CN105474425A - 有机发光器件及其制备方法 - Google Patents
有机发光器件及其制备方法 Download PDFInfo
- Publication number
- CN105474425A CN105474425A CN201480045520.2A CN201480045520A CN105474425A CN 105474425 A CN105474425 A CN 105474425A CN 201480045520 A CN201480045520 A CN 201480045520A CN 105474425 A CN105474425 A CN 105474425A
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- Prior art keywords
- organic luminescent
- luminescent device
- substrate
- organic
- electrode
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
- H10K59/877—Arrangements for extracting light from the devices comprising scattering means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8423—Metallic sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
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Abstract
本发明涉及一种有机发光器件及其制备方法。更具体而言,本发明的有机发光器件包含:基板;有机发光部分,其中第一电极、有机材料层、和第二电极依次层压在所述基板上;以及封装部分,其封装所述有机发光部分的外侧,其中保护单元设置于基板上的未设有所述有机发光单元及封装单元区域中的至少部分区域上,以及所述基板侧表面区域的至少部分区域上。
Description
技术领域
本申请要求并享有2013年9月30日在韩国知识产权局提交的韩国专利申请第10-2013-0116192号的优先权,其全文内容以引用的方式纳入本说明书。
本发明涉及一种有机发光器件及其制备方法。
背景技术
有机发光器件是这样一种发光器件,其中空穴和电子通过电极被注入到形成于电极之间的发光层,以使注入的空穴和电子形成的激子在消失时发光。
由于有机发光器件具有自发光的特性,与相关技术领域的液晶显示器相比,有机发光器件具有厚度小、能耗低、视角极佳、且响应速度高的长处。
此外,相比于等离子显示面板和无机EL平板显示器,有机发光器件具有能耗低且色感极佳的长处,这是因为有机发光器件可在10V或以下的低电压下驱动。此外,有机发光器件可以使用具有弯曲特性的塑料基板制作。
此外,有机发光器件可分为被动型有机发光器件和主动型有机发光器件。被动型发光器件采用了产生自发光层的光发射到基板表面的底部发光型。相反,在主动型发光器件采用底部发光型时,有机发光器件被薄膜电晶体(TFT)覆盖,以使孔径比(apertureratio)降低。因此,为了增加孔径比,需要一种将光发射到基板的相反侧的顶部发光型。
在相关技术领域中,具有如此优势的有机发光器件的封装方法和封装结构一般采用,将包含第一电极、第二电极和发光层的发光体的置于基板上,并通常使用热固化或光固化粘合构件来封装用于封装基板的封装帽。
发明内容
技术问题
在本技术领域中,对于具有优异的封装特性的有机发光器件的研究是必要的。
技术方案
