CN215818755U - High-strength aluminum alloy substrate structure for manufacturing backlight plate - Google Patents
High-strength aluminum alloy substrate structure for manufacturing backlight plate Download PDFInfo
- Publication number
- CN215818755U CN215818755U CN202122102512.7U CN202122102512U CN215818755U CN 215818755 U CN215818755 U CN 215818755U CN 202122102512 U CN202122102512 U CN 202122102512U CN 215818755 U CN215818755 U CN 215818755U
- Authority
- CN
- China
- Prior art keywords
- plate
- fixedly connected
- aluminum alloy
- heat
- strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The utility model discloses a high-strength aluminum alloy substrate structure for manufacturing a backlight plate, which relates to the technical field of substrates and comprises a first aluminum alloy plate, wherein the upper surface of the first aluminum alloy plate is fixedly connected with an insulating structure, the upper surface of the insulating structure is fixedly connected with a high-strength structure, the upper surface of the high-strength structure is fixedly connected with a corrosion-resistant bonding pad, the upper surface of the corrosion-resistant bonding pad is fixedly connected with a plurality of fixed insertion blocks, the upper surface of the corrosion-resistant bonding pad is fixedly connected with a plurality of circuit blocks, the lower surface of the first aluminum alloy plate is fixedly connected with a heat transfer layer, the lower surface of the heat transfer layer is fixedly connected with a heat dissipation structure, and the heat dissipation structure comprises a metal conduction plate. According to the utility model, through the additionally arranged heat dissipation structure, in the use process of the substrate, the heat dissipation plate structure can dissipate heat in a heat conduction mode of the convection machine to dissipate high temperature generated inside, so that the service life of the substrate is prolonged.
Description
Technical Field
The utility model relates to the technical field of substrates, in particular to a high-strength aluminum alloy substrate structure for manufacturing a backlight plate.
Background
The substrate is a basic material for manufacturing the PCB, generally, the substrate is a copper clad laminate, a single-sided printed board and a double-sided printed board are manufactured by selectively processing hole processing, chemical copper plating, electrolytic copper plating, etching and the like on the substrate material-the copper clad laminate to obtain a required circuit pattern, the other type of multilayer printed board is manufactured by using an inner core thin copper clad laminate as a base and alternately laminating and bonding a conductive pattern layer and a prepreg together at one time to form interconnection among more than 3 conductive pattern layers, and the multilayer printed board has the functions of conduction, insulation and support, and the performance, quality, processability, manufacturing cost, manufacturing level and the like of the printed board depend on the substrate material to a great extent.
Usual base plate is in the processing use, and not set up fine heat radiation structure, when using, often produces huge heat in equipment inside, can not obtain effectual giving off for the equipment leads to the condition of trouble to take place after the live time is long, needs people to change, brings inconvenience for people, to this, we have provided a high strength aluminum alloy base plate structure for being shaded the board preparation.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
Aiming at the defects of the prior art, the utility model provides a high-strength aluminum alloy substrate structure for manufacturing a backlight plate, which solves the problem that the heat can not be quickly dissipated.
(II) technical scheme
In order to achieve the above purposes, the technical scheme adopted by the utility model is as follows: a high-strength aluminum alloy substrate structure for manufacturing a backlight plate comprises a first aluminum alloy plate, wherein an insulation structure is fixedly connected to the upper surface of the first aluminum alloy plate, a high-strength structure is fixedly connected to the upper surface of the insulation structure, a corrosion-resistant bonding pad is fixedly connected to the upper surface of the high-strength structure, a plurality of fixed insertion blocks are fixedly connected to the upper surface of the corrosion-resistant bonding pad, a plurality of circuit blocks are fixedly connected to the upper surface of the corrosion-resistant bonding pad, a heat transfer layer is fixedly connected to the lower surface of the first aluminum alloy plate, a heat dissipation structure is fixedly connected to the lower surface of the heat transfer layer and comprises a metal conduction plate, heat-conducting silicone grease is coated on the lower surface of the metal conduction plate, a radiation heat dissipation plate is fixedly connected to the lower surface of the heat-conducting silicone grease, and a plurality of radiating fin structures are fixedly connected to the lower surface of the radiation heat dissipation plate, the radiating fin structure comprises an aluminum sheet, wherein a plurality of heat conducting blocks are fixedly connected to the outer side face of the aluminum sheet, heat conducting insertion blocks are fixedly connected to the upper surface of the aluminum sheet, the outer wall of each heat conducting insertion block is fixedly connected with the inner wall of the radiation heating panel, and each group of adjacent radiating fin structures are fixed through the heat conducting blocks.
