CN109576722A - Cleaning agent for copper - Google Patents
Cleaning agent for copper Download PDFInfo
- Publication number
- CN109576722A CN109576722A CN201910098514.8A CN201910098514A CN109576722A CN 109576722 A CN109576722 A CN 109576722A CN 201910098514 A CN201910098514 A CN 201910098514A CN 109576722 A CN109576722 A CN 109576722A
- Authority
- CN
- China
- Prior art keywords
- parts
- cleaning agent
- weight
- copper
- surfactant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
- C23G1/16—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions using inhibitors
- C23G1/18—Organic inhibitors
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
- C23G1/20—Other heavy metals
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Detergent Compositions (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The present invention provides a kind of cleaning agent for copper, by the cleaning agent for copper be 100 parts by weight based on, comprising: the deionized water of 40~65 parts by weight；The solketal of 25~35 parts by weight；The surfactant of 0.001~2 parts by weight；And 0.01~2 parts by weight corrosion inhibiter.
Description
Technical field
The present invention relates to a kind of cleaning agent for copper more particularly to a kind of cleaning agent for copper of removable macromolecule combination product.
Background technique
The existing commonly used copper wiring technique of large size TFT-LCD display carries on the back channel currently in 4 masking techniques
When etching, combines the molecular by-products generated to influence vulnerable to some copper, photoresist and dry etching gas, metal surface is caused to become
Color or electrically offset.General manufacturing process for cleaning, it is limited for molecular by-products removal ability using ultrapure water or deionized water.
It is cleaned currently, having using photoresist remover, but can not solve the problems, such as Metal surface contamination at all.
In order to solve the problems of prior art, a kind of cleaning agent for copper is needed, can remove copper and photoresist and dry ecthing
Gas, which combines, generates combination product, to promote product yield.
Summary of the invention
Based on above-mentioned, the object of the present invention is to provide a kind of cleaning agent for copper, can remove copper and photoresist and dry ecthing gas
Body, which combines, generates combination product, achievees the purpose that promote product yield.
To achieve the goals above, the present invention provides a kind of cleaning agent for copper, is 100 parts by weight as base using the cleaning agent for copper
Plinth, comprising: the deionized water of 40~65 parts by weight；The solketal of 25~35 parts by weight；The surface of 0.001~2 parts by weight
Activating agent；And 0.01~2 parts by weight corrosion inhibiter.
An embodiment according to the present invention, the cleaning agent for copper, pH value are 8~10.
An embodiment according to the present invention, the surfactant include monamide class compound, the amides chemical combination
Object include but is not limited to it is following at least one: ethylene glycol amide, single ethanol amide and polyethenoxy alkanolamide.
An embodiment according to the present invention, the surfactant include a quaternary ammonium compound, the quaternary ammonium salt
Compound include but is not limited to it is following at least one: benzyltriethylammonium chloride, hydrogen sulfate Ding Siji ammonium, trimethyl
Ammonium chloride, dodecyl benzyl dimethyl ammonium chloride, octadecyldimethyl ethylene hydroxy sulfuric acid ammonium and octadecyldimethyl
Ethoxy ammonium perchlorate.
An embodiment according to the present invention, the corrosion inhibiter include an azole compounds, the azole compounds include but
Be not limited to it is following at least one: benzotriazole, 1H- imidazoles, 1H-TETRAZOLE, 5- phenyl -1H-TETRAZOLE, 5- amino -1H-TETRAZOLE,
3- amino -1H- triazole and 5- carboxy benzotriazole.
An embodiment according to the present invention, by the cleaning agent for copper be 100 parts by weight based on, the cleaning agent for copper packet
It includes: the deionized water of 60~65 parts by weight；The solketal of 28~32.5 parts by weight；0.5~1.5 parts by weight surface-active
Agent；And 0.5~1 parts by weight corrosion inhibiter.
An embodiment according to the present invention, by the cleaning agent for copper be 100 parts by weight based on, the cleaning agent for copper packet
It includes: the deionized water of 65 parts by weight；The solketal of 32.5 parts by weight；1.5 parts surfactant；And 1 parts by weight
Corrosion inhibiter.
Cleaning agent for copper provided by the present invention can remove copper and generate combination product in conjunction with photoresist and dry etching gas, reaches
To the purpose for promoting product yield.
Detailed description of the invention
Nothing.
Specific embodiment
Referenced herein " embodiment " is it is meant that a particular feature, structure, or characteristic described can wrap in conjunction with the embodiments
Containing at least one embodiment of the present invention.Each position in the description occur the phrase might not each mean it is identical
Embodiment, nor the independent or alternative embodiment with other embodiments mutual exclusion.Those skilled in the art explicitly and
Implicitly understand, embodiment described herein can be combined with other embodiments.
The present invention provides a kind of cleaning agent for copper, can remove copper and generate combination product in conjunction with photoresist and dry etching gas,
Achieve the purpose that promote product yield.
