CN104260009A - Clamping and positioning device for substrate adhesion - Google Patents
Clamping and positioning device for substrate adhesion Download PDFInfo
- Publication number
- CN104260009A CN104260009A CN201410417289.7A CN201410417289A CN104260009A CN 104260009 A CN104260009 A CN 104260009A CN 201410417289 A CN201410417289 A CN 201410417289A CN 104260009 A CN104260009 A CN 104260009A
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- CN
- China
- Prior art keywords
- substrate
- metal shell
- positioning device
- positioning
- pressing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Connection Of Plates (AREA)
Abstract
The invention discloses a clamping and positioning device for substrate adhesion. The clamping and positioning device comprises a base (1) and a pressure plate (7), the base (1) is used for bearing a metal shell (4), and the pressure plate (7) is used for pressurizing a substrate (6). Double-row outer pins (5) of the metal shell (4) are downwardly distributed on two sides of the base (1), positioning columns (2) are arranged at the top of the base (1), and the face of the pressure plate is provided with positioning holes (8) matched with the positioning columns and further provided with a group of pressure heads (9) pressing the top face of the substrate. Surfaces of the positioning columns are provided with external threads, an adjusting nut (11) in threaded fit with each positioning column (2) sleeves the corresponding positioning column (2), and a spring (12) sleeves each positioning column (2) between the corresponding adjusting nut (11) and the pressure plate (7). Due to the facts that the metal shell is arranged on the base and the pressure plate is limited by cooperation of the positioning columns and the positioning holes, relative displacement between the substrate and the metal shell during adhesion can be avoided, and influences on the pins are avoided; by the aid of the adjusting nuts, pressure applied to the substrate by the pressure plate can be adjusted so as to adjust adhesion pressure, and adhesion strength between the substrate and the metal shell can be guaranteed.
Description
Technical field
The present invention relates to Electronic products manufacturing field, specifically a kind of for the bonding clamping and positioning device of substrate in microelectronic product with shell.
Background technology
Known, substrate binding technique refers to the mode by adopting specific adhesives, substrate and metal shell base is firmly linked together, and reaching the object of highly reliable interconnection assembling, is one of basic packaging technology of microelectronic product.For guaranteeing compactness, fastness that substrate binding interconnects, in bonding solidification process, generally need the pressure applying to fix between substrate and shell, with reach solidification after bonding interface smooth, even, without cavity etc. reliability requirement.At present, generally by the method for clamping of spring clip, applying pressure is carried out to substrate and metal shell, complete bonding, but this method of clamping can cause bonded adhesives relativity shift can occur between substrate and metal shell in the process of solidification, cause the outer pin length of bonding between substrate and metal shell stem inconsistent, also easily occur when outer pin is long toppling over phenomenon, in addition, because the spring degree of spring clip can change along with the increase of life cycle, thus cause bonding pressure inconsistent, have a strong impact on the adhesive strength after bonded adhesives solidification.
Summary of the invention
The object of the present invention is to provide a kind of substrate binding clamping and positioning device, this device can avoid substrate and metal shell to produce relative displacement in bonding process, can not externally impact by pin; And can bonding pressure be regulated, ensure the adhesive strength of substrate and metal shell.
The technical solution adopted for the present invention to solve the technical problems is:
A kind of substrate binding clamping and positioning device, substrate binding is in metal shell, described device comprise bearing metal shell pedestal and to the stressed pressing plate of undercoat, the outer pin of the biserial of metal shell is distributed in the both sides of pedestal downwards, and pedestal top is provided with locating dowel; Described pressing plate plate face is provided with the locating hole cooperatively interacted with locating dowel, and pressing plate plate face is provided with the one group of pressure head being pressed in substrate surface.
Further, described pressure head comprises four by the distribution of rectangle corner.
Further, described pressure head is stepped cylindrical.
Further, the cylinder of described locating dowel is provided with external screw thread, and locating dowel is arranged with the adjusting nut with its threaded engagement, and the locating dowel between adjusting nut and pressing plate is arranged with spring.
Further, the plate face of described pressing plate is provided with peep hole.
The invention has the beneficial effects as follows, metal shell is placed on pedestal, and spacing with coordinating pressing plate of locating hole by locating dowel, substrate and metal shell can be avoided in bonding process to produce relative displacement, can not externally impact by pin; Pressing plate can be adjusted by adjusting bolt and be applied to pressure on substrate, reach the object regulating bonding pressure, ensure the adhesive strength of substrate and metal shell.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the present invention is further described:
Fig. 1 is structural representation of the present invention;
Fig. 2 is the structural representation of pedestal in Fig. 1;
Fig. 3 is the top view of Fig. 2;
Fig. 4 is the assembling schematic diagram of pedestal in Fig. 1, metal shell and substrate;
Fig. 5 is the top view of Fig. 4;
Fig. 6 is the structural representation of center platen of the present invention;
Fig. 7 is the A-A sectional view of Fig. 6.
Detailed description of the invention
As shown in Figure 1, the invention provides a kind of substrate binding clamping and positioning device, comprise the pedestal 1 of bearing metal shell 4 and execute stressed pressing plate 7 to substrate 6, composition graphs 2 is with shown in Fig. 3, the two ends at pedestal 1 top are respectively equipped with locating dowel 2, and the cylinder of locating dowel 2 is provided with external screw thread 3; Composition graphs 4 is with shown in Fig. 5, and metal shell 4 is positioned on pedestal 1, and the outer pin 5 of biserial of metal shell 4 is distributed in the both sides of pedestal 1 downwards, bonding by bonded adhesives between substrate 6 with metal shell 4; Composition graphs 6 is with shown in Fig. 7, the plate face of described pressing plate 7 is provided with the locating hole 8 cooperatively interacted with locating dowel 2, coordinate spacing for pressing plate 7 by locating dowel 8 and locating hole 2, substrate 6 and metal shell 4 can be avoided in bonding process to produce relative displacement, can not externally impact by pin 5, pressing plate 7 plate face is provided with four pressure heads 9 for being pressed in substrate 6 end face, pressure head 9 is in stepped cylindrical, and form rectangular configuration in pressing plate plate face, pressing plate 7 is set on pedestal 1, and makes pressure head 9 be pressed on substrate 6; Locating dowel 2 is arranged with the adjusting nut 11 with its threaded engagement, and the locating dowel between adjusting nut 11 and pressing plate 7 is arranged with spring 12; The plate face of pressing plate 7 is also provided with peep hole 10.
During actual use, can check that the pressure head 9 of pressing plate 7 is pressed in the situation on substrate 6 by peep hole 10, when pressure head 9 is pressed in after on substrate 6 suitably, sheathed spring 12 in locating dowel 2, then to screw on adjusting nut 11, according to the bonding requirements of various substrates and metal shell, by torque spanner, adjusting nut 11 is regulated, thus bonding pressure can be controlled exactly, the adhesive strength of substrate and metal shell is met the demands, spring 12 plays cushioning effect, avoids stress to directly act on substrate and causes damage.
The above is only preferred embodiment of the present invention, not does any pro forma restriction to the present invention; Any those of ordinary skill in the art, do not departing under technical solution of the present invention ambit, the Method and Technology content of above-mentioned announcement all can be utilized to make many possible variations and modification to technical solution of the present invention, or be revised as the Equivalent embodiments of equivalent variations.Therefore, every content not departing from technical solution of the present invention, according to technical spirit of the present invention to any simple modification made for any of the above embodiments, equivalent replacement, equivalence change and modification, all still belongs in the scope of technical solution of the present invention protection.
Claims (5)
1. a substrate binding clamping and positioning device, substrate binding is in metal shell, it is characterized in that, described device comprises the pedestal (1) of bearing metal shell (4) and executes stressed pressing plate (7) to substrate (6), the outer pin (5) of biserial of metal shell (4) is distributed in the both sides of pedestal (1) downwards, and pedestal (1) top is provided with locating dowel (2); Described pressing plate (7) plate face is provided with the locating hole (8) cooperatively interacted with locating dowel (2), and pressing plate (7) plate face is provided with the one group of pressure head (9) being pressed in substrate (6) end face.
2. a kind of substrate binding clamping and positioning device according to claim 1, is characterized in that, described pressure head (9) comprises four by the distribution of rectangle corner.
3. a kind of substrate binding clamping and positioning device according to claim 1 and 2, is characterized in that, described pressure head (9) is in stepped cylindrical.
4. a kind of substrate binding clamping and positioning device according to claim 1 and 2, it is characterized in that, the cylinder of described locating dowel (2) is provided with external screw thread, locating dowel (2) is arranged with and the adjusting nut of its threaded engagement (11), and the locating dowel (2) between adjusting nut (11) and pressing plate (7) is arranged with spring (12).
5. a kind of substrate binding clamping and positioning device according to claim 1 and 2, is characterized in that, the plate face of described pressing plate is provided with peep hole (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410417289.7A CN104260009B (en) | 2014-08-23 | 2014-08-23 | A kind of substrate binding clamping and positioning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410417289.7A CN104260009B (en) | 2014-08-23 | 2014-08-23 | A kind of substrate binding clamping and positioning device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104260009A true CN104260009A (en) | 2015-01-07 |
| CN104260009B CN104260009B (en) | 2016-05-11 |
Family
ID=52151653
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410417289.7A Active CN104260009B (en) | 2014-08-23 | 2014-08-23 | A kind of substrate binding clamping and positioning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104260009B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106048826A (en) * | 2016-08-10 | 2016-10-26 | 沈全松 | Combined expansion reed |
| CN106763043A (en) * | 2017-03-09 | 2017-05-31 | 江西合力泰科技有限公司 | A kind of IFS classes bio-identification scheme attaching tooling tool |
| CN107165914A (en) * | 2017-07-17 | 2017-09-15 | 青岛科技大学 | A kind of fixing device for installing suitable for various material and size bonding piece |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107731572A (en) * | 2017-10-10 | 2018-02-23 | 中国振华（集团）新云电子元器件有限责任公司 | A kind of chip conducting polymer aluminum capacitor solidifies fixture |
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| CN87107124A (en) * | 1986-11-14 | 1988-05-25 | 库特·赫尔德·法布里肯特 | Method and apparatus for manufacturing composite wood product board |
| CN1054334A (en) * | 1990-01-23 | 1991-09-04 | 菲利浦光灯制造公司 | The semiconductor device and the manufacture method thereof that contain pedestal |
| US5451284A (en) * | 1992-12-25 | 1995-09-19 | Nippon Kokan Koji Kabushiki Kaisha | Self-mobile work vehicle moveable through pipeline and method and apparatus for lining interconnecting branch pipe using the vehicle |
| US5620065A (en) * | 1994-08-01 | 1997-04-15 | Rexnord Corporation | Spring set brake |
| US5687464A (en) * | 1995-12-20 | 1997-11-18 | Marshall; Perry C. | Apparatus for pulling golf club shafts from club heads |
| US5695593A (en) * | 1995-10-04 | 1997-12-09 | Lsi Logic Corporation | Method of centering a high pressure lid seal |
| US5833109A (en) * | 1996-02-22 | 1998-11-10 | Lg Electronics, Inc. | Pinch roller driving device for video recording and reproducing system |
| CN202076242U (en) * | 2010-12-23 | 2011-12-14 | 大连艾科科技开发有限公司 | Clamp applicable to sealing cover of dual in-line package shell |
| CN203503624U (en) * | 2013-08-08 | 2014-03-26 | 昆明物理研究所 | Infrared detector wafer adhesive clamp |
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2014
- 2014-08-23 CN CN201410417289.7A patent/CN104260009B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN85106110A (en) * | 1984-10-19 | 1986-10-01 | 株式会社东芝 | The device that is used for producing the semiconductor devices |
| CN85108782A (en) * | 1984-12-05 | 1986-10-08 | 洛迦诺电子工业股份有限公司 | The spark erosion machine that stationary work-table and reducible electrolyte working container are arranged |
| CN87107124A (en) * | 1986-11-14 | 1988-05-25 | 库特·赫尔德·法布里肯特 | Method and apparatus for manufacturing composite wood product board |
| CN87207075U (en) * | 1987-05-19 | 1988-02-03 | 金华铁路工务段劳动服务公司 | Rolling slat window with bearing guide |
| CN1054334A (en) * | 1990-01-23 | 1991-09-04 | 菲利浦光灯制造公司 | The semiconductor device and the manufacture method thereof that contain pedestal |
| US5451284A (en) * | 1992-12-25 | 1995-09-19 | Nippon Kokan Koji Kabushiki Kaisha | Self-mobile work vehicle moveable through pipeline and method and apparatus for lining interconnecting branch pipe using the vehicle |
| US5620065A (en) * | 1994-08-01 | 1997-04-15 | Rexnord Corporation | Spring set brake |
| US5695593A (en) * | 1995-10-04 | 1997-12-09 | Lsi Logic Corporation | Method of centering a high pressure lid seal |
| US5687464A (en) * | 1995-12-20 | 1997-11-18 | Marshall; Perry C. | Apparatus for pulling golf club shafts from club heads |
| US5833109A (en) * | 1996-02-22 | 1998-11-10 | Lg Electronics, Inc. | Pinch roller driving device for video recording and reproducing system |
| CN202076242U (en) * | 2010-12-23 | 2011-12-14 | 大连艾科科技开发有限公司 | Clamp applicable to sealing cover of dual in-line package shell |
| CN203503624U (en) * | 2013-08-08 | 2014-03-26 | 昆明物理研究所 | Infrared detector wafer adhesive clamp |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106048826A (en) * | 2016-08-10 | 2016-10-26 | 沈全松 | Combined expansion reed |
| CN106763043A (en) * | 2017-03-09 | 2017-05-31 | 江西合力泰科技有限公司 | A kind of IFS classes bio-identification scheme attaching tooling tool |
| CN107165914A (en) * | 2017-07-17 | 2017-09-15 | 青岛科技大学 | A kind of fixing device for installing suitable for various material and size bonding piece |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104260009B (en) | 2016-05-11 |
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