BR112014005507A2 - módulos de antena rfid e métodos de fabricação - Google Patents
módulos de antena rfid e métodos de fabricaçãoInfo
- Publication number
- BR112014005507A2 BR112014005507A2 BR112014005507A BR112014005507A BR112014005507A2 BR 112014005507 A2 BR112014005507 A2 BR 112014005507A2 BR 112014005507 A BR112014005507 A BR 112014005507A BR 112014005507 A BR112014005507 A BR 112014005507A BR 112014005507 A2 BR112014005507 A2 BR 112014005507A2
- Authority
- BR
- Brazil
- Prior art keywords
- manufacturing methods
- rfid antenna
- antenna modules
- modules
- rfid
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Applications Claiming Priority (12)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161533228P | 2011-09-11 | 2011-09-11 | |
| US13/294,578 US20120055013A1 (en) | 2010-07-13 | 2011-11-11 | Forming microstructures and antennas for transponders |
| US201161561938P | 2011-11-21 | 2011-11-21 | |
| US13/310,718 US8366009B2 (en) | 2010-08-12 | 2011-12-03 | Coupling in and to RFID smart cards |
| US201161569317P | 2011-12-12 | 2011-12-12 | |
| US201261586781P | 2012-01-14 | 2012-01-14 | |
| US201261595088P | 2012-02-05 | 2012-02-05 | |
| US201261624384P | 2012-04-15 | 2012-04-15 | |
| US201261624412P | 2012-04-16 | 2012-04-16 | |
| US201261646369P | 2012-05-14 | 2012-05-14 | |
| US201261660668P | 2012-06-15 | 2012-06-15 | |
| PCT/EP2012/066183 WO2013034426A1 (en) | 2011-09-11 | 2012-08-20 | Rfid antenna modules and methods of making |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BR112014005507A2 true BR112014005507A2 (pt) | 2017-06-13 |
Family
ID=46763058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BR112014005507A BR112014005507A2 (pt) | 2011-09-11 | 2012-08-20 | módulos de antena rfid e métodos de fabricação |
Country Status (8)
| Country | Link |
|---|---|
| EP (1) | EP2754204A1 (pt) |
| KR (1) | KR20140071423A (pt) |
| CN (1) | CN103891045B (pt) |
| AU (1) | AU2012306568A1 (pt) |
| BR (1) | BR112014005507A2 (pt) |
| CA (1) | CA2847968A1 (pt) |
| MX (1) | MX336040B (pt) |
| WO (1) | WO2013034426A1 (pt) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9112272B2 (en) | 2010-08-12 | 2015-08-18 | Feinics Amatech Teoranta | Antenna modules for dual interface smart cards, booster antenna configurations, and methods |
| US10733494B2 (en) | 2014-08-10 | 2020-08-04 | Féinics Amatech Teoranta | Contactless metal card constructions |
| US10518518B2 (en) | 2013-01-18 | 2019-12-31 | Féinics Amatech Teoranta | Smart cards with metal layer(s) and methods of manufacture |
| US10824931B2 (en) | 2012-08-30 | 2020-11-03 | Féinics Amatech Teoranta | Contactless smartcards with multiple coupling frames |
| US10552722B2 (en) | 2014-08-10 | 2020-02-04 | Féinics Amatech Teoranta | Smartcard with coupling frame antenna |
| US11551051B2 (en) | 2013-01-18 | 2023-01-10 | Amatech Group Limiied | Coupling frames for smartcards with various module opening shapes |
| US11354558B2 (en) | 2013-01-18 | 2022-06-07 | Amatech Group Limited | Contactless smartcards with coupling frames |
| US10599972B2 (en) | 2013-01-18 | 2020-03-24 | Féinics Amatech Teoranta | Smartcard constructions and methods |
| US10977542B2 (en) | 2013-01-18 | 2021-04-13 | Amtech Group Limited Industrial Estate | Smart cards with metal layer(s) and methods of manufacture |
| US11354560B2 (en) | 2013-01-18 | 2022-06-07 | Amatech Group Limited | Smartcards with multiple coupling frames |
| WO2014191123A1 (en) * | 2013-05-28 | 2014-12-04 | Féinics Amatech Teoranta | Antenna modules for dual interface smartcards, booster antenna configurations, and methods |
| CN103730733B (zh) * | 2013-09-09 | 2019-03-22 | 胜美达集团株式会社 | 电子模块 |
| KR102085105B1 (ko) * | 2019-05-20 | 2020-03-05 | 주식회사 엔에이블 | 박막화 가능한 전자 여권용 스마트 카드 |
Family Cites Families (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5084699A (en) | 1989-05-26 | 1992-01-28 | Trovan Limited | Impedance matching coil assembly for an inductively coupled transponder |
| EP0432239B1 (fr) | 1989-07-03 | 1994-08-03 | Sokymat S.A. | Procede de fabrication de composants electroniques comportant un bobinage en fil fin |
| DE3935364C1 (pt) | 1989-10-24 | 1990-08-23 | Angewandte Digital Elektronik Gmbh, 2051 Brunstorf, De | |
| JPH073808B2 (ja) | 1990-04-19 | 1995-01-18 | アキュ グスタフソ | プリント回路上へのコイル組立て方法 |
| JPH0817132B2 (ja) | 1991-02-25 | 1996-02-21 | アキュ グスタフソ | 電子回路に巻線を固定する方法 |
| CH684642A5 (fr) | 1991-02-25 | 1994-11-15 | Ake Gustafson | Pince de maintien d'un corps de bobine dans une machine de bobinage. |