本发明提供一种有机发光器件,其包含:
基板;有机发光单元,其中第一电极、有机材料层、和第二电极依次层压在所述基板上;封装单元,其布置为封装所述有机发光单元的外侧,
其中在基板上的未设置所述有机发光单元和封装单元的区域的至少部分区域上,以及所述基板侧表面区域中的至少部分区域上设有保护单元。
此外,本发明提供一种包含所述有机发光器件的照明器件。
另外,本发明提供一种包含所述有机发光器件的显示器件
有益效果
根据本发明的示例性实施方案,所述有机发光器件包含保护单元,其位于薄玻璃基板上的未设置有机发光单元和封装单元的区域,以及基板侧表面的区域中,因此保护所述薄玻璃基板免于暴露在外面,并以此提高有机发光器件产品的强度。
附图说明
图1为相关技术领域中的有机发光器件的示意图。
图2为根据本发明一个示例性实施方案的有机发光器件的示意图。
具体实施方式
下文中,将对本发明进行详细描述。
在OLED技术中,封装过程是决定OLED的寿命和可靠性的核心技术,并且OLED材料非常易受水分和氧的影响,因此当渗入水分或氧时会导致多种问题,如水分或氧诱发有机材料层和电极的变形和寿命变短。因此,在OLED中,阻隔外部空气渗入的封装步骤是绝对必要的。
将相关技术领域的有机发光器件概略性示意于下文的图1中。在相关技术领域的有机发光器件中,玻璃基板上设置包含第一电极、有机材料层,和第二电极的有机发光单元,并包含用于密封所述有机发光单元外侧的封装单元。为了使外部电源与所述有机发光器件的第一电极和第二电极电连接,需进行模块处理,且通常柔性印刷电路板(FPCB)设置于未设有所述有机发光单元和封装单元的玻璃基板上。此外,所述玻璃基板下设置外耦合膜(OCF)。所述OCF为扩散膜的一种,其可通过减弱光的全反射条件使器件内部产生的光有效地向外发射,可起到增强光效率的功能。本领域中已知的材料可用于所述OCF。
所述FPCB通过反射功容限被设计成小于焊盘的宽度,且OCF通过反射功容限被设计成小于玻璃基板的面积。
在相关领域中,当将薄玻璃基板用作有机发光器件的玻璃基板时,所述薄玻璃基板暴露在外面,并因此在处理有机发光器件产品时可能产生薄玻璃基板破裂的现象。
因此,在本发明中,已经对在薄玻璃基板用作有机发光器件的基板时保护薄玻璃基板的方法进行了研究,进而完成了本发明。
根据本发明的一个示例性实施方案,有机发光器件包含:基板;有机发光单元,其中第一电极、有机材料层、和第二电极依次层压在所述基板上;封装单元,其封装有机发光单元的外侧,其中基板上的未设置有机发光单元和封装单元的区域地至少部分区域上,以及所述基板侧表面区域中至少部分区域上设有保护单元。
在本发明中,所述基板可为薄玻璃基板。所述薄玻璃基板的厚度可为0.1mm以下,也可为50至100μm,但不限于此。
在本发明中,所述保护单元可设置于基板上的未设置有机发光单元和封装单元的整个区域和基板的外表面区域的整个区域上,
此外,所述保护单元还可另外设置于封装单元的上部区域和侧面区域的整个区域上。
即,所述保护单元可设置于有机发光器件的基板和封装单元的所有外侧上。
在本发明中,具有比基板更大面积的OCF还可设置于所述基板之下。在这种情况下,有机发光器件具有这样的结构:其中具有比OCF更小面积的基板设置于OCF上,且所述保护单元还可设置于OCF的未设置基板的区域上。
在本发明中,所述保护单元不仅物理保护暴露在外面的薄玻璃基板,而且可用作防止外部水分、空气等渗入薄玻璃基板的阻挡层。
在本发明中,所述保护单元可包含塑料膜。所述塑料膜可选自聚酰亚胺、聚对苯二甲酸乙二醇酯(PET)、聚酯、聚碳酸酯(PC)、聚萘二甲酸乙二酯(PEN)、聚醚醚酮(PEEK)、聚芳酯(PAR)、聚环烯烃(PCO)、聚降冰片烯、聚醚砜(PES)和环烯烃聚合物(COP),但不限于此。
在本发明中,所述保护单元可包含绝缘层和金属图案层。此外,所述保护单元可包含双层绝缘层,和设置于双层绝缘层之间的金属图案层。
绝缘层可包含聚酰亚胺,但不限于此。绝缘层的厚度可为1至50μm,以及5至20μm,但不限于此。
所述金属图案层可用作防止外部水分、空气等渗入有机发光单元内部的阻挡层。
在本发明中,所述第一电极或第二电极可通过金属图案层与外部电源进行电连接。更具体而言,所述金属图案层可包含用于电连接所述第一电极和外部电源的第一金属图案,和用于电连接所述第二电极和外部电源的第二金属图案。此外,在本发明中,所述金属层可包含第一金属图案和第二金属图案。
所述金属图案层可通过将预制的金属图案层压在绝缘层上而形成,或通过将金属层沉积在绝缘层上并图案化金属层而形成。
所述金属图案层的厚度可为1nm至50μm,也可为5至20μm,但不限于此。
所述金属图案层可包含一种或多种选自以下的金属:铜、铝、铁、镁、钙、钠、钾、钛、铟、钇、锂、钆、铂、金、钨、钽、银、锡和铅等,但不限于此。
在本发明中,所述保护单元可包含用于将第一电极或第二电极与外部电源进行电连接的接触孔。所述接触孔可使用本领域已知的方法形成。此外,为了将第一电极或第二电极与外部电源进行电连接,所述接触孔中可包含导电胶。所述导电胶可包含一种或多种选自以下的金属:Ag、Au、Cu、Ni、Al、W、Co、Pd及其合金,但不限于此。
在本发明中,所述保护单元可另外包含用于将第一电极或第二电极与外部电源进行电连接的各向异性导电膜。包含由小导电颗粒形成的导电球的热固性树脂膜可用作各向异性导电膜。
在本发明中,所述封装单元可包含密封层和设置于密封层上的金属层,其中所述密封层与有机发光单元的外侧接触。
密封层可以使用面密封膜。所述面密封膜可为包含吸气剂的胶膜。吸气剂是吸收残余气体或与残余气体形成化合物的物质,且对于吸气剂的种类没有限制,只要吸气剂能吸收胶膜所含的和存在的水分或氧气,或者通过与残余水分或氧气反应而形成化合物,但吸气剂可为例如活性炭、钡、镁、锆、和红磷中的至少一种。
此外,所述金属层可包含一种或多种选自以下的金属:铜、铝、铁、镁、钙、钠、钾、钛、铟、钇、锂、钆、铂、金、钨、钽、银、锡和铅,但不限于此。
将本发明的一个示例性实施例的实施方案的有机发光器件概略示意于图2中。
在本发明中,所述有机发光单元可包含负极、一层或多层的有机材料层,和正极。
负极可使用一种或多种选自以下的金属形成:镁、钙、钠、钾、钛、铟、钇、锂、钆、铝、铂、金、钨、钽、铜、银、锡和铅。
此外,负极也可使用透明的导电氧化物形成。此处,透明的导电氧化物可为至少一种选自以下元素的氧化物:铟(In)、锡(Sn)、锌(Zn)、镓(Ga)、铈(Ce)、镉(Cd)、镁(Mg)、铍(Be)、银(Ag)、钼(Mo)、钒(V)、铜(Cu)、铱(Ir)、铑(Rh)、钌(Ru)、钨(W)、钴(Co)、镍(Ni)、锰(Mn)、铝(Al)、和镧(La)。
所述负极可以利用选自以下的任一种物理气相沉积(PVD)法形成:溅镀法、电子束蒸镀法、热蒸镀法、激光分子束外延(L-MBE)法、和脉冲激光沉积(PLD)法;选自以下的任一种化学气相沉积法形成:热化学气相沉积法、等离子体增强的化学气相沉积(PECVD)法、光化学气相沉积法、激光化学气相沉积法、金属-有机化学气相沉积(MOCVD)法、和氢化物气相外延(HVPE)法;或通过原子层沉积(ALD)法形成。
为改进所述负极的电阻,还可以包含辅助电极。辅助电极可以使用选自导电密封剂和金属的一种或多种通过沉积过程或印刷过程而形成。更具体而言,辅助电极可以包含Cr、Mo、Al、Cu、及其合金的至少一种,但不限于此。
所述辅助电极上还可另外包含绝缘层。所述绝缘层可利用本领域已知的材料和方法形成。更具体而言,绝缘层可利用以下物质形成:常规的光阻材料、聚酰亚胺、聚丙烯、氮化硅、氧化硅、氧化铝、氮化铝、碱金属氧化物、碱土金属氧化物等,但不限于此。绝缘层的厚度可为10nm至10μm,但不限于此。
