CN104342058A - Photocuring anisotropic conductive film and preparation method thereof - Google Patents
Photocuring anisotropic conductive film and preparation method thereof Download PDFInfo
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- CN104342058A CN104342058A CN201410583873.XA CN201410583873A CN104342058A CN 104342058 A CN104342058 A CN 104342058A CN 201410583873 A CN201410583873 A CN 201410583873A CN 104342058 A CN104342058 A CN 104342058A
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Abstract
The invention discloses a photocuring anisotropic conductive film, comprising a plastic film base material and an anisotropic conductive rubber layer, wherein the anisotropic conductive rubber layer is formed by coating photocuring anisotropic conductive rubber on the plastic film base material and drying by hot air. The photocuring anisotropic conductive rubber comprises the following components in percentage by mass: 5%-11% of a single functional photocuring active monomer, 6%-12% of a multifunctional photocuring active monomer, 10%-15% of photocuring resin, 5%-8% of a photoinitiator, 30%-49% of film-forming resin, 10%-20% of an elastomer, 8%-16% of insulating nanoparticles, 3%-12% of conductive particles, 1.0%-3.0% of a flatting agent, 2%-5% of a coupling agent and 0.02%-0.05% of a polymerization inhibitor. The photocuring anisotropic conductive film prepared by the method is especially suitable for bonding between transparent conducive substrates (for example, an optical conductive film and conductive glass) and flexible circuit boards.
Description
Technical field
The present invention relates to UV and solidify anisotropic conductive (ACA), anisotropic conductive film (Anisotropic Conductive Film, ACF) and preparation method thereof, belong to microelectronics Packaging field.
Background technology
Usually, the function that anisotropic conductive rubber film (Anisotropic Conductive Film:ACF) has unilateral conduction concurrently and is adhesively fixed, at present for COG (chip on glass, chip glass), TCP (Tape Carrier Package, carrier package)/COF (Chip On Film, cover brilliant film), the microcircuit such as FPC (Flexible printed circuit, flexible PCB) uses hot pressing bonding machines when connecting.But, recent electronic product is (as mobile phone, panel computer, Wearable electronic product ...) constantly to miniaturization, thin type and scratch shape future development, more and more uses LCD liquid crystal display screen and touch screen that blooming or ultra-thin glass are microcircuit substrate.
Due to blooming and ultra-thin glass and anisotropic conductive film hot press under too high temperature and pressure, the problem that the pyrolytic damage of circuit and thermal expansion and thermal-shrinkage differential etc. cause can be caused.Such as, the ACF module of hot setting is in hot and humid reliability testing, and switching performance is the problem reduced As time goes on.Easily broken under nation's constant-pressure that ultra-thin glass is larger.Therefore lower ACF solidification value (less than e.g.130 DEG C) and less solidifying pressure become the fixed developing direction of ACF nation.
The applied research that UV-light is reacted in polymer cure shows, carries out ACF solidification nation and determines, can reduce the temperature of polymer cure reaction according to UV-light.And the Chinese patent CN101601171A of Sony Chemical provides double-deck ACF, wherein form by containing light and heat-curing resin containing electroconductive particle layer, its photocuring is for ACF film process, instead of electronic component and microcircuit substrate nation determine cohesive process.Chinese patent CN1926675A provides a kind of photocuring that adopts and carries out the fixed formula of ACF nation and technique, utilizes 200mJ/cm
2(320-390nm) photocuring location, 170 DEG C/80MPa/10sec hot binding, so high this pressure temperature is not suitable for the low temperature requirements that blooming or ultra-thin glass are microcircuit substrate, the Japanese Patent JP H10-338860A of BRIDGESTONE proposes a kind of ACF by thermofixation or photocuring, and its formula formed primarily of Polyvinyl acetal resin.Japanese Patent JP H10-338844A proposes the another kind of ACF by thermofixation or photocuring, and its formula formed primarily of (methyl) acrylic resin.US Patent No. 20050136246A1 and Chinese patent CN1639294 propose the another kind of ACF by thermofixation and photocuring, its formula formed primarily of acetal resin/modified polyacetal resin/melamine resin, and this ACF can in 130 DEG C/3MPa/20sec thermofixation or 30sec photocuring.Chinese patent CN101724361 proposes the mode promoting photocuring with thermofixation, and must carry out photocuring, if only carry out single light or thermofixation, curing reaction is incomplete, and curing degree is on the low side.The Chinese patent CN1367219A of Tsing-Hua University mentions containing the acrylic acid photocuring ACF of epoxy resin, but does not indicate enforceable concrete composition and condition.Four patents such as Korean Patent KR20110078247, Korean Patent KR20110076050, Japanese Patent JP H6-11683, Chinese patent CN203760001U all propose nation's locking equipment of the UV solidification ACF of Specialty Design.