Preferably, the structure of fixed inserted block is inside hollow cuboid, the height of fixed inserted block is 20mm, the material of heat conduction silicone grease is organosilicon, the material of heat conduction inserted block and heat conduction piece is copper.
Preferably, insulation system includes first aluminum plate, first aluminum plate's last fixed surface is connected with heat conduction insulation layer, heat conduction insulation layer's last fixed surface is connected with a plurality of copper foil, the white oil layer is scribbled to the surface of copper foil.
Preferably, the white oil layer has a specific gravity of 1 or less and a flash point of 130oC, the pour point of the white oil layer is-5oC。
Preferably, high strength structure includes second aluminum plate, second aluminum plate's lower fixed surface is connected with a plurality of briquetting, second aluminum plate's last fixed surface is connected with second carbon steel sheet, the last fixed surface of second carbon steel sheet is connected with the triangle steel fixed block of second, the first triangle steel fixed block of lateral surface fixedly connected with of the triangle steel fixed block of second, the last fixed surface of first triangle steel fixed block is connected with first carbon steel sheet, the outer wall of briquetting and the outer wall fixed connection of copper foil.
Preferably, the carbon content in the first carbon steel plate and the second carbon steel plate is 0.0218% to 2.11%, the material in the first triangular steel fixing block and the second triangular steel fixing block is a steel block, and the overall shapes of the first triangular steel fixing block and the second triangular steel fixing block are both triangular.
Preferably, the corrosion-resistant pad comprises a second aluminum alloy plate, and the upper surface of the second aluminum alloy plate
The surface is coated with a corrosion-resistant coating.
(III) advantageous effects
The utility model has the beneficial effects that:
1. this a high strength aluminum alloy substrate structure for board preparation in a poor light, through the heat radiation structure who adds, at the in-process that the base plate used, the fin structure can dispel the heat through the heat-conducting mode of convection machine, goes to disperse the high temperature that produces inside, has improved the life of base plate.
2. This a high strength aluminum alloy substrate structure for board in a poor light preparation through the high strength structure who sets up, can go the intensity of strengthening the inside self of base plate greatly, goes to promote life.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a front view of the structure of the present invention;
FIG. 3 is a front view of the heat dissipation structure of the present invention;
FIG. 4 is a front sectional view of the heat sink structure according to the present invention;
FIG. 5 is a front sectional view of the insulation structure of the present invention;
FIG. 6 is a front exploded view of the high strength structure of the present invention;
FIG. 7 is a front exploded view of a corrosion resistant pad of the present invention;
FIG. 8 is a process step diagram of the present invention.
In the figure: 1. a line block; 2. fixing the insert block; 3. a corrosion-resistant pad; 4. a high strength structure; 5. an insulating structure; 6. a first aluminum alloy sheet; 7. a heat transfer layer; 8. a heat dissipation structure; 9. a metal conductive plate; 10. heat-conducting silicone grease; 11. a radiation heat dissipation plate; 12. a heat sink structure; 1201. a heat conducting insert block; 1202. a heat conducting block; 1203. aluminum sheets; 501. a white oil layer; 502. copper foil; 503. a thermally conductive insulating layer; 504. a first aluminum plate; 401. a first carbon steel sheet; 402. a first triangular steel fixed block; 403. a second triangular steel fixed block; 404. a second carbon steel sheet; 405. a second aluminum plate; 406. briquetting; 13. a corrosion-resistant coating; 14. a second aluminum alloy sheet.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 to 8, the present invention provides a technical solution: a high-strength aluminum alloy substrate structure for manufacturing a backlight plate comprises a first aluminum alloy plate 6, wherein the upper surface of the first aluminum alloy plate 6 is fixedly connected with an insulating structure 5, the upper surface of the insulating structure 5 is fixedly connected with a high-strength structure 4, the upper surface of the high-strength structure 4 is fixedly connected with a corrosion-resistant bonding pad 3, the upper surface of the corrosion-resistant bonding pad 3 is fixedly connected with a plurality of fixed insertion blocks 2, the upper surface of the corrosion-resistant bonding pad 3 is fixedly connected with a plurality of circuit blocks 1, the lower surface of the first aluminum alloy plate 6 is fixedly connected with a heat transfer layer 7, the lower surface of the heat transfer layer 7 is fixedly connected with a heat dissipation structure 8, the heat dissipation structure 8 comprises a metal conduction plate 9, the lower surface of the metal conduction plate 9 is coated with heat conduction silicone grease 10, the lower surface of the heat conduction silicone grease 10 is fixedly connected with a radiation heat dissipation plate 11, and the lower surface of the radiation heat dissipation plate 11 is fixedly connected with a plurality of heat dissipation plate structures 12, fin structure 12 includes aluminum sheet 1203, the lateral surface fixedly connected with a plurality of heat conduction piece 1202 of aluminum sheet 1203, the last fixed surface of aluminum sheet 1203 is connected with heat conduction inserted block 1201, the outer wall of heat conduction inserted block 1201 and the inner wall fixed connection of radiation cooling plate 11, every adjacent fin structure 12 of group fixes through heat conduction piece 1202, the structure of fixed inserted block 2 is inside hollow cuboid, the height of fixed inserted block 2 is 20mm, the material of heat conduction silicone grease 10 is organic silicone, heat conduction inserted block 1201 is copper with the material of heat conduction piece 1202.
Further, the insulation structure 5 includes a first aluminum plate 504, a heat conduction insulation layer 503 is fixedly connected to the upper surface of the first aluminum plate 504, a plurality of copper foils 502 are fixedly connected to the upper surface of the heat conduction insulation layer 503, a white oil layer 501 is coated on the outer surface of the copper foils 502, the specific gravity of the white oil layer 501 is less than 1, and the flash point of the white oil layer 501 is 130oC, the pour point of the white oil layer 501 is-5oC。
Further, the high-strength structure 4 includes a second aluminum plate 405, a plurality of press blocks 406 are fixedly connected to the lower surface of the second aluminum plate 405, a second carbon steel plate 404 is fixedly connected to the upper surface of the second aluminum plate 405, a second triangular steel fixing block 403 is fixedly connected to the upper surface of the second carbon steel plate 404, a first triangular steel fixing block 402 is fixedly connected to the outer side surface of the second triangular steel fixing block 403, a first carbon steel plate 401 is fixedly connected to the upper surface of the first triangular steel fixing block 402, the outer wall of the press blocks 406 is fixedly connected to the outer wall of the copper foil 502, the carbon content of the first carbon steel plate 401 and the carbon content of the second carbon steel plate 404 are both 0.0218% to 2.11%, the materials inside the first triangular steel fixing block 402 and the second triangular steel fixing block 403 are both steel blocks, and the overall shapes of the first triangular steel fixing block 402 and the second triangular steel fixing block 403 are both triangular.
Further, the corrosion-resistant pad 3 includes a second aluminum alloy plate 14, and an upper surface of the second aluminum alloy plate 14 is coated with the corrosion-resistant coating 13.
A processing method of a high-strength aluminum alloy substrate structure for manufacturing a backlight plate comprises the following steps:
s1: fixing a plurality of heat conducting blocks 1202 on an original aluminum sheet 1203 material by machine welding, welding a heat conducting insert block 1201 on the upper surface of the aluminum sheet 1203 to form a group of structures, repeating the steps to process a plurality of groups of structures, welding the heat conducting blocks 1202 of the plurality of groups of structures by using a machine to form a complete whole, inserting the whole into a radiation heat dissipation plate 11, completing welding and fixing, fixedly installing a metal conducting plate 9 on the upper surface of the radiation heat dissipation plate 11, and coating a layer of heat conducting silicone grease 10 between the radiation heat dissipation plate 11 and the metal conducting plate 9 to complete the processing of a heat dissipation structure 8;
s2: placing a first aluminum plate 504 on equipment, pressing and bonding a heat conduction insulating layer 503, welding a plurality of copper foils 502 on the upper surface of the heat conduction insulating layer 503, and coating a white oil layer 501 on the outer surface of the copper foil 502 for later use;
s3: adding a trace amount of carbon material into steel in advance, processing to finish a first carbon steel plate 401 and a second carbon steel plate 404, cutting the steel blocks into triangular shapes, fixedly welding a first triangular steel fixing block 402 below the first carbon steel plate 401, welding a second triangular steel fixing block 403 on the second carbon steel plate 404 to form a whole, welding the whole on a second aluminum plate 405, and welding a pressing block 406 corresponding to the copper foil 502 on the lower surface of the second aluminum plate 405 to finish the processing of the high-strength structure 4 for later use;
s4: coating a layer of corrosion-resistant coating 13 on the outer surface of the second aluminum alloy plate 14 to finish the processing of the corrosion-resistant welding disc 3;
s5: placing a first aluminum alloy plate 6 as a substrate on processing equipment, pressing and bonding the processed heat dissipation structure 8, the insulation structure 5, the high-strength structure 4, the corrosion-resistant pad 3 and the heat transfer layer 7 respectively to complete the fixation of the whole structure, performing chemical copper plating, electro-coppering, etching and other processing on the upper surface of the corrosion-resistant pad 3 to obtain a required circuit block 1, welding the fixed insert block 2, and completing the processing of the substrate.
The above-mentioned embodiments, objects, technical solutions and advantages of the present invention are further described in detail, it should be understood that the above-mentioned embodiments are only illustrative of the present invention and are not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. The utility model provides a high strength aluminum alloy substrate structure for board preparation in a poor light, includes first aluminum alloy plate (6), its characterized in that: the upper surface of the first aluminum alloy plate (6) is fixedly connected with an insulation structure (5), the upper surface of the insulation structure (5) is fixedly connected with a high-strength structure (4), the upper surface of the high-strength structure (4) is fixedly connected with a corrosion-resistant pad (3), the upper surface of the corrosion-resistant pad (3) is fixedly connected with a plurality of fixed plug blocks (2), the upper surface of the corrosion-resistant pad (3) is fixedly connected with a plurality of circuit blocks (1), the lower surface of the first aluminum alloy plate (6) is fixedly connected with a heat transfer layer (7), the lower surface of the heat transfer layer (7) is fixedly connected with a heat dissipation structure (8), the heat dissipation structure (8) comprises a metal conduction plate (9), the lower surface of the metal conduction plate (9) is coated with heat-conducting silicone grease (10), and the lower surface of the heat-conducting silicone grease (10) is fixedly connected with a radiation heat dissipation plate (11), the lower surface fixedly connected with a plurality of fin structure (12) of radiation heating panel (11), fin structure (12) include aluminum sheet (1203), the lateral surface fixedly connected with a plurality of heat conduction piece (1202) of aluminum sheet (1203), the last fixed surface of aluminum sheet (1203) is connected with heat conduction inserted block (1201), the outer wall of heat conduction inserted block (1201) and the inner wall fixed connection of radiation heating panel (11), adjacent fin structure (12) of every group are fixed through heat conduction piece (1202).
2. The high-strength aluminum alloy substrate structure for backlight plate production as claimed in claim 1, wherein: the structure of fixed inserted block (2) is inside hollow cuboid, the height of fixed inserted block (2) is 20mm, the material of heat conduction silicone grease (10) is organic silicone, the material of heat conduction inserted block (1201) and heat conduction piece (1202) is copper.
3. The high-strength aluminum alloy substrate structure for backlight plate production as claimed in claim 1, wherein: insulation system (5) include first aluminum plate (504), the last fixed surface of first aluminum plate (504) is connected with heat conduction insulation layer (503), the last fixed surface of heat conduction insulation layer (503) is connected with a plurality of copper foil (502), white oil layer (501) is scribbled to the surface of copper foil (502).
4. The high-strength aluminum alloy substrate structure for backlight plate production as set forth in claim 3, wherein: the white oil layer (501) has a specific gravity of 1 or less, and the white oil layer (501) has a flash point of 130oC, the pour point of the white oil layer (501) is-5oC。
5. The high-strength aluminum alloy substrate structure for backlight plate production as claimed in claim 1, wherein: high strength structure (4) include second aluminum plate (405), the lower fixed surface of second aluminum plate (405) is connected with a plurality of briquetting (406), the last fixed surface of second aluminum plate (405) is connected with second carbon steel board (404), the last fixed surface of second carbon steel board (404) is connected with three angle steel fixed blocks of second (403), the first three angle steel fixed block of lateral surface fixedly connected with (402) of three angle steel fixed block of second (403), the first carbon steel board of last fixed surface of three angle steel fixed block (402) (401), the outer wall of briquetting (406) and the outer wall fixed connection of copper foil (502).
