CN108055766A - A kind of PCB and its manufacturing method - Google Patents
A kind of PCB and its manufacturing method Download PDFInfo
- Publication number
- CN108055766A CN108055766A CN201810040883.7A CN201810040883A CN108055766A CN 108055766 A CN108055766 A CN 108055766A CN 201810040883 A CN201810040883 A CN 201810040883A CN 108055766 A CN108055766 A CN 108055766A
- Authority
- CN
- China
- Prior art keywords
- pcb
- ceramic component
- storage tank
- substrate
- potsherd
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention relates to technical field of electronic products, specifically disclose a kind of PCB and its manufacturing method, which includes PCB substrate and ceramic component；The PCB substrate is equipped with storage tank, and the ceramic component is embedded in the storage tank, and the ceramic component is interference fitted with the storage tank, which includes, S1：The PCB substrate with storage tank is made, makes ceramic component；S2：The ceramic component is embedded in the storage tank of the PCB substrate, the ceramic component is interference fitted with the PCB substrate.PCB provided by the invention and its manufacturing method can realize the rapid cooling of heater element.
Description
Technical field
The present invention relates to technical field of electronic products more particularly to a kind of PCB and its manufacturing methods.
Background technology
Printed circuit board (Printed circuit board, abbreviation PCB), also known as printed circuit board (PCB), are electronic components
The supplier of electrical connection.Before printed circuit board appearance, the interconnection between electronic component is directly connected to by electric wire
Form complete circuit.In the present age, circuit board is intended only as effective experimental tool and exists, and printed circuit board is in electronics
The status of empery has been already taken up in industry.
Printed circuit board develops to dual platen, multi-layer board and flex plate from lamina, and constantly to high-precision, high density
Develop with high reliability direction.Volume is constantly reduced, cost is reduced, improves performance so that printed circuit board is produced in future electronic
In the evolution of product, powerful vitality is still maintained.Following printed circuit board manufacturing technology development trend is in property
To high density, high-precision, fine pore, thin wire, small spacing, highly reliable, multiple stratification, high-speed transfer, light weight or slim on energy
Directions is waited to develop.
Especially in terms of enhanced heat exchange, in recent years, the requirement both at home and abroad to the radiating rate of PCB is higher and higher, real to energy
The demand of the PCB of existing rapid cooling is also more and more vigorous.
The content of the invention
It is an object of the present invention to：A kind of PCB is provided, can realize the rapid cooling of heater element.
It is another object of the present invention to：A kind of manufacturing method of PCB is provided, the PCB of production can realize fever member
The rapid cooling of part.
For this purpose, on the one hand, the present invention provides a kind of PCB, including PCB substrate and ceramic component；The PCB substrate
Storage tank is equipped with, the ceramic component is embedded in the storage tank, and the ceramic component is interference fitted with the storage tank.
Ceramic component can be stably mounted in PCB substrate, by being interference fitted with storage tank in use, will hair very much
Thermal element is mounted on ceramic component, in the heat transfer that heater element generates to ceramic component, the radiating efficiency of ceramic component
Much larger than PCB substrate, so as to fulfill the rapid cooling of heater element.And ceramic component is directly embedded into accommodating in PCB substrate
In slot, ceramic component is not required to do bottom surface chamfering, edge sawtoothization processing.Storage tank can pass through milling machine milling in PCB substrate
It is disposable to complete, simple for process, low manufacture cost.
Preferably, the ceramic component is equipped at least one set of opposite wedge angle, the equal interference of wedge angle is caught in institute
In the side wall for stating storage tank.
Specifically, by applying pressure to ceramic component, the wedge angle on ceramic component can be slowly pressed into storage tank
In, and since the hardness of ceramic component is more than the hardness of PCB substrate, the wedge angle of ceramic component can be by the correspondence of accommodating groove sidewall
Position crimp, deformed PCB substrate firmly block ceramic component, and ceramic component will not come off from PCB substrate,
This connection mode is simple in structure, easy to implement, can effectively reduce the cost of manufacture of PCB.