对所述有机材料层的详细材料和形成方法没有特别地限制,且可利用本领域广为人知的材料和形成方法。
所述有机材料层使用各种聚合物材料,可通过与沉积法不同的溶剂法制备具有较少的层,例如,所述溶剂法为旋涂法、浸涂法、刮涂法、丝网印刷法、喷墨印刷法、或热转印法。
所述有机材料层可包括发光层,并可具有层压结构,所述层压结构含有一个或多个选自以下的层:空穴注入层、空穴传输层、电子传输层、和电子注入层。
为了促进空穴向有机材料层的注入,通常优选有大的功函数的材料作为能形成空穴注入层的材料,所述空穴注入材料的具体实例为:金属,如钒、铬、铜、锌、和金或其合金;金属氧化物,如氧化锌、氧化铟、氧化铟锡(ITO)、或氧化铟锌(IZO);金属和氧化物的组合物,如ZnO:Al或SnO2:Sb;导电聚合物,如聚(3-甲基噻吩)、聚[3,4-(亚乙基-1,2-二氧基)噻吩](PEDT)、聚吡咯、或聚苯胺,但不限于此。
为了使电子容易地注入有机材料层中通常优选具有小的功函数的材料作为能形成电子注入层的材料。
所述电子注入材料的具体实例可包括金属,如镁、钙、钠、钾、钛、铟、钇、锂、钆、铝、银、锡、和铅或其合金;多层结构材料,如LiF/Al或LiO2/Al,并且可使用与空穴注入电极材料相同的材料,但电子注入材料的实例不限于此。
作为能形成所述发光层的材料,优选能够在可见光区域通过接收来自空穴传输层的空穴和来自电子传输层的电子并将空穴和电子结合来发光的材料,且该材料具有高的对荧光和磷的光量子效率。该材料的具体实例为8-羟基喹啉铝复合物(Alq3);咔唑类化合物;二聚苯乙烯化合物;BAlq;10-羟基苯并喹啉-金属化合物;苯并噁唑类、苯并噻唑类、和苯并咪唑类化合物;聚(对苯乙炔)(PPV)-类聚合物;螺环化合物;聚芴和红荧烯;磷光主体CBP[[4,4'-双(9-咔唑基)联苯]等,但不限于此。
此外,为改进荧光和磷光性能,所述发光材料还可含有磷光掺杂剂或荧光掺杂剂。磷光掺杂剂的具体实例包括ir(ppy)(3)(fac三(2-苯基吡啶)铱)、和F2Irpic[双(4,6-二-氟苯基-吡啶-N,C2)吡啶甲酸铱(III)]等。荧光掺杂剂可使用本领域已知的材料。
适合作为能形成所述电子传输层的材料为能顺利地接收来自电子注入层的电子并将该电子传输至发光层,且具有大的电子迁移率的材料。具体实例包括:8-羟基喹啉的Al复合物;包含Alq3的复合物;有机自由基化合物;羟基黄酮-金属复合物等,但不限于此。
正极可包含一种或多种选自以下的金属:Al、Ag、Ca、Mg、Au、Mo、Ir、Cr、Ti、Pd及其合金,但不限于此。
根据本发明的有机发光器件可更优选地应用于照明用的有机发光器件。此外,根据本发明的有机发光器件可更优选地应用于柔性有机发光器件。
根据本发明的有机发光器件可包含光提取结构(lightextractingstructure)。更具体而言,所述基板和有机发光器件之间还可包含光提取层。
对于光提取层没有特别地限制,只要所述光提取层具有引发光散射而改进有机发光器件的光提取效率的结构。更具体而言,所述光提取层可具有其中散射颗粒分散于粘合剂中的结构。
此外,所述光提取层可通过以下方法例如旋涂法、棒涂法、狭缝涂布法直接在基材上形成,或可通过以附着在基材上的膜的形式制备光提取层的方法形成。
此外,所述光提取层上还可包含平整化层(flatteninglayer)。
此外,本发明提供一种包含有所述机发光器件的显示器件。显示器件中,所述有机发光器件可作为像素或背光。此外可应用本领域已知的结构作为显示器件的其他结构。
此外,本发明提供一种包含所述有机发光器件的照明器件。在该照明器件中,所述有机发光器件用作发光单元。此外可应用本领域已知的结构作为照明器件所需的其他结构。
如上所述,根据本发明的示例性实施方案的有机发光器件包含保护单元,其位于薄玻璃基板上的未设置有机发光单元和封装单元的区域以及基板的侧表面区域中,因此保护所述薄玻璃基板免于暴露在外面,并以此提高有机发光器件产品的强度。
Claims (19)
1.一种有机发光器件,其包含:
基板;
有机发光单元,其中第一电极、有机材料层、和第二电极依次层压在所述基板上;以及
封装单元,其布置为封装所述有机发光单元的外侧,
其中在基板上的未设置所述有机发光单元和封装单元的区域的至少部分区域上,以及所述基板侧表面区域的至少部分区域上设有保护单元。
2.权利要求1所述的有机发光器件,其中所述基板为薄玻璃基板。
3.权利要求2所述的有机发光器件,其中所述薄玻璃基板的厚度为0.1mm以下。
4.权利要求1所述的有机发光器件,其中所述保护单元设置于基板上的未设置有机发光单元和封装单元的区域上,和基板侧表面区域的整个区域上。
5.权利要求4所述的有机发光器件,其中所述保护单元另外设置于封装单元的上部区域和侧表面区域的整个区域上。
6.权利要求1所述的有机发光器件,其中具有比基板更大面积的外耦合膜(OCF)另外设置于基板下。
7.权利要求6所述的有机发光器件,其中具有比OCF更小面积的基板设置于OCF上,且
所述保护单元另外设置于未设置基板的OCF的区域上。
8.权利要求1所述的有机发光器件,其中所述保护单元包含塑料膜。
9.权利要求1所述的有机发光器件,其中所述保护单元包含绝缘层和金属图案层。
10.权利要求9所述的有机发光器件,其中所述保护单元包含两层绝缘层和设置于两层绝缘层之间的金属图案层。
11.权利要求9所述的有机发光器件,其中所述第一电极或第二电极通过金属图案层与外部电源进行电连接。
12.权利要求9所述的有机发光器件,其中所述金属图案层包含将第一电极和外部电源进行电连接的第一金属图案。
13.权利要求9所述的有机发光器件,其中所述金属图案层包含将第二电极和外部电源进行电连接的第二金属图案。
14.权利要求1所述的有机发光器件,其中所述封装单元包含与所述有机发光单元外侧接触的密封层,和设置于密封层上的金属层。
15.权利要求1所述的有机发光器件,其中所述有机发光器件为柔性有机发光器件。
16.权利要求1所述的有机发光器件,其还包含:
位于基板和第一电极之间的光提取层。
17.权利要求16所述的有机发光器件,其还包含:
位于光提取层上的平整化层。
18.一种照明器件,其包含权利要求1至17中任一项所述的有机发光器件。
19.一种显示器件,其包含权利要求1至17中任一项所述的有机发光器件。
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TW201523958A (zh) | 2015-06-16 |
KR20160013235A (ko) | 2016-02-03 |
EP3018724B1 (en) | 2023-03-01 |
EP3018724A4 (en) | 2017-05-10 |
TWI562428B (en) | 2016-12-11 |
CN105474425B (zh) | 2018-02-09 |
KR20150037713A (ko) | 2015-04-08 |
US9728739B2 (en) | 2017-08-08 |
KR101866296B1 (ko) | 2018-06-11 |
JP2016525779A (ja) | 2016-08-25 |
US20160181571A1 (en) | 2016-06-23 |
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