CN107333462B - Conductive layer, electromagnetic shielding film and processing method of electromagnetic shielding film - Google Patents
Conductive layer, electromagnetic shielding film and processing method of electromagnetic shielding film Download PDFInfo
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- 238000003672 processing method Methods 0.000 title claims abstract description 9
- 239000002245 particle Substances 0.000 claims abstract description 82
- 239000000843 powder Substances 0.000 claims abstract description 69
- 238000000576 coating method Methods 0.000 claims description 24
- 239000011248 coating agent Substances 0.000 claims description 22
- 230000001681 protective effect Effects 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 229910021389 graphene Inorganic materials 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 239000004925 Acrylic resin Substances 0.000 claims description 7
- 229920000178 Acrylic resin Polymers 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- 239000004814 polyurethane Substances 0.000 claims description 7
- 229920002635 polyurethane Polymers 0.000 claims description 7
- 229920001187 thermosetting polymer Polymers 0.000 claims description 7
- 239000003292 glue Substances 0.000 claims description 6
- 238000012545 processing Methods 0.000 claims description 5
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 4
- 229910000640 Fe alloy Inorganic materials 0.000 claims description 4
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910001297 Zn alloy Inorganic materials 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 239000011701 zinc Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 5
- 239000010408 film Substances 0.000 description 99
- 238000010586 diagram Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002985 plastic film Substances 0.000 description 3
- 229920006255 plastic film Polymers 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000005672 electromagnetic field Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
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Abstract
The invention provides a conductive layer, an electromagnetic shielding film and a processing method of the electromagnetic shielding film, and relates to the technical field of electromagnetic shielding. The conducting layer of the electromagnetic shielding film comprises a first conducting layer and a second conducting layer coated on one side of the first conducting layer; the conductive powder of the first conductive layer comprises dendritic conductive powder, and the particle size of conductive particles of the dendritic conductive powder is 5-20 um; the conductive powder of the second conductive layer comprises flaky conductive powder or spherical conductive powder, the particle size of the conductive particles of the flaky conductive powder or the spherical conductive powder is the same as the thickness of the second conductive layer, the technical problems that the appearance of the conductive layer of the electromagnetic shielding film is rough and uneven, the cost is increased easily, or the conductive performance and the shielding effectiveness are reduced easily, in the prior art are solved, the appearance of the first conductive layer is rough and uneven through the arrangement of the second conductive layer, and meanwhile, the shielding effect of the conductive layer of the whole electromagnetic shielding film is more excellent.
Description
Technical Field
The invention relates to the technical field of electromagnetic shielding, in particular to a conducting layer, an electromagnetic shielding film and a processing method of the electromagnetic shielding film.
Background
Electromagnetic shielding is widely applied to the fields of communication, electronic products, network hardware, medical instruments, aerospace, national defense and the like, and in the aspect of communication, the electromagnetic shielding is to isolate metal between two space regions so as to control the induction and radiation of an electric field, a magnetic field and electromagnetic waves from one region to the other region. Specifically, a shielding body is used to surround an interference source of a component, a circuit, a combination, a cable or the whole system to prevent an interference electromagnetic field from diffusing outwards, and a shielding body is used to surround a receiving circuit, equipment or a system to prevent the receiving circuit, the equipment or the system from being influenced by an external electromagnetic field, and an electromagnetic shielding film is a commonly used shielding body.
The coating machine is mainly used for surface coating process production of films, paper and the like, and is machine equipment which coats a layer of glue, paint, ink or the like with a specific function on a coiled base material, and carries out winding and storage after drying. The coating machine adopts a special multifunctional coating head, can realize the surface coating production in various forms, and the coating machine can realize the coating processes of laser transfer, gold stamping, optical films, protective films, electronic films, medium exchange films and the like until the development of the coating machine.
The coating production flow of the existing electromagnetic shielding film is mainly to coat an insulating layer on a carrier film, dry the surface of the insulating layer for hardening, process a metal layer on the outer side of the insulating layer according to actual needs to prepare a semi-finished product, coat conductive layer glue on the outer side of the semi-finished product, usually the thickness of the conductive layer is 5-15um, and finally attach a protective film on the outer side of the conductive layer to prepare the electromagnetic shielding film. In order to obtain excellent conductive performance and shielding effectiveness of the electromagnetic shielding film, the conductive particles of the conductive layer are selected from dendritic, flaky or spherical conductive powder with larger particle size, usually the particle size of the conductive powder is 5-20um, the adhesion among the conductive particles is increased due to the larger particle size, so that the conductive performance and shielding effectiveness of the electromagnetic shielding film are good, but the particle size of the conductive particles is larger when the conductive layer is coated, and the larger particle size makes the conductive layer have a rough and uneven appearance when the conductive layer is coated to a thickness of 5-15 um.
In order to improve the roughness and unevenness of the conductive layer appearance, the conductive layer thickness is usually increased, but the increase of the conductive layer thickness causes an increase in cost, and if the roughness and unevenness of the conductive layer appearance are improved by reducing the particle size of the conductive particles, the mutual adhesion is reduced due to the reduction of the particle size of the conductive particles, which adversely affects the conductivity and shielding performance of the conductive layer.
Disclosure of Invention
The invention aims to provide a conductive layer, an electromagnetic shielding film and a processing method of the electromagnetic shielding film, and aims to solve the technical problems that cost is increased or conductive performance and shielding efficiency are reduced easily in the prior art for improving the phenomena of rough and uneven appearance of the conductive layer of the electromagnetic shielding film.
The conducting layer of the electromagnetic shielding film provided by the invention comprises a first conducting layer and a second conducting layer coated on one side of the first conducting layer;
the conductive powder of the first conductive layer comprises dendritic conductive powder, and the particle size of conductive particles of the dendritic conductive powder is 5-20 um;
the conductive powder of the second conductive layer comprises flake conductive powder or spherical conductive powder, and the particle size of conductive particles of the flake conductive powder or the spherical conductive powder is the same as the thickness of the second conductive layer.
Further, the thickness of the first conducting layer is 5-10 um;
the particle size of the conductive particles of the flaky conductive powder or the spherical conductive powder is 1-3um, and the thickness of the second conductive layer is 1-3 um.
Further, the powder content of the dendritic conductive powder in the first conductive layer is 30-40%.
Further, the conductive particles of the first conductive layer and the second conductive layer include one or more of silver, copper, iron, nickel, zinc, silver alloy, copper alloy, iron alloy, nickel alloy, and zinc alloy.
Further, the first conductive layer and the second conductive layer are made of thermosetting epoxy resin, acrylic resin or polyurethane.
The electromagnetic shielding film provided by the invention comprises a conducting layer of the electromagnetic shielding film, a carrier film, an insulating layer and a protective film, wherein the conducting layer is arranged on the conducting layer;
the insulating layer is coated on one side of the carrier film, the first conducting layer is coated on one side, away from the carrier film, of the insulating layer, and the protective film is attached to one side, away from the first conducting layer, of the second conducting layer.
Furthermore, the insulating layer is made of thermosetting epoxy resin, acrylic resin or polyurethane glue.
Further, the material of the protective film comprises a release film or release paper.
Further, a metal layer or a graphene layer is arranged between the insulating layer and the conducting layer of the electromagnetic shielding film.
The processing method for processing the electromagnetic shielding film according to the technical scheme provided by the invention comprises the following steps:
coating the insulating layer on one side of the carrier film;
coating the first electrically conductive layer on a side of the insulating layer facing away from the carrier film;
coating the second conductive layer on the side of the first conductive layer facing away from the insulating layer;
and attaching the protective film to one side of the second conductive layer, which is far away from the first conductive layer.
The conductive layer of the electromagnetic shielding film comprises a first conductive layer and a second conductive layer, wherein the second conductive layer is coated on one side of the first conductive layer, the phenomena of rough appearance and unevenness of the conductive layer of the electromagnetic shielding film are improved by adopting the two conductive layers, and meanwhile, the electromagnetic shielding film has better conductive performance and shielding efficiency. Specifically, the conductive powder of the first conductive layer comprises dendritic conductive powder, the dendritic conductive powder has excellent mutual adhesion due to a dendritic form, and can realize conduction in the horizontal and vertical directions, and the conductive particles of the dendritic conductive powder have a particle size of 5-20um, so that the adhesion among the conductive particles is further increased due to the larger particle size of the conductive particles of the first conductive layer, and the first conductive layer has good conductive performance and shielding efficiency.
In order to avoid the problem that the conductive layer of the electromagnetic shielding film is rough and uneven in appearance due to the fact that the particle size of the conductive particles of the first conductive layer is too large and the coating thickness is small, the second conductive layer is coated on one side of the first conductive layer, the thickness of the conductive layer of the whole electromagnetic shielding film cannot be increased, and therefore cost cannot be increased.
Specifically, the conductive powder of the second conductive layer includes flake conductive powder or spherical conductive powder, which enables the second conductive layer to have good conductive performance, so that the second conductive layer can be conducted with the first conductive layer, because the particle size of the conductive particles of the flake conductive powder or spherical conductive powder is the same as the thickness of the second conductive layer, the vertical conductivity between the second conductive layer and the first conductive layer is satisfied, the second conductive layer mainly plays a vertical conduction role, and the first conductive layer plays a main shielding role, so that the shielding effect of the conductive layer of the whole electromagnetic shielding film is more excellent, and meanwhile, the particle size of the conductive particles of the second conductive layer is the same as the thickness of the second conductive layer, so that the appearance of the second conductive layer can be flat, thereby making up the problem that the conductive layer has a rough appearance due to the excessively large particle size of the conductive particles of the first conductive layer and low coating thickness, And (4) unevenness.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural view of an electromagnetic shielding film in the prior art;
fig. 2 is a schematic structural diagram of a first implementation of an electromagnetic shielding film according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a second implementation of an electromagnetic shielding film according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a third embodiment of an electromagnetic shielding film according to an embodiment of the present invention.
Icon: 100-a first conductive layer; 200-a second conductive layer; 300-a carrier film; 400-an insulating layer; 500-protective film; 600-a metal layer; 700-graphene layer.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that, as the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. appear, their indicated orientations or positional relationships are based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" as appearing herein are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" should be interpreted broadly, e.g., as being fixed or detachable or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Embodiments 1, 2 and 3 are described in detail below with reference to the accompanying drawings:
fig. 1 is a schematic structural view of an electromagnetic shielding film in the prior art; fig. 2 is a schematic structural diagram of a first implementation of an electromagnetic shielding film according to an embodiment of the present invention; fig. 3 is a schematic structural diagram of a second implementation of an electromagnetic shielding film according to an embodiment of the present invention; fig. 4 is a schematic structural diagram of a third embodiment of an electromagnetic shielding film according to an embodiment of the present invention.
Example 1
Referring to fig. 1 to 4 together, as shown in fig. 1, a schematic structural diagram of an electromagnetic shielding film in the prior art is shown, in which a conductive layer of the electromagnetic shielding film in the prior art only uses a single first conductive layer 100, and when a particle size of conductive particles of the first conductive layer 100 is too large and a coating thickness is small, the conductive layer of the electromagnetic shielding film is easily rough and uneven in appearance. In order to improve the roughness and unevenness of the conductive layer appearance, the thickness of the first conductive layer 100 is usually increased, but the increase of the thickness of the first conductive layer 100 causes an increase of cost, and if the roughness and unevenness of the conductive layer appearance are improved by reducing the particle size of the conductive particles, the mutual adhesion is reduced due to the reduction of the particle size of the conductive particles, which adversely affects the conductivity and shielding performance of the conductive layer.
Fig. 2 to 4 are schematic structural diagrams of the electromagnetic shielding film provided in this embodiment, and the embodiment provides a conductive layer of the electromagnetic shielding film, which includes a first conductive layer 100 and a second conductive layer 200 coated on one side of the first conductive layer 100, specifically:
the conductive powder of the first conductive layer 100 includes a dendritic conductive powder, and the particle diameter of the conductive particles of the dendritic conductive powder is 5-20 um;
the conductive powder of the second conductive layer 200 includes flake conductive powder or spherical conductive powder, and the particle diameter of the conductive particles of the flake conductive powder or spherical conductive powder is the same as the thickness of the second conductive layer 200.
As shown in fig. 2, the conductive layer of the electromagnetic shielding film includes a first conductive layer 100 and a second conductive layer 200, the second conductive layer 200 is coated on one side of the first conductive layer 100, and the two conductive layers are used to improve the phenomena of rough and uneven appearance of the conductive layer of the electromagnetic shielding film, so that the electromagnetic shielding film has better conductive performance and shielding effectiveness. Specifically, the conductive powder of the first conductive layer 100 includes dendritic conductive powder, the dendritic conductive powder has excellent adhesion to each other due to a dendritic form, and can achieve conduction in horizontal and vertical directions, and the conductive particles of the dendritic conductive powder have a particle size of 5 to 20um, and the adhesion between the conductive particles is further increased due to the larger particle size of the conductive particles of the first conductive layer 100, so that the first conductive layer 100 has good conductive performance and shielding effectiveness.
In order to prevent the conductive particles of the first conductive layer 100 from having an excessively large particle size and a small coating thickness from causing the conductive layer of the electromagnetic shielding film to have a rough and uneven appearance, the second conductive layer 200 is coated on one side of the first conductive layer 100, so that the thickness of the conductive layer of the electromagnetic shielding film as a whole is not increased, and thus the cost is not increased, and the conductive particles of the first conductive layer 100 have a large particle size, so that the conductive performance and the shielding effectiveness of the conductive layer of the electromagnetic shielding film are not reduced.
Specifically, the conductive powder of the second conductive layer 200 includes a flake conductive powder or a spherical conductive powder, which enables the second conductive layer 200 to have good conductive performance, so that the second conductive layer 200 can be conducted with the first conductive layer 100, since the particle size of the conductive particles of the flake conductive powder or the spherical conductive powder is the same as the thickness of the second conductive layer 200, the vertical conductivity between the second conductive layer 200 and the first conductive layer 100 is satisfied, the second conductive layer 200 mainly plays a vertical conduction role, and the first conductive layer 100 plays a main shielding role, so that the shielding effect of the conductive layer of the entire electromagnetic shielding film is more excellent, and meanwhile, since the particle size of the conductive particles of the second conductive layer 200 is the same as the thickness of the second conductive layer 200, the appearance of the second conductive layer 200 can be flat, thereby making up the problem that the appearance of the conductive layer is rough, caused by the coating thickness being low due to the excessively large particle size of the conductive particles of the first conductive layer 100, And (4) unevenness.
In a specific embodiment, the thickness of the first conductive layer 100 is 5-10um, the conductive layer of the electromagnetic shielding film is generally 5-15um, and the thickness of the first conductive layer 100 is set to 5-10um, so that the first conductive layer 100 can play a main shielding role, meanwhile, the particle size of the conductive particles of the first conductive layer 100 is larger, and the thickness of the first conductive layer 100 is lower, so that the appearance of the first conductive layer 100 is rough and uneven, the particle size of the conductive particles of the flake conductive powder or the spherical conductive powder of the second conductive layer 200 is set to 1-3um, and the thickness of the second conductive layer 200 is 1-3um, so that the thickness of the second conductive layer 200 is the same as or similar to the particle size of the conductive particles of the second conductive layer 200, thereby satisfying the vertical conductivity between the second conductive layer 200 and the first conductive layer 100, therefore, the shielding effect of the conductive layer of the whole electromagnetic shielding film is more excellent, and the appearance of the second conductive layer 200 is smooth, so that the problem that the appearance of the conductive layer is rough and uneven due to the fact that the coating thickness is low because the particle size of the conductive particles of the first conductive layer 100 is too large is solved. Since the thickness of the first conductive layer 100 is 5-10um and the thickness of the second conductive layer 200 is 1-3um, the thickness of the conductive layer of the entire electromagnetic shielding film is not increased, thereby not causing an increase in cost.
In an alternative of this embodiment, the powder content of the dendritic conductive powder in the first conductive layer 100 is 30 to 40%, so that the powder content of the dendritic conductive powder in the first conductive layer 100 is relatively small, thereby reducing the processing cost, and meanwhile, since the dendritic conductive powder is similar to a dendritic form, the adhesion density is relatively high under the condition that the powder content of the conductive layer is reduced, thereby reducing the cost of the electromagnetic shielding film and not affecting the shielding effectiveness. Through experimental research, the first conductive layer 100 for pressing the electromagnetic shielding film on the soft board and the hard board is communicated with the soft board and the hard board, and experimental results show that the electromagnetic shielding film provided by the embodiment has the shielding effectiveness of more than 50dB and excellent shielding effect, and the cost of the electromagnetic shielding film is reduced due to the fact that the content of the dendritic conductive powder in the first conductive layer 100 is small.
Specifically, the conductive particles of the first conductive layer 100 and the second conductive layer 200 include one or more of silver, copper, iron, nickel, zinc, silver alloy, copper alloy, iron alloy, nickel alloy, and zinc alloy, and the conductive particles are made of easily conductive silver, copper, iron, nickel, zinc, silver alloy, copper alloy, iron alloy, nickel alloy, and zinc alloy, so that the electromagnetic shielding film can have excellent conductive performance and shielding effectiveness.
The first conductive layer 100 and the second conductive layer 200 may be made of thermosetting epoxy resin, acrylic resin or polyurethane, which has good physical and chemical properties, excellent adhesion strength to the surface of metal and non-metal materials, good dielectric properties, small deformation shrinkage, good dimensional stability of products, high hardness, and good flexibility, thereby ensuring the functions of the first conductive layer 100 and the second conductive layer 200.
Example 2
The present embodiment provides an electro-magnetic shielding film including the conductive layer of the electro-magnetic shielding film of embodiment 1. Since the conductive layer adopts two conductive layers, in order to prevent the conductive particles of the first conductive layer 100 from having an excessively large particle size and a small coating thickness from causing a rough and uneven appearance of the conductive layer of the electromagnetic shielding film, the second conductive layer 200 is coated on one side of the first conductive layer 100, and the thickness of the conductive layer of the entire electromagnetic shielding film is not increased, thereby not causing an increase in cost, and simultaneously, since the particle size of the conductive particles of the first conductive layer 100 is large, the conductive performance and the shielding effectiveness of the conductive layer of the electromagnetic shielding film are not reduced.
In a specific embodiment, as shown in fig. 2, the electromagnetic shielding film may further include a carrier film 300, an insulating layer 400, and a protective film 500. Specifically, the insulating layer 400 is coated on one side of the carrier film 300, the first conductive layer 100 is coated on one side of the insulating layer 400 departing from the carrier film 300, and the protective film 500 is attached to one side of the second conductive layer 200 departing from the first conductive layer 100, so that a complete electromagnetic shielding film can be obtained, and the safety and the service life of the electromagnetic shielding film are improved.
Specifically, the material of the insulating layer 400 includes thermosetting epoxy resin, acrylic resin, or polyurethane glue. The thermosetting epoxy resin, acrylic resin or polyurethane glue has good physical and chemical properties, excellent bonding strength to the surfaces of metal and nonmetal materials, good dielectric property, small deformation shrinkage, good dimensional stability of products, high hardness and good flexibility, thereby ensuring the function of the insulating layer 400.
The material of the protection film 500 includes a release film or release paper. In general, in order to increase the release force of the plastic film, the plastic film is subjected to plasma treatment, so that the plastic film can show extremely light and stable release force for various organic pressure-sensitive adhesives. The protective film 500 is made of release film or release paper, so that the protective film 500 can achieve extremely light and stable release force when being peeled.
In an alternative of this embodiment, as shown in fig. 3, a metal layer 600 is further disposed between the insulating layer 400 and the conductive layer of the electromagnetic shielding film. The metal layer 600 can be selectively arranged according to actual needs, and the arrangement of the metal layer 600 can enable the electromagnetic shielding film to obtain better conductive performance and shielding performance.
In another alternative of this embodiment, as shown in fig. 4, a graphene layer 700 is further disposed between the insulating layer 400 and the conductive layer of the electromagnetic shielding film. The graphene layer 700 can be selectively arranged according to actual needs, graphene is the thinnest novel nanomaterial which has the greatest strength and the strongest electric and heat conducting performance and is found at present, and the arrangement of the graphene layer 700 can enable the electromagnetic shielding film to obtain better electric conductivity and shielding performance.
Example 3
The present embodiment provides a processing method for processing the electromagnetic shielding film of embodiment 2, including the steps of:
coating an insulating layer 400 on one side of the carrier film 300, and drying the insulating layer 400;
after the surface of the insulating layer 400 is hardened, coating the first conductive layer 100 on the side of the insulating layer 400 away from the carrier film 300;
coating a second conductive layer 200 on the side of the first conductive layer 100 facing away from the insulating layer 400;
a protective film 500 is attached to the second conductive layer 200 on the side away from the first conductive layer 100.
The method for processing the electromagnetic shielding film may further include the steps of:
the metal layer 600 or the graphene layer 700 is processed between the insulating layer 400 and the conductive layer of the electro-magnetic shielding film.
The processing method of the electromagnetic shielding film provided by the embodiment has simple steps, and the conductive layer of the obtained electromagnetic shielding film has smooth appearance and good conductive performance and shielding performance.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (9)
1. A conductive layer of an electro-magnetic shielding film, comprising a first conductive layer (100) and a second conductive layer (200) coated on one side of the first conductive layer (100);
the conductive powder of the first conductive layer (100) comprises dendritic conductive powder, and the particle size of conductive particles of the dendritic conductive powder is 5-20 um;
the conductive powder of the second conductive layer (200) comprises flake conductive powder or spherical conductive powder, and the particle diameter value of conductive particles of the flake conductive powder or the spherical conductive powder is equal to the thickness value of the second conductive layer (200);
the thickness of the first conductive layer (100) is 5-10 um;
the particle size of the conductive particles of the flaky conductive powder or the spherical conductive powder is 1-3um, and the thickness of the second conductive layer (200) is 1-3 um.
2. The conductive layer of an electro-magnetic shielding film according to claim 1, wherein the powder content of the branched conductive powder in the first conductive layer (100) is 30-40%.
3. The conductive layer of the electro-magnetic shielding film according to claim 1, wherein the conductive particles of the first conductive layer (100) and the second conductive layer (200) comprise one or more of silver, copper, iron, nickel, zinc, silver alloy, copper alloy, iron alloy, nickel alloy, and zinc alloy.
4. The conductive layer of an electro-magnetic shielding film according to claim 1, wherein the material of the first conductive layer (100) and the second conductive layer (200) comprises thermosetting epoxy resin, acrylic resin or polyurethane.
5. An electromagnetic shielding film comprising the conductive layer of the electromagnetic shielding film according to any one of claims 1 to 4, further comprising a carrier film (300), an insulating layer (400), and a protective film (500);
the insulating layer (400) is coated on one side of the carrier film (300), the first conducting layer (100) is coated on one side, facing away from the carrier film (300), of the insulating layer (400), and the protective film (500) is attached to one side, facing away from the first conducting layer (100), of the second conducting layer (200).
6. The EMI shielding film as claimed in claim 5, wherein the material of said insulating layer (400) includes thermosetting epoxy resin, acrylic resin or polyurethane glue.
7. The EMI shielding film as claimed in claim 5, wherein the material of the protection film (500) includes a release film or a release paper.
8. The electro-magnetic shielding film of claim 5, wherein a metal layer (600) or a graphene layer (700) is further disposed between the insulating layer (400) and the conductive layer of the electro-magnetic shielding film.
9. A processing method for processing the electro-magnetic shielding film according to claim 5, comprising:
coating the insulating layer (400) on one side of the carrier film (300);
coating the first electrically conductive layer (100) on the side of the insulating layer (400) facing away from the carrier film (300);
-applying the second electrically conductive layer (200) on a side of the first electrically conductive layer (100) facing away from the insulating layer (400);
and adhering the protective film (500) to one side of the second conductive layer (200) which is far away from the first conductive layer (100).
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| CN207070595U (en) * | 2017-08-16 | 2018-03-02 | 苏州城邦达力材料科技有限公司 | The conductive layer and electromagnetic shielding film of electromagnetic shielding film |
| TWI829973B (en) * | 2020-02-25 | 2024-01-21 | 日商拓自達電線股份有限公司 | Electromagnetic wave shielding film |
| TWI764350B (en) * | 2020-10-30 | 2022-05-11 | 臻鼎科技股份有限公司 | Electromagnetic shielding film and manufacturing method |
| CN114449876A (en) * | 2020-10-30 | 2022-05-06 | 臻鼎科技股份有限公司 | Electromagnetic shielding film and manufacturing method thereof |
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| CN102286254A (en) * | 2011-05-06 | 2011-12-21 | 广州方邦电子有限公司 | High-peeling-strength conductive adhesive film with through holes and preparation method thereof |
| CN103468159A (en) * | 2013-03-11 | 2013-12-25 | 苏州牛剑新材料有限公司 | Silver coated nickel powder conductive adhesive and preparation method thereof |
| JP2015015304A (en) * | 2013-07-03 | 2015-01-22 | 信越ポリマー株式会社 | Electromagnetic wave shield film, flexible printed wiring board with electromagnetic wave shield film, electronic equipment, and method for manufacturing the same |
| CN105283056A (en) * | 2014-07-15 | 2016-01-27 | 联茂电子股份有限公司 | Electromagnetic wave interference shielding film |
| CN104853576A (en) * | 2015-05-13 | 2015-08-19 | 东莞市万丰纳米材料有限公司 | Electromagnetic shielding membrane with excellent shielding performance and production technology thereof |
| CN106061103A (en) * | 2016-07-21 | 2016-10-26 | 东莞市航晨纳米材料有限公司 | High flexible electromagnetic shielding film and manufacturing method thereof |
| CN106952678B (en) * | 2017-04-28 | 2019-05-10 | 南昌联能科技有限公司 | A kind of electromagnetic shielding film for cable |
| CN207070595U (en) * | 2017-08-16 | 2018-03-02 | 苏州城邦达力材料科技有限公司 | The conductive layer and electromagnetic shielding film of electromagnetic shielding film |
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