Nothing Special   »   [go: up one dir, main page]

BR112015001173A2 - adesivo reativo de fusão a quente - Google Patents

adesivo reativo de fusão a quente

Info

Publication number
BR112015001173A2
BR112015001173A2 BR112015001173A BR112015001173A BR112015001173A2 BR 112015001173 A2 BR112015001173 A2 BR 112015001173A2 BR 112015001173 A BR112015001173 A BR 112015001173A BR 112015001173 A BR112015001173 A BR 112015001173A BR 112015001173 A2 BR112015001173 A2 BR 112015001173A2
Authority
BR
Brazil
Prior art keywords
hot melt
reactive adhesive
melt reactive
adhesives
adhesive
Prior art date
Application number
BR112015001173A
Other languages
English (en)
Inventor
Suen Wu
Original Assignee
Henkel US IP LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel US IP LLC filed Critical Henkel US IP LLC
Publication of BR112015001173A2 publication Critical patent/BR112015001173A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/2805—Compounds having only one group containing active hydrogen
    • C08G18/288—Compounds containing at least one heteroatom other than oxygen or nitrogen
    • C08G18/289—Compounds containing at least one heteroatom other than oxygen or nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/26—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L91/00—Compositions of oils, fats or waxes; Compositions of derivatives thereof
    • C08L91/06—Waxes
    • C08L91/08—Mineral waxes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C09J201/10—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/2805—Compounds having only one group containing active hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00—Compositions for adhesives
    • C08G2170/20—Compositions for hot melt adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/01—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L91/00—Compositions of oils, fats or waxes; Compositions of derivatives thereof
    • C08L91/06—Waxes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L93/00—Compositions of natural resins; Compositions of derivatives thereof
    • C08L93/04—Rosin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

resumo patente de invenção: "adesivo reativo de fusão a quente". a presente invenção refere-se a composições adesivas de fusão a quente reativas com silano com força verde melhorada, à produção de tais adesivos e ao uso de tais adesivos. 1/1
BR112015001173A 2012-07-24 2013-07-18 adesivo reativo de fusão a quente BR112015001173A2 (pt)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201261674884P 2012-07-24 2012-07-24
US201261738644P 2012-12-18 2012-12-18
US13/839,138 US9365751B2 (en) 2012-07-24 2013-03-15 Reactive hot melt adhesive
PCT/US2013/050977 WO2014018349A1 (en) 2012-07-24 2013-07-18 Reactive hot melt adhesive

Publications (1)

Publication Number Publication Date
BR112015001173A2 true BR112015001173A2 (pt) 2017-06-27

Family

ID=49993722

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112015001173A BR112015001173A2 (pt) 2012-07-24 2013-07-18 adesivo reativo de fusão a quente

Country Status (13)