Preferably, the depth that the wedge angle is caught in the side wall of the storage tank is 0.05mm~0.1mm.
Wedge angle is caught in the depth of the side wall of storage tank, is the unilateral matching allowance of ceramic component and storage tank, if
Above-mentioned unilateral matching allowance is smaller, and when ceramic component is pressed into storage tank, the deformation of accommodating groove sidewall will become smaller, phase
The side wall for the storage tank answered and the contact area of wedge angle and accommodating groove sidewall also can because deforming the extruding force applied for wedge angle
Become smaller, the ceramic component easily loose or dislocation from storage tank will be caused.If above-mentioned unilateral matching allowance is larger, although can be with
Connect the side wall of ceramic component and storage tank more firm, but correspondingly, the deformation of the side wall of storage tank will become larger, also
It is when saying to be caught in wedge angle in storage tank, it is larger for the damage of PCB substrate, result even in the rupture of monoblock PCB substrate.By
It is substantial amounts of experiments have shown that, when above-mentioned unilateral matching allowance is 0.05mm~0.1mm, the stable connection of ceramic component and storage tank
Effect is preferable, and will not make the performance impairment of PCB substrate.
Preferably, the upper surface of the ceramic component and the upper surface flush of the PCB substrate, the ceramic component
Lower surface is flushed with the lower surface of the PCB substrate.
By above-mentioned setting, the upper and lower surface of PCB substrate can be made to be flushed with the upper and lower surface of ceramic component, make PCB
It is whole more beautiful；If ceramic component is higher by PCB substrate, can cause the thickness of PCB increases, so as to cause PCB when in use,
Need to occupy the space of bigger, if ceramic component sinks into the PCB substrate, the contact area of ceramic component and PCB substrate
It will become smaller, the bonding strength of ceramic component and storage tank reduces, and ceramic component easily comes off from storage tank；By ceramic group
During part is installed to PCB substrate, when the lower surface of ceramic component flushed with the lower surface of PCB substrate and ceramic component it is upper
During the upper surface flush of surface and PCB substrate, that is, represent and be installed in place ceramic component just.
Preferably, the ceramic component includes potsherd and metal layer, the potsherd is equipped at least one set of opposite
Wedge angle, metal layer is arranged at the upper surface and/or lower surface of the potsherd.
The material of metal layer is preferably using copper, since ceramic material surfaces are easily contaminated and corrode, when the table of potsherd
After face is contaminated and corrodes, the combination power of potsherd and heater element can be influenced, and the chemical property of copper is milder, be not easy by
Pollution and corrosion set layers of copper in the upper surface of potsherd and/or lower surface, can preferably ensure potsherd and heater element
Good contact；Set layers of copper that can also be risen to the electronic component being arranged in layers of copper in the upper surface of potsherd and/or lower surface
It is acted on to signal shielding.
On the other hand, the present invention provides a kind of for manufacturing the manufacturing method of any of the above-described kind of PCB, including：
S1：The PCB substrate with storage tank is made, makes ceramic component；
S2：The ceramic component is embedded in the storage tank of the PCB substrate, the ceramic component and the PCB substrate
Interference fit.
Preferably, in the S1：
The making step of PCB substrate with storage tank includes：
Substrate is made, the storage tank is processed on substrate, heavy copper, plating are carried out to substrate；
The making step of ceramic component includes：
Potsherd is made, the potsherd is equipped at least one set and is capable of being caught in the side wall of the storage tank of interference
Wedge angle sets metal layer in the upper surface of the potsherd and/or lower surface.
Preferably, it further includes：
S3：Heavy copper, plating, line pattern making, welding resistance and surface are integrally carried out to the PCB substrate for being embedded with ceramic component
Processing.
