the cable 94, and is also connected to the

pressure sensors

95a, 95b, and 95c via the

cables

97a, 97b, and 97c and the

output units

96a, 96b, and 96 c. The

pressure sensors

95a, 95b, 95c support the fingerprint sensor 91 at 3 points.

The detection circuit 93A, like the detection circuit 93 of the embodiment, amplifies the signal inputted from the cable 94 for signal processing, and also amplifies the signal inputted from the

cables

97a, 97b, and 97c by an amplifier (not shown), converts the signal into a digital signal by an a/D converter (not shown), and processes the digital signal by a signal processing circuit (not shown).

The

pressure sensors

95a, 95b, and 95c are each formed of, for example, a piezoelectric element as a pressure-sensitive element.

That is, according to the collet check unit 90A having the above configuration, when the collet 22 is tilted for any reason, the outputs from the three

pressure sensors

95a, 95b, and 95c are unbalanced. Therefore, the tilt of the collet 22 can be easily detected by, for example, determining the center of gravity of the three

pressure sensors

95a, 95b, and 95c using the outputs thereof, and determining the distance (degree of deviation) from the original (non-tilted) center of gravity.

Next, mounting operation will be described with reference to fig. 16 and 17. Fig. 16 and 17 are flowcharts showing other examples of the mounting method of the chip mounter of fig. 1. The terminal a of the flowchart of fig. 16 is connected to the terminal a of the flowchart of fig. 17, and the terminal B of the flowchart of fig. 17 is connected to the terminal B of the flowchart of fig. 16. Hereinafter, the collet 22 of the pick-up head 21 will be described, but the same applies to the collet 42 of the mounting head 41.

Steps S1 to S5 are the same as in the embodiment of fig. 11.

The control unit 8 checks the collet in order to grasp the degree of consumption of the collet 22. That is, the controller 8 moves the collet 22 to the collet checking unit 90 by using the pick-up head 21 and the mounting head 41 (step S5), and reads the height and shape of the collet 22 by using the collet checking unit 90 (step S6A).

The control unit 8 determines whether or not the height of the holding portion 22c of the collet 22 or the variation in the height exceeds a predetermined value (step S7A). If no, the process proceeds to step S7, and if yes, the process proceeds to step S8.

In step S7, the control unit 8 determines whether or not the shape of the holding portion 22c of the collet 22 is the shape registered in advance in the initialization in step S1. If so, the process returns to step S2 to perform the mounting operation. If no, the process proceeds to step S8.

In step S8, the collet 22 is replaced. The collet 22 may be replaced manually by an operator or by an automated collet replacement technique.

Next, the control unit 8 moves the collet 22 to the collet inspection unit 90 by the pickup head 21 and makes contact therewith (step S9), and reads the height and shape of the holding portion 22c of the collet 22 by the collet inspection unit 90 (step SAA).

The control unit 8 determines whether or not the height of the collet 22 or the variation in the height of the holding portion 22c of the collet 22 exceeds a predetermined value (step SBA). When the value is equal to or less than the first predetermined value, the process proceeds to step SB, and when the value exceeds the first predetermined value but is equal to or less than the second predetermined value, the process proceeds to step SD, and when the value exceeds the second predetermined value, the process returns to step S8, and the collet 22 is mounted again.

In step SD, the control unit 8 operates the pickup head 21 based on the height deviation to adjust the inclination of the collet 22.

In step SB, the control unit 8 determines whether or not the shape of the collet 22 is the shape registered in advance in the initialization in step S1 (step SB). If yes, the process returns to step S2 to perform the mounting operation. If not, the control unit 8 determines that the collet type is wrong, and returns to step S8 to replace the collet with an accurate collet.

In the modification, a plurality of pressure sensors are assembled under the fingerprint sensor 91, the shape of the collet (the outer dimensions, the layout of the vacuum suction holes and/or the vacuum suction grooves, wear, and adhesion of foreign matter) is confirmed, and the state of conformity (the inclination angle and the height) of the collet is confirmed. This makes it possible to detect all the elements related to the abnormality of the collet (mounting position, inclination, wear, adhesion of foreign matter) at a time. Even when the inclination angle is equal to or less than a predetermined value, the inclination of the collet is adjusted by the head, and when the inclination angle exceeds the predetermined value, the collet is mounted again, whereby the collet can be automatically replaced and confirmed. By automatically grasping the consumption of the collet and further adding an automatic collet replacement function, a series of operations are completely automated, thereby reducing the cost of personnel expenses and improving the quality due to the reduction of human errors.

The invention created by the present inventors has been specifically described above based on the embodiments, but the present invention is not limited to the above embodiments and various modifications may be made.

For example, in the embodiment, the example in which the collet 22 is composed of the elastic body 22a, the stainless steel 22b, and the holding portion 22c has been described, but the present invention is not limited thereto, and for example, it may be composed of only an elastic body. In the embodiment, the collet has the suction hole, but the invention is not limited to this, and for example, the collet may have a suction groove.

In the embodiment, an example in which a fingerprint sensor is used as the shape detection sensor has been described, but the present invention is not limited to this, and for example, a planar or sheet-like sensor may be used as long as a plurality of sensors are two-dimensionally arranged in a lattice or zigzag pattern at a pitch necessary for inspecting the shape of the surface of the collet chuck.

In the modification, a pressure sensor is used, but a pressure-sensitive sheet or a displacement sensor may be used. In the modification, an example in which three pressure sensors are provided has been described, but the present invention is not limited to this, and four or more pressure sensors may be provided.