Country Link
US (1) US9365751B2 (pt)
EP (1) EP2877548B1 (pt)
JP (1) JP6078644B2 (pt)
CN (1) CN104487535B (pt)
AU (1) AU2013293347B2 (pt)
BR (1) BR112015001173A2 (pt)
CL (1) CL2015000156A1 (pt)
ES (1) ES2834624T3 (pt)
PL (1) PL2877548T3 (pt)
PT (1) PT2877548T (pt)
RU (1) RU2642627C2 (pt)
TW (1) TW201412914A (pt)
WO (1) WO2014018349A1 (pt)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9225296B2 (en) 2012-07-23 2015-12-29 Dali Systems Co. Ltd. Method and system for aligning signals widely spaced in frequency for wideband digital predistortion in wireless communication systems
RU2652254C2 (ru) * 2013-01-24 2018-04-25 ХЕНКЕЛЬ АйПи ЭНД ХОЛДИНГ ГМБХ Реактивный клей-расплав
CN105899614B (zh) 2014-01-14 2019-06-04 汉高知识产权控股有限责任公司 具有改进粘合性的反应性热熔性粘合剂
US20160326408A1 (en) * 2015-05-08 2016-11-10 Henkel lP & Holding GmbH Moisture curable hot melt adhesive with high adhesion strength and fast set time
CA3059467A1 (en) 2017-04-26 2018-11-01 Henkel IP & Holding GmbH Silane modified polymers with improved properties
ES2952150T3 (es) 2017-05-03 2023-10-27 Henkel Ag & Co Kgaa Polímeros modificados con silano, de características mejoradas para composiciones de adhesivo
FR3068633B1 (fr) * 2017-07-04 2019-08-23 Bostik Sa Preparation d'une composition adhesive dans une extrudeuse
WO2019109328A1 (en) * 2017-12-08 2019-06-13 Henkel Ag & Co. Kgaa Moisture Curable Hot-melt Adhesive Composition
CN108559437B (zh) * 2018-02-28 2020-12-08 广州市白云化工实业有限公司 反应型聚氨酯热熔胶及其制备方法
US11046872B2 (en) * 2018-12-03 2021-06-29 Toyota Boshoku Kabushiki Kaisha Two-component hot melt adhesive, solidified product, and method for controlling cross-linking time
DE102020111278A1 (de) * 2020-04-24 2021-10-28 Klebchemie M.G. Becker Gmbh & Co. Kg Reaktive Heißschmelzklebstoffzusammensetzungen basierend auf alpha-Silan-terminierten organischen Polymeren
EP4413084A2 (en) * 2021-10-08 2024-08-14 Synthomer Adhesive Technologies LLC Silane-functionalised rosin compositions
DE102021127517A1 (de) * 2021-10-22 2023-04-27 Klebchemie M.G. Becker GmbH & Co KG Reaktive Heißschmelzklebstoffzusammensetzungen basierend auf alpha-Silan-terminierten organischen Polymeren

