CN104392967A - Semiconductor module pressing structure and pressing method thereof - Google Patents
Semiconductor module pressing structure and pressing method thereof Download PDFInfo
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- CN104392967A CN104392967A CN201410566054.4A CN201410566054A CN104392967A CN 104392967 A CN104392967 A CN 104392967A CN 201410566054 A CN201410566054 A CN 201410566054A CN 104392967 A CN104392967 A CN 104392967A
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Abstract
The invention discloses a semiconductor module pressing structure, which comprises an upper pressing plate, a lower pressing plate arranged at two ends of the semiconductor module and a plurality of force-bearing positioning pieces, wherein the upper pressing plate and the lower pressing plate are fixedly connected by adopting a screw rod; the force-bearing positioning pieces are arranged at edges of the pressing plates; the edges serve as pressure-applying points to which the pressing force is applied; and the force-bearing positioning pieces position the pressing plates. The invention also provides a semiconductor module pressing method. The method comprises the following steps: a pressing force value of the pressing machine is set; the semiconductor module is placed at the corresponding pressing position on the pressing machine, the edges of the pressing plates are positioned by using the force-bearing positioning pieces, and the pressing force is applied to the edges of the pressing plates; after applying of the pressing force is in place, pressing plate nuts are fastened, and the pressing force is then released. When the structure and the method of the invention are applied, and purposes that operation of pressing operation is simple and convenient, accuracy of the pressing force inside the semiconductor module is improved, and parallelism between the upper pressing plate and the lower pressing plate of the module is improved can be realized.
Description
Technical field
The invention belongs to electric and electronic technical field, be specifically related to a kind of press mounting structure and pressing method thereof of semiconductor module.
Background technology
Semiconductor module press-loading process mode generally has two kinds: a kind of mode fastening for employing torque spanner is carried out element and press-fited fastening.Which is simple to operation, but because of moment and press-fit relation between force value and to convert complexity, affects greatly in practical application by uncertain factor, moment values and to press-fit the more difficult conversion of force value accurate; And need the fastening of artificial force, general many applications less at pressure assembling force.Another kind of press-fit approach adopts pressing machine to carry out element to the form of semiconductor module applying pressure assembling force to press-fit.Its form automatically applying pressure assembling force by controlling pressing machine press-fits, and effectively reduces personnel's operation intensity, improves operating efficiency.
Its workflow is:
1. pressing machine optimum configurations: according to semiconductor module drawing requirement, what arrange pressing machine equipment press-fits force value, and if drawing requirement pressure assembling force is F (unit K N), then the force value that press-fits arranging pressing machine equipment is F;
2. operate pressing machine to exert pressure: semiconductor module is placed on correspondence in pressing machine equipment and press-fits position, operation pressing machine equipment, applies pressure assembling force F to semiconductor module; Storage and the release of pressure assembling force is carried out by the deformation of inner butterfly spring;
3. the nut on double threaded screw is tightened: after pressure assembling force F applying puts in place, fastening semiconductor module top board nut;
4. discharge pressing machine pressure assembling force: after fastening nuts completes, operation pressing machine rises, release pressure assembling force;
5. press-fited: from pressing machine, take out semiconductor module, press-fited.
The press-fit approach based on pressing machine close with the present invention is: the element press-fit approach that upper and lower center single-point is exerted pressure.
Concrete mode is: be placed on lower support block 2 by semiconductor module 3, then on semiconductor module, place A briquetting 1 frock, aligns in center; Pressing machine leans on the position single-point at center to apply pressure assembling force by frock to top board 5 and lower platen 6.The structural representation press-fited as Fig. 1,
But there are following two aspects deficiencies in this kind of press-fit approach:
1., after semiconductor module press-fits, pressure assembling force and the actual requirement deviation of butterfly spring storage in it are larger.Concrete analysis is described as follows:
As shown in Figure 1, pressing machine applies pressure assembling force F to semiconductor module 3, and in semiconductor module, deformation occurs in butterfly spring compression, and it stores pressure assembling force F.It is that on semiconductor module, lower platen is by center that single-point applies to press-fit force, and other positions are not by pressure assembling force, and pressing plate deformation does not occur; After having exerted pressure, tightened by the nut 4 on upper and lower pressing plate corner place double threaded screw 7, fastening nuts moment is little herein, and upper and lower pressing plate does not also produce deformation, and now daylight opening is set to d up and down;
Thereafter, release pressure assembling force, the pressure assembling force of semiconductor module 3 is transferred on double threaded screw 7, and the interaction force that namely pressure assembling force and butterfly spring elastic force form changes the interaction force that the fastening force of four double threaded screws and butterfly spring elastic force form into.The pressure assembling force F of semiconductor module progressively transfers on four double threaded screws 7 by middle A briquetting; In transfer process, the pressure assembling force F that the inner butterfly spring of semiconductor module 3 stores acts on upper and lower pressing plate, and along with pressing machine pressure assembling force is withdrawn, the fastening force on double threaded screw 4 increases gradually.In the process, because upper and lower pressing plate is subject to the position difference of active force reaction force, (butterfly spring elastic stress, in the middle of pressing plate, is directed upwardly; The fastening force of nut is in pressing plate corner, direction down), upper lower platen can produce matrix Bending Deformation, butterfly spring upwards stretches, as shown in Figure 2, if after pressing machine pressure assembling force withdraws completely, upper lower platen each deformation Δ D, then butterfly spring has stretched 2 Δ D, then on semiconductor module lower platen middle ware apart from being D=d+2 Δ D;
If the coefficient of elasticity of butterfly spring is k, then after pressing machine is withdrawn, transfer to the power on double threaded screw, namely last pressure assembling force is: f=F-2 Δ Dk.Usually, the coefficient of elasticity of butterfly spring and the deflection of pressing plate larger, the conversion of the pressure assembling force after this press-fit approach press-fits is larger.
The semiconductor module that the press-fit approach adopting center single-point to exert pressure press-fits is tested, its press-fit keep in rear element semiconductor module press-fit force value and required value differs by more than more than 30%.
2. semiconductor module press-fits in process, and upper lower platen easily forms dislocation, and the pressing plate side depth of parallelism is poor.
As the schematic diagram that Fig. 3 is the dislocation of upper lower platen, its main cause occurred for before press-fiting not by upper lower platen adjustment alignment, to press-fit in process and also the device that upper lower platen carries out clamping and positioning do not positioned.
Summary of the invention
For above-mentioned technical problem, the present invention aims to provide one, and to press-fit Job Operations easy, and the accuracy of the inner pressure assembling force of semiconductor module is higher, the press mounting structure of the better semiconductor module of the depth of parallelism between upper and lower pressing plate and pressing method thereof.
The technical scheme that the present invention deals with problems is: a kind of press mounting structure of semiconductor module, comprise the upper and lower pressing plate being arranged on semiconductor module two ends, screw rod is adopted to be fixedly connected with between upper and lower pressing plate, especially the some stressed keeper be connected on pressing machine is also comprised, stressed keeper is arranged at the edge of pressing plate, this edge applies the compression point of pressure assembling force as pressing machine, and pressing plate is located by this stressed keeper.
In technique scheme, described pressing plate has corner angle, and described stressed keeper is arranged at each edges and corners of pressing plate, and these edges and corners apply the compression point of pressure assembling force as pressing machine, and each corner angle of pressing plate are located by this stressed keeper.
Further, pressing machine workbench is the workbench with T-slot; Described stressed keeper is B briquetting, and its top is provided with the T-shaped boss that can assemble with T-slot on pressing machine, and B briquetting bottom is arranged with the location notch mated with pressing plate corner angle; The T-slot of B briquetting and pressing machine removably connects.
Meanwhile, a kind of pressing method of semiconductor module is provided, comprises the steps:
(1) what arrange pressing machine equipment press-fits force value;
(2) semiconductor module is placed on correspondence in pressing machine equipment and press-fits position, and the stressed keeper in the edge of pressing plate is positioned, then pressure assembling force is applied to platen edge;
(3), after pressure assembling force applying puts in place, clam member nut, discharges pressure assembling force afterwards.
In above-mentioned pressing method, pressing plate used in step (2) is the pressing plate with corner angle, and stressed keeper used is B briquetting used in claim 3; Its step (2) press-fits position for semiconductor module is placed on correspondence in pressing machine equipment, and by each corner angle of pressing plate B briquetting location, then applies pressure assembling force to each angle point.
Press mounting structure force analysis of the present invention is as follows:
Pressing machine applies pressure assembling force F to semiconductor module, and in semiconductor module, deformation occurs in butterfly spring compression, and semiconductor module stores pressure assembling force F.Press-fit the edge that force is upper lower platen, now, upper lower platen is subject to pressing machine pressure assembling force because of edge, the middle reciprocal resilience force by butterfly spring; The deformation of upper lower platen generation matrix.After having exerted pressure, by the nut screwing clamping on upper and lower platen edge place screw rod.
Afterwards, release pressure assembling force, rise at pressing machine, in the process that pressure assembling force is withdrawn, the pressure assembling force on semiconductor module block edge is transferred on the nut of screw rod, is converted into the fastening force of nut; When press-fiting, the upper and lower pressing plate of stress deformation has trend of rebound, but puts in place because the nut on screw rod is fastening, and pressing plate does not have space and the displacement of resilience return; Thus, pressing plate will keep deformation when press-fiting stressed F, still keeps pressure assembling force to be F in semiconductor module.
As can be seen from above-mentioned analysis, due to the press-fit approach that the present invention adopts edge multiple spot to exert pressure, after pressing machine release pressure assembling force, upper lower platen does not almost have deformation resilience, so the accuracy of the inner pressure assembling force of semiconductor module is higher;
And press-fiting in process, secured the position (playing fixture effect) of upper lower platen by stressed keeper, pressing plate can only move up and down and deformation, can not left and right torsional deformation.Thus, effectively control and ensure that the depth of parallelism press-fiting rear upper lower platen.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, the invention will be further described.
Fig. 1 is the press-fit approach structure chart of prior art.
Fig. 2 is the press mounting structure stress deformation figure of prior art.
Fig. 3 is upper lower platen dislocation vertical view.
Fig. 4 is the schematic diagram of press mounting structure of the present invention.
Fig. 5 is the force diagram of press mounting structure of the present invention.
Fig. 6 is the stress deformation figure of press mounting structure of the present invention.
Fig. 7 is B briquetting schematic diagram of the present invention.
In figure, 1-A briquetting, 2-lower support block, 3-semiconductor module, 4-nut, 5-top board, 6-lower platen, 7-screw rod, 8-B briquetting, 81-T type boss, 82-right angle location notch.
Embodiment
As shown in Figure 4, a kind of press mounting structure of semiconductor module, comprise the pressing machine workbench (not shown) with T-slot, be arranged on square top board 5 and the lower platen 6 at semiconductor module 3 two ends, screw rod 7 is adopted to be fixedly connected with between upper and lower pressing plate, especially the some B briquettings 8 be connected on pressing machine are also comprised, as shown in Figure 7, described B briquetting 8 is " work " font, top is provided with T-shaped boss 81, B briquetting 8 bottom can assembled with T-slot on pressing machine and is arranged with right angle location notch 82;
Described B briquetting 8 is arranged at each edges and corners of pressing plate, and edges and corners apply the compression point of pressure assembling force as pressing machine, and each corner angle of pressing plate are located by B briquetting 8.
Meanwhile, a kind of pressing method of semiconductor module is provided, comprises the steps:
(1) what arrange pressing machine equipment press-fits force value;
(2) semiconductor module 3 is placed on correspondence in pressing machine equipment and press-fits position, and each corner angle B briquetting 8 of pressing plate is located, then pressure assembling force is applied to each angle point;
(3), after pressure assembling force applying puts in place, clam member nut 4, discharges pressure assembling force afterwards.
The force analysis of the present embodiment is as follows:
As Fig. 5, pressing machine applies pressure assembling force F to semiconductor module 3, and in semiconductor module 3, deformation occurs in butterfly spring compression, and semiconductor module stores pressure assembling force F.Press-fit each angle point that force is upper lower platen, then each B briquetting 8 is F/4 to the pressure assembling force of semiconductor module 3.Now, upper lower platen is subject to pressing machine pressure assembling force because of corner, the middle reciprocal resilience force by butterfly spring; The deformation of upper lower platen generation matrix.After having exerted pressure, the nut 4 on upper and lower pressing plate corner place double threaded screw 7 is tightened.If the spacing press-fiting rear upper lower platen corresponding angles is d1, each angle of upper and lower pressing plate becomes Δ D1 relative to the shape in the middle part of pressing plate, as shown in Figure 6;
Afterwards, release pressure assembling force, rise at pressing machine, in the process that pressure assembling force is withdrawn, the pressure assembling force on each angle of semiconductor module is transferred on the nut 4 of double threaded screw 7, is converted into the fastening force of nut 4; When press-fiting, the upper and lower pressing plate of stress deformation has trend of rebound, but puts in place because the nut 4 on double threaded screw 7 is fastening, and upper lower platen does not have space and the displacement of resilience return; Thus, upper lower platen will keep deformation when press-fiting stressed F, and the spacing d1 of upper and lower pressing plate corresponding angles is substantially constant, still keeps pressure assembling force to be F in semiconductor module 3.
Press-fiting in process, secure the position (playing fixture effect) of upper lower platen by B briquetting 8 location, pressing plate can only move up and down and deformation, can not the torsional deformation of left and right.Thus, effectively control and ensure that the depth of parallelism press-fiting rear upper lower platen.
By pressing machine, pressure assembling force is applied to semiconductor module 3, place in semiconductor module 3 inside the pressure assembling force that pressure assembling force transducer detects its storage inside; The semiconductor module of square shaped pressing plate carries out press-fiting test.That measures two kinds of press-fit approach press-fits force value Service Efficiency.
Semiconductor module require pressure assembling force be 45KN, by pressing machine to semiconductor module apply 45KN press-fit force value, press-fit rear semiconductor inside modules butterfly spring store press-fit the following table 1 of force value:
Table 1 test press-fits force value
| Press-fit approach | Storage press-fits force value | Press-fit force value Service Efficiency |
| The press-fit approach that center single-point is exerted pressure | 34.5KN | 76.7％ |
| The press-fit approach that each angle multiple spot is exerted pressure | 40.6KN | 90.2％ |
Show from test result, the press-fit approach adopting each angle multiple spot to exert pressure, press-fit rear pressure assembling force storing value and actual requirement closer to, substantially increase the accuracy of pressure assembling force.
Claims (5)
1. the press mounting structure of a semiconductor module, comprise the upper and lower pressing plate being arranged on semiconductor module two ends, screw rod is adopted to be fixedly connected with between upper and lower pressing plate, it is characterized in that: also comprise the some stressed keeper be connected on pressing machine, stressed keeper is arranged at the edge of pressing plate, this edge applies the compression point of pressure assembling force as pressing machine, and pressing plate is located by this stressed keeper.
2. the press mounting structure of semiconductor module according to claim 1, it is characterized in that: described pressing plate has corner angle, described stressed keeper is arranged at each edges and corners of pressing plate, and edges and corners apply the compression point of pressure assembling force as pressing machine, and each corner angle of pressing plate are located by this stressed keeper.
3. the press mounting structure of half module according to claim 2, is characterized in that: pressing machine workbench is the workbench with T-slot; Described stressed keeper is B briquetting, and its top is provided with the T-shaped boss that can assemble with T-slot on pressing machine, and B briquetting bottom is arranged with the location notch mated with pressing plate corner angle; The T-slot of B briquetting and pressing machine removably connects.
4. a pressing method for semiconductor module, is characterized in that comprising the steps:
(1) what arrange pressing machine equipment press-fits force value;
(2) semiconductor module is placed on correspondence in pressing machine equipment and press-fits position, and the stressed keeper in the edge of pressing plate is positioned, then pressure assembling force is applied to platen edge;
(3), after pressure assembling force applying puts in place, clam member nut, discharges pressure assembling force afterwards.
5. the pressing method of semiconductor module according to claim 4, is characterized in that: pressing plate used in step (2) is the pressing plate with corner angle, and stressed keeper used is B briquetting used in claim 3; Its step (2) press-fits position for semiconductor module is placed on correspondence in pressing machine equipment, and by each corner angle of pressing plate B briquetting location, then applies pressure assembling force to each angle point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410566054.4A CN104392967B (en) | 2014-10-22 | 2014-10-22 | Semiconductor module pressing structure and pressing method thereof |
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| CN201410566054.4A CN104392967B (en) | 2014-10-22 | 2014-10-22 | Semiconductor module pressing structure and pressing method thereof |
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| CN104392967A true CN104392967A (en) | 2015-03-04 |
| CN104392967B CN104392967B (en) | 2017-02-01 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104766786A (en) * | 2015-04-22 | 2015-07-08 | 株洲南车时代电气股份有限公司 | Device and method for assisting press fitting assembly in press fitting for semiconductor element |
| CN109755140A (en) * | 2019-02-27 | 2019-05-14 | 西安派瑞功率半导体变流技术股份有限公司 | The general automatic press mounting mechanism of high-power electric-power semiconductor device |
| CN111595557A (en) * | 2020-06-05 | 2020-08-28 | 哈工大机器人南昌智能制造研究院 | Laser Bar chip automatic checkout device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104766786A (en) * | 2015-04-22 | 2015-07-08 | 株洲南车时代电气股份有限公司 | Device and method for assisting press fitting assembly in press fitting for semiconductor element |
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| CN109755140A (en) * | 2019-02-27 | 2019-05-14 | 西安派瑞功率半导体变流技术股份有限公司 | The general automatic press mounting mechanism of high-power electric-power semiconductor device |
| CN109755140B (en) * | 2019-02-27 | 2023-10-17 | 西安派瑞功率半导体变流技术股份有限公司 | Universal automatic press-fitting mechanism for high-power semiconductor device |
| CN111595557A (en) * | 2020-06-05 | 2020-08-28 | 哈工大机器人南昌智能制造研究院 | Laser Bar chip automatic checkout device |
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Address after: The age of 412001 in Hunan Province, Zhuzhou Shifeng District Road No. 169 Patentee after: ZHUZHOU CRRC TIMES ELECTRIC Co.,Ltd. Address before: The age of 412001 in Hunan Province, Zhuzhou Shifeng District Road Patentee before: ZHUZH CSR TIMES ELECTRIC Co.,Ltd. |
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