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CN106463413A - 用于借助于转移衬底将经干燥的金属烧结制备物涂覆到用于电子部件的支承体上的方法、相对应的支承体及其用于与电子部件烧结连接的应用 - Google Patents

用于借助于转移衬底将经干燥的金属烧结制备物涂覆到用于电子部件的支承体上的方法、相对应的支承体及其用于与电子部件烧结连接的应用 Download PDF

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Publication number
CN106463413A
CN106463413A CN201480078656.3A CN201480078656A CN106463413A CN 106463413 A CN106463413 A CN 106463413A CN 201480078656 A CN201480078656 A CN 201480078656A CN 106463413 A CN106463413 A CN 106463413A
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China
Prior art keywords
metal sintering
electronic components
transfer substrate
carrier
electronic unit
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Granted
Application number
CN201480078656.3A
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CN106463413B (zh
Inventor
M·舍费尔
S·K·杜赫
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Heli Electronics Co ltd
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Heraeus Precious Metals GmbH and Co KG
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
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    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Geometry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Die Bonding (AREA)

Abstract

用于将多个由经干燥的金属烧结制备物构成的分立的层碎片涂覆到用于电子部件的支承体的预先确定的、导电的表面部分上的方法，所述方法包括如下步骤：(1)将多个由金属烧结制备物构成的分立的层碎片涂覆到在与所述预先确定的、导电的表面部分对称的装置中的平的转移衬底的一侧上，(2)在避免烧结的情况下使这样被涂覆的金属烧结制备物干燥，(3)将具有由经干燥的金属烧结制备物构成的层碎片的转移衬底朝向用于电子部件的支承体的表面而且在保证所述转移衬底的配备有经干燥的金属烧结制备物的表面部分与所述用于电子部件的支承体的预先确定的、导电的表面部分的全等的定位的情况下布置并且接触，(4)对在步骤(3)中所建立的接触装置使用压力，并且(5)从所述接触装置除去转移衬底，其中所述经干燥的金属烧结制备物在步骤(4)结束之后相对于所述用于电子部件的支承体的预先确定的、导电的表面部分的附着力大于相对于所述转移衬底的表面的附着力，其中所述平的转移衬底是不可烧结的并且必要时被涂层的金属箔或者是热塑性的塑料薄膜，其中所述用于电子部件的支承体是具有平的、带有一个或多个为10到500μm的凹处的表面的衬底，而且同时从包括引线框、陶瓷衬底、DCB衬底和金属复合材料的组中被选出，并且其中至少一个预先确定的、导电的表面部分在一凹处中。