Family Cites Families (74)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5974149A (ja) 1982-10-20 1984-04-26 Kanegafuchi Chem Ind Co Ltd 硬化性組成物
JPS60235747A (ja) 1984-05-07 1985-11-22 Nippon Telegr & Teleph Corp <Ntt> 光フアイバ接続部の補強方法
US4783504A (en) 1986-02-28 1988-11-08 Shell Oil Company Hot melt adhesive containing a silane grafted hydrogenated block polymer
GB8625528D0 (en) 1986-10-24 1986-11-26 Swift Adhesives Ltd Adhesive compositions
CA1312408C (en) 1987-10-09 1993-01-05 Peter W. Merz Reactive, thixotropic hot-melt adhesive on silane basis
JP2650696B2 (ja) 1987-12-18 1997-09-03 横浜ゴム株式会社 ホットメルト接着剤組成物
GB8811616D0 (en) 1988-05-17 1988-06-22 Swift Adhesives Ltd Compositions
GB8811615D0 (en) 1988-05-17 1988-06-22 Swift Adhesives Ltd Adhesive compositions
JP2649824B2 (ja) 1988-05-31 1997-09-03 三井・デュポンポリケミカル株式会社 架橋性樹脂組成物
DE3827464A1 (de) 1988-08-12 1990-02-22 Henkel Kgaa Alkoxysilanterminierte, feuchtigkeitsvernetzende schmelzkleber sowie ihre verwendung als klebe- und dichtmassen
US5097053A (en) 1988-10-13 1992-03-17 Basf Corporation Fast-cure polyurethane sealant composition containing silyl-substituted guanidine accelerators
JPH02150488A (ja) 1988-12-02 1990-06-08 Mitsui Toatsu Chem Inc プライマー組成物とその接着加工方法
GB8924619D0 (en) 1989-11-01 1989-12-20 Swift Adhesives Ltd Crosslinkable polymers
GB8927003D0 (en) 1989-11-29 1990-01-17 Swift Adhesives Ltd Chemical compounds
DE4000695C2 (de) 1990-01-12 1997-07-03 Huels Chemische Werke Ag Weitgehend amorphe Polyalphaolefine mit enger Molekulargewichtsverteilung, Verfahren zu deren Herstellung und Verwendung für Teppichschwerbeschichtungsmassen oder Schmelzklebstoffe
US5331049A (en) 1990-06-22 1994-07-19 Exxon Chemical Patents Inc. Water-curable, hot melt adhesive composition
JPH04176028A (ja) 1990-11-07 1992-06-23 Funai Denki Kenkyusho:Kk ディスクの偏心ずれ吸収装置
JPH04335080A (ja) 1991-05-11 1992-11-24 Kanegafuchi Chem Ind Co Ltd 反応性ホットメルト接着剤を用いた接着方法
US5210150A (en) 1991-11-22 1993-05-11 E. I. Du Pont De Nemours And Company Moisture-curable melt-processible ethylene copolymer adhesives
US5346939A (en) 1993-01-25 1994-09-13 Minnesota Mining And Manufacturing Company Water curable resin compositions
US5472785A (en) * 1994-04-12 1995-12-05 Minnesota Mining And Manufacturing Company Reactive wax-containing moisture curable hot melt composition
US5461110A (en) 1994-05-04 1995-10-24 Du Pont Canada Inc. Cross-linkable adhesive polymers
GB2292154A (en) 1994-08-10 1996-02-14 Minnesota Mining & Mfg Abrasive elements comprising adhesives cross-linked via silyl groups
US5669940A (en) 1995-08-09 1997-09-23 Minnesota Mining And Manufacturing Company Abrasive article
EP0827994B1 (de) 1996-09-04 2002-12-18 Degussa AG Verwendung von silangepfropften amorphen Poly-alpha-Olefinen als feuchtigkeitsvernetzender Klebrohstoff oder Klebstoff
JP3976350B2 (ja) 1997-03-14 2007-09-19 スリーエム カンパニー 反応性シラン官能性を有する要求に応じて硬化する、湿分硬化性組成物
JP3681854B2 (ja) 1997-03-17 2005-08-10 ダイセル化学工業株式会社 シラン変性熱可塑性エラストマー及びホットメルト接着剤
EP1080126B1 (en) 1998-04-27 2003-10-22 Essex Specialty Products, Inc. Method of bonding a window to a substrate using a silane functional adhesive composition
US6828403B2 (en) 1998-04-27 2004-12-07 Essex Specialty Products, Inc. Method of bonding a window to a substrate using a silane functional adhesive composition
US6121354A (en) 1998-11-19 2000-09-19 Bostik, Inc. High performance single-component sealant
JP3030020B1 (ja) 1998-12-10 2000-04-10 コニシ株式会社 ウレタン系樹脂及びその製造方法
WO2000040654A1 (fr) 1999-01-05 2000-07-13 Kaneka Corporation Composition de resine durcissable
WO2000043432A1 (en) 1999-01-20 2000-07-27 H.B. Fuller Licensing & Financing, Inc. Moisture curable polyurethane compositions
EP1036807B1 (en) 1999-03-18 2007-12-12 Kaneka Corporation Curable composition
DE60021460T2 (de) 1999-03-25 2006-04-20 Kaneka Corp. Härtbare Zusammensetzung
CA2302653A1 (en) 1999-03-29 2000-09-29 Hideharu Jyono Curable composition
JP4414045B2 (ja) 1999-06-01 2010-02-10 株式会社カネカ 硬化性樹脂組成物
