CN109671646A - The manufacturing method of semiconductor manufacturing apparatus and semiconductor devices - Google Patents
The manufacturing method of semiconductor manufacturing apparatus and semiconductor devices Download PDFInfo
- Publication number
- CN109671646A CN109671646A CN201811201411.1A CN201811201411A CN109671646A CN 109671646 A CN109671646 A CN 109671646A CN 201811201411 A CN201811201411 A CN 201811201411A CN 109671646 A CN109671646 A CN 109671646A
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- Prior art keywords
- collet chuck
- bare chip
- head
- pick
- manufacturing apparatus
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 31
- 238000007689 inspection Methods 0.000 claims abstract description 39
- 238000001514 detection method Methods 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims description 49
- 238000000034 method Methods 0.000 claims description 29
- 230000008569 process Effects 0.000 claims description 22
- 238000005520 cutting process Methods 0.000 claims description 14
- 238000005299 abrasion Methods 0.000 claims description 6
- 238000006073 displacement reaction Methods 0.000 claims description 2
- 238000009434 installation Methods 0.000 abstract description 17
- 238000012790 confirmation Methods 0.000 abstract description 13
- 238000010586 diagram Methods 0.000 description 15
- 230000009471 action Effects 0.000 description 8
- 238000004806 packaging method and process Methods 0.000 description 8
- 229920001971 elastomer Polymers 0.000 description 6
- 239000000806 elastomer Substances 0.000 description 6
- 238000012545 processing Methods 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 230000003321 amplification Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000007767 bonding agent Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000011218 segmentation Effects 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention provides a kind of semiconductor manufacturing apparatus, has the collet chuck confirmation inspection portion of the confirmation of the shape and installation condition that are able to carry out collet chuck.Semiconductor manufacturing apparatus has the head that bare chip is adsorbed and picked up by collet chuck, confirmation and checks the collet chuck inspection portion of the collet chuck and control the control device in the head and collet chuck inspection portion.Collet chuck inspection portion has SHAPE DETECTION sensor.The control device reads the shape of the collet chuck by the SHAPE DETECTION sensor.
Description
Technical field
This disclosure relates to semiconductor manufacturing apparatus, such as can be applied to the chip attachment machine for having collet chuck inspection portion.
Background technique
In a part of the manufacturing process of semiconductor devices, has and carry semiconductor chip (hereinafter referred to as bare chip)
In circuit board or lead frame etc. (hereinafter referred to as substrate) and the process of assembled package, at one of the process of assembled package
Have in point from the process (cutting action) of semiconductor wafer (hereinafter referred to as chip) segmentation bare chip and by the naked core after segmentation
Piece is equipped on the attachment process on substrate.Mounting semiconductor manufacturing apparatus used in process is chip attachment machine.
Chip attachment machine is that bare chip is mounted (carry and be bonded) Yu Ji using scolding tin, gold-plated, resin as grafting material
Device on plate or the bare chip mounted.In the chip attachment machine on surface that bare chip is for example mounted on to substrate, weight
(operation) is acted as follows again, it may be assumed that bare chip is adsorbed and picked up from chip using the adsorption mouth for being referred to as collet chuck, is carried
On to substrate and pressing force is assigned, and grafting material is heated, is thus mounted.Collet chuck is with adsorption hole, inhales
Draw air and adsorb the holder for keeping bare chip, there is the size with bare chip equal extent.
In this chip attachment machine, need to replace collet chuck or accordingly with kind (naked core chip size etc.) in order to anti-
Only the damage or pollution on the surface of bare chip and need per replacing the cylinder that contacts with the surface of bare chip after a period of use
Folder.After collet chuck replacement, need in suitable position with suitable posture setting collet chuck (for example, patent document 1).
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2016-139629 bulletin
In patent document 1, in the movement routine for the bare chip mobile mechanism (pick-up head or mounting head) for having collet chuck
The protrusion of multiple location contacts for collet chuck is set, the gradient of collet chuck is determined based on the height when collet chuck contacts.However,
Although can differentiate gradient, the shape anomaly of collet chuck is not known that.
Summary of the invention
The project of the disclosure is, provides a kind of collet chuck of the confirmation of shape and installation condition for having and being able to carry out collet chuck
Confirm the semiconductor manufacturing apparatus in inspection portion.
Other projects and new feature become clear according to the narration and attached drawing of this specification.
Briefly describe representative summary in the disclosure, then it is as follows.
That is, semiconductor manufacturing apparatus has the head that bare chip is adsorbed and picked up by collet chuck, confirmation and checks the cylinder
The collet chuck inspection portion of folder and the control device for controlling the head and collet chuck inspection portion.Collet chuck inspection portion has
SHAPE DETECTION sensor.The control device reads the shape of the collet chuck by the SHAPE DETECTION sensor.
Invention effect
According to above-mentioned semiconductor manufacturing apparatus, it is able to carry out the confirmation of the shape and installation condition of collet chuck.
Detailed description of the invention
Fig. 1 is the figure for illustrating the structural example of chip attachment machine.
Fig. 2 is the figure of the structure of the chip attachment machine of explanatory diagram 1.
Fig. 3 is the figure of the structure of the bare chip supply unit of explanatory diagram 1.
Fig. 4 is the figure of the major part of the bare chip supply unit of explanatory diagram 3.
Fig. 5 is the figure of the construction of collet chuck bracket used in the chip attachment machine of explanatory diagram 1.
Fig. 6 is the figure of the construction of the collet chuck bracket of explanatory diagram 5.
Fig. 7 is the figure of the collet chuck of explanatory diagram 5.
Fig. 8 is the figure in the collet chuck inspection portion of explanatory diagram 2.
Fig. 9 is the figure of the fingerprint sensor of explanatory diagram 8.
Figure 10 is the figure for the gradient detection that explanation carries out collet chuck using the fingerprint sensor of Fig. 8.
Figure 11 is the figure of an example of the attaching method of the chip attachment machine of explanatory diagram 1.
Figure 12 is the figure of an example of the attaching method of the chip attachment machine of explanatory diagram 1.
Figure 13 is the flow chart for showing the manufacturing method of semiconductor devices for the chip attachment machine for having used Fig. 1.
Figure 14 is the figure for illustrating the collet chuck inspection portion of variation.
Figure 15 is the figure that the gradient for the collet chuck that explanation is carried out using the fingerprint sensor of Figure 14 detects.
Figure 16 is other figures of the attaching method of the chip attachment machine of explanatory diagram 1.
Figure 17 is other figures of the attaching method of the chip attachment machine of explanatory diagram 1.
Description of symbols
10 chip attachment machines
1 bare chip supply unit
2 pickup section
21 pick-up heads
22 collet chucks
25 collet chuck brackets
3 intermediate microscope carrier portions
31 intermediate microscope carriers
4 attachment portions
41 mounting heads
42 collet chucks
5 trucking departments
51 board carrying pawls
8 control units
90 collet chuck inspection portions
91 fingerprint sensors
92 support plates
93 detection circuits
94 cables
D bare chip
S substrate
P packaging area
Specific embodiment
Hereinafter, using Detailed description of the invention embodiment and variation.But in the following description, sometimes for same composition
Element marks same appended drawing reference and omits repeated explanation.In addition, in figure, it is apparent in order to make to illustrate, with actual mode phase
Than being schematically shown sometimes to the width of each section, thickness, shape etc., but be an example eventually, not limiting solution of the invention
It releases.
Embodiment
Fig. 1 is the top view for showing the outline of chip attachment machine of embodiment.Fig. 2 is illustrated in Fig. 1 from the direction arrow A
The figure of the movement of pick-up head and mounting head when observation.
Chip attachment machine 10 substantially has supply unit 1, pickup section 2, intermediate microscope carrier portion 3, attachment portion 4, trucking department 5, substrate
Supply unit 6, substrate moving section 7, the movement for monitoring and controlling each section control unit 8, supply unit 1 for be given to be printed with one or
The bare chip D of the substrate S installation of multiple product areas (hereinafter referred to as packaging area P) for eventually becoming an encapsulation.Y direction
For the front-rear direction of chip attachment machine 10, X-direction is left and right directions.Bare chip supply unit 1 is configured in chip attachment machine 10
Nearby side, attachment portion 4 are configured in inside.
Firstly, the bare chip D that bare chip supply unit 1 is installed for being given to the packaging area P of substrate S.Bare chip supply unit 1 has
There is the chip holding station 12 for keeping chip 11 and being represented by dotted lines of above pushing away from chip 11 of bare chip D is above pushed away into unit 13.It is naked
Chip supply unit 1 is moved by driving mechanism (not shown) along the direction XY, is moved to bare chip D to be picked up and is pushed away list
The position of member 13.
Pickup section 2 has the Y driving of the pick-up head 21 for picking up bare chip D, the pick-up head for moving pick-up head 21 along Y-direction
Portion 23 makes the lifting of collet chuck 22, rotation and each driving portion (not shown) moved in X direction.Pick-up head 21 has and will be pushed
Bare chip D absorption be held in the collet chuck 22 (also referring to Fig. 2) of front end, pick up bare chip D from bare chip supply unit 1 and carried
It is placed on intermediate microscope carrier 31.Pick-up head 21 has each driving (not shown) for making the lifting of collet chuck 22, rotating and moving in X direction
Portion.
Intermediate microscope carrier portion 3 has the naked core on the temporary intermediate microscope carrier 31 for loading bare chip D, for identification intermediate microscope carrier 31
The microscope carrier identification camera 32 of piece D and collet chuck inspection portion 90.
Bare chip D is picked up from intermediate microscope carrier 31 and is mounted on the substrate S's being transported on attachment microscope carrier BS in attachment portion 4
On packaging area P, or pasted in the form on the bare chip that is laminated on the packaging area P for being mounted on substrate S
Dress.Attachment portion 4 has the collet chuck 42 for having in the same manner as pick-up head 21 and bare chip D absorption being held in front end (also referring to Fig. 2)
Mounting head 41, the Y driving portion 43, the position recognition mark to the packaging area P of substrate S that move mounting head 41 along Y-direction
The substrate that (not shown) is shot to identify mounting position identifies camera 44.
Through this structure, mounting head 41 based on microscope carrier identification camera 32 photographed data come correct take-off location,
Posture picks up bare chip D from intermediate microscope carrier 31, and bare chip D is mounted on by the photographed data based on substrate identification camera 44
Substrate S.
Trucking department 5 has the transport passage for transporting 52 for picking up the simultaneously board carrying pawl 51 of handling substrate S and substrate S movement.Base
Plate S is by driving the board carrying set on transport passage for transporting 52 using the ball-screw (not shown) being arranged along transport passage for transporting 52
The nut not shown of pawl 51 and move in the X direction.
Through this structure, substrate S is moved to mounting position along transport passage for transporting 52 from substrate supply unit 6, is mounting
It is moved to substrate moving section 7 later, delivers substrate S to substrate moving section 7.
Control unit 8 has storage monitoring and controls the storage of the program (software) of the movement of each section of chip attachment machine 10
The central processing unit (CPU) for the program that device and execution are stored in memory.
Then, it is illustrated using structure of the Fig. 3 and Fig. 4 to bare chip supply unit 1.Fig. 3 is to show bare chip supply
The figure of the stereoscopic figure in portion.Fig. 4 is the schematic sectional view for showing the major part of bare chip supply unit.
Bare chip supply unit 1 is with the chip holding station 12 moved on (direction XY) in the horizontal direction and in above-below direction
Upper movement above pushes away unit 13.Chip holding station 12 have keep wafer ring 14 expanded ring 15, will be held in wafer ring 14 and
It is bonded with the support ring 17 that the cutting belt 16 of multiple bare chip D positions in the horizontal direction.It above pushes away unit 13 and is configured at support ring
17 inside.
Bare chip supply unit 1 is carrying out when above pushing away of bare chip D, declines the expanded ring 15 that remain wafer ring 14.Its
It as a result is to be held in the cutting belt 16 of wafer ring 14 to be stretched, the interval of bare chip D expands, by above pushing away unit 13 from naked core
Bare chip D is pushed away on the lower section piece D, improves the pick of bare chip D.In addition, bare chip is adhered on substrate with slimming
Bonding agent is changed to membranaceous from liquid, and the membranaceous adhesives of referred to as bare chip bonding die film (DAF) 18 is attached to chip 11
Between cutting belt 16.In the chip 11 with bare chip bonding die film 18, cutting is to chip 11 and bare chip bonding die film 18
It carries out.Therefore, in stripping process, chip 11 and bare chip bonding die film 18 are removed from cutting belt 16.Bare chip bonding die film
18 are solidified by heating.
There is chip attachment machine 10 the wafer identification camera 24 of the posture of the bare chip D on identification chip 11, identification to carry
The microscope carrier for being placed in the posture of the bare chip D of intermediate microscope carrier 31 identifies that camera 32, identification mount the installation site on microscope carrier BS
Substrate identifies camera 44.Have to the posture dislocation between amendment identification camera is related with the pickup that mounting head 41 carries out
Microscope carrier identification camera 32 and substrate related with the attachment of mounting head 41 to installation site identify camera 44.
Then, illustrate collet chuck using Fig. 5~7 and keep the collet chuck bracket of collet chuck.Fig. 5~7 are the chips for explanatory diagram 1
The figure of collet chuck used in placement equipment and collet chuck bracket.Fig. 5 is the cross-sectional view of pick-up head, collet chuck bracket and collet chuck.Fig. 6 is cylinder
Press from both sides the top view of bracket.Fig. 7 is the bottom view of collet chuck.Hereinafter, the collet chuck 22 to pick-up head 21 is illustrated, but mounting head 41
Collet chuck 42 is also identical.
Collet chuck bracket 25 has at center and the adsorption hole 21a of the pick-up head 21 suction hole 25a being connected to and fixed collet chuck 22
Magnet 25b.Collet chuck bracket 25 four sides it is each center nearby have incised notch mouth (pawl escape groove) 251c, collet chuck replacement fixture at
For collet chuck can be held.The opening portion of collet chuck bracket 25 becomes more bigger cone cell downwards, in order to be attracted by magnet 25b
Collet chuck 22 and collet chuck 22 can be installed.
Collet chuck 22 by can the back side deposition in such a way that magnet is fixed in the elastomer 22a of silicon rubber etc. have stainless steel
(SUS (magnetism)) 22b, four sides are kept by collet chuck bracket 25, and are had and be connected to suction hole 251a to adsorb bare chip D
Multiple suction holes 221.There is the maintaining part 22c contacted with bare chip D to keep bare chip D on the surface of elastomer 22a.It protects
It holds portion 22c and elastomer 22a to be integrally formed, there is the size with bare chip D equal extent.
Collet chuck 22 falls in the surface of bare chip D, is under pressure at this time when picking up bare chip D from chip 11.Later, lead to
The bare chip D adsorbed by collet chuck 22 is transported on intermediate microscope carrier 31 by the movement for crossing pick-up head 21.The bare chip D that the carrying comes
It falls on intermediate microscope carrier 31.Collet chuck 42 picks up bare chip D from intermediate microscope carrier 31, and will pass through collet chuck by the mobile of mounting head 41
The bare chip D of 42 absorption is transported on substrate S.The bare chip D that the carrying comes is fallen on substrate S, from mounting head 41 along Vertical Square
To the load (number N~tens of N) received for engagement.That is, chip attachment machine is by repeating the process volume production product.
