CN105485534A - LED filament lamp - Google Patents
LED filament lamp Download PDFInfo
- Publication number
- CN105485534A CN105485534A CN201610057542.1A CN201610057542A CN105485534A CN 105485534 A CN105485534 A CN 105485534A CN 201610057542 A CN201610057542 A CN 201610057542A CN 105485534 A CN105485534 A CN 105485534A
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- China
- Prior art keywords
- led silk
- line plate
- led
- described led
- radiating piece
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- 239000000463 material Substances 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims description 20
- 238000012546 transfer Methods 0.000 claims description 11
- 239000011521 glass Substances 0.000 claims description 6
- 238000005452 bending Methods 0.000 claims description 2
- 229910052594 sapphire Inorganic materials 0.000 claims description 2
- 239000010980 sapphire Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 7
- 230000017525 heat dissipation Effects 0.000 abstract description 7
- 238000009825 accumulation Methods 0.000 abstract description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004020 luminiscence type Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
An LED filament lamp comprises at least two LED filaments, a bulb casing and a heat dissipation piece, wherein the bottom of the bulb casing is fixed on the top surface of the heat dissipation piece, and the LED filaments are accommodated in the bulb casing; the LED filament lamp further comprises a first circuit board, the first circuit board is made of a heat conduction material, is fixed on the heat dissipation piece and is in hot connection with the heat dissipation piece, connecting parts corresponding to the LED filaments respectively are arranged on the first circuit board, the bottom end of each LED filament is fixed at the corresponding connecting part and is in hot connection with the connecting part, and the LED filaments are in electrical connection with the first circuit board respectively. The bottom ends of the LED filaments are fixed at the connecting parts to form hot connection, so that the LED filaments are in hot connection with the first circuit board. Therefore, part of heat produced by the LED filaments is transferred to the first circuit board and then is dissipated through the heat dissipation piece; heat accumulation of the LED filaments is avoided, and the LED filament lamp has a good heat dissipation effect.
Description
Technical field
The present invention relates to technical field of LED illumination, particularly a kind of LED silk lamp.
Background technology
In recent years, because the development of LED industry is rapid, LED lamp progressively replaces traditional lighting.Because LED luminescence has the characteristic such as spot light and directionality, therefore LED lamp is difficult to replace conventional incandescent completely, accomplishes that full luminous intensity distribution throws light on.Existing a kind of LED silk, is that one group of LED chip encapsulation is formed LED silk on the transparent substrate, can realizes wide-angle luminescence, then multiple filament is connected to form the illumination effect of similar tengsten lamp.At present, LED silk does not have radiator substantially, and LED silk cannot carry out heat conducting and radiating, so the heat conduction be difficult to LED chip produces is gone out, heat can only lean on the convection current of radiation and internal gas to carry out heat conduction and heat radiation, easily causes the accumulation of heat, makes the lost of life of LED silk.
Existing LED silk lamp usually adopts and fills heat-conducting gas and glass envelope bubble manufacture technics, the technical requirement of this technique to envelope bubble is high, apparatus expensive, envelope bubble is easily caused not to be tamping, gas leakage, the problems such as blast, glass envelope is frangible, Long-Time Service there will be leakage problem, and the heat dispersion of gas is limited, the exploitation of low-power LED filament lamp can only be met, and once do high-power, the heat of the generation of LED silk cannot shed in time, easily cause cause thermal damage and the light decay of LED chip, make the lux maintenance of whole lamp low, the life-span is short.
Summary of the invention
In view of this, be necessary to provide a kind of simple for assembly process, dispel the heat LED silk lamp good.
A kind of LED silk lamp, comprise at least two LED silks, bulb housing and radiating pieces, the bottom of this bulb housing is fixed on the end face of this radiating piece and accommodates described LED silk, also comprise first line plate, this first line plate is made up of Heat Conduction Material, this first line plate to be fixed on this radiating piece and thermally coupled with this radiating piece, on this first line plate, corresponding every root LED silk is respectively equipped with a connecting portion, the bottom of described LED silk to be fixed on this connecting portion and thermally coupled with this connecting portion, and described LED silk is electrically connected with this first line plate respectively.
Compared with prior art, LED silk lamp connecting portion is formed thermally coupled by being fixed on the bottom of LED silk, makes LED silk and this first line plate form thermally coupled relation.Therefore, a part of heat that LED silk produces is delivered on first line plate, then is distributed by this radiating piece.Avoid LED silk to produce the accumulation of heat, make this LED silk light fixture have good radiating effect.Without the need to arranging the structure of complicated heat-conducting gas and seal glass bubble, have structure simple, assemble convenient, good advantage of dispelling the heat.