DE10132678A1 (de) 2000-07-26 2002-02-07 Henkel Kgaa Alkoxysilylgruppenhaltige Bindemittel und Bindemittelzusammensetzungen, Verfahren zu deren Herstellung und deren Verwendung
US6433055B1 (en) 2000-09-13 2002-08-13 Dow Corning Corporation Electrically conductive hot-melt silicone adhesive composition
US6664323B2 (en) 2001-02-02 2003-12-16 General Electric Company Moisture curable sealants
DE10139132A1 (de) 2001-08-09 2003-02-27 Consortium Elektrochem Ind Alkoxyvernetzende einkomponentige feuchtigkeitshärtende Massen
EP1285946B1 (en) 2001-08-14 2005-05-04 Kaneka Corporation Curable resin composition
JPWO2003046079A1 (ja) 2001-11-29 2005-04-07 株式会社カネカ 硬化性組成物
JP3621678B2 (ja) 2001-12-26 2005-02-16 コニシ株式会社 ウレタン樹脂系ホットメルト接着剤
US6649016B2 (en) 2002-03-04 2003-11-18 Dow Global Technologies Inc. Silane functional adhesive composition and method of bonding a window to a substrate without a primer
US6749943B1 (en) 2002-07-02 2004-06-15 3M Innovative Properties Company Silane based moisture curing hot-melt adhesives
US20040020589A1 (en) * 2002-08-01 2004-02-05 Good David J. Hot melt adhesive
TW200407390A (en) 2002-09-03 2004-05-16 Rohm & Haas Reactive hot-melt adhesive compositions with improved adhesion to difficult substrates
US6803412B2 (en) 2003-03-13 2004-10-12 H.B. Fuller Licensing & Financing Inc. Moisture curable hot melt sealants for glass constructions
JP2005015885A (ja) 2003-06-27 2005-01-20 Ebara Corp 基板処理方法及び装置
DE10338344A1 (de) 2003-08-21 2005-03-24 Clariant Gmbh Modifizierte Polyolefinwachse
JP4176028B2 (ja) 2004-02-16 2008-11-05 大阪瓦斯株式会社 エネルギシステム
US7645831B2 (en) 2004-03-26 2010-01-12 Henkel Ag & Co. Kgaa Reactive hot melt adhesives
KR100839743B1 (ko) 2004-08-11 2008-06-19 고니시 가부시키가이샤 반응성 핫멜트 수지 조성물 및 반응성 핫멜트 접착제
US20080241407A1 (en) 2004-09-02 2008-10-02 Hsien-Kun Chu Silicone-Containing Hot-Melt Compositions
DE102004055450A1 (de) 2004-11-17 2006-05-18 Degussa Ag Feuchtigkeitshärtendes Bindemittel
DE102004062653A1 (de) 2004-12-24 2006-07-06 Bayer Materialscience Ag Feuchthärtende Zusammensetzung und Schmelzklebstoff
JP4886208B2 (ja) 2005-04-11 2012-02-29 株式会社カネカ 被着体の貼り合せ方法
DE102005026765A1 (de) * 2005-06-10 2006-12-14 Degussa Ag Rückenfixierung von Kunstrasenrohware mit Schmelzklebern auf Basis von amorphen Poly-alpha-Olefinen und/oder modifizierten, amorphen Poly-alpha-Olefinen
US7812085B2 (en) * 2005-06-24 2010-10-12 Exxonmobil Chemical Patents Inc. Functionalized propylene copolymer adhesive composition
JP4865716B2 (ja) * 2005-07-29 2012-02-01 株式会社Ｍｏｒｅｓｃｏ 接着剤組成物
EP1849845A1 (de) 2006-04-26 2007-10-31 Sika Technology AG Feuchtigkeitshärtende Zusammensetzungen enthaltend silanfunktionelle Polymere und Aminosilan-Addukte
DE102006059473A1 (de) 2006-12-14 2008-06-19 Henkel Kgaa Silylgruppen enthaltende Mischung von Prepolymeren und deren Verwendung
AU2008228842B2 (en) 2007-03-21 2014-01-16 Avery Dennison Corporation Pressure sensitive adhesives
JP5554891B2 (ja) 2007-07-20 2014-07-23 株式会社カネカ 硬化性組成物およびその使用方法
ATE446332T1 (de) 2008-03-05 2009-11-15 Sika Technology Ag Zusammensetzung mit verbesserter haftung auf porösen substraten
WO2010033383A1 (en) 2008-09-16 2010-03-25 Beckman Coulter, Inc. Interactive tree plot for flow cytometry data
DE102009001771A1 (de) 2009-03-24 2010-09-30 Henkel Ag & Co. Kgaa Erstarrende Klebstoffe mit Silanvernetzung
CN102782073B (zh) * 2009-12-22 2014-11-12 汉高公司 湿固化热熔粘合剂
JP5893000B2 (ja) * 2010-03-16 2016-03-23 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング シラン湿気硬化性ホットメルト
PL3480273T3 (pl) * 2010-11-19 2021-05-17 Henkel Ag & Co. Kgaa Kompozycje klejowe i ich zastosowanie
CN102516921B (zh) 2011-12-09 2013-10-02 山东北方现代化学工业有限公司 一种硅烷改性聚氨酯玻璃底涂剂及其制备方法
EP2607442A1 (de) 2011-12-19 2013-06-26 Sika Technology AG Reaktiver Polyolefin-Schmelzklebstoff mit niedriger Viskosität und dessen Verwendung für Textilkaschierungen
EP2730626A1 (de) 2012-11-12 2014-05-14 Sika Technology AG Reaktiver Polyolefin-Heissschmelzklebstoff mit geringer Haftung zu nichtbeschichteten Aluminiumwerkzeugen und dessen Verwendung als Kaschier-Hotmelt

