CN204011480U - A kind of electric heating separates the also circuit board of integrated LED chip - Google Patents
A kind of electric heating separates the also circuit board of integrated LED chip Download PDFInfo
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- CN204011480U CN204011480U CN201420328754.5U CN201420328754U CN204011480U CN 204011480 U CN204011480 U CN 204011480U CN 201420328754 U CN201420328754 U CN 201420328754U CN 204011480 U CN204011480 U CN 204011480U
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- led chip
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- solder joint
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Abstract
Electric heating separates an also circuit board for integrated LED chip, comprising: the circuit layer of pressing, insulating barrier and heat dissipating layer successively; On described circuit layer, possesses the hole slot that at least one is communicated to heat dissipating layer; In described hole slot, be filled with highly heat-conductive material; One end of described highly heat-conductive material is connected on described heat dissipating layer; The other end of described highly heat-conductive material is provided with LED chip; Described circuit layer is provided with at least one LED solder joint, and described LED solder joint is arranged on the outside of described hole slot; The P utmost point of described LED chip is connected with described LED solder joint by gold thread respectively with the N utmost point; And an anodal and negative pole, described positive pole is connected with LED solder joint described in each by circuit layer with negative pole.
Description
Technical field
The utility model relates to LED and manufactures field, relates in particular to a kind of LED circuit plate.
Background technology
Along with the progress of LED technology, heat radiation becomes restriction LED technology and continues the important bottleneck developing.In traditional handicraft, on LED substrate, there is the aluminium lamination of being divided into, insulating barrier and copper foil layer; Copper and aluminium possess good thermal conductivity as metal material, but due to the existence of insulating barrier, the thermal conductivity of this bi-material reduces greatly, and the heat that has therefore caused LED chip to produce cannot distribute in time, and high temperature has seriously shortened the life-span of LED chip for a long time.
Meanwhile, in traditional LED manufacture craft, each LED core all needs to connect encapsulation separately after both positive and negative polarity, has caused cost of manufacture increase, and anodally can block with negative pole the light that a part of LED chip sends, and causes luminous efficiency reduction.
Utility model content
Technical problem underlying to be solved in the utility model is to provide a kind of LED circuit plate, can realize high heat conduction and without each LED chip is encapsulated separately, increase the luminous efficiency of LED chip.
In order to solve above-mentioned technical problem, the utility model provides a kind of electric heating to separate the also circuit board of integrated LED chip, comprising:
The circuit layer of pressing, insulating barrier and heat dissipating layer successively; On described circuit layer, possesses the hole slot that at least one is communicated to heat dissipating layer;
In described hole slot, be filled with highly heat-conductive material; One end of described highly heat-conductive material is connected on described heat dissipating layer; The other end of described highly heat-conductive material is provided with at least one LED chip;
Described circuit layer is provided with at least one LED solder joint, the mutual independence of described LED solder joint and be arranged on the outside of described hole slot; The P utmost point of described LED chip is connected with described LED solder joint by gold thread respectively with the N utmost point; And
On described circuit layer, be also provided with an anodal and negative pole, described positive pole is connected with LED solder joint described in each by circuit with negative pole.
In a preferred embodiment: the material of described Heat Conduction Material is plated metal or changes metal.
In a preferred embodiment: the material of described circuit layer is Copper Foil; The material of described insulating barrier is epoxy resin; The material of described heat dissipating layer is aluminium.
In a preferred embodiment: fill with viscose glue in the gap between described hole slot and described Heat Conduction Material.
In a preferred embodiment: described LED chip is flip LED chips.
Compared to prior art, the technical solution of the utility model possesses following beneficial effect:
1. the technical scheme that the utility model provides has realized electric heating separation, thereby the heat that LED chip is produced is directly delivered in heat dissipating layer by highly heat-conductive material, has greatly promoted heat-conducting effect.
2. in the technical scheme that the utility model provides, LED chip shares a positive pole and a negative pole, so without LED chip is encapsulated separately, saved cost.Also avoid positive pole and negative pole to luminous the blocking of LED chip, improved luminous efficiency.
3. in the technical scheme that the utility model provides, LED chip adopts reverse installation process fixed installation, has further improved luminous efficiency.
Brief description of the drawings
Fig. 1 is the hierarchical diagram of circuit board in the utility model preferred embodiment;
Fig. 2 is the overall structure figure of circuit board in the utility model preferred embodiment.
Embodiment
Below with embodiment, the utility model is described further by reference to the accompanying drawings.
With reference to figure 1, Fig. 2.Electric heating separates an also circuit board for integrated LED chip, comprising:
The circuit layer 1 of pressing, insulating barrier 2 and heat dissipating layer 3 successively; On described circuit layer 1, possesses the hole slot 11 that at least one is communicated to heat dissipating layer 3; In the present embodiment, described circuit layer 1 is Copper Foil, and insulating barrier 2 is epoxy resin, and heat dissipating layer is aluminium.
In described hole slot 11, be filled with highly heat-conductive material 12, in the present embodiment, described highly heat-conductive material 12 is selected electro-coppering; One end of described highly heat-conductive material 12 is connected on described heat dissipating layer 3; The other end of described highly heat-conductive material 12 is provided with at least one LED chip 13; In the present embodiment, described LED chip 13 is flip LED chips.
Described circuit layer is provided with at least one LED solder joint 14, and described LED solder joint arranges 14 in the outside of described hole slot 11, and in the present embodiment, described LED solder joint 14 is circular distribution with described hole slot 11; The P utmost point of described LED chip 13 is connected with described LED solder joint 14 by gold thread 15 respectively with the N utmost point; And
On described circuit layer 1, be also provided with one anodal 16 and one negative pole 17, described anodal 16 are connected with LED solder joint 14 described in each by circuit with negative pole 17.
The technical scheme that the utility model provides has realized electric heating separation, thereby the heat that LED chip is produced is directly delivered in heat dissipating layer 3 by highly heat-conductive material 12, has greatly promoted heat-conducting effect.In addition LED chip 13 shares a positive pole 16 and a negative pole 17, so without LED chip 13 is encapsulated separately, saved cost.Also avoid positive pole and negative pole to luminous the blocking of LED chip, improved luminous efficiency.LED chip 13 adopts reverse installation process fixed installation, has further improved luminous efficiency.
The above, it is only utility model preferred embodiment, not the technical scope of utility model is imposed any restrictions, therefore any trickle amendment that every foundation technical spirit of the present utility model is done above example, equivalent variations and modification, all still belong in the scope of technical solutions of the utility model.
Claims (4)
1. electric heating separates an also circuit board for integrated LED chip, it is characterized in that comprising:
The circuit layer of pressing, insulating barrier and heat dissipating layer successively; On described circuit layer, possesses the hole slot that at least one is communicated to heat dissipating layer;
In described hole slot, be filled with highly heat-conductive material; One end of described highly heat-conductive material is connected on described heat dissipating layer; The other end of described highly heat-conductive material is provided with at least one LED chip;
Described circuit layer is provided with at least one LED solder joint, the mutual independence of described LED solder joint and be arranged on the outside of described hole slot; The P utmost point of described LED chip is connected with described LED solder joint by gold thread respectively with the N utmost point;
On described circuit layer, be also provided with an anodal and negative pole, described positive pole is connected with LED solder joint described in each by circuit with negative pole.
2. a kind of electric heating according to claim 1 separates the also circuit board of integrated LED chip, it is characterized in that: the material of described Heat Conduction Material is plated metal or changes metal.
3. a kind of electric heating according to claim 1 separates the also circuit board of integrated LED chip, it is characterized in that: the material of described circuit layer is Copper Foil; The material of described insulating barrier is epoxy resin; The material of described heat dissipating layer is aluminium.
4. a kind of electric heating according to claim 1 separates the also circuit board of integrated LED chip, it is characterized in that: described LED chip is flip LED chips.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420328754.5U CN204011480U (en) | 2014-06-19 | 2014-06-19 | A kind of electric heating separates the also circuit board of integrated LED chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420328754.5U CN204011480U (en) | 2014-06-19 | 2014-06-19 | A kind of electric heating separates the also circuit board of integrated LED chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204011480U true CN204011480U (en) | 2014-12-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420328754.5U Expired - Fee Related CN204011480U (en) | 2014-06-19 | 2014-06-19 | A kind of electric heating separates the also circuit board of integrated LED chip |
Country Status (1)
| Country | Link |
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| CN (1) | CN204011480U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105280793A (en) * | 2014-06-19 | 2016-01-27 | 厦门汇耕电子工业有限公司 | Electric-thermal separated, LED chip integrated and high-reflectivity circuit board and manufacture method thereof |
-
2014
- 2014-06-19 CN CN201420328754.5U patent/CN204011480U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105280793A (en) * | 2014-06-19 | 2016-01-27 | 厦门汇耕电子工业有限公司 | Electric-thermal separated, LED chip integrated and high-reflectivity circuit board and manufacture method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141210 Termination date: 20180619 |
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| CF01 | Termination of patent right due to non-payment of annual fee |