KR20130029804A - Bonded material, and process for production thereof - Google Patents

Abstract

The present invention provides a method of manufacturing a bonded body in which a first circuit member and a second circuit member are electrically bonded through an anisotropic conductive film containing conductive particles and a photocurable resin, wherein the first circuit member, the anisotropic conductive film, and Arranging the second circuit member in this order; applying an ultrasonic wave when pressing the first circuit member and the second circuit member through the anisotropic conductive film; and applying the ultrasonic wave, It is a manufacturing method of the bonding body including the process of irradiating light to the said anisotropic conductive film, pressing-contacting a 1st circuit member and a said 2nd circuit member through the said anisotropic conductive film.

Description

Conjugate and its manufacturing method {BONDED MATERIAL, AND PROCESS FOR PRODUCTION THEREOF}

The present invention relates to a conjugate and a method for producing the conjugate.

Conventionally, the tape-shaped connection material (for example, anisotropic conductive film (ACF; Anisotropic Conductive Film)) which apply | coated resin which electroconductive particle disperse | distributed to the peeling film is used as a means to connect an electronic component.

This anisotropic conductive film has various terminals, for example, when connecting the terminal of an electronic component (IC chip) or a flexible printed circuit board (FPC), and the ITO (Indium Tin Oxide) electrode formed on the glass substrate of an LCD panel. It is used in the case of bonding together and electrically connecting and manufacturing a joined body.

In particular, a COG mount for mounting an IC chip on an LCD panel or the like using the anisotropic conductive film, and a COF mount for mounting an IC chip bonded to a flexible tape having metal wiring on an LCD panel or the like using the anisotropic conductive film Attention has been paid to high precision, thinning and narrowing of liquid crystal displays.

However, in the COG implementation of the development, connection is carried out by applying a heat amount for 5 seconds to 10 seconds at a temperature of 150 ° C to 250 ° C, and the panel is bent due to thermal expansion and contraction of the IC chip and the panel, resulting in screen display unevenness. have. In addition, in the COF mounting of the present invention, the heat is applied for 5 seconds to 10 seconds at a temperature of 150 ° C to 250 ° C in the same manner, and alignment is caused by misalignment due to thermal expansion and contraction of the IC chip bonded to the flexible tape. There is a problem that short circuit occurs between terminals.

As a means to solve the said problem, the anisotropic conductive connection using photocuring and ultrasonic application attracts attention.

For example, the technique which connects a board | substrate by applying an ultrasonic wave to the anisotropic conductive film containing an organic peroxide as a hardening agent is proposed (for example, refer patent document 1).

However, this technique has a problem that the problem caused by thermal stretching cannot be solved because the anisotropic conductive film is thermally cured.

Moreover, the technique which apply | coats an ultraviolet (UV) curable resin between circuit boards, joins the terminal of a circuit board with an ultrasonic wave, and hardens an ultraviolet (UV) curable resin by ultraviolet (UV) is proposed (for example, See Patent Document 2).

However, this technique has a problem that sufficient joint strength cannot be obtained and connection reliability is low.

Moreover, the technique of applying an ultrasonic wave, heating by irradiating the anisotropic conductive film by irradiating the light beam which generate | occur | produced with a YAG laser, a xenon lamp, a halogen lamp, etc. is proposed (for example, refer patent document 3).

However, in this technique, when an anisotropic conductive film containing a photocurable resin cured by light irradiation (for example, refer to Patent Document 4) is used, the bonding (adhesion) strength is not sufficient, and the electrical properties are inferior. there is a problem.

Japanese Patent Publication No. 2010-4067 Japanese Patent Laid-Open No. 2005-209704 Japanese Patent Publication No. 8-146451 Japanese Patent Publication No. 2010-16388

This invention solves the said various problem in the past, and makes it a subject to achieve the following objectives. That is, an object of this invention is to provide the joined body which is excellent in electrical characteristics, suppresses curvature, and can improve connection reliability, and its manufacturing method.

Means for solving the above problems are as follows. In other words,

<1> A method for producing a bonded body in which a first circuit member and a second circuit member are electrically bonded through an anisotropic conductive film containing conductive particles and a photocurable resin, wherein the first circuit member, the anisotropic conductive film, and After the step of arranging the second circuit member in this order, the step of applying ultrasonic waves when the first circuit member and the second circuit member are press-contacted through the anisotropic conductive film, and after applying the ultrasonic waves, It is a manufacturing method of the joined body characterized by including the process of irradiating light to the said anisotropic conductive film, pressing-contacting a 1st circuit member and the said 2nd circuit member through the said anisotropic conductive film.

<2> In <1>, it is a manufacturing method of the bonding body which irradiates an ultrasonic wave from one side with respect to an anisotropic conductive film, and irradiates light from the other side with respect to the said anisotropic conductive film.

<3> The method of producing a conjugate according to <1> or <2>, wherein the wavelength of the irradiated light is 200 nm to 750 nm.

<4> The method for producing a joined body according to any one of <1> to <3>, wherein the photocurable resin contains at least one of a photocationic curable resin and a photoradical curable resin.

<5> The method for producing a joined body according to any one of <1> to <4>, wherein the application time of the ultrasonic waves is 0.1 seconds to 2.0 seconds and the light irradiation time is 1.0 seconds to 5.0 seconds.

<6> It is a conjugate | zygote manufactured by the manufacturing method in any one of said <1>-<5>.

According to the present invention, the above-mentioned various problems in the related art can be solved, and the above object can be achieved, and the joined body and the manufacturing method thereof can be provided which are excellent in electrical characteristics, suppress the warpage, and improve connection reliability. have.

1 is a schematic explanatory diagram showing a conjugate of the present invention.

(Bonded body)

The joined body of this invention has at least a 1st circuit member, a 2nd circuit member, and an anisotropic conductive film, and also has other members suitably selected as needed.

<First and second circuit members>

There is no restriction | limiting in particular as said 1st and 2nd circuit member, According to the objective, it can select suitably, For example, a wiring board, an electronic component, a flexible wiring board (FPC), etc. are mentioned.

There is no restriction | limiting in particular as said wiring board, According to the objective, it can select suitably, For example, an LCD board, a PDP board | substrate, an organic EL board | substrate, etc. are mentioned.

There is no restriction | limiting in particular as a material of the said wiring board, Although it can select suitably according to the objective, From the point which is light transmissive, glass, a transparent plastic, etc. are preferable.

There is no restriction | limiting in particular as a transmittance | permeability of the light of wavelength 200nm-750nm of the said wiring board, Although it can select suitably according to the objective, 50%-100% are preferable and 70%-100% are more preferable.

When the said transmittance | permeability is less than 50%, the site | part with low hardening rate of a binder becomes easy to generate | occur | produce, and connection defect may be caused. On the other hand, if the said transmittance | permeability exists in the said especially preferable range, it is advantageous at the point which becomes easy to obtain a uniform hardening state as a whole, and can maintain a favorable connection state.

Moreover, when the site | part (non-transmissive site | part) which does not partially transmit light by metal wiring etc. on a glass substrate exists, it can use preferably. As a ratio in the board | substrate of the said non-transmissive site | part, 50% or less is preferable from a hardening side of a favorable binder, and 30% or less is more preferable.

As said electronic component, an IC chip, the TAB tape which mounted an IC chip, etc. are mentioned, for example.

<Anisotropic Conductive Film>

The anisotropic conductive film has at least a conductive layer and further has other layers as necessary.

It is preferable that the said anisotropic conductive film of this invention contains film formation resin (thermoplastic resin), photocurable resin, electroconductive particle, and a hardening | curing agent at least.

-Conductive layer-

The said conductive layer contains at least electroconductive particle and photocurable resin, and may contain a hardening | curing agent, a thermoplastic resin, and another component as needed.

--Conductive Particles--

There is no restriction | limiting in particular as said electroconductive particle, According to the objective, it can select suitably, For example, metal particles, such as solder, nickel, gold, silver, copper; Organic fillers such as resin particles coated (plated) with a metal (nickel, gold, silver, palladium, aluminum, copper, etc.); And inorganic fillers such as glass particles and ceramic particles coated (plated) with a metal (nickel, gold, silver, palladium, aluminum, copper, and the like).

There is no restriction | limiting in particular as a particle diameter of the said electroconductive particle, According to the objective, it can select suitably, For example, 2 micrometers-10 micrometers are preferable as a volume average particle diameter, and 2 micrometers-4 micrometers are more preferable.

When the said volume average particle diameter is less than 2 micrometers, it is difficult to classify and obtain, and when it exceeds 10 micrometers, it may become difficult to cope with narrowing of the said junction terminal by the fine pitch of a junction terminal.

There is no restriction | limiting in particular as specific gravity of the said electroconductive particle, According to the objective, it can select suitably.

--Photocurable resin--

There is no restriction | limiting in particular as said photocurable resin, According to the objective, it can select suitably, For example, radical photocurable resin, photocationic curable resin, etc. are mentioned.

There is no restriction | limiting in particular as said radical photocurable resin, According to the objective, it can select suitably, For example, an epoxy (meth) acrylate, a urethane (meth) acrylate, a (meth) acrylate oligomer, etc. are mentioned. have.

Moreover, there is no restriction | limiting in particular as said optical radical curable resin, According to the objective, it can select suitably, For example, methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, epoxy acrylate, ethylene glycol Diacrylate, diethylene glycol diacrylate, trimethylol propane triacrylate, dimethylol tricyclodecane diacrylate, tetramethylene glycol tetraacrylate, 2-hydroxy-1,3-diacryloxypropane, 2, 2-bis [4- (acryloxymethoxy) phenyl] propane, 2,2-bis [4- (acryloxyethoxy) phenyl] propane, dicyclopentenyl acrylate, tricyclodecanyl acrylate, tris ( Acryloxyethyl) isocyanurate, urethane acrylate, etc. are mentioned. These may be used alone, or two or more of them may be used in combination.

Moreover, as said radical photocurable resin, what made the said acrylate the methacrylate is mentioned, These may be used individually by 1 type, and may use 2 or more types together.

There is no restriction | limiting in particular as said photocationic curable resin, According to the objective, it can select suitably, For example, a bisphenol-A epoxy resin, a bisphenol F-type epoxy resin, a novolak-type epoxy resin, an oxetane resin, an alicyclic epoxy resin And these modified epoxy resins. These may be used alone, or two or more of them may be used in combination.

Moreover, it can also use together by mixing radical photocurable resin, photocationic curable resin, etc.

--Hardeners--

There is no restriction | limiting in particular as said hardening | curing agent, According to the objective, it can select suitably, For example, the hardening | curing agent which generate | occur | produces active cationic species or radical species by the light of wavelength range 200 nm-750 nm, etc. are mentioned.

There is no restriction | limiting in particular as a photocationic hardener which produces cationic species, According to the objective, it can select suitably, For example, a sulfonium salt, an onium salt, etc. are mentioned. These can cure various epoxy resins well.

There is no restriction | limiting in particular as an optical radical hardener which generate | occur | produces a radical species, According to the objective, it can select suitably, For example, an alkylphenone type photoinitiator, an acyl phosphine oxide type photoinitiator, a titanocene type polymerization initiator, an oxime ester A photoinitiator, etc. are mentioned. These can cure various acrylates well.

Moreover, as a hardening | curing agent which generate | occur | produces active cationic species or radical species by the light of the said wavelength range 200nm-750nm, it is an optical radical hardening | curing agent (brand name: Irgacure 651, Ciba Specialty Chemicals company make), light, for example. And cationic curing agents (trade name: Irgacure 369, manufactured by Ciba Specialty Chemicals).

Moreover, it can also use together by mixing an optical radical hardening | curing agent and an optical cationic hardening | curing agent.

--Thermoplastic (film forming resin)-

There is no restriction | limiting in particular as said thermoplastic resin, According to the objective, it can select suitably, For example, a phenoxy resin, a urethane resin, a polyester resin, a styrene isoprene resin, a nitrile butadiene resin, etc. are mentioned.

--Other ingredients--

There is no restriction | limiting in particular as said other components, According to the objective, it can select suitably, For example, a pigment, a silane coupling agent, an inorganic filler, an organic filler, etc. are mentioned.

--- Pigment ---

There is no restriction | limiting in particular as said pigment, According to the objective, it can select suitably, For example, titanium dioxide, zinc oxide, ultramarine blue, red iron oxide, lithopone, lead, cadmium, iron, cobalt, aluminum, hydrochloride, sulfate, etc. Inorganic pigments; Organic pigments, such as an azo pigment and a copper phthalocyanine pigment, etc. are mentioned.

--- Silane Coupling Agents ---

There is no restriction | limiting in particular as said silane coupling agent, According to the objective, it can select suitably, For example, a vinyl tris (2-methoxyethoxy) silane, a vinyl triethoxysilane, a vinyl trimethoxysilane, 3-sty Aryltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-acryloxypropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, N -2- (aminoethyl) -3-aminopropyltrimethoxysilane, N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane, 3-aminopropyltriethoxysilane, N-phenyl-3- Aminopropyl trimethoxysilane, 3-mercaptopropyl trimethoxysilane, 3-chloropropyl trimethoxysilane, etc. are mentioned.

--- Inorganic Filling Materials ---

There is no restriction | limiting in particular as said inorganic filler, According to the objective, it can select suitably, For example, a silica, alumina, titanium oxide, barium sulfate, talc, calcium carbonate, glass powder, quartz powder etc. are mentioned.

--- Organic Filling Materials ---

There is no restriction | limiting in particular as said organic filler, According to the objective, it can select suitably, For example, a urethane powder, an acrylic powder, a silicone powder, etc. are mentioned.

-Other layers-

There is no restriction | limiting in particular as said other layer, According to the objective, it can select suitably, For example, a peeling layer is mentioned.

There is no restriction | limiting in particular about the shape, structure, size, thickness, material (material), etc. as said peeling layer, Although it can select suitably according to the objective, The thing with favorable peelability and high heat resistance is preferable, for example, The transparent peeling PET (polyethylene terephthalate) sheet etc. which apply | coated the peeling agent, such as silicone, are mentioned preferably. In addition, a PTFE (polytetrafluoroethylene) sheet may be used.

As shown in FIG. 1, the bonding body 100 of this invention has the LCD panel 10 as a 1st circuit member, the IC chip 11 as a 2nd circuit member, and the anisotropic conductive film 12. As shown in FIG. The terminal 11a of the IC chip 11, the conductive particles 12a of the anisotropic conductive film 12, and the terminal (not shown) of the LCD panel 10 are conducted so that the LCD panel 10 and the IC chip are conducted. (11) is electrically connected.

(Method of producing a conjugate)

The manufacturing method of the joined body of this invention contains the other process which suitably selected as needed, including an arrangement process, an ultrasonic application process, and a light irradiation process at least.

<Batch process>

The said arrangement process is a process of arrange | positioning a 1st circuit member, an anisotropic conductive film, and a 2nd circuit member in this order.

Ultrasonic application process

The said ultrasonic wave application process is a process of applying an ultrasonic wave, when pressing a 1st circuit member and a 2nd circuit member through an anisotropic conductive film.

The said pressure contact means that a 1st circuit member and a 2nd circuit member are the thing through which conduction is obtained through an anisotropic conductive film, ie, the state in which the electroconductive particle in an anisotropic conductive film contact | connects the connection terminal of a 1st and 2nd circuit member. do.

The pressure welding is performed by pressing any one of the first circuit member and the second circuit member using a pressing member (20 in FIG. 1) such as a heat tool, and the pressing member A buffer member made of Teflon (registered trademark) or the like may be sandwiched between the second circuit members. By inserting the cushioning material, not only the pressure fluctuation can be reduced, but also the heat tool can be prevented from being contaminated.

There is no restriction | limiting in particular as said pressurizing member, According to the objective, it can select suitably, The pressurization can be performed once using the pressurizing member which has an area larger than a pressurizing object, and also using the pressurizing member whose area is smaller than a pressurizing object Pressurization may be divided into several times.

There is no restriction | limiting in particular as a tip shape of the said press member, According to the objective, it can select suitably, For example, a planar shape, a curved surface, etc. are mentioned. In addition, when the tip shape is curved, pressure may be applied along the curved surface.

There is no restriction | limiting in particular as a pressing force at the time of the said pressurization, It changes with the kind and purpose of a circuit member, The range of a pressing force can be suitably selected from them.

It is desirable to maintain pressurization until the optimum curing rate is reached. As said optimal hardening rate, although it changes with kinds of connection material and a circuit member, 60%-100% are preferable and 70%-100% are more preferable.

When the said hardening rate is less than 60%, connection defect may arise.

There is no restriction | limiting in particular as a frequency of the said ultrasonic wave, Although it can select suitably according to the objective, 10 kHz-100 kHz are preferable, and 20 kHz-60 kHz are more preferable.

If the frequency is less than 10 kHz, the force to press-in the circuit member may be insufficient to cause connection failure. If the frequency exceeds 100 kHz, the junction terminal of the circuit member may be deformed to cause short or connection failure.

There is no restriction | limiting in particular as a vibration direction of the said ultrasonic wave, According to the objective, it can select suitably, For example, it may be either horizontal vibration or vertical vibration with respect to the plane of a 1st circuit member or a 2nd circuit member. . In terms of damage reduction of the first circuit member or the second circuit member, horizontal vibration is preferable, and vertical vibration is preferable from the viewpoint of preventing alignment misalignment of the fine pitch connection.

There is no restriction | limiting in particular as said ultrasonic application time, Although it can select suitably according to the objective, 0.1 second-2.0 second are preferable, and 0.5 second-1.0 second are more preferable.

When the said ultrasonic application time is less than 0.1 second, the underpressure of a circuit member may generate | occur | produce, and when it exceeds 2.0 second, the wiring of a circuit member may deform | transform.

Metal melt | dissolves by the said ultrasonic application, for example, bonding of gold in the bonding terminal (bump) of gold and a circuit member in electroconductive particle, bonding terminal (bump) of gold in a conductive particle and a circuit member The bond with tin in can be formed.

There is no restriction | limiting in particular as said ultrasonic application means, According to the objective, it can select suitably, For example, the ultrasonic member which can apply the ultrasonic wave incorporating a vibrator etc. (20 in FIG. 1) etc. are mentioned.

<Light irradiation step>

The said light irradiation process is a process of irradiating light to an anisotropic conductive film, pressing-contacting a 1st circuit member and a 2nd circuit member through an anisotropic conductive film after applying an ultrasonic wave.

The said pressure contact means that a 1st circuit member and a 2nd circuit member are the thing through which conduction is obtained through an anisotropic conductive film, ie, the state in which the electroconductive particle in an anisotropic conductive film contact | connects the connection terminal of a 1st and 2nd circuit member. do.

In order to press-contact a 1st circuit member and a 2nd circuit member through an anisotropic conductive film, at least any one of a 1st circuit member and a 2nd circuit member is pressed, for example.

As said light, there is no restriction | limiting in particular as long as it is light which can be photocurable resin curable, Although it can select suitably according to the objective, the light (ultraviolet ray) of wavelength 200nm-750nm is preferable.

There is no restriction | limiting in particular as a light source (30 in FIG. 1) which emits the said light, According to the objective, it can select suitably, For example, a LED light source, a UV lamp light source, etc. are mentioned.

As light irradiation timing, after pressurizing and ultrasonic irradiation, the 1st circuit member and the 2nd circuit member are pressure-contacted through the anisotropic conductive film, and then light irradiation. In addition, the ultrasonic application is stopped at the time of light irradiation. This is because when ultrasonic waves are applied in a state where photocuring has been performed, cracks may occur in the joined body, resulting in a decrease in connection reliability.

There is no restriction | limiting in particular as an irradiation direction of the said light irradiation, According to irradiation efficiency etc., it can select suitably, For example, it may be a perpendicular | vertical direction with respect to an irradiation target, and may be a direction inclined with respect to the said radial direction.

Moreover, after irradiating light, pressing-contacting a 1st circuit member and a 2nd circuit member through an anisotropic conductive film, light irradiation can also be performed for 0.5 second or more, without pressing a 2nd circuit member to a 1st circuit member side further. . Thereby, hardening can be further performed in the state which the stress to press-in is reduced, and connection reliability can be improved further.

There is no restriction | limiting in particular as a pressing force at the time of the said pressurization, It changes with a kind and a purpose of a circuit member, The range of a pressing force can be suitably selected from them.

It is desirable to maintain pressurization until the optimum curing rate is reached. As said optimal hardening rate, although it changes with kinds of connection material and a circuit member, 60%-100% are preferable and 70%-100% are more preferable.

When the said hardening rate is less than 60%, connection defect may arise.

There is no restriction | limiting in particular as said light irradiation time, Although it can select suitably according to the objective, 1.0 second-10.0 second are preferable, and 1.0 second-5.0 second are more preferable.

When the said light irradiation time is less than 1.0 second, light curing may not be enough, and when it exceeds 10.0 second, a short time connection may become impossible and a tact time may increase and a unit price may increase.

It is preferable to perform ultrasonic application and light irradiation from the direction which opposes an anisotropic conductive film. For example, it is preferable to perform ultrasonic application from one circuit member (electronic component or FCP) side and to perform light irradiation from the other circuit member (wiring substrate) side.

By performing light irradiation from the other circuit member, since the pressing member for pressurizing one circuit member does not block light, light irradiation efficiency can be improved and it can further harden | cure light while pressing.

For example, in COG mounting which connects a glass wiring board and an IC chip, the anisotropic conductive film containing an ultraviolet curable resin is arrange | positioned on a glass wiring board, melts an anisotropic conductive film by ultrasonic wave from an IC chip side, and IC After pressing-in a chip | tip, it performs without heating the connection of a glass wiring board and an IC chip by irradiating and hardening an ultraviolet irradiation from the glass substrate side in the state which applied the pressure. As a result, the panel warpage due to heat shrinkage can be prevented, whereby the problem of display unevenness can be solved.

Moreover, in COF mounting which connects a glass wiring board and COF, alignment misalignment by thermal expansion and contraction can be reduced by the same connection method, and sufficient connection area can be secured and terminal short can be prevented.

In addition, for the purpose of promoting the melting of the anisotropic conductive film, it may also be carried out by applying heat of 60 ° C to 100 ° C auxiliary.

[Example]

Hereinafter, although the Example of this invention is described, this invention is not limited to a following example at all.

(Production Example 1)

60 parts by mass of a phenoxy resin (trade name: YP50, manufactured by Toto Kasei Co., Ltd.), 35 parts by mass of a radical photopolymerizable resin (brand name: EB-600, manufactured by Daicel Cytec Co., Ltd.), and a silane coupling agent (brand name: KBM-503 Gold-plated conductive particles (trade name: AUL704, Sekisui Chemical Industries, Ltd.) in an adhesive comprising 1 part of Shin-Etsu Chemical Co., Ltd.) and 2 parts of an optical radical curing agent (trade name: Irgacure 651, manufactured by Ciba Specialty Chemicals Co., Ltd.). A film-like connection material A having a thickness of 20 µm obtained by dispersing teacher production) so as to have a particle density of 20,000 particles / mm ² was obtained.

(Production Example 2)

60 parts by mass of a phenoxy resin (trade name: YP50, manufactured by Toto Kasei Co., Ltd.), 35 parts by mass of a photo cationic curable resin (liquid epoxy resin) (brand name: JER-828, manufactured by Japan Epoxy Resin Co., Ltd.), and a silane coupling agent (brand name) : Gold-plated conductive particles (trade name: AUL704, three) in KBM-403, manufactured by Shin-Etsu Chemical Co., Ltd., 1 part, and an optical cationic curing agent (trade name: Irgacure 369, manufactured by Ciba Specialty Chemicals Co., Ltd.). 20 micrometers-thick film-form connection material B which disperse | distributed Kisui Chemicals Co., Ltd. product) was made to have a particle density of 20,000 piece / mm <^2> .

(Production Example 3)

60 parts by mass of a phenoxy resin (trade name: YP50, manufactured by Toto Kasei Co., Ltd.), 35 parts by mass of an optical radical curable resin (brand name: EB-600, manufactured by Daicel Cytec Co., Ltd.), and a silane coupling agent (brand name: KBM-503, Gold-plated conductive particles (trade name: AUL704, manufactured by Sekisui Kagaku Kogyo Co., Ltd.) in an adhesive containing 1 part of Shin-Etsu Chemical Co., Ltd.) and 2 parts of a thermal radical curing agent (trade name: Perbutyl O, manufactured by Nichiyu Co., Ltd.) The film-form connection material C of 20 micrometers in thickness which disperse | distributed so that it might become a particle density of 20,000 piece / mm <^2> was obtained.

(Production Example 4)

In manufacture example 2, the film-form connection material D was obtained like manufacture example 2 except not disperse | distributing gold plating electroconductive particle.

(Production Example 5)

In manufacture example 2, the film-form connection material E was obtained like manufacture example 2 except having used silver plating electroconductive particle instead of gold plating electroconductive particle.

(Production Example 6)

In manufacture example 2, the film-form connection material F was obtained like manufacture example 2 except having used copper plating electroconductive particle instead of gold plating electroconductive particle.

(Production Example 7)

In manufacture example 2, the film-form connection material G was obtained like manufacture example 2 except having used nickel plating electroconductive particle instead of gold plating electroconductive particle.

(Preparation Example 8)

In manufacture example 2, the film-form connection material H was obtained like manufacture example 2 except having used palladium plating electroconductive particle instead of gold plating electroconductive particle.

(Example 1)

The film-form connection material A produced by the manufacture example 1 is arrange | positioned on the aluminum wiring pattern glass substrate (brand name: 1737F, Corning Corporation make, size: 50mm * 30mm * 0.5mm) corresponding to the pattern of an IC chip, and it is a film form An IC chip (dimensions: 1.8 mm × 20.0 mm, thickness: 0.5 mm, gold bump size: 30 μm × 85 μm, bump height: 15 μm, pitch: 50 μm) is disposed on the connection material A, and the IC chip and aluminum Wiring pattern When the glass substrate is press-contacted through the film-like connection material A, after applying ultrasonic waves for 1.0 second under the condition of vibration 50 Hz, amplitude 2 µm and pressing force 60 MPa, the aluminum wiring pattern is maintained in a pressing force of 60 MPa. The conjugate 1 was produced by irradiating an ultraviolet-ray for 5.0 second and a light quantity of 5,000 mJ / cm <2> using the metal halide lamp (brand name: MLDS250, the Iwasaki Denki Corporation make) from the glass substrate side.

(Example 2)

In Example 1, the junction body 2 was produced like Example 1 except having used the film connection material B produced by the manufacture example 2 instead of using the film connection material A.

(Example 3)

In Example 1, the bonding body 3 was produced like Example 1 except having used the film connection material E produced by the manufacture example 5 instead of using the film connection material A.

(Example 4)

In Example 1, the bonding body 4 was produced like Example 1 except having used the film connection material F produced by the manufacture example 6 instead of using the film connection material A.

(Example 5)

In Example 1, the bonding body 5 was produced like Example 1 except having used the film connection material G produced by the manufacture example 7, instead of using the film connection material A.

(Example 6)

In Example 1, the bonding body 6 was produced like Example 1 except having used the film connection material H produced by the manufacture example 8 instead of using the film connection material A.

(Comparative Example 1)

IC film (dimensions: 1.8 mm x 20.0 mm, thickness: 0.5 mm, gold bump size: 30 micrometers x 85 micrometers, bump height: 15 micrometers, pitch: 50) using the film-form connection material C produced by the manufacture example 3 7 m) and an aluminum wiring pattern glass substrate (trade name: 1737F, manufactured by Corning Corporation, size: 50 mm x 30 mm x 0.5 mm) corresponding to the pattern of the IC chip. Was produced.

(Comparative Example 2)

In Example 1, the bonding body 8 was produced like Example 1 except having used the film connection material D produced by the manufacture example 4 instead of using the film connection material A.

(Comparative Example 3)

In Example 1, after applying ultrasonic wave for 1.0 second, instead of irradiating an ultraviolet ray for 5.0 second, it is the same as Example 1 except having performed ultrasonic application and ultraviolet irradiation simultaneously for 1.0 second, and performing only ultraviolet irradiation for 4.0 second. Thus, the conjugate 9 was produced.

(Comparative Example 4)

In Example 1, the conjugate 10 was produced similarly to Example 1 except having applied the ultrasonic wave for 1.0 second, after irradiating an ultraviolet-ray for 5.0 second, instead of irradiating an ultraviolet-ray for 5.0 second after applying ultrasonic wave for 1.0 second. It was.

The following measurements were performed about the conjugates 1-10 produced in Examples 1-6 and Comparative Examples 1-4.

<Measurement of reaction rate (hardening rate)>

The reaction rate (hardening rate) of the film-form connection material which exists in the back surface of the aluminum wiring pattern in an aluminum wiring pattern glass substrate using an infrared spectrophotometer (article number FT / IR-4100, Nippon Bunko company make) before mounting It calculated from the attenuation amount (%) of the epoxy absorption wavelength after mounting, or the attenuation amount (%) of the absorption wavelength of an unsaturated group. The results are shown in Table 1 below.

<Measurement of the amount of warpage>

It scanned from the lower side of a glass substrate using the needle | contact type surface roughness meter (brand name: SE-3H, the Kosaka Corporation company), and measured the curvature amount (micrometer) of the aluminum wiring pattern glass substrate surface after IC chip crimping. The results are shown in Table 1.

<Measurement of connection resistance>

Initial connection resistance (Ω) and connection resistance after environmental test (85 ° C / 85% / 500 hours) using a digital multimeter (brand name: digital multimeter 7561, manufactured by Yokogawa Denki Co., Ltd.) ) Was measured. The results are shown in Table 1.

<Measurement of Initial Adhesive Strength>

The initial adhesive strength (kg / IC) was measured using the die share measuring device (brand name: Dage2400, Daisy Corporation). The results are shown in Table 1.

From Table 1, by using a combination of ultrasonic waves and ultraviolet rays to produce a bonded body, the bonded body can be connected without heating to a high temperature, whereby the warpage of the bonded panel can be suppressed and the problem of display unevenness can be solved. Moreover, since the residual stress of the joined body after mounting is small, the connection reliability is high.

The manufacturing method of the joined body of this invention can be used suitably for manufacture of an IC tag, an IC card, a memory card, a flat panel display, etc., for example.

10: LCD panel (circuit member)
11: IC chip (circuit member)
11a: terminal
12: anisotropic conductive film
12a: conductive particles
20: pressing member
30: Light source
100: conjugate

Claims (6)

In the manufacturing method of the joined body in which a 1st circuit member and a 2nd circuit member are electrically bonded through the anisotropic conductive film containing electroconductive particle and photocurable resin,
Disposing the first circuit member, the anisotropic conductive film, and the second circuit member in this order;
Applying an ultrasonic wave when pressing the first circuit member and the second circuit member through the anisotropic conductive film;
And after applying the ultrasonic wave, irradiating light to the anisotropic conductive film while pressing the first circuit member and the second circuit member through the anisotropic conductive film. The manufacturing method of the bonded body of Claim 1 which irradiates an ultrasonic wave from one side with respect to an anisotropic conductive film, and irradiates light from the other side with respect to the said anisotropic conductive film. The manufacturing method of the conjugate of Claim 1 or 2 whose wavelength of the irradiated light is 200 nm-750 nm. The manufacturing method of the joined body in any one of Claims 1-3 in which photocurable resin contains at least any one of a photocationic curable resin and a photoradical curable resin. The method for producing a conjugate according to any one of claims 1 to 4, wherein the application time of the ultrasonic waves is for 0.1 second to 2.0 seconds and the light irradiation time is for 1.0 second to 5.0 seconds. It was manufactured by the manufacturing method in any one of Claims 1-5, The conjugate | zygote characterized by the above-mentioned.

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