The cleaning agent for copper of the present invention adds certain amine using neutral flux solketal and deionized water as primary solvent
Class and salt corrosion inhibitor, to remove macromolecule combination product.
Specifically, in an embodiment of the present invention, the copper of the present invention cleans, with the cleaning agent for copper for 100 parts by weight
Based on, it may include: the deionized water of 40~65 parts by weight；The solketal of 25~35 parts by weight；0.001~2 parts by weight
Surfactant；And 0.01~2 parts by weight corrosion inhibiter；It preferably includes: the deionized water of 60~65 parts by weight；28~
The solketal of 32.5 parts by weight；0.5~1.5 parts surfactant；And 0.5~1 parts by weight corrosion inhibiter；More preferably
It include: the deionized water of 65 parts by weight；The solketal of 32.5 parts by weight；1.5 parts surfactant；And 1 weight
Part corrosion inhibiter.
An embodiment according to the present invention, the pH value of the cleaning agent for copper can be 8~10.
In the present invention, excellent surfactant can effectively improve surface-active.An embodiment according to the present invention,
The surfactant may include monamide class compound, the amides compound include but is not limited to it is following at least one:
Ethylene glycol amide, single ethanol amide and polyethenoxy alkanolamide.
An embodiment according to the present invention, the surfactant include a quaternary ammonium compound, the quaternary ammonium salt
Compound may include but be not limited to it is following at least one: benzyltriethylammonium chloride, hydrogen sulfate Ding Siji ammonium, dodecyl front three
Ammonium chloride, dodecyl benzyl dimethyl ammonium chloride, octadecyldimethyl ethylene hydroxy sulfuric acid ammonium and hexadecyldimethylamine
Base ethoxy ammonium perchlorate.
In the present invention, the corrosion inhibiter shields the metal ion generated after etching, reduces the erosion to copper surface.
An embodiment according to the present invention, the corrosion inhibiter may include an azole compounds, and the azole compounds include but is not limited to
It is following at least one: benzotriazole, 1H- imidazoles, 1H-TETRAZOLE, 5- phenyl -1H-TETRAZOLE, 5- amino -1H-TETRAZOLE, 3- amino -
1H- triazole and 5- carboxy benzotriazole.
Accordingly, the present invention provides a kind of cleaning agent for copper, removable copper generates compound in conjunction with photoresist and dry etching gas
Product achievees the purpose that promote product yield.
In conclusion although the present invention has been disclosed above in the preferred embodiment, but above preferred embodiment is not to limit
The system present invention, those skilled in the art can make various changes and profit without departing from the spirit and scope of the present invention
Decorations, therefore protection scope of the present invention subjects to the scope of the claims.
Claims (10)
1. a kind of cleaning agent for copper, based on being 100 parts by weight by the cleaning agent for copper, comprising:
The deionized water of 40~65 parts by weight；
The solketal of 25~35 parts by weight；
The surfactant of 0.001~2 parts by weight；And
The corrosion inhibiter of 0.01~2 parts by weight.
2. cleaning agent for copper according to claim 1, pH value is 8~10.
3. cleaning agent for copper according to claim 1, wherein the surfactant includes monamide class compound.
4. cleaning agent for copper according to claim 1, wherein the surfactant include it is following at least one: ethylene glycol acyl
Amine, single ethanol amide and polyethenoxy alkanolamide.
5. cleaning agent for copper according to claim 1, wherein the surfactant includes a quaternary ammonium compound.
6. cleaning agent for copper according to claim 1, wherein the surfactant include it is following at least one: zephiran chloride
Triethyl ammonium, hydrogen sulfate Ding Siji ammonium, dodecyl trimethyl ammonium chloride, dodecyl benzyl dimethyl ammonium chloride, octadecane
Base dimethyl hydroxy ethyl ammonium sulfate and octadecyldimethyl ethoxy ammonium perchlorate.
7. cleaning agent for copper according to claim 1, wherein the corrosion inhibiter includes an azole compounds.
8. cleaning agent for copper according to claim 1, wherein the corrosion inhibiter include it is following at least one: benzotriazole,
1H- imidazoles, 1H-TETRAZOLE, 5- phenyl -1H-TETRAZOLE, 5- amino -1H-TETRAZOLE, 3- amino -1H- triazole and 5- carboxyl benzo three
Nitrogen azoles.
9. cleaning agent for copper according to claim 1, wherein based on being 100 parts by weight by the cleaning agent for copper, the copper
Cleaning agent includes:
The deionized water of 60~65 parts by weight；
The solketal of 28~32.5 parts by weight；
0.5~1.5 parts surfactant；And
0.5~1 parts by weight corrosion inhibiter.