所述用于电子部件的支承体可以已经装上一个或多个电子部件。所述转移衬底可具有用于已经存在于所述支承体上的电子部件的凹陷部。所述配备有经干燥的金属烧结制备物的用于电子部件的支承体在如下方法中被应用，在所述方法中，首先建立常见的由所述配备有经干燥的金属烧结制备物的用于电子部件的支承体和电子部件构成的三明治装置，而且此后所述三明治装置经受烧结工序。

Description

用于借助于转移衬底将经干燥的金属烧结制备物涂覆到用于 电子部件的支承体上的方法、相对应的支承体及其用于与电 子部件烧结连接的应用
背景技术
在电子工业中，将金属烧结制备物(Metallsinterzubereitung)用于电子部件(诸如半导体芯片)的固定和电接触并且用于从电子部件(诸如半导体芯片)散热是公知的。例如，在WO2011/026623A1、EP2425920A1、EP2428293A2和EP2572814A1中公开了这种金属烧结制备物。通常，这种金属烧结制备物通过印刷(例如丝网印刷或者漏版印刷)被涂覆到支承体衬底上、必要时被干燥、装上电子部件并且接着经受烧结工序。不经过液态，金属颗粒(Metallteilchen)在烧结期间通过扩散在构造支承体与电子部件之间的固定的、导电和导热的金属连接的情况下相连。
也公知一种通过滴涂(Dispensen)的应用作为对金属烧结制备物的印刷作业的替换方案。
该发明的任务曾是找到一种方法，所述方法能够实现将金属烧结制备物的多个层碎片(Schichtfragment)同时应用(在一个工序步骤中应用)到不完全平的并且必要时部分地已经装上电子部件的支承体上，而且将对支承体或必要时已经在该支承体上的电子部件的温度要求保持得尽可能低。
发明内容
本发明涉及一种用于将多个由经干燥的金属烧结制备物构成的分立的层碎片涂覆到用于电子部件的支承体的预先确定的、导电的表面部分(Oberflaechenanteil)上的方法。在按照本发明的方法中使用配备有经干燥的金属烧结制备物的、平的转移衬底(Transfersubstrat)。该方法包括如下步骤：
(1)将多个由金属烧结制备物构成的分立的层碎片涂覆到在与所述预先确定的、导电的表面部分对称的装置中的平的转移衬底的一侧上，
(2)在避免烧结的情况下使这样被涂覆的金属烧结制备物干燥，
(3)将具有由经干燥的金属烧结制备物构成的层碎片的转移衬底朝向用于电子部件的支承体的表面而且在保证所述转移衬底的配备有经干燥的金属烧结制备物的表面部分与所述用于电子部件的支承体的预先确定的、导电的表面部分的全等的(deckungsgleich)定位的情况下布置并且接触(Inkontaktbringen)，
(4)对在步骤(3)中所建立的接触装置使用压力，并且
(5)从所述接触装置除去转移衬底，
其中所述经干燥的金属烧结制备物在步骤(4)结束之后相对于所述用于电子部件的支承体的预先确定的、导电的表面部分的附着力大于相对于所述转移衬底的表面的附着力，
其中所述平的转移衬底是不可烧结的并且必要时被涂层的金属箔或者是热塑性的塑料薄膜，
其中所述用于电子部件的支承体是具有平的、带有一个或多个为10到500μm的凹处的表面的衬底，而且同时从包括引线框(Leadframe)、陶瓷衬底、DCB衬底和金属复合材料的组中被选出，并且其中至少一个预先确定的、导电的表面部分在一凹处中。
本发明也涉及根据所述按照本发明的方法来制造的配备有经干燥的金属烧结制备物的用于电子部件的支承体。
针对电子部件的例子是有源部件(例如半导体芯片，如LED、二极管、IGBT、晶闸管、MOSFET、晶体管)和/或无源部件(例如电阻、电容、电感和忆阻器)和/或压电陶瓷和/或珀耳帖部件(Peltierelement)。
术语“经干燥的金属烧结制备物”意味着不再湿的、完全或者基本上被去除了挥发性的组成部分的、没有被烧结的金属烧结制备物。例如，“经干燥的金属烧结制备物”意味着：最初包含在该金属烧结制备物中的挥发性的组成部分的重量百分比98到100％已经被除去，而且所述经干燥的金属烧结制备物也在重复使用被用在步骤(2)中的干燥条件之后以重量测定的方式被证明为质量恒定的或者基本上质量恒定的。所述经干燥的金属烧结制备物是凝固的并且在温度＜70℃的情况下形状稳定的、仍可烧结的金属烧结制备物。在进一步的过程中还探讨在按照本发明的方法的步骤(1)中所应用的金属烧结制备物本身。
用于电子部件的在按照本发明的方法中被干燥的金属烧结制备物被涂覆到其上的支承体是在电子工业中常见的从包括引线框、陶瓷衬底、DCB衬底和金属复合材料的组中选出的支承体衬底，其中所述用于电子部件的支承体同时是具有本身平的但是有一个或多个也被称作空穴的为10到500μm的凹处的表面的衬底。所述支承体可以是平坦的衬底。所述用于电子部件的支承体具有导电的表面部分，用于对所述电子部件的电压/电流供应。在此，术语“导电的表面部分”涉及该支承体的导电的表面部分的布局(Layout)或涉及该支承体的本身电绝缘的表面，因此例如意味着印刷导线(Leiterbahn)的图案。而利用术语“预先确定的、导电的表面部分”来参考导电的表面部分的这种部分：经干燥的金属烧结制备物应该被涂覆到导电的表面部分的所述这种部分上或应该借助于经干燥的金属烧结制备物在导电的表面部分的所述这种部分固定并且电接触电子部件。在此，至少一个预先确定的、导电的表面部分在为10到500μm的凹处中。换句话说，如下多个星座(Konstellation)都是可能的：
-支承体有一个为10到500μm的凹处，而且预先确定的、导电的表面部分在该凹处中，其中一个或多个其它的预先确定的、导电的表面部分在该凹处之外。
-该支承体有一个为10到500μm的凹处，而且多个预先确定的、导电的表面部分在该凹处中，其中一个或多个其它的预先确定的、导电的表面部分在该凹处之外。
-该支承体有一个为10到500μm的凹处，而且所有预先确定的、导电的表面部分都在该凹处中。
-该支承体有多个为10到500μm的凹处，而且所述预先确定的、导电的表面部分中的一个在所述凹处之一中，而所述一个或多个其它的预先确定的、导电的表面部分都在所述凹处之外。
-该支承体有多个为10到500μm的凹处，而且多个预先确定的、导电的表面部分在所述凹处之一中，而一个或多个其它的预先确定的、导电的表面部分在所述凹处之外。
-该支承体有多个为10到500μm的凹处，而且所有预先确定的、导电的表面部分都在所述凹处之一中。
-该支承体有多个为10到500μm的凹处，而且在每个所述凹处中都各有一个预先确定的、导电的表面部分，而没有、有一个或多个其它的预先确定的、导电的表面部分在所述凹处之外。
-该支承体有多个为10到500μm的凹处，而且在一些所述凹处中各有一个预先确定的、导电的表面部分，而没有、有一个或多个其它的预先确定的、导电的表面部分在所述凹处之外。
-该支承体有多个为10到500μm的凹处，而且在每个所述凹处中都各有多个预先确定的、导电的表面部分，而没有、有一个或多个其它的预先确定的、导电的表面部分在所述凹处之外。
-该支承体有多个为10到500μm的凹处，而且在一些所述凹处中各有多个预先确定的、导电的表面部分，而没有、有一个或多个其它的预先确定的、导电的表面部分在所述凹处之外。
-该支承体有多个为10到500μm的凹处，而且在两个或多个所述凹处中有部分地一个而部分地多个预先确定的、导电的表面部分，而没有、有一个或多个其它的预先确定的、导电的表面部分在所述凹处之外。
-该支承体有多个为10到500μm的凹处，而且在所述凹处中有部分地一个而部分地多个预先确定的、导电的表面部分，其中不存在没有预先确定的、导电的表面部分的凹处，而且其中没有、有一个或多个其它的预先确定的、导电的表面部分在所述凹处之外。
此外，在所述用于电子部件的支承体在按照本发明的方法中被配备所述由经干燥的金属烧结制备物构成的层碎片之前，所述用于电子部件的支承体还可以已经装上一个或多个电子部件。根据部件高度，在这些相邻的部件之间例如为10到200μm或者在具有相对大的部件高度的情况下甚至例如为200到1000μm的深度或者总深度可占支配地位(vorherrschen)。所述总深度例如可以由所述被提到过的为10到500μm的凹处之一的深度加上所述一个或多个与这种凹处相邻的或在这种凹处旁边的电子部件的最高的部件高度组成。
尤其是，所述用于电子部件的支承体的导电的表面部分是金属的。在后者的情况下涉及用于电接触的常见的薄的金属层或者金属喷镀(Metallisierung)，例如由铜、银、黄金、钯、镍、铝和这些金属的适当的合金构成的薄的金属层或者金属喷镀。也可以涉及例如敷上黄金层(Goldschicht)的镍、敷上黄金外层和钯层的镍、敷上黄金层的银/钯合金。
在按照本发明的方法的步骤(1)中，以多个分立的层碎片的形式的金属烧结制备物被涂覆到在与所述用于电子部件的支承体的预先确定的、导电的表面部分对称的装置(也就是说在与所述用于电子部件的支承体的预先确定的、导电的表面部分相对应的然而对称的装置)中的平的转移衬底的一侧上。在此，从实践的角度来考虑，所述分立的层碎片在一个步骤中或者同时被涂覆。“分立的层碎片”意味着：不是涉及连续的层，而是涉及单个的彼此绝缘的由金属烧结制备物构成的层形状的被涂覆的元件。如已经从更前面所给出的解释得出的那样，所述预先确定的、导电的表面部分也涉及单个的并且彼此绝缘的表面部分。
所述金属烧结制备物是本身已知的金属烧结制备物，如其在电子工业中得到应用用于电子部件的固定和电接触并且用于从电子部件散热的那样。除了由一个或多个金属或者金属合金构成的颗粒和/或在烧结工序中形成金属的金属化合物之外，所述金属烧结制备物除了可能的添加剂之外尤其是也还包含挥发性的有机溶剂。所述金属颗粒例如涉及这种由铜、镍、铝构成的或者尤其是由银构成的分别具有在例如为1到10μm的范围内的平均的颗粒大小(d50，用激光衍射来确定)的金属颗粒。例如，对于添加剂来说是用于金属颗粒的涂层(Coating)(诸如C8-C28脂肪酸、C8-C28脂肪酸盐、C8-C28脂肪酸酯)、常见的烧结助剂和聚合物粘合剂。WO2011/026623A1、EP2425920A1、EP2428293A2和EP2572814A1代表了如下文献的例子，在所述文献中公开了可应用的金属烧结制备物、尤其是金属烧结糊剂。
所述平的转移衬底是不可烧结的并且必要时被涂层的金属箔或者是例如由聚酯、含氟聚合物(诸如聚四氟乙烯)、聚酰亚胺、硅胶或者聚烯烃构成的热塑性的塑料薄膜。该塑料薄膜可以在质量中或者在所述要配备有金属烧结制备物的一侧上配备(例如被涂层)减附的(haffvermindernd)材料。针对减附的材料的例子包括基于硅胶或含氟聚合物的物质。优选地，所述平的转移衬底是透明的塑料薄膜。
重要的是，所述经干燥的金属烧结制备物在步骤(4)结束之后相对于所述用于电子部件的支承体的预先确定的、导电的表面部分的附着力大于相对于所述转移衬底的表面的附着力。例如，如果按照DIN EN 14099(2002年10月)用具有附着强度为220g/cm的粘合带来确定，该附着力大了0.4N/cm或者更多，则足够。
在实施方式中，所述转移衬底是非刚性的热塑性的塑料薄膜，所述非刚性的热塑性的塑料薄膜即使在热负荷之后也在很大程度上是尺寸稳定的。优选地，所述非刚性的热塑性的塑料薄膜在30分钟120℃目标温度(Objekttemperatur)的热负荷之后具有在长度和宽度上≤1.5％(ASTM D 1204)的尺寸变化，也就是说优选地在所述条件下在长度和宽度方向上没有或者各有为最大到1.5％的尺寸变化(ASTM D 1204)。
针对可用作按照本发明的方法中的转移衬底的热塑性的塑料薄膜的例子是在贸易中可得到的三菱公司(Mitsubishi)的 RN75塑料薄膜、杜邦公司(DuPont)的 A 50μm或75μm塑料薄膜和东丽公司(Toray)的40.01塑料薄膜。
将金属烧结制备物涂覆到转移衬底上通常通过在例如为5到200μm的干燥层厚度中印刷(例如丝网印刷或者漏版印刷)来进行。在足够稀薄的金属烧结制备物的情况下，所述涂覆也可以通过喷涂作业(Spruehauftrag)来进行，其中采取用于保护不应该与金属烧结制备物发生接触的区域的措施可以是适宜的。针对这种措施的例子是胶带或者利用漏版来覆盖。
在按照本发明的方法的步骤(2)中，在步骤(1)中被涂覆的、湿的金属烧结制备物在避免烧结的情况下被干燥、也就是说在步骤(1)中被涂覆的、湿的金属烧结制备物的挥发性的组成部分(诸如有机溶剂)被去除。所述金属烧结制备物的干燥优选地在适合于从金属烧结制备物中除去挥发性的组成部分的条件、尤其是温度条件下进行，然而在干燥之后，在金属烧结制备物之内的烧结工序完全不曾进行。对此，配备有该金属烧结制备物的转移衬底可以例如在炉子(例如空气循环加热炉)中被加热到80到150℃例如10到30分钟。在此，必要时可以例如借助于氮气气氛使炉子惰化(inertisieren)。
如已经说明的那样，所述经干燥的金属烧结制备物的挥发性的组成部分(如有机溶剂)至少基本上被去除，而且所述经干燥的金属烧结制备物除了金属颗粒和/或在稍后的烧结工序中形成金属的金属化合物之外例如仍包含不挥发的添加剂。所述经干燥的金属烧结制备物凝固，然而没有被烧结或者只部分地被烧结、也就是说所述凝固的金属烧结制备物仍是可烧结的。
因此，具有在其上的经干燥的金属烧结制备物的转移衬底形成如下预成形品(Vorform)，所述预成形品可以作为中间产品被输送给其它的、包括步骤(3)到(5)的制造工序。所述其它的、包括步骤(3)到(5)的制造工序可以在实施步骤(1)和(2)的制造商处或者在另一制造商处进行。该中间产品总体上是稳定的并且是可操作的(handhabbar)，使得该中间产品可以被运输用于进一步处理。原因在于：所述经干燥的金属烧结制备物是凝固的并且是形状稳定的。
在按照本发明的方法的步骤(3)中，将具有由经干燥的金属烧结制备物构成的层碎片的转移衬底朝向所述用于电子部件的支承体的表面而且在保证所述转移衬底的配备有经干燥的金属烧结制备物的表面部分与所述用于电子部件的支承体的预先确定的、导电的表面部分的全等的定位的情况下布置并且接触。以这种方式来保证：利用所述针对电子部件的支承体的被提到过的预先确定的、导电的表面部分来覆盖在转移衬底上具有所述经干燥的金属烧结制备物的部位，经干燥的金属烧结制备物应该被涂覆到所述表面部分上或稍后应该借助于之前被涂覆的经干燥的金属烧结制备物在所述表面部分固定并且电接触电子部件。可以以任意的位置、例如以垂直的位置或者水平的位置来实现在步骤(3)中的装置。例如可以以水平的位置将转移衬底布置在所述用于电子部件的支承体之下或者反之亦然。
在按照本发明的方法的步骤(4)、即真正的转移步骤中，或者整面地或者至少完全地在所述经干燥的金属烧结制备物所在的位置上对在步骤(3)中所建立的接触装置施加压力。例如，为0.5到10MPa的压紧力(Anpressdruck)可以在例如为1到30秒的持续时间内得以使用。在此使用被提到的为直至150℃的目标温度可以是适宜的；例如可以借助于压紧工具(Presswerkzeug)的底面供热和/或顶面供热来进行该加热。为了执行方法步骤(4)可以应用常见的设备，例如层压压机、尤其是可供热的层压压机。附加地，例如在冲压机(Pressstempel)与配备有经干燥的金属烧结制备物的转移衬底之间可以采用具有被适配的硬度、例如为50到70的邵尔A硬度(Shore-A-Haerte)的硅胶板。尤其是在非整面地施加压紧力的情况下也可以采用如下助剂，所述助剂根据在所述经干燥的金属烧结制备物所在的位置上的冲压机的类型来起作用。尤其是当支承体已经装上电子部件、特别是装上具有相对大的结构高度的电子部件时，这种做法是有利的。此外，如果所述转移衬底具有用于这种已经存在的电子部件的相对应的凹陷部，使得所述转移衬底可以完全与所述用于电子部件的支承体的表面发生接触，那么可以是适宜的。
在步骤(4)结束之后，在按照本发明的方法的步骤(5)中除去转移衬底，其中所述经干燥的金属烧结制备物留在所述用于电子部件的支承体的预先确定的、导电的表面部分上。现在，所述经干燥的金属烧结制备物的之前附着在转移衬底上的、通过所述转移被去除的表面被确定用于容纳电子部件或用于与电子部件的连接，这留待另一制造工序去做。
步骤(3)至(5)可以作为批量工序(Batchprozess)或者例如就滚轮层压工序而言连续地来执行。从实践的角度来考虑，在步骤序列(3)至(5)中，所述分立的层碎片在一个步骤中或者同时从转移衬底被转移到用于电子部件的支承体上。
在实施方式中，可以执行所述按照本发明的方法，使得所述用于电子部件的支承体在两侧都配备有经干燥的金属烧结制备物。在此，以如下区别来进行相同的方法步骤(1)至(5)：所述用于电子部件的支承体在步骤(3)至(4)中被布置在两个相对应地配备有经干燥的金属烧结制备物的转移衬底之间并且经受压紧过程，而且紧接着在步骤(5)中将所述用于电子部件的支承体的两侧的转移衬底除去。
所述一个或多个为了容纳电子部件并且与电子部件连接而进行的步骤属于另一制造工序，所述制造工序例如也可以在另一制造商处进行。所述另一制造工序包括真正的烧结步骤。在此，首先建立常见的由具有依照按照本发明的方法被转移到其上的经干燥的金属烧结制备物的用于电子部件的支承体和电子部件构成的三明治装置。接着，所述三明治装置经受烧结工序，在所述烧结工序的过程中从所述经干燥的金属烧结制备物中形成被烧结的金属烧结制备物并且在支承体与电子部件之间形成机械的、电的和导热的连接。
包括步骤(1)至(5)的按照本发明的方法的以配备有经干燥的金属烧结制备物的用于电子部件的支承体的形式的产品形成预成形品，所述预成形品可以作为中间产品被输送给在上述段落中所解释的另一制造工序。
该中间产品总体上是稳定的并且是可操作的，使得该中间产品可以被运输用于进一步处理。原因在于：所述被转移的、经干燥的金属烧结制备物是凝固的并且是形状稳定的。
所述按照本发明的方法允许在一个步骤中将以层碎片为形式的经干燥的金属烧结制备物涂覆到用于电子部件的支承体上，而且没有用在干燥金属烧结制备物时占支配地位的温度来使支承体或者电子部件承受负荷。在此，所述按照本发明的方法允许将经干燥的金属烧结制备物涂覆在所述支承体的表面上的凹处中并且必要时涂覆在已经存在于所述支承体上的电子部件之间，这用传统的丝网印刷或者漏版印刷是不可能的。
在下文，依据实施例来解释本发明，然而所述实施例不应该被理解为受限制的。
具体实施方式
实施例(在作为用于电子部件的支承体的500μm厚的银制薄板中将2个二极管(IFXIDC73D120T6H)烧结到150μm深的空穴中)：
贺利氏哈瑙公司(Fa.Heraeus，Hanau)的烧结糊剂ASP 043-04借助于DEK Horizon03iX漏版印刷机在应用科能公司(Fa.Koenen)的75μm厚的钢制漏版(Stahlschablone)的情况下被印到作为转移衬底的三菱公司的 RN7525JK型PET膜上(印刷速度20mm/s、刮板压力(Rakeldruck)2kg)，其中所印上的烧结糊剂的布局与在银制薄板中的空穴的布局对称地布置。
被印刷的转移薄膜在空气循环加热炉(宾德公司(Fa.Binder))中在100℃的情况下被干燥15min。
为了将烧结糊剂转移到所述银制薄板的空穴中，被印刷的并且配备有经干燥的烧结糊剂的转移薄膜利用被印刷的一侧以烧结糊剂与空穴全等的对齐被放置到所述银制薄板上。
为了压力分布(Druckverteilung)，硅胶膜(阿尔法技术贸易公司(Fa.AlphaTectrade)，“Silikon 60 rot Basic”型)被布置在所述转移薄膜的未被印刷的一侧上。
在层压压机(劳费尔公司(Fa.Laufer))的情况下，烧结糊剂被转移到银制薄板上到空穴中(在所述银制薄板的一侧上在100℃的温度情况下在5MPa的压紧力的情况下10秒，不在转移薄膜的一侧上加热)。在结束转移之后除去所述转移薄膜，而且所述银制薄板可以在配备有经干燥的烧结糊剂的空穴中装上二极管并且接着被输送给印刷烧结工序。

Claims (11)

1.用于将多个由经干燥的金属烧结制备物构成的分立的层碎片涂覆到用于电子部件的支承体的预先确定的、导电的表面部分上的方法，所述方法包括如下步骤：
(1)将多个由金属烧结制备物构成的分立的层碎片涂覆到在与所述预先确定的、导电的表面部分对称的装置中的平的转移衬底的一侧上，
(2)在避免烧结的情况下使这样被涂覆的金属烧结制备物干燥，
(3)将具有由经干燥的金属烧结制备物构成的层碎片的转移衬底朝向所述用于电子部件的支承体的表面而且在保证所述转移衬底的配备有经干燥的金属烧结制备物的表面部分与所述用于电子部件的支承体的预先确定的、导电的表面部分的全等的定位的情况下布置并且接触，
(4)对在步骤(3)中所建立的接触装置使用压力，并且
(5)从所述接触装置除去转移衬底，
其中所述经干燥的金属烧结制备物在步骤(4)结束之后相对于所述用于电子部件的支承体的预先确定的、导电的表面部分的附着力大于相对于所述转移衬底的表面的附着力，
其中所述平的转移衬底是不可烧结的并且必要时被涂层的金属箔或者是热塑性的塑料薄膜，
其中所述用于电子部件的支承体是具有平的、带有一个或多个为10到500μm的凹处的表面的衬底，而且同时从包括引线框、陶瓷衬底、DCB衬底和金属复合材料的组中被选出，并且其中至少一个预先确定的、导电的表面部分在一凹处中。
2.根据权利要求1所述的方法，
其中所述转移衬底是非刚性的热塑性的塑料薄膜，所述非刚性的热塑性的塑料薄膜在30分钟120℃目标温度的热负荷之后具有在长度和宽度上≤1.5％(ASTM D1204)的尺寸变化。
3.根据权利要求1或2所述的方法，
其中所述用于电子部件的支承体已经装上一个或多个电子部件。
4.根据权利要求3所述的方法，
其中所述转移衬底具有用于已经存在于所述支承体上的电子部件的凹陷部。
5.根据上述权利要求之一所述的方法，
其中所述塑料薄膜是透明的。
6.根据上述权利要求之一所述的方法，
其中所述金属烧结制备物在步骤(1)中通过印刷或者通过喷涂作业来涂覆。
7.根据上述权利要求之一所述的方法，
其中在步骤(2)中在10到30分钟期间通过加热到80至150℃的目标温度来进行所述干燥。
8.根据上述权利要求之一所述的方法，
其中在步骤(4)中在为1到30秒的持续时间内使用0.5到10MPa的压紧力。
9.根据上述权利要求之一所述的方法，
其中在步骤(4)中使用被提高的为直至150℃的目标温度。
10.根据上述权利要求之一所述的方法的配备有经干燥的金属烧结制备物的用于电子部件的支承体。
11.根据权利要求10所述的配备有经干燥的金属烧结制备物的用于电子部件的支承体在如下方法中的应用，在所述方法中，首先建立常见的由所述配备有经干燥的金属烧结制备物的用于电子部件的支承体和电子部件构成的三明治装置，而且此后所述三明治装置经受烧结工序。
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