Preferably, in the S1：
The making step of PCB substrate with storage tank includes：
Substrate is made, the storage tank is processed on substrate, heavy copper, plating and line pattern are carried out to substrate and is made；
The making step of ceramic component includes：
Potsherd is made, the potsherd is equipped at least one set and is capable of being caught in the side wall of the storage tank of interference
Wedge angle sets metal layer in the upper surface of the potsherd and/or lower surface, line pattern is made on the metal layer.
Preferably, it further includes：
S3：Welding resistance and surface treatment are integrally carried out to the PCB substrate for being embedded with ceramic component.
Beneficial effects of the present invention are：A kind of high heat conduction PCB and its manufacturing method are provided, by set ceramic component with
PCB substrate reliable fit, and then realize the rapid cooling of heater element.
Description of the drawings
The present invention is described in further detail below according to drawings and examples.
Fig. 1 is a kind of structure diagram of PCB in the embodiment of the present invention one；
Fig. 2 is a kind of diagrammatic cross-section of PCB in the embodiment of the present invention one；
Fig. 3 is a kind of diagrammatic cross-section of another structure of PCB in the embodiment of the present invention one；
Fig. 4 is a kind of flow chart of PCB production methods in the embodiment of the present invention two；
Fig. 5 is the structure diagram of the PCB made by PCB production methods in the embodiment of the present invention two a kind of；
Fig. 6 is a kind of flow chart of PCB production methods in the embodiment of the present invention three.
In figure：
1st, PCB substrate；101st, core plate；102nd, prepreg；103rd, storage tank；
2nd, ceramic component；201st, potsherd；2011st, wedge angle；202nd, metal layer.
Specific embodiment
Technical solution to further illustrate the present invention below with reference to the accompanying drawings and specific embodiments.
Embodiment one
The present embodiment provides a kind of PCB, as shown in Figures 1 to 3, including PCB substrate 1 and ceramic component 2；It is set in PCB substrate 1
There is storage tank 103, ceramic component 2 is embedded in storage tank 103, and heater element is mounted on ceramic component 2, what heater element generated
Heat is directly delivered on ceramic component 2, since the radiating efficiency of ceramic component 2 is much larger than PCB substrate 1, so as to fulfill quick
Heat dissipation.And ceramic component 2 is directly embedded into the storage tank 103 in PCB substrate 1, and ceramic component 2 is not required to do bottom surface chamfering, side
The serrating processing of edge, simple for process, low manufacture cost.It should be noted that all in the present embodiment " on ", " under " direction,
When referring both to PCB tilings, the vertical direction at visual angle as shown in Figure 1.
As shown in Figure 1, the PCB substrate 1 in the present embodiment is multi-layer board, by two core plates 101 and positioned at two core plates 101
Intermediate prepreg 102 presses, and storage tank 103 is offered in PCB substrate 1, which runs through entire PCB bases
Plate 1.Certainly, PCB substrate 1 or core plate 101 or the multi-layer boards of more multiple core plates 101 is included.
Ceramic component 2 includes potsherd 201 and the metal layer 202 positioned at 201 upper and lower surface of potsherd, this
Metal layer in embodiment uses layers of copper, because the chemical property of copper is relatively milder, it is perishable not allow and is led with good
Electrical property.Certainly, metal layer can also use other materials with above-mentioned characteristic, the layers of copper positioned at 201 upper surface of potsherd,
Its upper surface and the upper surface flush of PCB substrate 1, the layers of copper positioned at 201 lower surface of potsherd, lower surface and PCB substrate 1
Lower surface flushes.
It is understood that according to actual needs, ceramic component 2 can also be arranged to, including potsherd 201 and
Layers of copper positioned at 201 upper surface of potsherd, the upper surface of the layers of copper and the upper surface flush of PCB substrate 1, under potsherd 201
Surface is flushed with the lower surface of PCB substrate 1；Ceramic component 2 can also be arranged to, including potsherd 201 and positioned at ceramics
The layers of copper of 201 lower surface of piece, the lower surface of the layers of copper are flushed with the lower surface of PCB substrate 1, the upper surface of potsherd 201 and PCB
The upper surface flush of substrate 1.
Potsherd 201 is located in storage tank 103, which is provided at least one set of opposite wedge angle 2011, the mistake of wedge angle 2011
That is full of is caught in the side wall of storage tank 103, specifically, as shown in Fig. 2, the horizontal cross-section of potsherd 201 is in just in the present embodiment
Square, including two groups of opposite wedge angles 2011, the horizontal cross-section of storage tank 103 is also square and its four angles are fallen
Fillet processing, four wedge angle 2011 face, four fillets, and four wedge angles 2011 overlap with PCB substrate 1, that is, hold
The catercorner length for putting 103 arc angle position of slot is less than cornerwise length of corresponding wedge angle 2011 on corresponding potsherd 201.It can
By applying pressure to ceramic component 2, ceramic component 2 is slowly pressed into storage tank 103, during pressing, due to pottery
201 hardness of tile is greater than the hardness of PCB substrate 1, and four wedge angles 2011 of potsherd 201 can be by the side wall of storage tank 103
Correspondence position crimp, deformed PCB substrate 1 firmly block potsherd 201, so as to which ceramic component 2 will not be calm
It puts in slot 103 and comes off, and this connection mode is simple in structure, it is easy to implement, the cost of manufacture of PCB can be effectively reduced.
It is understood that suitable shape, such as Fig. 3 can be made in potsherd 201 according to actual needs in the present embodiment
Shown, the cross section of potsherd 201 is hexagon.It should be noted that wedge angle 2011 can be acute angle or right angle or
Obtuse angle.
Preferably, the depth that wedge angle 2011 is caught in the side wall of storage tank 103 is 0.05mm~0.1mm.
The present embodiment is by setting ceramic component 2 and heater element being made to be contacted directly with ceramic component 2, by ceramic group
Part 2 radiates, since the radiating efficiency of ceramic component 2 is much larger than PCB substrate 1, so as to fulfill the high efficiency and heat radiation of heater element.
Embodiment two
As shown in figure 4, the present embodiment provides a kind of production method of PCB in embodiment one, including,
S1：The PCB substrate 1 with storage tank 103 is made, makes ceramic component 2.
Step S1 includes：
Make the PCB substrate 1 with storage tank 103：
Make substrate：Two core plates 101 with inner line figure are made, and two core plates 101 are carried out at brown
Reason, a core plate 101, prepreg 102 and another core plate 101 are overlapped successively, substrate is made by high temperature and pressure.
The position of embedded potsherd 201 is needed to open up storage tank 103 on substrate, storage tank 103 can disposably be added by milling machine milling
Work comes out, and storage tank 103 runs through substrate.Machine drilling and/or laser drill are carried out to substrate.Heavy copper, plating are carried out to substrate.
It should be noted that can also machine drilling or laser drill first be carried out to substrate, storage tank 103 is then processed.
Make ceramic component 2：
Potsherd 201 is made, potsherd 201 is equipped with the side wall for being caught in storage tank 103 that at least one set is capable of interference
In wedge angle 2011, in 201 upper surface of potsherd and/or lower surface copper plate, and on potsherd 201 and potsherd 201,
The sum of thickness of layers of copper of lower surface is equal to the depth of storage tank 103.Since ceramic material surfaces are easily contaminated and corrode, when
After the surface of potsherd 201 is contaminated and corrodes, the combination power of potsherd and heater element can be influenced, and the chemical property of copper ratio
It is relatively mild, it is not easy contaminated and corrodes, in the upper surface of potsherd 201 and/or lower surface copper plate, can preferably ensure to make pottery
Tile 201 and heater element good contact.
S2：Ceramic component 2 is embedded in the storage tank 103 of PCB substrate 1, ceramic component 2 is interference fitted with PCB substrate 1.
Step S2 includes：
Ceramic component 2 is slowly pressed, ceramic component 2 is made to slowly enter in storage tank 103, the upper and lower table of ceramic component 2
Face flushes respectively with the upper and lower surface of PCB substrate 1.
S3：Heavy copper, plating, line pattern making, welding resistance and table are carried out to 1 entirety of PCB substrate for being embedded with ceramic component 2
Surface treatment.
Step S3 includes：
Heavy copper is carried out to 1 entirety of PCB substrate for being embedded with ceramic component 2；Then it is whole to be electroplated, in PCB substrate 1 and pottery
The upper and lower surface of porcelain component 2 copper plate simultaneously, as shown in figure 5, institute's copper plate is by PCB substrate 1 and the upper surface of ceramic component 2
Integrally covered with the original layers of copper in lower surface, and make the layers of copper of 1 upper and lower surface of PCB substrate respectively with ceramic component 2
The layers of copper mutual conduction of upper and lower surface.The thickness of institute's copper plate can be depending on actual demand, certainly, when PCB substrate 1
Originally when the copper layer thickness on upper and lower surface can meet demand, then need not be electroplated, when without plating, the knot of PCB
Structure is as shown in Figure 1；Then whole line pattern making, welding resistance and surface treatment, the process of surface treatment of carrying out can be hot wind
Leveling, organic coat, chemical nickel plating, leaching gold, leaching silver, wicking etc..
It is understood that during step S1 in the present embodiment makes ceramic component 2, it can not be in potsherd
201 upper surfaces and/or lower surface copper plate, only by heavy copper, the electroplating technology of step S3 make potsherd 201 upper surface and/
Or lower surface copper plate, it can not also only be made in the upper and lower copper coating layer of substrate by heavy copper, the electroplating technology of step S3
The upper and lower copper coating of substrate.
Embodiment three
As shown in fig. 6, the present embodiment provides the production method of the PCB in embodiment one a kind of, the present embodiment and embodiment
Two difference lies in, the present embodiment in step s3, to being embedded with, the PCB substrate 1 of ceramic component 2 is whole not to carry out heavy copper, plating
And line pattern is made, and during step S1 makes the PCB substrate 1 with storage tank 103, machine is being carried out to substrate
After tool drilling and/or laser drill, line pattern making is carried out to substrate, during step S1 makes ceramic component,
After 201 upper and lower surface copper plate of potsherd, graphic making is carried out to the upper and lower surface of potsherd 201.
Obviously, the above embodiment of the present invention is just for the sake of clearly illustrating example of the present invention, and it is pair to be not
The restriction of embodiments of the present invention.For those of ordinary skill in the art, may be used also on the basis of the above description
To make other variations or changes in different ways.There is no necessity and possibility to exhaust all the enbodiments.It is all this
All any modification, equivalent and improvement made within the spirit and principle of invention etc., should be included in the claims in the present invention
Protection domain within.
Claims (10)
1. a kind of PCB, which is characterized in that including PCB substrate and ceramic component；The PCB substrate is equipped with storage tank, the pottery
Porcelain component is embedded in the storage tank, and the ceramic component is interference fitted with the storage tank.
2. PCB according to claim 1, which is characterized in that the ceramic component is equipped at least one set of opposite wedge angle,
The equal interference of wedge angle is caught in the side wall of the storage tank.
3. PCB according to claim 2, which is characterized in that the depth that the wedge angle is caught in the side wall of the storage tank is
0.05mm~0.1mm.
4. according to claim 2~3 any one of them PCB, which is characterized in that the upper surface of the ceramic component with it is described
The upper surface flush of PCB substrate, the lower surface of the ceramic component are flushed with the lower surface of the PCB substrate.
5. PCB according to claim 4, which is characterized in that the ceramic component includes potsherd and metal layer, the pottery
Tile is equipped at least one set of opposite wedge angle, and metal layer is arranged at the upper surface and/or lower surface of the potsherd.
6. a kind of manufacturing method of PCB, for 1~5 any one of them PCB of manufacturing claims, which is characterized in that including：
S1：The PCB substrate with storage tank is made, makes ceramic component；
S2：The ceramic component is embedded in the storage tank of the PCB substrate, the ceramic component and the PCB substrate
Interference fit.
7. the manufacturing method of a kind of PCB according to claim 6, which is characterized in that in the S1：
The making step of PCB substrate with storage tank includes：
Substrate is made, the storage tank is processed on substrate, heavy copper, plating are carried out to substrate；
The making step of ceramic component includes：
Potsherd is made, the potsherd is equipped with the point being caught in the side wall of the storage tank that at least one set is capable of interference
Angle sets metal layer in the upper surface of the potsherd and/or lower surface.
8. the manufacturing method of a kind of PCB according to claim 7, which is characterized in that after the S2, further include：
S3：The PCB substrate for being embedded with ceramic component is integrally carried out at heavy copper, plating, line pattern making, welding resistance and surface
Reason.
9. the manufacturing method of a kind of PCB according to claim 6, which is characterized in that in the S1：
The making step of PCB substrate with storage tank includes：
Substrate is made, the storage tank is processed on substrate, heavy copper, plating and line pattern are carried out to substrate and is made；
The making step of ceramic component includes：
Potsherd is made, the potsherd is equipped with the point being caught in the side wall of the storage tank that at least one set is capable of interference
Angle sets metal layer in the upper surface of the potsherd and/or lower surface, line pattern is made on the metal layer.
10. the manufacturing method of a kind of PCB according to claim 9, which is characterized in that after the S2, further include：
S3：Welding resistance and surface treatment are integrally carried out to the PCB substrate for being embedded with ceramic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810040883.7A CN108055766A (en) | 2018-01-16 | 2018-01-16 | A kind of PCB and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810040883.7A CN108055766A (en) | 2018-01-16 | 2018-01-16 | A kind of PCB and its manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108055766A true CN108055766A (en) | 2018-05-18 |
Family
ID=62127591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810040883.7A Pending CN108055766A (en) | 2018-01-16 | 2018-01-16 | A kind of PCB and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108055766A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021052061A1 (en) * | 2019-09-19 | 2021-03-25 | 生益电子股份有限公司 | Manufacturing method for thermally-conductive pcb and pcb |
| CN112566355A (en) * | 2019-09-25 | 2021-03-26 | 铠侠股份有限公司 | Module substrate and printed substrate |
| CN113630986A (en) * | 2021-07-14 | 2021-11-09 | 广东世运电路科技股份有限公司 | Ceramic-embedded PCB and manufacturing method and application thereof |
| CN113966067A (en) * | 2020-07-20 | 2022-01-21 | 宏恒胜电子科技（淮安）有限公司 | Circuit board and manufacturing method thereof |
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| CN103096638A (en) * | 2011-10-27 | 2013-05-08 | 北大方正集团有限公司 | Press-in type high thermal conductive printed circuit board (PCB) and manufacture method thereof |
| CN105430922A (en) * | 2015-12-18 | 2016-03-23 | 景旺电子科技(龙川)有限公司 | Manufacturing method for embedding metal matrix into printed board |
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| CN103096638A (en) * | 2011-10-27 | 2013-05-08 | 北大方正集团有限公司 | Press-in type high thermal conductive printed circuit board (PCB) and manufacture method thereof |
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| WO2021052061A1 (en) * | 2019-09-19 | 2021-03-25 | 生益电子股份有限公司 | Manufacturing method for thermally-conductive pcb and pcb |
| CN112566355A (en) * | 2019-09-25 | 2021-03-26 | 铠侠股份有限公司 | Module substrate and printed substrate |
| CN113966067A (en) * | 2020-07-20 | 2022-01-21 | 宏恒胜电子科技（淮安）有限公司 | Circuit board and manufacturing method thereof |
| CN113630986A (en) * | 2021-07-14 | 2021-11-09 | 广东世运电路科技股份有限公司 | Ceramic-embedded PCB and manufacturing method and application thereof |
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Application publication date: 20180518 |