10. cleaning agent for copper according to claim 1, wherein based on being 100 parts by weight by the cleaning agent for copper, the copper
Cleaning agent includes:
The deionized water of 65 parts by weight；
The solketal of 32.5 parts by weight；
1.5 parts surfactant；And
1 parts by weight corrosion inhibiter.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910098514.8A CN109576722A (en) | 2019-01-31 | 2019-01-31 | Cleaning agent for copper |
| PCT/CN2019/094141 WO2020155551A1 (en) | 2019-01-31 | 2019-07-01 | Copper detergent |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910098514.8A CN109576722A (en) | 2019-01-31 | 2019-01-31 | Cleaning agent for copper |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109576722A true CN109576722A (en) | 2019-04-05 |
Family
ID=65918651
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910098514.8A Pending CN109576722A (en) | 2019-01-31 | 2019-01-31 | Cleaning agent for copper |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109576722A (en) |
| WO (1) | WO2020155551A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110129807A (en) * | 2019-05-23 | 2019-08-16 | 电子科技大学 | It is a kind of for copper/iron-based material restrainer and pickling solution |
| CN110760863A (en) * | 2019-11-18 | 2020-02-07 | 黄山学院 | Corrosion inhibitor suitable for dynamic strong alkaline washing of metal workpiece and preparation method thereof |
| WO2020155551A1 (en) * | 2019-01-31 | 2020-08-06 | 深圳市华星光电技术有限公司 | Copper detergent |
Citations (5)
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|---|---|---|---|---|
| CN103468434A (en) * | 2013-09-17 | 2013-12-25 | 华阳新兴科技（天津）集团有限公司 | Environment-friendly safe solvent cleaning agent |
| CN103469236A (en) * | 2013-09-22 | 2013-12-25 | 西北机器有限公司 | Copper base material cleaning agent and preparation method thereof |
| CN104451712A (en) * | 2014-11-26 | 2015-03-25 | 成都川硬合金材料有限责任公司 | Water-based cleaning agent for copper surface |
| CN107326375A (en) * | 2017-06-29 | 2017-11-07 | 顾渊 | One Albatra metal cleaning agent |
| CN109023395A (en) * | 2018-08-07 | 2018-12-18 | 秦晓平 | Steel detergent |
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| US7326673B2 (en) * | 2001-12-31 | 2008-02-05 | Advanced Technology Materials, Inc. | Treatment of semiconductor substrates using long-chain organothiols or long-chain acetates |
| WO2010048139A2 (en) * | 2008-10-21 | 2010-04-29 | Advanced Technology Materials, Inc. | Copper cleaning and protection formulations |
| KR101946379B1 (en) * | 2012-11-20 | 2019-02-11 | 주식회사 동진쎄미켐 | Composition for photoresist stripping solution and stripping method of photoresist using the same |
| CN105143517A (en) * | 2013-04-22 | 2015-12-09 | 高级技术材料公司 | Copper cleaning and protection formulations |
| CN109576722A (en) * | 2019-01-31 | 2019-04-05 | 深圳市华星光电技术有限公司 | Cleaning agent for copper |
-
2019
- 2019-01-31 CN CN201910098514.8A patent/CN109576722A/en active Pending
- 2019-07-01 WO PCT/CN2019/094141 patent/WO2020155551A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103468434A (en) * | 2013-09-17 | 2013-12-25 | 华阳新兴科技（天津）集团有限公司 | Environment-friendly safe solvent cleaning agent |
| CN103469236A (en) * | 2013-09-22 | 2013-12-25 | 西北机器有限公司 | Copper base material cleaning agent and preparation method thereof |
| CN104451712A (en) * | 2014-11-26 | 2015-03-25 | 成都川硬合金材料有限责任公司 | Water-based cleaning agent for copper surface |
| CN107326375A (en) * | 2017-06-29 | 2017-11-07 | 顾渊 | One Albatra metal cleaning agent |
| CN109023395A (en) * | 2018-08-07 | 2018-12-18 | 秦晓平 | Steel detergent |
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| 范望喜等: "《有机化学（第三版）》", 30 June 2015, 华中师范大学出版社 * |
| 马世昌: "《化学物质辞典》", 30 April 1999, 陕西科学技术出版社 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020155551A1 (en) * | 2019-01-31 | 2020-08-06 | 深圳市华星光电技术有限公司 | Copper detergent |
| CN110129807A (en) * | 2019-05-23 | 2019-08-16 | 电子科技大学 | It is a kind of for copper/iron-based material restrainer and pickling solution |
| CN110760863A (en) * | 2019-11-18 | 2020-02-07 | 黄山学院 | Corrosion inhibitor suitable for dynamic strong alkaline washing of metal workpiece and preparation method thereof |
| CN110760863B (en) * | 2019-11-18 | 2021-10-29 | 黄山学院 | Corrosion inhibitor suitable for dynamic strong alkaline washing of metal workpiece and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020155551A1 (en) | 2020-08-06 |
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| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20190405 |