In addition, the surface of the fingerprint sensor (plate) can be automatically cleaned.

The chip mounter may include a plurality of mounting units including a pickup unit, an alignment unit, and a mounting unit, and a conveyance path, or may include a plurality of mounting units including a pickup unit, an alignment unit, and a mounting unit, and a conveyance path.

In the embodiment, the example using the die bond film is described, but the pre-formed portion to which the adhesive is applied may be provided on the substrate without using the die bond film.

In the embodiments, the die mounter which picks up the bare chip from the bare chip supply portion by the pickup head, mounts the bare chip on the intermediate stage, and mounts the bare chip mounted on the intermediate stage on the substrate by the mounting head has been described.

For example, the present invention can be applied to a die mounter which mounts a bare chip of a bare chip supply unit on a substrate by a mounting head without using an intermediate stage and a pickup head.

Further, the present invention can be applied to a flip chip mounter which picks up a bare chip from a bare chip supply unit without an intermediate stage, rotates a bare chip pickup head upward, transfers the bare chip to a mounting head, and mounts the bare chip on a substrate by the mounting head.

Further, the present invention can be applied to a chip handler that does not have an intermediate stage and a mounting head and that places a bare chip picked up by a pickup head for a bare chip supply unit on a tray or the like.

Claims

1. A semiconductor manufacturing apparatus is characterized by comprising:

a header that adsorbs and picks up a bare chip by a collet;

a collet checking unit that checks and checks a surface of the collet that is in contact with the bare chip; and

a control device for controlling the head and the collet inspection unit,

the collet inspection unit includes a first sensor that detects the shape of the surface of the collet by contacting the surface,

the control device is configured to read the shape of the surface of the collet by bringing the first sensor into contact with the collet, and to detect an abnormality of the collet by comparing data stored by reading the shape of the collet at a predetermined position in advance by the first sensor with data obtained by reading the shape of the collet by the first sensor at the time of inspection,

the collet inspection unit further includes at least three second sensors for detecting a deviation in height of the collet below the first sensor.

2. The semiconductor manufacturing apparatus according to claim 1,

the control device is configured to detect a deviation in height of the collet by determining a center of gravity of the collet using at least three second sensors.

3. The semiconductor manufacturing apparatus according to claim 1,

the abnormality of the collet is wear of the collet, foreign matter adhesion, inclination, or a variety error.

4. The semiconductor manufacturing apparatus according to claim 3,

the control device is configured to replace the collet when abnormality of the collet is detected.

5. The semiconductor manufacturing apparatus according to claim 1,

the second sensor is arranged on the support plate and is configured to be in contact with the lower surface of the first sensor, and the second sensor is a pressure sensor, a pressure sensitive sheet or a displacement sensor.

6. The semiconductor manufacturing apparatus according to claim 1,

the control device is configured to determine that the mounting of the collet is normal when the variation in height of the collet is equal to or less than a first predetermined value, determine that the inclination adjustment of the collet is necessary when the variation in height of the collet is greater than the first predetermined value and equal to or less than a second predetermined value, and determine that the mounting of the collet is abnormal when the variation in height of the collet is greater than the second predetermined value.

7. The semiconductor manufacturing apparatus according to claim 6,

the second sensor is a pressure sensor, a pressure sensitive strip or a displacement sensor.

8. The semiconductor manufacturing apparatus according to claim 1,

the first sensor is a plate-shaped fingerprint sensor or a panel-shaped sensor in which a plurality of sensors are two-dimensionally arranged in a grid or zigzag pattern at a pitch smaller than the pitch of the irregularities on the surface of the collet.

9. The semiconductor manufacturing apparatus according to claim 1, further comprising:

a bare chip supply part having a wafer ring holding a dicing tape to which bare chips are attached;

a pick-up head picking up the bare chip attached to the dicing tape;

an intermediate stage on which the bare chip picked up by the pickup head is placed; and

a mounting head which mounts the bare chip picked up from the intermediate stage onto a substrate or a mounted bare chip,

the head is at least one of the pickup head and the mounting head.

10. The semiconductor manufacturing apparatus according to claim 9,

the collet checking unit is located within a range of movement of both the pick-up head and the mounting head,

the control device moves the pick-up head and the mounting head to the collet inspection unit, and inspects the collet of the pick-up head and the collet of the mounting head.

11. A method for manufacturing a semiconductor device includes:

preparing the semiconductor manufacturing apparatus according to any one of claims 1 to 10;

a step of carrying in a wafer ring, wherein the wafer ring holds a dicing tape to which bare chips are attached;

preparing to carry in a substrate;

a picking-up step of picking up a bare chip; and

and a mounting step of mounting the picked bare chip on the substrate or the mounted bare chip.

12. The method for manufacturing a semiconductor device according to claim 11,

the picking up process is to pick up the bare chip attached to the dicing tape by using a mounting head,

the mounting process is to mount the bare chip picked up by the mounting head on the substrate or the mounted bare chip.

13. The method for manufacturing a semiconductor device according to claim 11,

the pickup step includes:

picking up the bare chip attached to the dicing tape by a pickup head; and

a step of placing the bare chip picked up by the pickup head on an intermediate stage,

the mounting process includes:

picking up the bare chip mounted on the intermediate stage by using a mounting head; and

and a step of placing the bare chip picked up by the mounting head on the substrate.