Accompanying drawing explanation
Fig. 1 is the stereogram of LED silk lamp first embodiment of the present invention.
Fig. 2 is the stereogram of first line plate development in the silk of LED shown in Fig. 1 lamp.
Fig. 3 is the stereogram that in the silk of LED shown in Fig. 1 lamp, the second wiring board launches.
Detailed description of the invention
Below in conjunction with accompanying drawing and detailed description of the invention, the present invention is described in further detail.
Please refer to Fig. 1 to Fig. 3, this LED silk lamp comprises at least two LED silks 30, bulb housing 20 and radiating piece 10.The bottom of this bulb housing 20 is fixed on the end face of this radiating piece 10 and accommodates described LED silk 30.Also comprise first line plate 60, this first line plate 60 is made up of Heat Conduction Material, and this first line plate 60 to be fixed on this radiating piece 10 and thermally coupled with this radiating piece 10.On this first line plate 60, corresponding every root LED silk 30 is respectively equipped with a connecting portion 61, and the bottom of described LED silk 30 to be fixed on this connecting portion 61 and thermally coupled with this connecting portion 61.Described LED silk 30 is electrically connected with this first line plate 60 respectively, and this first line plate 60 is provided with terminal 63 for being connected with extraneous power electric.Wherein, the bottom of LED silk 30 is fixed on and connecting portion 61 is formed thermally coupled, make LED silk 30 and this first line plate 60 form thermally coupled relation.Therefore, a part of heat produced when LED silk 30 works is delivered on first line plate 60, then is distributed by this radiating piece 10.
Please refer to Fig. 1 to Fig. 3, also comprise column 40, this column 40 is arranged on the middle part of this radiating piece 10, and this column 40 is made up of Heat Conduction Material.This second wiring board 50 to be fixed on this column 40 and thermally coupled with this column 40.Also comprise the second wiring board 50, this second wiring board 50 bending after be fitted in this column 40 end face and sidewall on.The top of LED silk 30 is electrically connected with this second wiring board 50, and this second wiring board 50 and this first circuit board coordinate together with described LED silk 30 serial or parallel connection.Top and this column 40 of these LED silks 30 are thermally coupled, and bottom and this radiating piece 10 of these LED silks 30 are thermally coupled.Therefore, LED silk 30 top by this second wiring board 50 and this column 40 formed thermally coupled, be electrically connected.A part of heat that LED silk 30 is produced is delivered on radiating piece 10 with column 40 by the second wiring board 50, is more outwards distributed by this radiating piece 10.Wherein, as shown in Figure 3, this second wiring board 50 is made for flexible base board 32, and this second wiring board 50 is one-body molded after being bent by deployed configuration.Be convenient to the second wiring board 50 need to make different structure according to difference.Preferably be fitted in end face and the sidewall of column 40, increase the contact area with column 40, accelerate heat trnasfer.
The end face of this radiating piece 10 is planar structure, this first line plate 60 also comprises heat transfer part 62, this heat transfer part 62 is thermally coupled with the end face of this radiating piece 10, this connecting portion 61 this heat transfer part 62 relative is obliquely installed, and the bottom of LED silk 30 is sticked on this connecting portion 61 and the top surface inclination of described LED silk 30 this radiating piece 10 relative is arranged.This bulb housing 20 was preferably hemisphere cell-shell, and this LED silk 30 is for strip is vertical or be inclined in cell-shell, and the quantity of this LED silk 30 is preferably more than four.Therefore this LED silk 30 realizes 4 π luminescences, and illuminating effect is close with traditional filament.As shown in Figure 2, this first line plate 60 is bent into desired structure by deployed configuration, and this first line plate 60 is one-body molded, simplifies the manufacture craft of first line plate 60.This connecting portion 61 this heat transfer part 62 relative upwards bends relative its and is obliquely installed, and this heat transfer part 62 is in covering of the fan type.That is, heat transfer part 62 is arranged to fan-like pattern, with the radiating piece 10 of planar structure, there is larger thermocontact area, accelerate radiating rate.
Described LED silk 30 comprises substrate 32, multiple LED light source and two electrode tips 31, these LED light sources to be arranged on this substrate 32 and thermally coupled with this substrate 32, these two electrode tips 31 are made by Heat Conduction Material, described LED silk 30 is separately fixed on this column 40 and this radiating piece 10 by described electrode tip 31, and described LED silk 30 is thermally coupled with this column 40, this radiating piece 10 respectively by described electrode tip 31.The heat that this LED silk 30 produces transmits respectively to this first line plate 60, this second wiring board 50 via two electrode tips 31.Wherein, these LED light sources are more, closeer near the distribution of the position of this first line plate 60 on this substrate 32.Like this, the heat that these LED light sources send just can be delivered to shorter heat dissipation path on this first line plate 60 and this radiator 10, thus improves radiating efficiency.Certainly, also more can distribute near the position of this second wiring board 50 LED light source on this substrate 32.
