CN108550684A - A kind of LED light source - Google Patents
A kind of LED light source Download PDFInfo
- Publication number
- CN108550684A CN108550684A CN201810624313.2A CN201810624313A CN108550684A CN 108550684 A CN108550684 A CN 108550684A CN 201810624313 A CN201810624313 A CN 201810624313A CN 108550684 A CN108550684 A CN 108550684A
- Authority
- CN
- China
- Prior art keywords
- bonding wire
- holder
- chip
- flat
- led light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 210000005069 ears Anatomy 0.000 claims abstract description 6
- 241001391944 Commicarpus scandens Species 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of LED light sources, including holder, the upper surface of the holder is equipped with chip, the upper surface side of the chip is electrically connected holder by flat ear bank shape bonding wire, the both ends of the flat ear bank shape bonding wire connect chip by soldered ball and holder, the flat ear bank shape bonding wire are set as bonding wire of the upper-end bent at flat shape of ears.The LED light source, reasonable for structure, highly practical, chip is connect by flat ear bank shape bonding wire with holder, is connected firmly, and flat ear bank shape bonding wire extensibility is good, and anti-ability of expanding with heat and contract with cold is good, not easy to break.
Description
Technical field
The invention belongs to LED technology fields, and in particular to a kind of LED light source.
Background technology
The chip of existing LED light source is directly connected to holder, straight line connection is formed, in this way when LED light source is long
Between will produce high temperature when working, due to the physical principle expanded with heat and contract with cold, conducting wire can be made to be pulled away from, LED light source is caused to damage.
Invention content
The purpose of the present invention is to provide a kind of LED light sources, to solve the problems mentioned in the above background technology.
To achieve the above object, the present invention provides the following technical solutions：A kind of LED light source, including holder, the holder
Upper surface is equipped with chip, and the upper surface side of the chip is electrically connected holder, the flat ear by flat ear bank shape bonding wire
The both ends of piece bank shape bonding wire connect chip and holder by soldered ball, the flat ear bank shape bonding wire be set as upper-end bent at
The bonding wire of flat shape of ears.
Preferably, the soldered ball volume of the bracket end is more than the soldered ball volume of die terminals.
The technique effect and advantage of the present invention：The LED light source, reasonable for structure, highly practical, chip passes through flat ear bank
Shape bonding wire is connect with holder, is connected firmly, and flat ear bank shape bonding wire extensibility is good, and anti-ability of expanding with heat and contract with cold is good, not easily broken
It splits.
Description of the drawings
Fig. 1 is the structural diagram of the present invention.
In figure：1 holder, 2 chips, 3 flat ear bank shape bonding wires, 4 soldered balls.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
The present invention provides a kind of LED light source as shown in Figure 1, including holder 1, the upper surface of the holder 1 is equipped with core
The upper surface side of piece 2, the chip 2 is electrically connected holder 1, the flat ear bank shape by flat ear bank shape bonding wire 3
The both ends of bonding wire 3 connect chip 2 by soldered ball 4 and holder 1, the flat ear bank shape bonding wire 3 are set as upper-end bent at flat
The bonding wire of shape of ears.
Specifically, 4 volume of soldered ball at 1 end of the holder is more than 4 volume of soldered ball at 2 end of chip.
One end of flat ear bank shape bonding wire 3 is in flat shape of ears, can play the role of buffering, when light source is in low temperature,
Bonding wire is shunk, and is shortened wire length, flat shape of ears bonding wire can only deformed, without breaking, when light source high temperature, bonding wire is in warm
Elongated under the action of swollen, the cushioning effect of flat ear bank shape bonding wire 3 keeps bonding wire, soldered ball 4 unaffected.
Finally it should be noted that：The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention,
Although the present invention is described in detail referring to the foregoing embodiments, for those skilled in the art, still may be used
With technical scheme described in the above embodiments is modified or equivalent replacement of some of the technical features,
All within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in the present invention's
Within protection domain.
Claims (2)
1. a kind of LED light source, including holder（1）, it is characterised in that：The holder（1）Upper surface be equipped with chip（2）, described
Chip（2）Upper surface side pass through flat ear bank shape bonding wire（3）It is electrically connected holder（1）, the flat ear bank shape weldering
Line（3）Both ends pass through soldered ball（4）Connect chip（2）And holder（1）, the flat ear bank shape bonding wire（3）It is set as upper end
Bend to the bonding wire of flat shape of ears.
2. a kind of LED light source according to claim 1, it is characterised in that：The holder（1）The soldered ball at end（4）Volume is big
In chip（2）The soldered ball at end（4）Volume.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810624313.2A CN108550684A (en) | 2018-06-16 | 2018-06-16 | A kind of LED light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810624313.2A CN108550684A (en) | 2018-06-16 | 2018-06-16 | A kind of LED light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108550684A true CN108550684A (en) | 2018-09-18 |
Family
ID=63493722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810624313.2A Pending CN108550684A (en) | 2018-06-16 | 2018-06-16 | A kind of LED light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108550684A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111864530A (en) * | 2019-04-30 | 2020-10-30 | 深圳市聚飞光电股份有限公司 | Wire bonding method and optical device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101071779A (en) * | 2006-05-08 | 2007-11-14 | 矽品精密工业股份有限公司 | Semiconductor package stacking structure and its preparing method |
| CN202111074U (en) * | 2011-07-08 | 2012-01-11 | 深圳电通纬创微电子股份有限公司 | Welding wire point structure of integrated circuit |
| CN103378043A (en) * | 2012-04-25 | 2013-10-30 | 鸿富锦精密工业（深圳）有限公司 | Chip assembly structure and chip assembly method |
| CN206490087U (en) * | 2016-12-27 | 2017-09-12 | 江苏稳润光电科技有限公司 | A kind of LED encapsulation structure |
-
2018
- 2018-06-16 CN CN201810624313.2A patent/CN108550684A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101071779A (en) * | 2006-05-08 | 2007-11-14 | 矽品精密工业股份有限公司 | Semiconductor package stacking structure and its preparing method |
| CN202111074U (en) * | 2011-07-08 | 2012-01-11 | 深圳电通纬创微电子股份有限公司 | Welding wire point structure of integrated circuit |
| CN103378043A (en) * | 2012-04-25 | 2013-10-30 | 鸿富锦精密工业（深圳）有限公司 | Chip assembly structure and chip assembly method |
| CN206490087U (en) * | 2016-12-27 | 2017-09-12 | 江苏稳润光电科技有限公司 | A kind of LED encapsulation structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111864530A (en) * | 2019-04-30 | 2020-10-30 | 深圳市聚飞光电股份有限公司 | Wire bonding method and optical device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Country or region after: China Address after: 529000 workshop of ChaoLian tanbian Yuelong Commercial Logistics Park (Building 2, No. 36 Jiaxing Road), Pengjiang district, Jiangmen City, Guangdong Province Applicant after: Guangdong Zhongyangguang Electric Technology Co.,Ltd. Address before: 529000 Chaolian Tanbian Yuelong Commercial Logistics Park, Pengjiang District, Jiangmen City, Guangdong Province Applicant before: JIANGMEN ZHONGYANG PHOTOELECTRIC Co.,Ltd. Country or region before: China |