6. The high-strength aluminum alloy substrate structure for backlight plate production as claimed in claim 5, wherein: the carbon content of the first carbon steel plate (401) and the carbon content of the second carbon steel plate (404) are both 0.0218% to 2.11%, the materials of the first triangular steel fixing block (402) and the second triangular steel fixing block (403) are both steel blocks, and the overall shapes of the first triangular steel fixing block (402) and the second triangular steel fixing block (403) are both triangular.
7. The high-strength aluminum alloy substrate structure for backlight plate production as claimed in claim 1, wherein: the corrosion-resistant welding pad (3) comprises a second aluminum alloy plate (14), and a corrosion-resistant coating (13) is coated on the upper surface of the second aluminum alloy plate (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122102512.7U CN215818755U (en) | 2021-09-02 | 2021-09-02 | High-strength aluminum alloy substrate structure for manufacturing backlight plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122102512.7U CN215818755U (en) | 2021-09-02 | 2021-09-02 | High-strength aluminum alloy substrate structure for manufacturing backlight plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215818755U true CN215818755U (en) | 2022-02-11 |
Family
ID=80155168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122102512.7U Active CN215818755U (en) | 2021-09-02 | 2021-09-02 | High-strength aluminum alloy substrate structure for manufacturing backlight plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215818755U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113660772A (en) * | 2021-09-02 | 2021-11-16 | 张家港润盛科技材料有限公司 | High-strength aluminum alloy substrate structure for manufacturing backlight plate and processing method thereof |
-
2021
- 2021-09-02 CN CN202122102512.7U patent/CN215818755U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113660772A (en) * | 2021-09-02 | 2021-11-16 | 张家港润盛科技材料有限公司 | High-strength aluminum alloy substrate structure for manufacturing backlight plate and processing method thereof |
| CN113660772B (en) * | 2021-09-02 | 2024-06-11 | 张家港润盛科技材料有限公司 | High-strength aluminum alloy substrate structure for manufacturing backlight plate and processing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH1140902A (en) | Printed wiring board and manufacture thereof | |
| CN215818755U (en) | High-strength aluminum alloy substrate structure for manufacturing backlight plate | |
| CN201513770U (en) | Heat-dissipation type LED light source module | |
| CN107734859B (en) | PCB manufacturing method and PCB | |
| CN108200714A (en) | A kind of PCB and its manufacturing method | |
| CN215011262U (en) | Corrugated heat dissipation device for graphene heating sheet assembly | |
| CN113660772B (en) | High-strength aluminum alloy substrate structure for manufacturing backlight plate and processing method thereof | |
| CN1802069A (en) | Substrate with high heat conduction and its making process | |
| CN103987211A (en) | Efficient cooling aluminum substrate based on enlarged aluminum-based face and manufacturing method thereof | |
| CN110677978A (en) | Printed circuit board and manufacturing method thereof | |
| CN111954381A (en) | Process method for manufacturing sandwich aluminum-based double-sided board | |
| CN202652697U (en) | PCB with metal substrate | |
| CN215121297U (en) | Copper-clad plate with holes and of multilayer composite structure | |
| CN210899795U (en) | Printed circuit board | |
| CN111954368A (en) | Thermoelectric separation filling electroplated double-sided metal substrate and manufacturing method thereof | |
| CN115734468A (en) | Novel aluminum-based double-sided aluminum foil-clad plate and manufacturing process thereof | |
| CN210381441U (en) | High-temperature-resistant circuit board | |
| CN113923856A (en) | Composite heat-conducting PCB and using method thereof | |
| CN220139810U (en) | Novel aluminum-based double-sided aluminum foil-coated plate | |
| CN209882216U (en) | Multilayer high-thermal-conductivity composite metal-based circuit board | |
| CN220493440U (en) | Simple and convenient reinforced structure of aluminium base board | |
| CN211702521U (en) | Optimize radiating built-in controller PCBA of put motor in | |
| CN214901432U (en) | Double-sided aluminum-based circuit board | |
| CN113608381A (en) | Composite copper foil material for preventing warping of liquid crystal module | |
| CN218162989U (en) | High-temperature-resistant ceramic circuit substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |