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CN108550684A - 一种led光源 - Google Patents

一种led光源 Download PDF

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Publication number
CN108550684A
CN108550684A CN201810624313.2A CN201810624313A CN108550684A CN 108550684 A CN108550684 A CN 108550684A CN 201810624313 A CN201810624313 A CN 201810624313A CN 108550684 A CN108550684 A CN 108550684A
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CN
China
Prior art keywords
bonding wire
holder
chip
flat
led light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810624313.2A
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English (en)
Inventor
陈广明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangmen Zhongyang Photoelectric Technology Co Ltd
Original Assignee
Jiangmen Zhongyang Photoelectric Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangmen Zhongyang Photoelectric Technology Co Ltd filed Critical Jiangmen Zhongyang Photoelectric Technology Co Ltd
Priority to CN201810624313.2A priority Critical patent/CN108550684A/zh
Publication of CN108550684A publication Critical patent/CN108550684A/zh
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

本发明公开了一种LED光源,包括支架,所述支架的上端面设有芯片,所述芯片的上端面一侧通过扁耳朵线弧状焊线电性连接支架,所述扁耳朵线弧状焊线的两端通过焊球连接芯片和支架,所述扁耳朵线弧状焊线设置为上端弯曲成扁耳朵状的焊线。该LED光源,结构合理,实用性强,芯片通过扁耳朵线弧状焊线与支架连接,连接牢固,且扁耳朵线弧状焊线伸展性好,抗热胀冷缩能力好,不易断裂。

Description

一种LED光源
技术领域
本发明属于LED技术领域,具体涉及一种LED光源。
背景技术
现有的LED光源的芯片与支架均是直接连接,形成直线连接,这样在LED光源长时间工作时会产生高温,由于热胀冷缩的物理原理,会使导线拉离,导致LED光源损坏。
发明内容
本发明的目的在于提供一种LED光源,以解决上述背景技术中提出的问题。
为实现上述目的,本发明提供如下技术方案:一种LED光源,包括支架,所述支架的上端面设有芯片,所述芯片的上端面一侧通过扁耳朵线弧状焊线电性连接支架,所述扁耳朵线弧状焊线的两端通过焊球连接芯片和支架,所述扁耳朵线弧状焊线设置为上端弯曲成扁耳朵状的焊线。
优选的,所述支架端的焊球体积大于芯片端的焊球体积。
本发明的技术效果和优点:该LED光源,结构合理,实用性强,芯片通过扁耳朵线弧状焊线与支架连接,连接牢固,且扁耳朵线弧状焊线伸展性好,抗热胀冷缩能力好,不易断裂。
附图说明
图1为本发明的结构示意图。
图中:1支架、2芯片、3扁耳朵线弧状焊线、4焊球。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
本发明提供了如图1所示的一种LED光源,包括支架1,所述支架1的上端面设有芯片2,所述芯片2的上端面一侧通过扁耳朵线弧状焊线3电性连接支架1,所述扁耳朵线弧状焊线3的两端通过焊球4连接芯片2和支架1,所述扁耳朵线弧状焊线3设置为上端弯曲成扁耳朵状的焊线。
具体的,所述支架1端的焊球4体积大于芯片2端的焊球4体积。
扁耳朵线弧状焊线3的一端呈扁耳朵状,可以起到缓冲的作用,当光源在低温时,焊线收缩,缩短焊线长度,只会使扁耳朵状焊线变形,而不会拉断,当光源高温时,焊线在热胀的作用下变长,扁耳朵线弧状焊线3的缓冲作用使焊线、焊球4不受影响。
最后应说明的是:以上所述仅为本发明的优选实施例而已,并不用于限制本发明,尽管参照前述实施例对本发明进行了详细的说明,对于本领域的技术人员来说,其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换,凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。

Claims (2)

1.一种LED光源,包括支架(1),其特征在于:所述支架(1)的上端面设有芯片(2),所述芯片(2)的上端面一侧通过扁耳朵线弧状焊线(3)电性连接支架(1),所述扁耳朵线弧状焊线(3)的两端通过焊球(4)连接芯片(2)和支架(1),所述扁耳朵线弧状焊线(3)设置为上端弯曲成扁耳朵状的焊线。
2.根据权利要求1所述的一种LED光源,其特征在于:所述支架(1)端的焊球(4)体积大于芯片(2)端的焊球(4)体积。
CN201810624313.2A 2018-06-16 2018-06-16 一种led光源 Pending CN108550684A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810624313.2A CN108550684A (zh) 2018-06-16 2018-06-16 一种led光源

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810624313.2A CN108550684A (zh) 2018-06-16 2018-06-16 一种led光源

Publications (1)

Publication Number Publication Date
CN108550684A true CN108550684A (zh) 2018-09-18

Family

ID=63493722

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810624313.2A Pending CN108550684A (zh) 2018-06-16 2018-06-16 一种led光源

Country Status (1)

Country Link
CN (1) CN108550684A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111864530A (zh) * 2019-04-30 2020-10-30 深圳市聚飞光电股份有限公司 一种焊线方法和光器件

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101071779A (zh) * 2006-05-08 2007-11-14 矽品精密工业股份有限公司 半导体封装件堆栈结构及其制法
CN202111074U (zh) * 2011-07-08 2012-01-11 深圳电通纬创微电子股份有限公司 集成电路焊线点结构
CN103378043A (zh) * 2012-04-25 2013-10-30 鸿富锦精密工业(深圳)有限公司 芯片组装结构及芯片组装方法
CN206490087U (zh) * 2016-12-27 2017-09-12 江苏稳润光电科技有限公司 一种led封装结构

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101071779A (zh) * 2006-05-08 2007-11-14 矽品精密工业股份有限公司 半导体封装件堆栈结构及其制法
CN202111074U (zh) * 2011-07-08 2012-01-11 深圳电通纬创微电子股份有限公司 集成电路焊线点结构
CN103378043A (zh) * 2012-04-25 2013-10-30 鸿富锦精密工业(深圳)有限公司 芯片组装结构及芯片组装方法
CN206490087U (zh) * 2016-12-27 2017-09-12 江苏稳润光电科技有限公司 一种led封装结构

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111864530A (zh) * 2019-04-30 2020-10-30 深圳市聚飞光电股份有限公司 一种焊线方法和光器件

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