Therefore, it is gradually deformed by elastomer 22a of collet chuck 22 of the formation such as silicon rubber etc. by repeating above-mentioned process
(so-called conquassation), when the output reached a certain level, is replaced.When carrying out the replacement, with collet chuck monomer
Or it is integrally carried out with collet chuck bracket, but at this time at the joint portion for the collet chuck and collet chuck newly replaced or the joint portion of head and bracket
Error (so-called " shaking ") can be generated.
In chip attachment machine, collet chuck it is every using a period of time when just replaced.In addition, having replaced collet chuck
Afterwards, it needs that collet chuck is arranged in an adequate manner in suitable position.
Then, confirmed before replacement or after replacement using Fig. 8~10 pair, check that the collet chuck inspection portion of collet chuck is illustrated.
Fig. 8 is the figure for illustrating collet chuck inspection portion, and (A) of Fig. 8 is the schematic side elevation of collet chuck and collet chuck inspection portion, and (B) of Fig. 8 refers to
The schematic perspective view of line sensor.Fig. 9 is the figure of the fingerprint sensor of explanatory diagram 8.Figure 10 is the fingerprint sensor of explanatory diagram 8
The figure of the detection of the gradient of the collet chuck of progress.Hereinafter, the collet chuck 22 to pick-up head 21 is illustrated, but for mounting head 41
Collet chuck 42 is also identical.
Collet chuck inspection portion 90 has the fingerprint sensor 91, support plate 92, detection circuit 93 as SHAPE DETECTION sensor.
Detection circuit 93 is connect via cable 94 with fingerprint sensor 91.
In general, fingerprint sensor is able to detect that the fine irregularities of contacted part, there are optical mode, direct capacitance side
Formula, electric field strength mode etc..Fingerprint is formed because of the bumps of finger surface, and protrusion is referred to as mountain line, and recess portion is referred to as valley line.It is flat
The concave-convex height of equal fingerprint is about 50 μm, and the interval of mountain line is about 400 μm, with about 50 μm of intervals detection fingerprints and by its turn
It is changed to electric signal.For example, in electrostatic capacitance type, using the distance of finger and sensor according to the recessed of the mountain line of fingerprint or valley line
It is convex and change, and direct capacitance also changes this characteristic.
In embodiment, fingerprint sensor 91 detects shape (outer dimension, vacuum attraction of collet chuck instead of detection fingerprint
The layout of hole and/or vacuum attraction slot, abrasion, foreign matter attachment).In fingerprint sensor 91 for example using electrostatic capacitance type the case where
Under, as shown in figure 9, electrode 91b in the surface of maintaining part 22c of detection collet chuck 22 and the plate of fingerprint sensor 91 in 91a it
Between direct capacitance, by the shape image of collet chuck.Fingerprint sensor 91 can certainly use the fingerprint other than electrostatic capacitance type
Sensor.
Detection circuit 93 (does not scheme the signal inputted from cable 94 amplifier amplification (not shown) using A/D converter
Show) digital signal is converted to, and handled by signal processing circuit (not shown).
In the case where the surface of the maintaining part 22c of collet chuck 22 has abrasion, foreign matter attachment, using the shape of collet chuck as not
Same shape is detected.
In addition to the shape of collet chuck, fingerprint sensor 91 can also carry out the confirmation of installation condition (gradient).For example, such as
Shown in Figure 10, in collet chuck 22 there are in the case where gradient, only a part of the maintaining part 22c of collet chuck 22 and fingerprint sensor 91
Contact, therefore, is detected the shape of collet chuck as different shapes.
Speed and collet chuck 22 before collet chuck 22 will be contacted with fingerprint sensor 91 are being sufficiently far from fingerprint sensor
Speed when 91 position is mobile is compared, and is set as slowly moving.As a result, in addition to have collet chuck 22 will be with fingerprint sensing
Before device 91 contacts, the damage of collet chuck 22 caused by collision when contacting collet chuck 22 and fingerprint sensor 91, fingerprint sensor
Except 91 damage, the advantages of showing to the burden of Z driving portion, has the further advantage that and be sufficiently far from fingerprint in collet chuck 22
When the position of sensor 91 is mobile, collet chuck 22 can be to move than the fireballing speed before will contacting with fingerprint sensor 91
Dynamic, thereby, it is possible to promptly implement the measurement of the position of this part collet chuck 22.
In addition, can be connect when collet chuck 22 and fingerprint sensor 91 contact with certain power, such as 1N power detection below
Touching.As long as this can correctly and accurately detect the contact of collet chuck 22 with fingerprint sensor 91.But it is possible to constitute
To keep the power of contact not too strong without destroying collet chuck 22 or fingerprint sensor 91.
Collet chuck inspection portion 90 is configured at intermediate microscope carrier portion 3 (near intermediate microscope carrier 31), but also can be set and carry in centre
On platform 31, can also be set to can connect even if the outside in intermediate microscope carrier portion 3 for mounting head 41 and 21 both sides of pick-up head
Close position.As long as that is, being configured at the position for being able to confirm that the collet chuck both sides for checking mounting head 41 and pick-up head 21.Separately
Outside, collet chuck inspection portion 90 may be set to be that be movable to can be for 21 both sides close position of mounting head 41 and pick-up head, energy
Enough confirmations check the collet chuck both sides of mounting head 41 and pick-up head 21.
Then, illustrate that attachment acts using Figure 11,12.Figure 11,12 are the attaching methods for showing the chip attachment machine of Fig. 1
The flow chart of an example.The terminal A of the flow chart of Figure 11 is connected with the terminal A of the flow chart of Figure 12, the terminal B of the flow chart of Figure 12
It is connected with the terminal B of the flow chart of Figure 11.Hereinafter, the collet chuck 22 to pick-up head 21 is illustrated, but the collet chuck 42 of mounting head 41
It is also identical.
Firstly, the initialization (step S1) that control unit 8 is mounted.Here, the position as pick-up head 21, mounting head 41
Initialization, wafer identification camera 24, microscope carrier identification camera 32 and substrate identification camera 44 initialization of position etc.
One of initialization process, control unit 8 read and register the shape of the collet chuck 22 of accurate position.Specifically, control unit 8 makes cylinder
Folder 22 is moved in collet chuck inspection portion 90, is contacted with fingerprint sensor 91, read the shape of the maintaining part 22c of collet chuck 22 and by its
It is stored in the storing mechanisms such as the memory in control unit 8 (not shown).
Then, control unit 8 carries out picking up bare chip D from chip 11 using pick-up head 21, is placed in intermediate microscope carrier 31,
And bare chip D is picked up from intermediate microscope carrier 31 using mounting head 41, it is installed on the installation action (step S2) of substrate S etc..It connects
, control unit 8 judges whether to implement the installation action (step S3) of stipulated number.If implementing stipulated number, control
Portion 8 ends processing.If stipulated number is not carried out, control unit 8 judges whether implementation movement is more than to need to confirm collet chuck 22
Number or time confirm setting value (device produces number or whether the device working time has been more than specified value) (step S4).?
This, the confirmation setting value of collet chuck 22 and the confirmation setting value of collet chuck 42 can also be different.If being less than confirmation setting value, return
It returns step S2 and carries out installation action.If it exceeds confirmation setting value, then control unit 8 is in order to grasp the maintaining part 22c of collet chuck 22
Consumption degree etc. and the control for carrying out collet chuck.That is, control unit 8 makes collet chuck 22 to collet chuck inspection portion using pick-up head 21, mounting head 41
90 mobile (step S5), the shape (step S6) of the maintaining part 22c of collet chuck 22 is read using collet chuck inspection portion 90.Control unit 8 is sentenced
Whether the shape of the maintaining part 22c of disconnected collet chuck 22 is the shape (step S7) pre-registered in the initialization of step S1.It is being
In the case where, return step S2 carries out installation action.In a case of no, collet chuck 22 (step S8) is replaced.
The replacement of collet chuck 22 can be the manual mode that operator is artificially replaced, and be also possible to through collet chuck automatically more
The mode that the technology of changing is replaced.
Then, control unit 8 is moved to collet chuck 22 in collet chuck inspection portion 90 and is in contact with it (step by pick-up head 21
S9), the shape (step SA) of collet chuck 22 is read using collet chuck inspection portion 90.Whether the shape for judging collet chuck 22 is in step S1
The shape (step SB) pre-registered in initialization.Where it has, return step S2 carries out installation action.In no situation
Under, control unit 8 notifies exception (step SC).In this case, for example, control unit 8 shows collet chuck image, in the cylinder clean and tidy for pattern
In the case where the shape of folder, operator is judged as collet chuck kind mistake, is manually or automatically replaced with accurate collet chuck.Pattern not
In the case where the shape for forming collet chuck, operator is judged as that the installations such as collet chuck inclination are bad, and collet chuck 22 is manually or automatically pacified again
Loaded on collet chuck bracket 25.
Then, the manufacturing method of the semiconductor devices for the chip attachment machine for having used embodiment is illustrated using Figure 13.Figure 13
It is the flow chart for showing the manufacturing method of semiconductor devices.
Step S11: the wafer ring 14 that remain the cutting belt 16 for being pasted with the bare chip D being partitioned into from chip 11 is saved
In wafer case (not shown), and move in chip attachment machine 10.Control unit 8 is supplied from the wafer case filled with wafer ring 14 to bare chip
Wafer ring 14 is supplied to portion 1.In addition, prepared substrate S, and moved in chip attachment machine 10.Control unit 8 utilizes substrate supply unit
Substrate S is placed in transport passage for transporting 52 by 6.
Step S12: control unit 8 picks up bare chip D from the cutting belt 16 for being held in wafer ring 14.
Step S13: the bare chip D picked up is equipped on the packaging area P of substrate S or is laminated in and pasted by control unit 8
On the bare chip of dress.More specifically, the bare chip D picked up from cutting belt 16 is placed in intermediate microscope carrier 31 by control unit 8, is led to
It crosses mounting head 41 and picks up bare chip D again from intermediate microscope carrier 31, and be mounted on the packaging area P for carrying the substrate S come.
Step S14: substrate S is moved to substrate moving section 7 using board carrying pawl 51 by control unit 8, to substrate moving section 7
It delivers substrate S and moves out substrate S (substrate unloading) from chip attachment machine 10.
In embodiment, by using the fingerprint sensings such as optical mode fingerprint sensor or static capacitive fingerprint sensor
Device is able to detect that the fine bumps of contacted part, can accurately detect collet chuck shape (abrasion, foreign matter it is attached
) or installation condition (gradient).In addition, being easy to log in the shape of collet chuck in the same manner as capable of logging in fingerprint.Finger can be passed through
Line identification log in collet chuck replace automatically used in multiple types collet chuck, can easily be done automatically replace after really
Recognize.Product caused by the exception because of collet chuck can be prevented bad in possible trouble.
<variation>
Hereinafter, several to representative modified examples.In the explanation of variation below, for have with it is above-mentioned
Appended drawing reference identical with the above embodiments can be used in the part of the identical structure of the content illustrated in embodiment and function.And
And for the explanation of the part, not generating technically in the range of contradiction can be suitable for the explanation quoted in the above embodiments.
In addition, all or part of of a part of above-described embodiment and multiple variations technically can be suitable in reconcilable range
It applies compoundly.
Figure 14 is the figure for illustrating the collet chuck inspection portion of variation, and (A) of Figure 14 is the schematic of collet chuck and collet chuck inspection portion
Side view, (B) of Figure 14 are the schematic perspective views of fingerprint sensor.Figure 15 is that explanation is carried out using the fingerprint sensor of Figure 14
Collet chuck gradient detection figure.Hereinafter, the collet chuck 22 to pick-up head 21 is illustrated, but the collet chuck 42 of mounting head 41
It is identical.
Collet chuck inspection portion 90A removes the fingerprint sensor 91 for having the collet chuck inspection portion 90 of embodiment, support plate 92 and detection
Except circuit 93, it is also equipped with pressure sensor 95a, 95b, 95c.Detection circuit 93A is removed via cable 94 and fingerprint sensor 91
Except connection, pressure sensor 95a, 95b, 95c also are connected via cable 97a, 97b, 97c and output section 96a, 96b, 96c.Pressure
Force snesor 95a, 95b, 95c are with 3 dot point fingerprint sensors 91.
Detection circuit 93A is identical as the detection circuit 93 of embodiment, except the signal amplification that will be inputted from cable 94 carries out letter
Number processing except, also by signal input from cable 97a, 97b, 97c with amplifier it is (not shown) amplify, utilize A/D converter
(not shown) is converted to digital signal and is handled using signal processing circuit (not shown).
Pressure sensor 95a, 95b, 95c are for example made of the piezoelectric element as pressure cell respectively.
That is, according to the collet chuck inspection portion 90A of above structure, for any reason and under leading to the inclined situation of collet chuck 22,
Output from three pressure sensors 95a, 95b, 95c generates unbalance.Therefore, using from these three pressure sensors 95a,
Its focus point is for example sought in the output of 95b, 95c, by find out deviate original (when not tilting) focus point distance (it is well-behaved from
Degree), and can easily detect the inclination of collet chuck 22.
Then, illustrate that attachment acts using Figure 16,17.Figure 16,17 are the attaching methods for showing the chip attachment machine of Fig. 1
Other flow charts.The terminal A of the flow chart of Figure 16 is connected with the terminal A of the flow chart of Figure 17, the end of the flow chart of Figure 17
Sub- B is connected with the terminal B of the flow chart of Figure 16.Hereinafter, the collet chuck 22 to pick-up head 21 is illustrated, but the collet chuck of mounting head 41
42 be also identical.
Step S1~S5 is identical as the embodiment of Figure 11.
Control unit 8 carries out the control of collet chuck for consumption degree for grasping collet chuck 22 etc..That is, control unit 8 utilizes pick-up head
21, mounting head 41 keeps collet chuck 22 mobile (step S5) to collet chuck inspection portion 90, and the height of collet chuck 22 is read using collet chuck inspection portion 90
Degree, shape (step S6A).
Control unit 8 judges whether the collet chuck height of the maintaining part 22c of collet chuck 22 or the deviation of height are more than specified value (step
S7A).In a case of no, step S7 is moved to, where it has, moving to step S8.
In the step s 7, control unit 8 judges whether the shape of the maintaining part 22c of collet chuck 22 is in the initialization of step S1
The shape logged in advance.Where it has, return step S2 carries out installation action.Step S8 is moved in a case of no.
In step s 8, collet chuck 22 is replaced.The replacement of collet chuck 22 can be the manual mode that operator is artificially replaced,
It is also possible to replace automatically by way of technology replaced collet chuck.
Then, control unit 8 is moved to collet chuck 22 in collet chuck inspection portion 90 and is in contact with it (step by pick-up head 21
S9), height, the shape (step SAA) of the maintaining part 22c of collet chuck 22 are read using collet chuck inspection portion 90.
Control unit 8 judges whether the collet chuck height of the maintaining part 22c of collet chuck 22 or the deviation of height are more than specified value (step
SBA).In for the first specified value situation below, step SB is moved to, more than the first specified value but for below the second specified value
In the case where, step SD is moved to, more than the second specified value, return step S8 installs collet chuck 22 again.
In step SD, control unit 8 acts pick-up head 21 based on the deviation of height, adjusts the gradient of collet chuck 22.
In step SB, control unit 8 judges whether the shape of collet chuck 22 is to log in advance in the initialization of step S1
Shape (step SB).Where it has, return step S2 carries out installation action.In a case of no, control unit 8 is judged as cylinder
Kind mistake is pressed from both sides, return step S8 is changed to accurate collet chuck.
In variation, multiple pressure sensors are assembled under fingerprint sensor 91, confirm shape (the shape ruler of collet chuck
The layout of very little, vacuum attraction hole and/or vacuum attraction slot, abrasion, foreign matter attachment), and confirm (tilting according to state for collet chuck
Angle, height).Element (installation site, gradient, abrasion, foreign matter attachment) thereby, it is possible to one-time detection in relation to collet chuck exception
Deng whole elements.It is super in tilt angle using the gradient of head adjustment collet chuck in the case where tilt angle is specified value situation below
In the case where crossing specified value, collet chuck is installed again, thus also can automatically carry out the replacement and its confirmation of collet chuck.By automatic
It grasps the consumption degree of collet chuck and further adds collet chuck and replace function automatically, a series of movement goes completely into automatically, as a result, can
Enough realize that the quality caused by the cost reduction of staff cost, mistake reduce improves.
More than, the invention created by the present inventor is specifically illustrated based on embodiment, but the present invention is not limited to above-mentioned implementations
Example, also various modifications may be made.
For example, in embodiment, example that collet chuck 22 is made of elastomer 22a, stainless steel 22b and maintaining part 22c into
Go explanation, but not limited to this, such as can also be only made of elastomer.In addition, in embodiment, illustrating that collet chuck has and inhaling
The example of pilot hole, but not limited to this, such as also can have attraction slot.
In addition, in embodiment, to using example of the fingerprint sensor as SHAPE DETECTION sensor to be illustrated, but
It is without being limited thereto, as long as such as by multiple sensors with pitch needed for the inspection of the shapes such as the bumps on the surface of collet chuck be in grid
The sensor of the panel shape or sheet of shape or zigzag two dimension setting.
In addition, in variation, using pressure sensor but it is also possible to be pressure-sensitive or displacement sensor.In addition, becoming
The example for having three pressure sensors is illustrated in shape example, but not limited to this, such as or four or more.
Alternatively, it is also possible to clean the surface of fingerprint sensor (plate) automatically.
Furthermore it is possible to be the mounting portion and transport passage for transporting for having multiple groups including pickup section, aligned portions and attachment portion
Chip attachment machine, be also possible to have multiple groups and include pickup section, aligned portions and attachment portion in interior mounting portion and there is one remove
Wan access.
In addition, in embodiment, illustrating the example using bare chip bonding die film, but coating can also be arranged on substrate
The pre-shaped section of bonding agent is without the use of bare chip bonding die film.
In addition, in embodiment, with pick-up head pickup bare chip and being placed in intermediate load to from bare chip supply unit
On platform, and the chip attachment machine that the bare chip being placed on intermediate microscope carrier is mounted on substrate is illustrated with mounting head,
But not limited to this, it is applicable to pick up the semiconductor manufacturing apparatus of bare chip from bare chip supply unit.
For example, can also be suitable for without intermediate microscope carrier and pick-up head but pass through mounting head for bare chip supply unit
Bare chip is mounted on the chip attachment machine on substrate.
In addition, can be suitable for not having intermediate microscope carrier but pick up bare chip from bare chip supply unit and pick up bare chip
It takes head to rotate upwards, bare chip is transferred to mounting head and is mounted on the flip-chip chip mounter on substrate with mounting head.
In addition, can be suitable for without intermediate microscope carrier and mounting head but will be picked up from bare chip supply unit with pick-up head
Bare chip be placed in the die selector of pallet etc..
Claims (13)
1. a kind of semiconductor manufacturing apparatus, which is characterized in that have:
Head is adsorbed using collet chuck and picks up bare chip；
Collet chuck inspection portion confirms and checks the collet chuck；And
Control device controls the head and collet chuck inspection portion,
Collet chuck inspection portion has SHAPE DETECTION sensor,
The control device reads the shape of the collet chuck by the SHAPE DETECTION sensor.
2. semiconductor manufacturing apparatus according to claim 1, which is characterized in that
The control device in advance will be read out the shape of the collet chuck at specified position by the SHAPE DETECTION sensor
And store data and check when the shape of the collet chuck is read out as the SHAPE DETECTION sensor obtained from
Data are compared, to detect the exception of the collet chuck.
3. semiconductor manufacturing apparatus according to claim 2, which is characterized in that
The exception of the collet chuck is the abrasion of collet chuck, foreign matter attachment, inclination or kind mistake.
4. semiconductor manufacturing apparatus according to claim 3, which is characterized in that
In the case where the control device detects the exception of the collet chuck, the collet chuck is replaced.
5. semiconductor manufacturing apparatus according to claim 2, which is characterized in that
Height of the collet chuck inspection portion at least three detection collet chucks also under the SHAPE DETECTION sensor or
The sensor of the deviation of height.
6. semiconductor manufacturing apparatus according to claim 5, which is characterized in that
The control device is judged as the collet chuck in the case where the deviation of the height of the collet chuck is the first specified value situation below
Be installed as normal, the first specified value described in the deviation ratio of the height of the collet chuck is big and is the situation below the second specified value
Under, it is judged as the tilt adjustments for needing to carry out the collet chuck, the second specified value described in the deviation ratio of the height of the collet chuck is big
In the case where, be judged as the collet chuck is installed as exception.
7. semiconductor manufacturing apparatus according to claim 6, which is characterized in that
The sensor is pressure sensor, pressure-sensitive or displacement sensor.
8. semiconductor manufacturing apparatus according to claim 1, which is characterized in that
The SHAPE DETECTION sensor is fingerprint sensor.
9. semiconductor manufacturing apparatus according to claim 1, which is characterized in that be also equipped with:
Bare chip supply unit has the wafer ring for the cutting belt for keeping being pasted with bare chip；
Pick-up head picks up the bare chip for being attached at the cutting belt；
Intermediate microscope carrier, the bare chip that mounting is picked up by the pick-up head；And
Mounting head will be mounted from the bare chip that the intermediate microscope carrier picks up on substrate or the bare chip mounted,
The head is at least one party of the pick-up head and the mounting head.
10. semiconductor manufacturing apparatus according to claim 9, which is characterized in that
The collet chuck check point in the moving range of the pick-up head and the mounting head both sides,
The control device keeps the pick-up head and the mounting head mobile to collet chuck inspection portion, checks the pick-up head
The collet chuck of collet chuck and the mounting head.
11. a kind of manufacturing method of semiconductor devices, has:
(a) prepare the process of semiconductor manufacturing apparatus according to any one of claims 1 to 10；
(b) process of wafer ring is moved in, wherein the wafer ring keeps the cutting belt for being pasted with bare chip；
(c) prepare the process for moving in substrate；
(d) process of bare chip is picked up；And
(e) by the bare chip attachment picked up to the process on the substrate or the bare chip mounted.
12. the manufacturing method of semiconductor devices according to claim 11, which is characterized in that
(d) process is that the bare chip for being attached at the cutting belt is picked up using mounting head,
(e) process is by the bare chip picked up by the mounting head attachment to the substrate or the bare chip mounted
On.
13. the manufacturing method of semiconductor devices according to claim 11, which is characterized in that
(d) process includes
(d1) process for being attached at the bare chip of the cutting belt is picked up by pick-up head；And (d2) will pass through the pick-up head
The process that the bare chip picked up is placed in intermediate microscope carrier,
(e) process has:
(e1) process for being placed in the bare chip of the intermediate microscope carrier is picked up using mounting head；And
(e2) process that the bare chip picked up by the mounting head is placed in the substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017200097A JP7033878B2 (en) | 2017-10-16 | 2017-10-16 | Semiconductor manufacturing equipment and methods for manufacturing semiconductor equipment |
| JP2017-200097 | 2017-10-16 |
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| Publication Number | Publication Date |
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| CN109671646A true CN109671646A (en) | 2019-04-23 |
| CN109671646B CN109671646B (en) | 2023-03-24 |
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| JP (1) | JP7033878B2 (en) |
| KR (2) | KR102190697B1 (en) |
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| JP7326861B2 (en) * | 2019-05-17 | 2023-08-16 | 三菱電機株式会社 | Semiconductor manufacturing equipment and semiconductor device manufacturing method |
| KR102202080B1 (en) * | 2019-07-02 | 2021-01-12 | 세메스 주식회사 | Collet exchange method, die transfer method and die bonding method |
| JP7291586B2 (en) * | 2019-09-19 | 2023-06-15 | ファスフォードテクノロジ株式会社 | Die bonding apparatus and semiconductor device manufacturing method |
| JP6880158B1 (en) * | 2019-11-29 | 2021-06-02 | キヤノンマシナリー株式会社 | Work transfer device, work transfer method, transfer body manufacturing method, semiconductor device manufacturing method, and die bonder |
| JP7080284B2 (en) * | 2020-09-08 | 2022-06-03 | キヤノンマシナリー株式会社 | Collet adjustment device, bonding device, collet adjustment method |
| WO2023228366A1 (en) * | 2022-05-26 | 2023-11-30 | 三菱電機株式会社 | Substrate for foreign material adhesion inspection, foreign material adhesion inspection device, and foreign material adhesion inspection method |
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- 2018-10-01 KR KR1020180116853A patent/KR102190697B1/en active IP Right Grant
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI734030B (en) | 2021-07-21 |
| KR102190697B1 (en) | 2020-12-14 |
| TW201923964A (en) | 2019-06-16 |
| KR20190042445A (en) | 2019-04-24 |
| KR102329117B1 (en) | 2021-11-19 |
| JP7033878B2 (en) | 2022-03-11 |
| JP2019075446A (en) | 2019-05-16 |
| CN109671646B (en) | 2023-03-24 |
| KR20200107905A (en) | 2020-09-16 |
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