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CN105674100A - LED lamp filament lamp - Google Patents

LED lamp filament lamp Download PDF

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Publication number
CN105674100A
CN105674100A CN201610020858.3A CN201610020858A CN105674100A CN 105674100 A CN105674100 A CN 105674100A CN 201610020858 A CN201610020858 A CN 201610020858A CN 105674100 A CN105674100 A CN 105674100A
Authority
CN
China
Prior art keywords
led filament
heat transfer
transfer part
column
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610020858.3A
Other languages
Chinese (zh)
Inventor
曾茂进
王其远
鲍永均
曹亮亮
陈小波
吴峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhangzhou Lidaxin Optoelectronic Technology Co ltd
Original Assignee
Zhangzhou Lidaxin Optoelectronic Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhangzhou Lidaxin Optoelectronic Technology Co ltd filed Critical Zhangzhou Lidaxin Optoelectronic Technology Co ltd
Priority to CN201610020858.3A priority Critical patent/CN105674100A/en
Publication of CN105674100A publication Critical patent/CN105674100A/en
Pending legal-status Critical Current

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

The invention relates to an LED lamp filament lamp. The LED lamp filament lamp comprises LED lamp filaments, a stand column, a heat transferring part and a radiating piece; the heat transferring part is arranged on the radiating piece and is in hot connection with the radiating piece, the stand column is fixed to the heat transferring part, the top ends of the LED lamp filaments are fixed to the stand column, and the bottom ends of the LED lamp filaments are fixed to the heat transferring part; and at least one end of each LED lamp filament is in hot connection with the heat transferring part, the middle portions of the LED lamp filaments, the stand column and the heat transferring part are arranged in a spaced manner, and the light-emitting angle of the LED lamp filaments is larger than 180 degrees. The LED lamp filament lamp has the beneficial effects of being simple in assembling process and good in radiating.

Description

LED filament lamp
Technical field
The present invention relates to technical field of LED illumination, in particular to a kind of LED filament lamp.
Background technology
In recent years, owing to the development of LED industry is rapid, LED lamp progressively replaces traditional lighting. Owing to LED luminescence has the characteristic such as pointolite and directivity, therefore LED lamp is difficult to replace conventional incandescent completely, accomplishes that full luminous intensity distribution throws light on. Existing a kind of LED filament is that one group of LED chip encapsulation is formed LED filament on the transparent substrate, it is possible to realize wide-angle luminescence, then multiple filament is connected to form the illumination effect of similar tengsten lamp. At present, LED filament does not have radiator substantially, and LED filament cannot carry out heat conducting and radiating, go out so being difficult to the heat conduction by LED chip produces, heat can only carry out heat conduction and heat radiation by the convection current of radiation and internal gas, it is easy to causes the accumulation of heat so that the life-span of LED filament shortens.
Existing LED filament lamp usually adopts and fills heat conduction gas and glass envelope bubble manufacture technics, this technique is to the technical requirements height of envelope bubble, apparatus expensive, envelope bubble is easily caused not to be tamping, gas leakage, the problems such as blast, glass envelope is frangible, life-time service there will be gas leakage problem, and the heat dispersion of gas is limited, the exploitation of low-power LED filament lamp can only be met, and once do high-power, the heat of the generation of LED filament cannot fall apart in time, cause thermal damage and the light of LED chip is easily caused to decline so that the lux maintenance of whole lamp is low, and the life-span is short.
Summary of the invention
In view of this, it is necessary to a kind of simple for assembly process, LED filament lamp of dispelling the heat good is provided.
A kind of LED filament lamp, comprise LED filament, column, heat transfer part and heat radiation part, this heat transfer part be arranged on this heat radiation part and with this heat radiation part hot tie-in, this column is fixed on this heat transfer part, the top of described LED filament is fixed on this column, the bottom of described LED filament is fixed on this heat transfer part and arranges with this heat transfer part hot tie-in, the middle part of described LED filament and this column and this heat transfer part interval, and the lighting angle of described LED filament is greater than 180 degree.
Compared with prior art, the two ends of these LED filament are separately fixed on this column and this heat transfer part by the present invention, this column is fixed on this heat transfer part, and at least one end of these LED filament and this heat transfer part hot tie-in, this heat transfer part and this heat radiation part hot tie-in, like this, the heat part that these LED filament produce is delivered on this heat radiation part by this heat transfer part, distribute finally by this heat radiation part, these LED filament are avoided to produce the accumulation of heat, this LED filament light fixture is made to have good radiating effect, and without the need to filling heat conduction gas and glass envelope bubble technique in addition, avoid and seal, for filling heat conduction gas and glass, the complicated technology steeped and design specially, have simple for assembly process, dispel the heat good advantage.
Accompanying drawing explanation
Fig. 1 is the stereographic map of LED filament lamp first embodiment of the present invention.
Fig. 2 is the lamp three-dimensional exploded view of LED filament shown in Fig. 1.
Fig. 3 is the sectional view of the lamp of LED filament shown in Fig. 1.
Fig. 4 is the three-dimensional exploded view of LED filament in the lamp of LED filament shown in Fig. 1.
Description of reference numerals:
10LED filament 11 substrate
12LED light source 13 electrode tip
131 connection sections 132 stretch portion
14 heat-conducting layer 15 encapsulated layers
30 heat transfer parts 40 dispel the heat part
50 first line plate 60 the 2nd wiring boards
Embodiment
Below in conjunction with accompanying drawing and embodiment, the present invention is described in further detail.
Please refer to Fig. 1 to Fig. 4, this LED filament lamp comprises six LED filament 10, column 20, heat transfer part 30 and heat radiation part 40. This heat transfer part 30 be arranged on this heat radiation part 40 and with this heat radiation part 40 hot tie-in, this column 20 is fixed on this heat transfer part 30, and the top of these LED filament 10 is fixed on this column 20, and the bottom of these LED filament 10 is fixed on this heat transfer part 30. In the present embodiment, being also provided with hemisphere bubble shell shape bulb housing, this bulb housing is arranged on the top of this heat radiation part 40, and in these LED filament 10, column 20 and heat transfer part 30 are located at.
Wherein, at least one end of these LED filament 10 and this heat transfer part 30 hot tie-in, that is, the bottom of these LED filament 10 and this heat transfer part 30 hot tie-in; Or the top of these LED filament 10 and this column 20 hot tie-in, meanwhile, this column 20 and this heat transfer part 30 hot tie-in so that the top of this LED filament 10 and this heat transfer part 30 hot tie-in. The middle part of these LED filament 10 and this column 20 and this heat transfer part 30 interval are arranged. The lighting angle of these LED filament 10 is greater than 180 degree. In the present embodiment, this column 20 is made up of thermally conductive material, the top of these LED filament 10 and this column 20 hot tie-in, the bottom of these LED filament 10 and this heat transfer part 30 hot tie-in, like this, heat simultaneously from two ends difference heat trnasfer to this column 20 and this heat transfer part 30, can be distributed, avoid heat build-up by heat that these LED filament 10 produce in time. Owing to the middle part of these LED filament 10 and this column 20 and this heat transfer part 30 interval are arranged, and the lighting angle of these LED filament 10 is greater than 180 degree, so, inwall towards this bulb housing is launched by the light that these LED filament 10 fronts send, the light that these LED filament 10 back sides send will irradiate towards this column 20, owing to there being interval, light irradiates through this interval towards the bulb housing inwall at these LED filament 10 back sides. This provides for improved the light extraction efficiency of these LED filament 10, make the Light distribation of whole lamp more even.
In the present embodiment, this column 20 this heat transfer part 30 substantially vertical is arranged on the middle part of this heat transfer part 30, the external diameter of this column 20 is less than the external diameter of this heat transfer part 30, the top of these LED filament 10 is fixed on the outer side of this column 20, the bottom of these LED filament 10 is fixed on the outer side of this heat transfer part 30 so that these LED filament 10 forming station body ray structures. In the present embodiment, this column 20 is made up of transparent or semitransparent material, or, this column 20 and this heat transfer part 30 are made into integration by transparent or semitransparent material, or, this column 20 and heat transfer part 30 and the part 40 that dispels the heat are made into integration.
In addition, the LED/light source 12 that these LED filament 10 comprise substrate 11 and are arranged on this substrate 11, this substrate 11 is made up of transparent or semitransparent glass, pottery or sapphire.
In the present embodiment, these LED filament 10 comprise substrate 11, LED/light source 12 and two electrode tips 13, these LED/light source 12 be arranged on this substrate 11 and with this substrate 11 hot tie-in, these two electrode tips 13 are made by thermally conductive material, these two electrode tips 13 include connection section 131, these connection sections 131 are arranged on and are electrically connected on this substrate 11 and with these LED/light source 12, these connection sections 131 and this substrate 11 hot tie-in, these LED filament 10 are separately fixed on this column 20 and this heat transfer part 30 by these electrode tips 13, these LED filament 10 by these electrode tips 13 respectively with this column 20 and heat transfer part 30 hot tie-in. these two electrode tips 13 are welded on this substrate 11 respectively, and these LED/light source 12 are electrically connected with these two electrode tips 13 respectively by gold thread. these LED/light source 12 are arranged on the front of this substrate 11, the front of this substrate 11 is also provided with heat-conducting layer 14, the front hot tie-in of this heat-conducting layer 14 and this substrate 11, this heat-conducting layer 14 and the setting of these LED/light source 12 interval, at least one and this heat-conducting layer hot tie-in in these two electrode tips 13. this heat-conducting layer 14 is for being delivered to above-mentioned electrode tip 13 faster by the heat on this substrate 11. these two electrode tips 13 are made by resilient material, and the middle part of each electrode tip 13 is provided with flexible portion 132, and this flexible portion 132 is " several " font structure of bending. during work, this LED filament 10 encapsulates structure and is heated and can expand with heat and contract with cold, but dilatation can occur due to this flexible portion 132, so stress can be avoided to produce, LED filament 10 is bending or the problem of fracture. certainly, it is also possible to this flexible portion is not set, and directly allows each electrode tip 13 form plate-like structure. in addition, also comprising encapsulated layer 15, this encapsulated layer 15 covers the connection section 131 of the LED/light source 12 on this substrate 11 and these two electrode tips 13.
In addition, comprise multiple LED filament 10, also comprise first line plate 50 and the 2nd wiring board 60, this first line plate 50 is arranged on the outer side of this column 20,2nd wiring board 60 is arranged on the outer side of this heat transfer part 30, and this first line plate 50 and the 2nd wiring board 60 are electrically connected these LED filament 10 are connected or to be connected in parallel with the top of these LED filament 10 and bottom respectively. 2nd wiring board 60 is flexible base board, the outer side of this heat transfer part 30 is truncated cone-shaped structure, 2nd wiring board 60 bend after be attached to this heat transfer part 30 outer side and with this heat transfer part 30 hot tie-in, like this, the heat that these LED filament 10 produce also is delivered on this heat transfer part 30 by the 2nd wiring board 60, then by distributing with this heat transfer part 30 this heat radiation part 40 hot linked.
In sum, the two ends of these LED filament 10 are separately fixed on this column 20 and this heat transfer part 30 by the present invention, this column 20 is fixed on this heat transfer part 30, and at least one end of these LED filament and this heat transfer part 30 hot tie-in, this heat transfer part 30 and this heat radiation part 40 hot tie-in, like this, the heat part that these LED filament 10 produce is delivered on this heat radiation part 40 by this heat transfer part 30, some heat is successively delivered to this heat transfer part 30 by this column 20, on this heat radiation part 40, distribute finally by this heat radiation part 40, avoid the heat build-up that these LED filament 10 produce, this LED filament light fixture is made to have good radiating effect, and without the need to filling heat conduction gas and glass envelope bubble technique in addition, avoid and seal, for filling heat conduction gas and glass, the complicated technology steeped and design specially, there is advantage simple for assembly process.
The foregoing is only the better embodiment of the present invention, not in order to limit the present invention, any those skilled in the art, not departing from this scheme technical scope, utilize the technology contents of above-mentioned exposure to make the equivalent embodiment for equal change of few modifications. In every case depart from technical solution of the present invention content, according to the technology of the present invention essence to any amendment made for any of the above embodiments, equivalent replacement, improvement etc., all should be included within the scope of protection of the invention.

Claims (12)

1. a LED filament lamp, comprise LED filament, column, heat transfer part and heat radiation part, this heat transfer part be arranged on this heat radiation part and with this heat radiation part hot tie-in, this column is fixed on this heat transfer part, it is characterized in that, the top of described LED filament is fixed on this column, the bottom of described LED filament is fixed on this heat transfer part, at least one end of described LED filament and this heat transfer part hot tie-in, the middle part of described LED filament and this column and this heat transfer part interval are arranged, and the lighting angle of described LED filament is greater than 180 degree.
2. LED filament lamp according to claim 1, it is characterised in that: this column is made up of thermally conductive material, the top of described LED filament and this column hot tie-in, the bottom of described LED filament and this heat transfer part hot tie-in.
3. LED filament lamp according to claim 1, it is characterised in that: described LED filament comprises substrate and arranges LED/light source on the substrate, and this substrate is made up of transparent or semitransparent glass, pottery or sapphire.
4. LED filament lamp according to claim 1, it is characterised in that: this column is made up of transparent or semitransparent material, or, this column and this heat transfer part are made into integration by transparent or semitransparent material, or, this column and heat transfer part and the part that dispels the heat are made into integration.
5. LED filament lamp according to claim 1, it is characterized in that: this column this heat transfer part substantially vertical is arranged on the middle part of this heat transfer part, the external diameter of this column is less than the external diameter of this heat transfer part, the top of described LED filament is fixed on the outer side of this column, and the bottom of described LED filament is fixed on the outer side of this heat transfer part.
6. LED filament lamp according to claim 1, it is characterized in that: comprise multiple LED filament, also comprise first line plate and the 2nd wiring board, this first line plate is arranged on the outer side of this column, 2nd wiring board is arranged on the outer side of this heat transfer part, and this first line plate and the 2nd wiring board are electrically connected described LED filament is connected or to be connected in parallel with the top of described LED filament and bottom respectively.
7. LED filament lamp according to claim 6, it is characterised in that: the 2nd wiring board is flexible base board, and the outer side of this heat transfer part is truncated cone-shaped structure, the 2nd wiring board bend after be attached to this heat transfer part outer side and with this heat transfer part hot tie-in.
8. LED filament lamp according to claim 1, it is characterized in that: described LED filament comprises substrate, LED/light source and two electrode tips, described LED/light source arranges and is connected on the substrate and with this substrate heat, these two electrode tips are made by thermally conductive material, these two electrode tips include connection section, described connection section arranges and is electrically connected on the substrate and with described LED/light source, described connection section is connected with this substrate heat, described LED filament is separately fixed on this column and this heat transfer part by described electrode tip, described LED filament by described electrode tip respectively with this column and heat transfer part hot tie-in.
9. LED filament lamp according to claim 8, it is characterised in that: also comprising encapsulated layer, described encapsulated layer covers the LED/light source on this substrate and the connection section of these two electrode tips.
10. LED filament lamp according to claim 8, it is characterized in that: described LED/light source is arranged on the front of this substrate, the front of this substrate is also provided with heat-conducting layer, the front hot tie-in of this heat-conducting layer and this substrate, this heat-conducting layer and described LED/light source interval are arranged, at least one and this heat-conducting layer hot tie-in in these two electrode tips.
11. LED filament lamps according to claim 8, it is characterised in that: these two electrode tips weld on the substrate respectively, and described LED/light source is electrically connected with these two electrode tips respectively by gold thread.
12. LED filament lamps according to claim 8, it is characterised in that: these two electrode tips are made by resilient material, and the middle part of each electrode tip is provided with flexible portion, and this flexible portion is " several " font structure of bending.
CN201610020858.3A 2016-01-14 2016-01-14 LED lamp filament lamp Pending CN105674100A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610020858.3A CN105674100A (en) 2016-01-14 2016-01-14 LED lamp filament lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610020858.3A CN105674100A (en) 2016-01-14 2016-01-14 LED lamp filament lamp