Also Published As

Publication number Publication date
CN104487535A (zh) 2015-04-01
EP2877548A1 (en) 2015-06-03
JP2015527441A (ja) 2015-09-17
CN104487535B (zh) 2017-05-03
RU2642627C2 (ru) 2018-01-25
PL2877548T3 (pl) 2021-05-17
CL2015000156A1 (es) 2015-07-17
AU2013293347A1 (en) 2015-01-22
PT2877548T (pt) 2020-12-09
RU2015105801A (ru) 2016-09-10
US9365751B2 (en) 2016-06-14
ES2834624T3 (es) 2021-06-18
US20140027056A1 (en) 2014-01-30
TW201412914A (zh) 2014-04-01
AU2013293347B2 (en) 2017-04-06
JP6078644B2 (ja) 2017-02-08
EP2877548B1 (en) 2020-10-21
WO2014018349A1 (en) 2014-01-30
EP2877548A4 (en) 2016-03-16

Similar Documents

Publication Publication Date Title
BR112015001173A2 (pt) adesivo reativo de fusão a quente
WO2012042371A3 (en) Pharmaceutical composition
PH12014502397B1 (en) Pesticidal compositions and processes related thereto
WO2012064071A3 (ko) 점착제 조성물
MX2013011859A (es) Adhesivo de cianocrilato con resistencia mejorada a agua.
PL2526158T3 (pl) Udoskonalona kompozycja klejąca
WO2011138281A3 (de) Verfahren zur herstellung von dithiin-tetracarboxy-diimiden
GB201006427D0 (en) Methacrylate-based adhesive compositions
IL226383A0 (en) Antibodies against ccl20, preparations containing them and their uses
IN2014DN09891A (pt)
BR112015017087A2 (pt) adesivo de fusão a quente reativo
EP2926345A4 (en) FLEXIBLE HIGH-FILLED COMPOSITION, PROTECTIVE CLOTHING THEREOF AND METHOD FOR THE MANUFACTURE THEREOF
EP2880209A4 (en) FABRICATION OF NANOFIBRES AS DRY ADHESIVES AND THEIR APPLICATIONS
PH12015501073A1 (en) Novel pyridine derivatives
HK1188245A1 (en) Structural adhesive compositions
PL2648862T3 (pl) Zespół dwóch części zaciskanych jedna na drugiej
EP2835128A4 (en) DENTAL ADHESIVE IN ONE PACKAGING
BR112014005935A2 (pt) derivados de anilina, sua preparação e sua aplicação terapêutica
TWI563050B (en) Adhesive composition and optical member using the same
EP2739140A4 (en) PRODRUGS OF HOMOARGININE AND / OR CONJUGATES OF AMPHETAMINES AND OTHER STIMULANTS AND METHODS OF MAKING AND USING SAME
WO2013108105A3 (en) Novel solvates of darunavir
EP2890708A4 (en) PARATHYROIDHORMONE, INSULIN AND RELATED BONE-TAGING UNIT-RELATED PEPTIDES, AND METHOD FOR THE PRODUCTION AND USE THEREOF
EP2617701A4 (en) COMPOUND HAVING PROPYL ETHER AS BINDING GROUP, LIQUID CRYSTAL COMPOSITION, AND LIQUID CRYSTAL DISPLAY ELEMENT
MX2014004439A (es) Composiciones adhesivas para dentaduras postizas.
PL2611317T3 (pl) Masa klejąca do wkładek do łączenia na gorąco

Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06I Publication of requirement cancelled [chapter 6.9 patent gazette]

Free format text: ANULADA A PUBLICACAO CODIGO 6.6.1 NA RPI NO 2462 DE 13/03/2018 POR TER SIDO INDEVIDA.

B25C Requirement related to requested transfer of rights

Owner name: HENKEL US IP LLC (US)

B25A Requested transfer of rights approved

Owner name: HENKEL CORPORATION (US)

B25A Requested transfer of rights approved

Owner name: HENKEL IP AND HOLDING GMBH (DE)

B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B11B Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements