CN104031578A - Anisotropic conductive adhesive adopting particles with three different functions, namely, conducting, reinforcing and filling - Google Patents
Anisotropic conductive adhesive adopting particles with three different functions, namely, conducting, reinforcing and filling Download PDFInfo
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- CN104031578A CN104031578A CN201410264133.XA CN201410264133A CN104031578A CN 104031578 A CN104031578 A CN 104031578A CN 201410264133 A CN201410264133 A CN 201410264133A CN 104031578 A CN104031578 A CN 104031578A
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Abstract
The invention discloses an anisotropic conductive adhesive adopting particles with three different functions, namely, conducting, reinforcing and filling. The anisotropic conductive adhesive is prepared by dispersedly adding particles with three different functions, namely, conducting, reinforcing and filling to the epoxy resin adhesive, by terms of the number of the functional particles contained in the anisotropic conductive adhesive, the anisotropic conductive adhesive per 2*10<5> cubic micrometer comprises 7-8 of resin-core silver-plated conductive particles of which the diameter is 6 micrometers, 4-5 of tin-enhanced particles of which the diameter is 6 micrometers and 18-20 of insulation thermally-conductive filling particles of which the diameter is 4 micrometers, the anisotropic conductive adhesive has the characteristics of short preparation process, good thermal and electricity conductivities and high reliability and is used for LED flip chip packaging to achieve the technical effects of excellent and reliable thermal and electricity conductivities and heat dissipation and adhesive properties and the requirements of LED flip chip packaging technology are fully met.
Description
Technical field
The present invention relates to a kind of anisotropic conducting rubber for bonding LED flip-chip, particularly a kind of anisotropic conducting rubber that adopts conduction, enhancing, fills three kinds of difference in functionality particles.Belong to LED Flip-Chip Using technical field.
Background technology
Semiconductor light-emitting-diode LED is a kind of Novel electric light source, owing to having, electric quantity consumption is low, stable performance, life-span are long, pollution-free, use the advantages such as simple, at present in a large number for illumination and decoration, but application LED has an important technical barrier, it is exactly heat radiation, for this reason, engineering technical personnel have taked various means, but effect is all undesirable.Although LED flip-chip is better than LED formal dress chip cooling performance, but because existing LED Flip-Chip Using is all lower with the thermal conductivity of adhesives and installation base plate, the capacity of heat transmission is poor, the heat that causes LED to produce is difficult to disperse, the enhance heat of must taking measures, also just to LED, large batch of intensive use forms restriction for this, becomes the technical bottleneck of promoting the use of now LED illumination lighting engineering.
Summary of the invention
Technical problem to be solved by this invention is the adhesives that a kind of suitable LED Flip-Chip Using of exploitation is used, i.e. a kind of anisotropic conducting rubber that adopts conduction, enhancing, fills three kinds of difference in functionality particles, the heat radiation difficult problem while use to solve LED flip-chip.
The present invention solves the technical scheme that its technical problem takes: a kind of anisotropic conducting rubber that adopts conduction, enhancing, fills three kinds of difference in functionality particles, it is in epoxy resin glue, to disperse to add the particle of conduction, enhancing, three kinds of difference in functionalitys of filling to make, in its contained functional particles number, every 2 × 10
5in the anisotropic conducting rubber of cu μ m, contain:
7～8 of the silver-plated conducting particless of resin core that diameter is 6 microns;
The tin that diameter is 6 microns strengthens 4～5, particle;
18～20 of the insulating heat-conductive particle filled composites that diameter is 4 microns.
This employing conduction provided by the present invention, strengthen, fill the anisotropic conducting rubber of three kinds of difference in functionality particles, when use, be coated on installation base plate and want die bond LED flip-chip place, when by exerting pressure, executing heat is slightly less than after the diameter of insulating heat-conductive particle filled composite the gap between LED bottom-side electrodes and installation base plate corresponding position Copper Foil, can LED bottom-side electrodes be contacted to connection with installation base plate corresponding position Copper Foil by conducting particles, and by the tin enhancing particle of hot melt, LED bottom-side electrodes and installation base plate corresponding position Copper Foil are welded together, be communicated with by welding, guarantee LED bottom-side electrodes and the reliable electric connection of installation base plate corresponding position Copper Foil, can and strengthen particle and be full of particle filled composite between them by conducting particles again and between LED bottom-side electrodes and installation base plate corresponding position Copper Foil, form reliably, the heat transmission path of high thermal conductivity energy, ensure that the heat that LED produces effectively conducts to installation base plate by LED bottom-side electrodes, and in the corresponding position of non-electrode place, LED bottom surface and installation base plate, because this bulk is greater than conducting particles and the diameter that strengthens particle, the anisotropic conducting rubber being full of therebetween only can be brought into play the effect of bonding LED flip-chip and installation base plate after solidifying, can guarantee good insulation, thereby the anisotropic conducting rubber of this insulating heat-conductive particle filled composite that includes conduction and two kinds of larger diameter particles of enhancing and a kind of small diameter provided by the present invention is applied to LED Flip-Chip Using, can obtain conduction, heat radiation, superior and the reliable technique effect of adhesiveproperties, can fully meet the requirement of LED Flip-Chip Using technology.
Brief description of the drawings
The distribution plan of three kinds of difference in functionality particles in the employing conduction that Fig. 1 provides for the embodiment of the present invention, the anisotropic conducting rubber that strengthens, fills three kinds of difference in functionality particles;
Result of use figure after the employing conduction that Fig. 2 provides for the embodiment of the present invention, the anisotropic conducting rubber that strengthens, fills three kinds of difference in functionality particles pressurize, heat, solidify;
Reference numeral in figure:
1, the insulating heat-conductive particle filled composite of 4 microns of diameters, 2, the silver-plated conducting particles of resin core of 6 microns of diameters, 3, the tin of 6 microns of diameters strengthens particle, 4, LED flip-chip, 5, LED bottom surface N electrode, 6, LED bottom surface P electrode, 7, installation base plate, 8, Copper Foil on installation base plate.
Embodiment
Below in conjunction with embodiment, the invention will be further described, but do not limit the scope of the invention.
The embodiment of the present invention 1 provides a kind of anisotropic conducting rubber that adopts conduction, enhancing, fills three kinds of difference in functionality particles, it is in epoxy resin glue, to disperse to add the particle of conduction, enhancing, three kinds of difference in functionalitys of filling to make, in its contained functional particles number, every 2 × 10
5in the anisotropic conducting rubber of cu μ m, contain:
(2) 8 of the silver-plated conducting particless of resin core that diameter is 6 microns;
The tin that diameter is 6 microns strengthens (3) 4, particle;
(1) 20 of the aluminium nitride insulating heat-conductive particle filled composite that the aluminium sesquioxide that diameter is 4 microns or diameter are 4 microns.
The anisotropic conducting rubber of three kinds of difference in functionality particles is conducted electricity, strengthens, fills in the employing that the embodiment of the present invention 2 provides, in its contained functional particles number, every 2 × 10
5in the anisotropic conducting rubber of cu μ m, contain:
(2) 7 of the silver-plated conducting particless of resin core that diameter is 6 microns;
The tin that diameter is 6 microns strengthens (3) 5, particle;
(1) 18 of the aluminium nitride insulating heat-conductive particle filled composite that the aluminium sesquioxide that diameter is 4 microns or diameter are 4 microns.
The anisotropic conducting rubber of three kinds of difference in functionality particles is conducted electricity, strengthens, fills in the employing that the embodiment of the present invention 3 provides, in its contained functional particles number, every 2 × 10
5in the anisotropic conducting rubber of cu μ m, contain:
(2) 7 of the silver-plated conducting particless of resin core that diameter is 6 microns;
The tin that diameter is 6 microns strengthens (3) 4, particle;
(1) 18 of the aluminium nitride insulating heat-conductive particle filled composite that the aluminium sesquioxide that diameter is 4 microns or diameter are 4 microns.
Employing that the embodiment of the present invention provides conduction, strengthen, fill the anisotropic conducting rubber of three kinds of difference in functionality particles, concrete product has two types of two-pack and single components.
1, two-pack:
A component material is made up of the particle of low-molecular-weight epoxy resin, thinner, flow agent, defoamer, conduction and enhancing and three kinds of difference in functionalitys of filling.Preparation technology: make conduction, enhancing, fill three kinds of various raw material mixture → stirrings of functional particles → A component, deaeration → inspection → packaging;
B component material is glue class solidifying agent.
When use, A component, B component material are pressed to certain weight ratio and mixed, can be for the production of after high-speed stirring.
2, single component:
Moiety is: the particle of low-molecular-weight epoxy resin, thinner, flow agent, latent glue class solidifying agent, conduction and enhancing and three kinds of difference in functionalitys of filling.Preparation technology: make conduction, enhancing, fill three kinds of functional particles → various raw material mixture → stirrings, deaeration → inspection → packaging.
The anisotropic conducting rubber of employing conduction provided by the present invention, enhancing, three kinds of difference in functionality particles of filling, has the advantages that preparation technology's flow process is short, electrical and thermal conductivity performance good, reliability is high.
Claims (5)
1. an anisotropic conducting rubber that adopts conduction, enhancing, fills three kinds of difference in functionality particles, it is characterized in that it is in epoxy resin glue, to disperse to add the particle of conduction, enhancing, three kinds of difference in functionalitys of filling to make, in its contained functional particles number, every 2 × 10
5in the anisotropic conducting rubber of cu μ m, contain:
(2) 7～8 of the silver-plated conducting particless of resin core that diameter is 6 microns;
The tin that diameter is 6 microns strengthens (3) 4～5, particle;
(1) 18～20 of the insulating heat-conductive particle filled composite that diameter is 4 microns.
2. the anisotropic conducting rubber of employing conduction according to claim 1, enhancing, three kinds of difference in functionality particles of filling, is characterized in that in its contained functional particles number every 2 × 10
5in the anisotropic conducting rubber of cu μ m, contain:
(2) 8 of the silver-plated conducting particless of resin core that diameter is 6 microns;
The tin that diameter is 6 microns strengthens (3) 4, particle;
(1) 20 of the insulating heat-conductive particle filled composite that diameter is 4 microns.
3. the anisotropic conducting rubber of employing conduction according to claim 1, enhancing, three kinds of difference in functionality particles of filling, is characterized in that in its contained functional particles number every 2 × 10
5in the anisotropic conducting rubber of cu μ m, contain:
(2) 7 of the silver-plated conducting particless of resin core that diameter is 6 microns;
The tin that diameter is 6 microns strengthens (3) 4, particle;
(1) 18 of the insulating heat-conductive particle filled composite that diameter is 4 microns.
4. the anisotropic conducting rubber of employing conduction according to claim 1, enhancing, three kinds of difference in functionality particles of filling, is characterized in that in its contained functional particles number every 2 × 10
5in the anisotropic conducting rubber of cu μ m, contain:
(2) 7 of the silver-plated conducting particless of resin core that diameter is 6 microns;
The tin that diameter is 6 microns strengthens (3) 5, particle;
(1) 18 of the insulating heat-conductive particle filled composite that diameter is 4 microns.
5. according to the anisotropic conducting rubber of the employing conduction described in claim 1,2,3 or 4, enhancing, three kinds of difference in functionality particles of filling, it is characterized in that: the insulating heat-conductive particle filled composite (1) that its contained diameter is 4 microns is aluminium sesquioxide or aluminum nitride particle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410264133.XA CN104031578B (en) | 2014-06-13 | 2014-06-13 | Adopt conduction, strengthen, fill the anisotropic conducting rubber of three kinds of difference in functionality particles |
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| CN201410264133.XA CN104031578B (en) | 2014-06-13 | 2014-06-13 | Adopt conduction, strengthen, fill the anisotropic conducting rubber of three kinds of difference in functionality particles |
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| CN104031578B CN104031578B (en) | 2016-03-16 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105336275A (en) * | 2015-10-28 | 2016-02-17 | 江苏新广联半导体有限公司 | High-density RGB (red green blue) inverted LED (light emitting diode) display screen encapsulation structure and manufacturing method |
| WO2016192376A1 (en) * | 2015-06-04 | 2016-12-08 | 王伟 | Led flip chip solid crystal conductive adhesive structure and mounting method therefor |
| WO2019095397A1 (en) * | 2017-11-17 | 2019-05-23 | 苏州锐特捷化工制品有限公司 | Highly thermally and electrically conductive environmentally-friendly adhesive and preparation method therefor |
| CN110549040A (en) * | 2019-09-11 | 2019-12-10 | 桂林电子科技大学 | Aluminum nitride/nano-silver solder paste heat conduction material and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050247916A1 (en) * | 2004-05-06 | 2005-11-10 | Mccormick Demetrius | Compositions for use in electronics devices |
| CN102888204A (en) * | 2011-07-20 | 2013-01-23 | 爱博斯迪科化学(上海)有限公司 | Novel conductive adhesive for capacitor and capacitor adopting the novel conductive adhesive |
| CN103436197A (en) * | 2013-09-02 | 2013-12-11 | 南京萨特科技发展有限公司 | Conductive adhesive for over-temperature overcurrent protective element and production method thereof |
| CN103666363A (en) * | 2012-09-10 | 2014-03-26 | 珠海方正科技高密电子有限公司 | Conductive adhesive containing conductive macromolecules and preparation method thereof |
-
2014
- 2014-06-13 CN CN201410264133.XA patent/CN104031578B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050247916A1 (en) * | 2004-05-06 | 2005-11-10 | Mccormick Demetrius | Compositions for use in electronics devices |
| CN102888204A (en) * | 2011-07-20 | 2013-01-23 | 爱博斯迪科化学(上海)有限公司 | Novel conductive adhesive for capacitor and capacitor adopting the novel conductive adhesive |
| CN103666363A (en) * | 2012-09-10 | 2014-03-26 | 珠海方正科技高密电子有限公司 | Conductive adhesive containing conductive macromolecules and preparation method thereof |
| CN103436197A (en) * | 2013-09-02 | 2013-12-11 | 南京萨特科技发展有限公司 | Conductive adhesive for over-temperature overcurrent protective element and production method thereof |
Non-Patent Citations (2)
| Title |
|---|
| 康永等: "2.1填料的导热特性", 《化学工业》, vol. 29, no. 12, 31 December 2011 (2011-12-31), pages 42 - 45 * |
| 张洪雁等: "《高性能橡胶密封材料》", 31 July 2007, article "17.5.2绝缘导热密封剂基本组成和制备工艺", pages: 361-362 * |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016192376A1 (en) * | 2015-06-04 | 2016-12-08 | 王伟 | Led flip chip solid crystal conductive adhesive structure and mounting method therefor |
| US10424706B2 (en) | 2015-06-04 | 2019-09-24 | Jianwei Chen | LED flip chip die-bond conductive adhesive structure and mounting method thereof |
| CN105336275A (en) * | 2015-10-28 | 2016-02-17 | 江苏新广联半导体有限公司 | High-density RGB (red green blue) inverted LED (light emitting diode) display screen encapsulation structure and manufacturing method |
| WO2019095397A1 (en) * | 2017-11-17 | 2019-05-23 | 苏州锐特捷化工制品有限公司 | Highly thermally and electrically conductive environmentally-friendly adhesive and preparation method therefor |
| CN110549040A (en) * | 2019-09-11 | 2019-12-10 | 桂林电子科技大学 | Aluminum nitride/nano-silver solder paste heat conduction material and preparation method thereof |
| CN110549040B (en) * | 2019-09-11 | 2021-09-14 | 桂林电子科技大学 | Aluminum nitride/nano-silver solder paste heat conduction material and preparation method thereof |
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| CN104031578B (en) | 2016-03-16 |
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