Publications (1)

Publication Number Publication Date
CN105674100A true CN105674100A (en) 2016-06-15

Family

ID=56300416

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610020858.3A Pending CN105674100A (en) 2016-01-14 2016-01-14 LED lamp filament lamp

Country Status (1)

Country Link
CN (1) CN105674100A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106369366A (en) * 2016-11-16 2017-02-01 漳州立达信光电子科技有限公司 LED lamp filament assembly and LED filament lamp
CN106523946A (en) * 2016-11-16 2017-03-22 漳州立达信光电子科技有限公司 LED filament lamp

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201696901U (en) * 2010-01-25 2011-01-05 光裕应用能源科技有限公司 LED bulb with longitudinal heat transfer device
CN104595753A (en) * 2014-12-11 2015-05-06 上海飞乐音响股份有限公司 Filament type LED lamp
CN104791627A (en) * 2015-04-21 2015-07-22 贵州光浦森光电有限公司 Establishing method of LED filament lamp and LED filament lamp
CN204592952U (en) * 2015-04-23 2015-08-26 浙江锐迪生光电有限公司 A kind of LED silk lamp with radiating piece LED silk
CN104879669A (en) * 2015-06-19 2015-09-02 厦门李氏兄弟有限公司 LED filament lamp
CN105202399A (en) * 2015-10-29 2015-12-30 漳州立达信光电子科技有限公司 LED (light-emitting diode) filament lamp
CN205480235U (en) * 2016-01-14 2016-08-17 漳州立达信光电子科技有限公司 LED (Light emitting diode) filament lamp

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201696901U (en) * 2010-01-25 2011-01-05 光裕应用能源科技有限公司 LED bulb with longitudinal heat transfer device
CN104595753A (en) * 2014-12-11 2015-05-06 上海飞乐音响股份有限公司 Filament type LED lamp
CN104791627A (en) * 2015-04-21 2015-07-22 贵州光浦森光电有限公司 Establishing method of LED filament lamp and LED filament lamp
CN204592952U (en) * 2015-04-23 2015-08-26 浙江锐迪生光电有限公司 A kind of LED silk lamp with radiating piece LED silk
CN104879669A (en) * 2015-06-19 2015-09-02 厦门李氏兄弟有限公司 LED filament lamp
CN105202399A (en) * 2015-10-29 2015-12-30 漳州立达信光电子科技有限公司 LED (light-emitting diode) filament lamp
CN205480235U (en) * 2016-01-14 2016-08-17 漳州立达信光电子科技有限公司 LED (Light emitting diode) filament lamp

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106369366A (en) * 2016-11-16 2017-02-01 漳州立达信光电子科技有限公司 LED lamp filament assembly and LED filament lamp
CN106523946A (en) * 2016-11-16 2017-03-22 漳州立达信光电子科技有限公司 LED filament lamp
CN106369366B (en) * 2016-11-16 2020-01-21 漳州立达信光电子科技有限公司 LED filament assembly and LED filament lamp

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Application publication date: 20160615