Summary of the invention
The technical problem to be solved in the present invention is: provide a kind of for FOF (FPC on film, flexible PCB nation fixes on film), FOG (FPC on Glass, flexible PCB nation fixes on glass) etc. the photocuring ACF and preparation method thereof of transparent circuit board, improve the clinging power of anisotropic conductive film for PET blooming, utilize photocuring to substitute existing thermofixation nation and determine technique, avoid the nation's timing under too high temperature and pressure of blooming and ultra-thin glass and anisotropic conductive film, the problem that the pyrolytic damage of circuit and thermal expansion and thermal-shrinkage differential etc. cause can be caused.
In order to solve the problems of the technologies described above, the present invention proposes following technical scheme: a kind of photocuring anisotropic conductive film, and it comprises a plastic film substrate, an anisotropic conductive adhesive layer;
This anisotropic conductive adhesive layer is coated on a kind of light-cured type anisotropic conductive on this plastic film substrate and is formed by warm air drying;
This light-cured type anisotropic conductive is made up of the following component according to mass percent:
Described simple function group photocuring reactive monomer is made up of the mixture of following a kind of material or many kinds of substance: hydroxyethyl methylacrylate, methacrylic ester hydroxypropyl acrylate, (methyl) isobornyl acrylate, ethoxyethoxyethyl acrylate, lauric acid (methyl) acrylate, 2-phenoxyethyl acrylate;
Described polyfunctional group photocuring reactive monomer is made up of the mixture of following a kind of material or many kinds of substance: 2-dimethyl propyl ester diacrylate, Tricyclodecane Dimethanol diacrylate, ethoxylated bisphenol A diacrylate, (ethoxyquin-) 2-methyl isophthalic acid, 3 propylene glycol diacrylates, two (three) propylene glycol diacrylates, three (2-hydroxyethyl) tricarbimide triacrylate, ethoxyquin (the third oxidation) Viscoat 295, glycerol propoxylate triacrylate, two-trimethylolpropane tetra-acrylate, (ethoxyquin) tetramethylol methane tetraacrylate, double pentaerythritol C5 methacrylate, double pentaerythritol methacrylate,
Described light-cured resin is made up of the mixture of following a kind of material or many kinds of substance: the polyacrylic resin of unsaturated polyester, epoxy acrylic resin, polyurethane acrylic resin, polyester acrylate resin, polyoxyalkylene acrylate resin, acrylate functional, the polyolefin resin containing unsaturated double-bond, various epoxy resin, epoxy-functional polyorganosiloxane resin, have the resin of vinyl ether functional base;
Described light trigger belongs to radical photoinitiator or cation light initiator, and described light trigger is made up of the mixture of following a kind of material or many kinds of substance: benzoin ether derivative, benzil derivatives, Dialkoxy acetophenones, alpha-hydroxyalkyl benzophenone, α-amine alkyl phenones, acylphosphine oxide, aryl peroxy esters compound, benzoyl formiate, benzophenone/tertiary amine, thioxanthone/tertiary amine, anthraquinone/tertiary amine;
Described film-forming resin is made up of the mixture of following a kind of material or many kinds of substance: saturated polyol polyester, phenoxy resin;
Described elastomerics is made up of the mixture of following a kind of material or many kinds of substance: epoxy terminated paracril, polyaspartic rubber, nbr carboxyl terminal, carboxylated nbr, hydroxy-terminated polybutadienes, thiorubber, acrylic rubber.
The further restriction of technique scheme is: described nanometer insulating particle is made up of the mixture of following a kind of material or many kinds of substance: nano-ceramic powder, Nano-meter SiO_2
2, nano-TiO
2, nano-calcium carbonate.
The further restriction of technique scheme is: described electrically conductive particles is made up of the mixture of following a kind of material or many kinds of substance: the metal conductive particles of copper, nickel, gold and silver, tin, zinc, palladium, iron, tungsten, molybdenum; The composite conducting particles of copper, nickel, gold and silver, tin, zinc, palladium is coated with at polymer microsphere surface.
The further restriction of technique scheme is: described flow agent is made up of the mixture of following a kind of material or two kinds of materials: polydimethylsiloxane, polyester modified siloxane, polyether modified siloxane, aralkyl modified siloxanes, acrylate flow agent.
The further restriction of technique scheme is: above-mentioned coupling agent is made up of the mixture of following a kind of material or many kinds of substance: β-(3.4-epoxy cyclohexyl) ethyl trimethoxy silane, γ-glycidoxypropyl trimethoxy silane, γ-(methacryloxypropyl) propyl trimethoxy silicane.
The further restriction of technique scheme is: above-mentioned stopper is made up of the mixture of following a kind of material or many kinds of substance: Resorcinol, para benzoquinone, toluhydroquinone, MEHQ, 2-Tert. Butyl Hydroquinone, p-ten.-butylcatechol, 2,5-di-tert-butyl hydroquinone, thiodiphenylamine, tertiarybutylhydroquinone, 1,4-naphthoquinone.
The further restriction of technique scheme is: this photocuring anisotropic conductive film needs use one photocuring binding device, and this photocuring nation determines device and comprises a control unit, a Light Curing Unit, a heat-pressure unit;
A storer, an input unit, an indicating meter, a power supply that this control unit comprises a principal controller and is connected with this principal controller;
This Light Curing Unit comprises a UV producer, a UV line source, a silica glass base, a transparent conductive substrate, an anisotropic conductive film, a flexible circuit board, a UV shield cap;
This UV producer is connected with this principal controller, UV line source respectively;
This silica glass floor installation is above this UV line source;
This transparent conductive substrate is placed on this silica glass base;
This transparent conductive substrate is provided with some conducting terminals;
This anisotropic conductive film is placed on this transparent conductive substrate;
This flexible circuit board is placed on this this anisotropic conductive film;
This flexible circuit board is provided with some flexible circuit board terminals;
By this anisotropic conductive film, this flexible circuit board and this transparent conductive substrate realize electrically conducting;
This UV shield cap covers on the outside of this UV line source, silica glass base, transparent conductive substrate, anisotropic conductive film, flexible circuit board;
This heat-pressure unit comprises a drive part, a hot press parts, a thermal head;
This drive part is connected with this principal controller, this hot press parts respectively;
This thermal head is arranged on the below of this hot press parts;
This thermal head is arranged on the top of this flexible circuit board.
The further restriction of technique scheme is: UV line source is the UV line source of wavelength 200-400nm; The light-emitting window of described UV line source is of a size of long 20-320mm, wide 2-10mm, is preferably long 50-100mm, wide 5mm; The physical dimension of described UV line source is long 100-320mm, wide 30-80mm, high 50-100mm, is preferably long 50-120mm, wide 30-50mm, high 50-60mm.
In order to solve the problems of the technologies described above, the present invention also proposes following technical scheme: a kind of preparation method of photocuring anisotropic conductive film, comprises the following steps:
Step one: take simple function group photocuring reactive monomer 5-11%, polyfunctional group photocuring reactive monomer 6-12%, light-cured resin 10-15%, light trigger 5-8%, film-forming resin 30-49%, elastomerics 10-20%, nanometer insulating particle 8-16%, electrically conductive particles 3-12%, flow agent 1-3%, coupling agent 2-5%, stopper 0.02-0.05% according to mass percent;
Step 2: by light-cured resin, film-forming resin, elastomerics, put into dispersing mixer heat fused by toluene and vinyl acetic monomer according to the solvent that 1:1 mass ratio forms, melt temperature is less than 150 DEG C, forms mixture;
Step 3: mixture step 2 obtained is cooled to less than 60 DEG C, then the simple function group photocuring reactive monomer of liquid state and polyfunctional group photocuring reactive monomer are added in said mixture;
Step 4: nanometer insulating particle is added in said mixture;
Step 5: electrically conductive particles is added in said mixture;
Step 6: light trigger, flow agent, coupling agent, stopper are added in said mixture, obtained above-mentioned light-cured type anisotropic conductive;
Step 7: above-mentioned light-cured type anisotropic conductive is coated on above-mentioned plastic film substrate with coating machine;
Step 8: by the work in-process of step 7 gained, by hot air dryer, drying and forming-film, namely the film of formation is above-mentioned anisotropic conductive adhesive layer, can obtain the photocuring anisotropic conductive film of the present invention without protective membrane.
The further restriction of technique scheme is: this preparation method also comprises step 9: covered by layer protecting film on this anisotropic conductive adhesive layer, can obtain the photocuring anisotropic conductive film of the present invention with protective membrane.The present invention has following beneficial effect:
1, the invention provides a kind of photocuring ACF for transparent circuit board such as FOF, FOG, this light-cured type ACF adopts polyester polyol as film-forming resin, to improve the clinging power of anisotropic conductive film for PET blooming,
2, utilize photocuring to substitute existing thermofixation nation and determine technique, avoid the nation's timing under too high temperature and pressure of blooming and ultra-thin glass and anisotropic conductive film, the problem that the pyrolytic damage of circuit and thermal expansion and thermal-shrinkage differential etc. cause can be caused.
3, on the basis of existing thermocompressor, increase UV line source and a pilot circuit, realize photocuring nation and determine technique.
4, the nation that the ACF that prepared by the present invention is specially adapted between transparent conductive substrate (as photoconductive film and conductive glass) and flexible circuit board is fixed.
Accompanying drawing explanation
Fig. 1 is that the photocuring nation of light-cured type anisotropic conductive film of the present invention determines process schematic representation.
Fig. 2 is profile and the light-emitting window scale diagrams that photocuring nation of the present invention determines the UV line source of device.
Fig. 3 is the technical process control schematic diagram that photocuring nation of the present invention determines device.
Embodiment
1, photocuring anisotropic conductive film:
The present invention proposes a kind of photocuring anisotropic conductive film, and it comprises a plastic film substrate, an anisotropic conductive adhesive layer and covers protective membrane on this anisotropic conductive adhesive layer.
Described plastic film substrate is PET (polyethylene terephthalate, polyethylene terephthalate) material.
This anisotropic conductive adhesive layer is coated on a kind of light-cured type anisotropic conductive on this plastic film substrate and is formed by warm air drying.
This light-cured type anisotropic conductive is made up of the following component according to mass percent:
Described simple function group photocuring reactive monomer is made up of the mixture of following a kind of material or many kinds of substance: hydroxyethyl methylacrylate, methacrylic ester hydroxypropyl acrylate, (methyl) isobornyl acrylate, ethoxyethoxyethyl acrylate, lauric acid (methyl) acrylate, 2-phenoxyethyl acrylate.
Described polyfunctional group photocuring reactive monomer is made up of the mixture of following a kind of material or many kinds of substance: 2-dimethyl propyl ester diacrylate, Tricyclodecane Dimethanol diacrylate, ethoxylated bisphenol A diacrylate, (ethoxyquin-) 2-methyl isophthalic acid, 3 propylene glycol diacrylates, two (three) propylene glycol diacrylates, three (2-hydroxyethyl) tricarbimide triacrylate, ethoxyquin (the third oxidation) Viscoat 295, glycerol propoxylate triacrylate, two-trimethylolpropane tetra-acrylate, (ethoxyquin) tetramethylol methane tetraacrylate, double pentaerythritol C5 methacrylate, double pentaerythritol methacrylate.
Described light-cured resin is made up of the mixture of following a kind of material or many kinds of substance: the polyacrylic resin of unsaturated polyester, epoxy acrylic resin, polyurethane acrylic resin, polyester acrylate resin, polyoxyalkylene acrylate resin, acrylate functional, the polyolefin resin containing unsaturated double-bond, various epoxy resin, epoxy-functional polyorganosiloxane resin, have the resin of vinyl ether functional base.
Described light trigger belongs to radical photoinitiator or cation light initiator, and described light trigger is made up of the mixture of following a kind of material or many kinds of substance: benzoin ether derivative, benzil derivatives, Dialkoxy acetophenones, alpha-hydroxyalkyl benzophenone, α-amine alkyl phenones, acylphosphine oxide, aryl peroxy esters compound, benzoyl formiate, benzophenone/tertiary amine, thioxanthone/tertiary amine, anthraquinone/tertiary amine.
Described film-forming resin is made up of the mixture of following a kind of material or many kinds of substance: saturated polyol polyester, phenoxy resin.
Described elastomerics is made up of the mixture of following a kind of material or many kinds of substance: epoxy terminated paracril, polyaspartic rubber, nbr carboxyl terminal, carboxylated nbr, hydroxy-terminated polybutadienes, thiorubber, acrylic rubber.
Described nanometer insulating particle is made up of the mixture of following a kind of material or many kinds of substance: nano-ceramic powder, Nano-meter SiO_2
2, nano-TiO
2, nano-calcium carbonate.
Described electrically conductive particles is made up of the mixture of following a kind of material or many kinds of substance: the metal conductive particles of copper, nickel, gold and silver, tin, zinc, palladium, iron, tungsten, molybdenum; The composite conducting particles of copper, nickel, gold and silver, tin, zinc, palladium is coated with at polymer microsphere surface.
Described flow agent is made up of the mixture of following a kind of material or two kinds of materials: polydimethylsiloxane, polyester modified siloxane, polyether modified siloxane, aralkyl modified siloxanes, acrylate flow agent.
Above-mentioned coupling agent is made up of the mixture of following a kind of material or many kinds of substance: β-(3.4-epoxy cyclohexyl) ethyl trimethoxy silane, γ-glycidoxypropyl trimethoxy silane, γ-(methacryloxypropyl) propyl trimethoxy silicane.
Above-mentioned stopper is made up of the mixture of following a kind of material or many kinds of substance: Resorcinol, para benzoquinone, toluhydroquinone, MEHQ, 2-Tert. Butyl Hydroquinone, p-ten.-butylcatechol, 2,5-di-tert-butyl hydroquinone, thiodiphenylamine, tertiarybutylhydroquinone, 1,4-naphthoquinone.
2, the preparation method of photocuring anisotropic conductive film:
The preparation method of above-mentioned photocuring anisotropic conductive film, comprises the steps:
Step one: take simple function group photocuring reactive monomer 5-11%, polyfunctional group photocuring reactive monomer 6-12%, light-cured resin 10-15%, light trigger 5-8%, film-forming resin 30-49%, elastomerics 10-20%, nanometer insulating particle 8-16%, electrically conductive particles 3-12%, flow agent 1-3%, coupling agent 2-5%, stopper 0.02-0.05% according to mass percent;
Step 2: by light-cured resin, film-forming resin, elastomerics, put into dispersing mixer heat fused by toluene and vinyl acetic monomer according to the solvent that 1:1 mass ratio forms, melt temperature is less than 150 DEG C, forms mixture;
Step 3: mixture step 2 obtained is cooled to less than 60 DEG C, then the simple function group photocuring reactive monomer of liquid state and polyfunctional group photocuring reactive monomer are added in said mixture;
Step 4: nanometer insulating particle is added in said mixture;
Step 5: electrically conductive particles is added in said mixture;
Step 6: light trigger, flow agent, coupling agent, stopper are added in said mixture, obtained above-mentioned light-cured type anisotropic conductive;
Step 7: above-mentioned light-cured type anisotropic conductive is coated on above-mentioned plastic film substrate with coating machine;
Step 8: by the work in-process of step 7 gained, by hot air dryer, drying and forming-film, namely the film of formation is above-mentioned anisotropic conductive adhesive layer, can obtain the photocuring anisotropic conductive film of the present invention without protective membrane.
Following step 9 is optionally; if prepare the photocuring anisotropic conductive film with protective membrane; then after step 8, proceed step 9: covered by layer protecting film on this anisotropic conductive adhesive layer, the photocuring anisotropic conductive film containing protective membrane can be obtained.
The nation that the light-cured type ACF prepared by table-1 and table-2 visible the present invention is more suitable under the cold condition between transparent conductive substrate (as photoconductive film and conductive glass) and flexible circuit board than existing thermohardening type ACF is fixed, and has better bonding strength.
The recipe ratio of the thermofixation ACF comparative example 1-2 of table-1 photocuring ACF embodiment 1-4 of the present invention and prior art comparatively
(note: in table, the proportioning of each component is mass ratio)
The Performance comparision of table-2 photocuring ACF embodiment 1-4 and thermofixation ACF comparative example 1-2
3, the photocuring nation of anisotropic conductive film determines device:
Above-mentioned photocuring anisotropic conductive film, need to use a kind of photocuring nation as shown in Figure 1 to Figure 3 to determine device, this photocuring nation determines device and comprises control unit 30, Light Curing Unit 29, heat-pressure unit 21.
Storer 24, one input unit 25, indicating meter 26, power supply 27 that this control unit 30 comprises a principal controller 23 and is connected with this principal controller 23.
This Light Curing Unit 29 comprises UV producer 28, UV line source 10, silica glass base 11, transparent conductive substrate 12, anisotropic conductive film 18, flexible circuit board 16, UV shield cap 22.
This UV producer 28 is connected with this principal controller 23, UV line source 10 respectively.
This silica glass base 11 is arranged on above this UV line source 10.
This transparent conductive substrate 12 is placed on this silica glass base 11.
This transparent conductive substrate 12 is provided with some conducting terminals 13.
This anisotropic conductive film 18 is placed on this transparent conductive substrate 12.Containing conducting particles 14 in this anisotropic conductive film 18.
This flexible circuit board 16 is placed on this this anisotropic conductive film 18.
This flexible circuit board 16 is provided with some flexible circuit board terminals 15.
By this anisotropic conductive film 18, this flexible circuit board 16 and this transparent conductive substrate 12 realize electrically conducting.
This UV shield cap 22 covers on the outside of this UV line source 10, silica glass base 11, transparent conductive substrate 12, anisotropic conductive film 18, flexible circuit board 16.
This heat-pressure unit 21 comprises drive part 20, hot press parts 19, thermal head 17.
This drive part 20 is connected with this principal controller 23, this hot press parts 19 respectively.
This thermal head 17 is arranged on the below of this hot press parts 19.
This thermal head 17 is arranged on the top of this flexible circuit board 16.
This anisotropic conductive film 18 is placed between silica glass base 11 and thermal head 17.This silica glass base 11 and thermal head 17 are exerted pressure to this anisotropic conductive film 18 and heat.Wherein, silica glass base 11 allows UV light permeability.The UV light permeability silica glass base 11 that UV line source 10 sends, carries out the solidification of UV rayed to this anisotropic conductive film 18.
Above-mentioned UV line source is the UV line source of wavelength 200-400nm.
The light-emitting window of UV line source is of a size of long 20-320mm, wide 2-10mm, is preferably long 50-100mm, wide 5mm.
The physical dimension of the light-emitting window size of UV line source is long 100-320mm, wide 30-80mm, high 50-100mm, is preferably as long 50-120mm, wide 30-50mm, high 50-60mm.
Above-mentioned photocuring nation determines device, as long as increase UV line source and a pilot circuit thereof on the basis of existing thermocompressor.Existing thermofixation bonding machines, because nation's timing needs to make CCD or infrared light contraposition, base is formed by silica glass, as long as therefore install the UV line source of a small volume in the below of silica glass base, just can realize photocuring nation and determine technique.
Above-mentioned UV line source pilot circuit increases a UV line source pilot circuit on the basis of existing Control of Hot Press Control circuit, and UV line source pilot circuit is incorporated to former Control of Hot Press Control circuit, jointly realizes the control that nation determines technique.
Wherein Light Curing Unit 29 to have the UV line source 10 of Fig. 2 profile, is arranged in the below accommodation space of the silica glass base 11 of original thermocompressor;
Below the operator's console that UV producer 28 is installed in original thermocompressor rack accommodation space in;
Optical Fiber Transmission is used between described UV line source and UV producer.
This photocuring nation determines device by hot-press solidifying and photocuring isolated operation, also can run simultaneously, makes former thermocompressor have photo-thermal dual curable nation and determines function.
This photocuring nation determines device and also utilizes the control unit of former thermocompressor to control after thermal head unit starts pressing, activates UV solidified cell, the yield of radiation of controls UV solidified cell generation simultaneously and irradiation time through the required time.
This photocuring nation determines device and utilizes the pressure head of the storer memory response presser unit in former Control of Hot Press Control unit by the precompressed required time of anisotropic conductive film.Storer also can be used for yield of radiation and the irradiation time of memory response UV solidified cell.
This photocuring nation determines device and utilizes the indicating meter display light of former Control of Hot Press Control unit to solidify the fixed various parameter of nation and running status.
This photocuring nation determine device utilize former Control of Hot Press Control unit input unit input various parameter.
4, use this photocuring nation to determine device to carry out nation to determine the key operation step of technological process as follows:
Step 1: will treat that pressure transparent conductive substrate 12 is placed in above-mentioned photocuring nation and determines on the silica glass base 11 of device;
Step 2: start CCD (or infrared light) alignment device, carries out flexible circuit board 16 and the contraposition of transparent conductive substrate 12 having attached anisotropic conductive film 18;
Step 3: by the top of platform movement good for contraposition to UV line source 10, the below of thermal head 17, principal controller 23 starts after thermal head unit 21 starts pressing, and after the set time, principal controller 23 activates UV solidified cell 29, complete photocuring nation and determine process.
Claims (10)
1. a photocuring anisotropic conductive film, it comprises a plastic film substrate, an anisotropic conductive adhesive layer; It is characterized in that:
This anisotropic conductive adhesive layer is coated on a kind of light-cured type anisotropic conductive on this plastic film substrate and is formed by warm air drying;
This light-cured type anisotropic conductive is made up of the following component according to mass percent:
Simple function group photocuring reactive monomer 5-11%;
Polyfunctional group photocuring reactive monomer 6-12%;
Light-cured resin 10-15%;
Light trigger 5-8%;
Film-forming resin 30-49%;
Elastomerics 10-20%;
Nanometer insulating particle 8-16%;
Electrically conductive particles 3-12%;
Flow agent 1.0-3.0%;
Coupling agent 2-5%;
Stopper 0.02-0.05%;
Described simple function group photocuring reactive monomer is made up of the mixture of following a kind of material or many kinds of substance: hydroxyethyl methylacrylate, methacrylic ester hydroxypropyl acrylate, (methyl) isobornyl acrylate, ethoxyethoxyethyl acrylate, lauric acid (methyl) acrylate, 2-phenoxyethyl acrylate;
Described polyfunctional group photocuring reactive monomer is made up of the mixture of following a kind of material or many kinds of substance: 2-dimethyl propyl ester diacrylate, Tricyclodecane Dimethanol diacrylate, ethoxylated bisphenol A diacrylate, (ethoxyquin-) 2-methyl isophthalic acid, 3 propylene glycol diacrylates, two (three) propylene glycol diacrylates, three (2-hydroxyethyl) tricarbimide triacrylate, ethoxyquin (the third oxidation) Viscoat 295, glycerol propoxylate triacrylate, two-trimethylolpropane tetra-acrylate, (ethoxyquin) tetramethylol methane tetraacrylate, double pentaerythritol C5 methacrylate, double pentaerythritol methacrylate,
Described light-cured resin is made up of the mixture of following a kind of material or many kinds of substance: the polyacrylic resin of unsaturated polyester, epoxy acrylic resin, polyurethane acrylic resin, polyester acrylate resin, polyoxyalkylene acrylate resin, acrylate functional, the polyolefin resin containing unsaturated double-bond, various epoxy resin, epoxy-functional polyorganosiloxane resin, have the resin of vinyl ether functional base;
Described light trigger belongs to radical photoinitiator or cation light initiator, and described light trigger is made up of the mixture of following a kind of material or many kinds of substance: benzoin ether derivative, benzil derivatives, Dialkoxy acetophenones, alpha-hydroxyalkyl benzophenone, α-amine alkyl phenones, acylphosphine oxide, aryl peroxy esters compound, benzoyl formiate, benzophenone/tertiary amine, thioxanthone/tertiary amine, anthraquinone/tertiary amine;
Described film-forming resin is made up of the mixture of following a kind of material or many kinds of substance: saturated polyol polyester, phenoxy resin;
Described elastomerics is made up of the mixture of following a kind of material or many kinds of substance: epoxy terminated paracril, polyaspartic rubber, nbr carboxyl terminal, carboxylated nbr, hydroxy-terminated polybutadienes, thiorubber, acrylic rubber.
2. a kind of photocuring anisotropic conductive film according to claim 1, is characterized in that: described nanometer insulating particle is made up of the mixture of following a kind of material or many kinds of substance: nano-ceramic powder, Nano-meter SiO_2
2, nano-TiO
2, nano-calcium carbonate.
3. a kind of photocuring anisotropic conductive film according to claim 1, is characterized in that: described electrically conductive particles is made up of the mixture of following a kind of material or many kinds of substance: the metal conductive particles of copper, nickel, gold and silver, tin, zinc, palladium, iron, tungsten, molybdenum; The composite conducting particles of copper, nickel, gold and silver, tin, zinc, palladium is coated with at polymer microsphere surface.
4. a kind of photocuring anisotropic conductive film according to claim 1, is characterized in that: described flow agent is made up of the mixture of following a kind of material or two kinds of materials: polydimethylsiloxane, polyester modified siloxane, polyether modified siloxane, aralkyl modified siloxanes, acrylate flow agent.
5. a kind of photocuring anisotropic conductive film according to claim 1, is characterized in that: above-mentioned coupling agent is made up of the mixture of following a kind of material or many kinds of substance: β-(3.4-epoxy cyclohexyl) ethyl trimethoxy silane, γ-glycidoxypropyl trimethoxy silane, γ-(methacryloxypropyl) propyl trimethoxy silicane.
6. a kind of photocuring anisotropic conductive film according to claim 1, it is characterized in that: above-mentioned stopper is made up of the mixture of following a kind of material or many kinds of substance: Resorcinol, para benzoquinone, toluhydroquinone, MEHQ, 2-Tert. Butyl Hydroquinone, p-ten.-butylcatechol, 2,5-di-tert-butyl hydroquinone, thiodiphenylamine, tertiarybutylhydroquinone, 1,4-naphthoquinone.
7. photocuring anisotropic conductive film according to claim 1, is characterized in that, this photocuring anisotropic conductive film needs use one photocuring binding device, and this photocuring nation determines device and comprises a control unit, a Light Curing Unit, a heat-pressure unit;
A storer, an input unit, an indicating meter, a power supply that this control unit comprises a principal controller and is connected with this principal controller;
This Light Curing Unit comprises a UV producer, a UV line source, a silica glass base, a transparent conductive substrate, an anisotropic conductive film, a flexible circuit board, a UV shield cap;
This UV producer is connected with this principal controller, UV line source respectively;
This silica glass floor installation is above this UV line source;
This transparent conductive substrate is placed on this silica glass base;
This transparent conductive substrate is provided with some conducting terminals;
This anisotropic conductive film is placed on this transparent conductive substrate;
This flexible circuit board is placed on this this anisotropic conductive film;
This flexible circuit board is provided with some flexible circuit board terminals;
By this anisotropic conductive film, this flexible circuit board and this transparent conductive substrate realize electrically conducting;
This UV shield cap covers on the outside of this UV line source, silica glass base, transparent conductive substrate, anisotropic conductive film, flexible circuit board;
This heat-pressure unit comprises a drive part, a hot press parts, a thermal head;
This drive part is connected with this principal controller, this hot press parts respectively;
This thermal head is arranged on the below of this hot press parts;
This thermal head is arranged on the top of this flexible circuit board.
8. photocuring anisotropic conductive film according to claim 7, is characterized in that, UV line source is the UV line source of wavelength 200-400nm; The light-emitting window of described UV line source is of a size of long 20-320mm, wide 2-10 mm, is preferably long 50-100mm, wide 5 mm; The physical dimension of described UV line source is long 100-320mm, wide 30-80 mm, high 50-100 mm, is preferably long 50-120mm, wide 30-50 mm, high 50-60 mm.
9. the preparation method of a kind of photocuring anisotropic conductive film according to claim 1, is characterized in that: comprise the following steps:
Step one: take simple function group photocuring reactive monomer 5-11%, polyfunctional group photocuring reactive monomer 6-12%, light-cured resin 10-15%, light trigger 5-8%, film-forming resin 30-49%, elastomerics 10-20%, nanometer insulating particle 8-16%, electrically conductive particles 3-12%, flow agent 1-3%, coupling agent 2-5%, stopper 0.02-0.05% according to mass percent;
Step 2: by light-cured resin, film-forming resin, elastomerics, put into dispersing mixer heat fused by toluene and vinyl acetic monomer according to the solvent that 1:1 mass ratio forms, melt temperature is less than 150 DEG C, forms mixture;
Step 3: mixture step 2 obtained is cooled to less than 60 DEG C, then the simple function group photocuring reactive monomer of liquid state and polyfunctional group photocuring reactive monomer are added in said mixture;
Step 4: nanometer insulating particle is added in said mixture;
Step 5: electrically conductive particles is added in said mixture;
Step 6: light trigger, flow agent, coupling agent, stopper are added in said mixture, obtained above-mentioned light-cured type anisotropic conductive;
Step 7: above-mentioned light-cured type anisotropic conductive is coated on above-mentioned plastic film substrate with coating machine;
Step 8: by the work in-process of step 7 gained, by hot air dryer, drying and forming-film, namely the film of formation is above-mentioned anisotropic conductive adhesive layer, can obtain the photocuring anisotropic conductive film of the present invention without protective membrane.
10. the preparation method of photocuring anisotropic conductive film according to claim 9; it is characterized in that; this preparation method also comprises step 9: covered by layer protecting film on this anisotropic conductive adhesive layer, can obtain the photocuring anisotropic conductive film of the present invention with protective membrane.
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| CN110938402A (en) * | 2019-12-18 | 2020-03-31 | 湖南省和祥润新材料有限公司 | Flame-retardant light-cured adhesive and preparation method thereof |
| CN112898776A (en) * | 2021-01-22 | 2021-06-04 | 镇江中垒新材料科技有限公司 | Anisotropic conductive sheet and preparation method thereof |
| CN113046004A (en) * | 2021-03-23 | 2021-06-29 | 业成科技（成都）有限公司 | Anisotropic conductive adhesive and bonding method |
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