This substrate 32 is made up of transparent or semitransparent glass, pottery or sapphire.Wherein, preferably this LED light source arranges the front of this substrate 32, is that this LED light source irradiates towards this bulb housing 20.These two electrode tips 31 are welded on this substrate 32 respectively, and described LED light source is electrically connected with these two electrode tips 31 respectively by gold thread.
In sum, the top surface inclination of this radiating piece 10 relative for LED silk 30 arranges by the present invention, and this LED silk 30 is strip, and it is luminous that this LED silk 30 realizes 4 π, and illuminating effect is close with traditional filament, has the advantage that light angle is large, effect is good.And the substrate 32 of LED silk 30 adopts transparent or semitransparent structure, the optical efficiency of the LED light source on this LED silk 30 is improved, and namely most light all can shine out towards this bulb housing 20, reduces light losing.Two electrode tips 31 of this LED silk 30 are thermally coupled with first line plate 60, second wiring board 50 respectively, a part of heat that this LED silk 30 produces is delivered to radiating piece 10 by first line plate 60, and also have partial heat to be delivered to radiating piece 10 by the second wiring board 50, column 40, finally outwards distributed by radiating piece 10.Avoid LED silk 30 to produce the accumulation of heat, make this LED silk 30 light fixture have good radiating effect.Without the need to arranging the structure of complicated heat-conducting gas and seal glass bubble, have structure simple, assemble convenient, good advantage of dispelling the heat.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, any those skilled in the art, not departing from this programme technical scope, utilize the technology contents of above-mentioned exposure to make the Equivalent embodiments for equal change of few modifications.In every case depart from technical solution of the present invention content, according to the technology of the present invention essence to any amendment made for any of the above embodiments, equivalent replacement, improvement etc., all should be included within the scope of protection of the invention.
Claims (11)
1. a LED silk lamp, comprise at least two LED silks, bulb housing and radiating piece, the bottom of this bulb housing is fixed on the end face of this radiating piece and accommodates described LED silk, it is characterized in that, also comprise first line plate, this first line plate is made up of Heat Conduction Material, this first line plate to be fixed on this radiating piece and thermally coupled with this radiating piece, on this first line plate, corresponding every root LED silk is respectively equipped with a connecting portion, the bottom of described LED silk to be fixed on this connecting portion and thermally coupled with this connecting portion, described LED silk is electrically connected with this first line plate respectively.
2. LED silk lamp according to claim 1, it is characterized in that: the end face of this radiating piece is planar structure, this first line plate also comprises heat transfer part, the end face of this heat transfer part and this radiating piece is thermally coupled, this connecting portion relatively this heat transfer part is obliquely installed, and the bottom of described LED silk is sticked on this connecting portion and the top surface inclination of described LED silk this radiating piece is relatively arranged.
3. LED silk lamp according to claim 1, is characterized in that: also comprise the second wiring board, and the top of described LED silk is electrically connected with this second wiring board, and this second wiring board and this first circuit board coordinate together with described LED silk serial or parallel connection.
4. LED silk lamp according to claim 3, it is characterized in that: also comprise column, this column is arranged on the middle part of this radiating piece, and this second wiring board to be fixed on this column and thermally coupled with this column.
5. LED silk lamp according to claim 3, is characterized in that: this second wiring board is that flexible base board is made, this second wiring board bending after be fitted in this column end face and sidewall on.
6. LED silk lamp according to claim 3, it is characterized in that: described LED silk comprises substrate, LED light source and electrode tip, described LED light source arranges on the substrate and is connected with this substrate heat, these two electrode tips are made by Heat Conduction Material, and described LED silk to be fixed on this first line plate by described electrode tip and thermally coupled with this first line plate.
7. LED silk lamp according to claim 4, is characterized in that: this column is made up of Heat Conduction Material, and top and this column of described LED silk are thermally coupled, and bottom and this radiating piece of described LED silk are thermally coupled.
8. LED silk lamp according to claim 2, is characterized in that: this first line plate is one-body molded, and this connecting portion this heat transfer part relative upwards bends relative its and is obliquely installed, and this heat transfer part is covering of the fan type.
9. LED silk lamp according to claim 6, is characterized in that: the LED light source that described LED silk comprises substrate and arranges on the substrate, and this substrate is made up of transparent or semitransparent glass, pottery or sapphire.
10. LED silk lamp according to claim 6, is characterized in that: each LED silk comprises two electrode tips, these two electrode tips weld on the substrate respectively, these two electrode tips respectively with this first line plate and the second wiring board thermally coupled.
11. LED silk lamps according to claim 1, is characterized in that: multiple LED light sources that described LED silk comprises substrate and arranges on the substrate, and described LED light source is more, closeer near the distribution of the position of this first line plate on the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610057542.1A CN105485534A (en) | 2016-01-28 | 2016-01-28 | LED filament lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610057542.1A CN105485534A (en) | 2016-01-28 | 2016-01-28 | LED filament lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105485534A true CN105485534A (en) | 2016-04-13 |
Family
ID=55672701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610057542.1A Pending CN105485534A (en) | 2016-01-28 | 2016-01-28 | LED filament lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105485534A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106523946A (en) * | 2016-11-16 | 2017-03-22 | 漳州立达信光电子科技有限公司 | LED filament lamp |
| CN107461617A (en) * | 2017-08-03 | 2017-12-12 | 漳州立达信光电子科技有限公司 | Led filament |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103353071A (en) * | 2013-07-05 | 2013-10-16 | 立达信绿色照明股份有限公司 | LED lamp emitting light in large angle |
| CN103471063A (en) * | 2013-09-23 | 2013-12-25 | 立达信绿色照明股份有限公司 | High heat-dissipating bulb |
| CN204083941U (en) * | 2014-09-30 | 2015-01-07 | 周夷 | LED silk bulb |
| EP2824379A1 (en) * | 2013-07-12 | 2015-01-14 | vosla GmbH | Lamp |
| CN104359023A (en) * | 2014-10-30 | 2015-02-18 | 四川联恺环保科技有限公司 | LED bulb |
| CN104373842A (en) * | 2014-11-04 | 2015-02-25 | 蔡干强 | LED plastic structure bulb |
| CN104832819A (en) * | 2015-05-25 | 2015-08-12 | 立达信绿色照明股份有限公司 | Led lamp |
| CN104864297A (en) * | 2015-06-02 | 2015-08-26 | 贵州亿众生物柴油开发有限公司 | Led lamp bulb |
| CN204592952U (en) * | 2015-04-23 | 2015-08-26 | 浙江锐迪生光电有限公司 | A kind of LED silk lamp with radiating piece LED silk |
| CN204647931U (en) * | 2015-05-26 | 2015-09-16 | 中山市鼎立德光电科技有限公司 | A kind of LED disjunctor filament lamp |
| CN205640259U (en) * | 2016-01-28 | 2016-10-12 | 漳州立达信光电子科技有限公司 | LED (Light emitting diode) filament lamp |
-
2016
- 2016-01-28 CN CN201610057542.1A patent/CN105485534A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103353071A (en) * | 2013-07-05 | 2013-10-16 | 立达信绿色照明股份有限公司 | LED lamp emitting light in large angle |
| EP2824379A1 (en) * | 2013-07-12 | 2015-01-14 | vosla GmbH | Lamp |
| CN103471063A (en) * | 2013-09-23 | 2013-12-25 | 立达信绿色照明股份有限公司 | High heat-dissipating bulb |
| CN204083941U (en) * | 2014-09-30 | 2015-01-07 | 周夷 | LED silk bulb |
| CN104359023A (en) * | 2014-10-30 | 2015-02-18 | 四川联恺环保科技有限公司 | LED bulb |
| CN104373842A (en) * | 2014-11-04 | 2015-02-25 | 蔡干强 | LED plastic structure bulb |
| CN204592952U (en) * | 2015-04-23 | 2015-08-26 | 浙江锐迪生光电有限公司 | A kind of LED silk lamp with radiating piece LED silk |
| CN104832819A (en) * | 2015-05-25 | 2015-08-12 | 立达信绿色照明股份有限公司 | Led lamp |
| CN204647931U (en) * | 2015-05-26 | 2015-09-16 | 中山市鼎立德光电科技有限公司 | A kind of LED disjunctor filament lamp |
| CN104864297A (en) * | 2015-06-02 | 2015-08-26 | 贵州亿众生物柴油开发有限公司 | Led lamp bulb |
| CN205640259U (en) * | 2016-01-28 | 2016-10-12 | 漳州立达信光电子科技有限公司 | LED (Light emitting diode) filament lamp |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106523946A (en) * | 2016-11-16 | 2017-03-22 | 漳州立达信光电子科技有限公司 | LED filament lamp |
| CN107461617A (en) * | 2017-08-03 | 2017-12-12 | 漳州立达信光电子科技有限公司 | Led filament |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160413 |