| NL9100347A (nl) | 1991-02-26 | 1992-03-02 | Nedap Nv | Geintegreerde transformator voor een contactloze identificatiekaart. |
| DE4311493C2 (de) | 1993-04-07 | 2000-04-06 | Amatech Advanced Micromechanic | IC-Kartenmodul zur Herstellung einer IC-Karte |
| DE4403753C1 (de) | 1994-02-08 | 1995-07-20 | Angewandte Digital Elektronik | Kombinierte Chipkarte |
| DE4443980C2 (de) | 1994-12-11 | 1997-07-17 | Angewandte Digital Elektronik | Verfahren zur Herstellung von Chipkarten und Chipkarte hergestellt nach diesem Verfahren |
| US5955723A (en) | 1995-05-03 | 1999-09-21 | Siemens Aktiengesellschaft | Contactless chip card |
| DE19534480C2 (de) | 1995-09-18 | 1999-11-11 | David Finn | IC-Kartenmodul zur Herstellung einer IC-Karte sowie IC-Karte mit einem IC-Kartenmodul |
| ES2146989T3 (es) | 1996-02-12 | 2000-08-16 | David Finn | Procedimiento y dispositivo para el contacto de un conductor de hilo. |
| DE59701709C5 (de) | 1996-02-12 | 2014-01-09 | Smartrac Ip B.V. | Verfahren und vorrichtung zur kontaktierung eines drahtleiters |
| FR2744863B1 (fr) * | 1996-02-13 | 1998-03-06 | Schlumberger Ind Sa | Procede de realisation d'un objet portatif a antenne bobinee |
| DE19654902C2 (de) | 1996-03-15 | 2000-02-03 | David Finn | Chipkarte |
| DE19632813C2 (de) | 1996-08-14 | 2000-11-02 | Siemens Ag | Verfahren zur Herstellung eines Chipkarten-Moduls, unter Verwendung dieses Verfahrens hergestellter Chipkarten-Modul und diesen Chipkarten-Modul enthaltende Kombi-Chipkarte |
| DE19634661A1 (de) | 1996-08-28 | 1998-03-05 | David Finn | Verfahren und Vorrichtung zur Herstellung einer Spulenanordnung |
| JP2001505682A (ja) | 1996-10-09 | 2001-04-24 | ペーアーファウ カード ゲームベーハ | スマートカードの製造方法及び製造のための接続配置 |
| DE19703029A1 (de) | 1997-01-28 | 1998-07-30 | Amatech Gmbh & Co Kg | Übertragungsmodul für eine Transpondervorrichtung sowie Transpondervorrichtung und Verfahren zum Betrieb einer Transpondervorrichtung |
| DE69831592T2 (de) | 1997-11-14 | 2006-06-22 | Toppan Printing Co. Ltd. | Zusammengesetzte ic-karte |
| IL122250A (en) | 1997-11-19 | 2003-07-31 | On Track Innovations Ltd | Smart card amenable to assembly using two manufacturing stages and a method of manufacture thereof |
| EP1078559B1 (en) * | 1998-04-14 | 2002-03-13 | The Goodyear Tire & Rubber Company | Encapsulation package and method of packaging an electronic circuit module |
| WO2000010124A1 (de) | 1998-08-10 | 2000-02-24 | Kreft Hans Diedrich | Chipkarte mit erhöhter kartensicherheit |
| FR2801707B1 (fr) | 1999-11-29 | 2002-02-15 | A S K | Procede de fabrication d'une carte a puce hybride contact- sans contact avec un support d'antenne en materiau fibreux |
| US6424301B1 (en) * | 2000-03-01 | 2002-07-23 | Siemens Vdo Automotive Corporation | Combination battery holder and antenna for keyfob |
| FR2838850B1 (fr) | 2002-04-18 | 2005-08-05 | Framatome Connectors Int | Procede de conditionnement de microcircuits electroniques pour carte a puce et microcircuit electronique ainsi obtenu |
| FR2882174B1 (fr) | 2005-02-11 | 2007-09-07 | Smart Packaging Solutions Sps | Procede de fabrication d'un dispositif microelectronique a fonctionnement sans contact notamment pour passeport electronique |
| FR2890212B1 (fr) | 2005-08-30 | 2009-08-21 | Smart Packaging Solutions Sps | Module electronique a double interface de communication, notamment pour carte a puce |
| FR2890502A1 (fr) | 2005-09-02 | 2007-03-09 | Gemplus Sa | Ajustement de frequence de resonance par reglage de capacite repartie inter-spires |
| DE102005058101B4 (de) | 2005-12-05 | 2019-04-25 | Smartrac Ip B.V. | Chipkarte und Verfahren zur Herstellung einer Chipkarte |
| DE102006024247A1 (de) * | 2006-05-23 | 2007-11-29 | Denso Corp., Kariya | Drahtlose Kartentyp-Vorrichtung, Antennenspule und Verfahren zum Herstellen eines Kommunikationsmoduls |
| US8322624B2 (en) | 2007-04-10 | 2012-12-04 | Feinics Amatech Teoranta | Smart card with switchable matching antenna |
| FR2915011B1 (fr) | 2007-03-29 | 2009-06-05 | Smart Packaging Solutions Sps | Carte a puce a double interface de communication |
| US7980477B2 (en) | 2007-05-17 | 2011-07-19 | Féinics Amatech Teoranta | Dual interface inlays |
| FR2919409B1 (fr) | 2007-07-26 | 2009-09-04 | Smart Packaging Solutions Sps | Document securise a puce sans contact avec protection des donnees contre les lectures non autorisees. |
| EP2045872B1 (en) | 2007-10-03 | 2011-08-10 | Assa Abloy Ab | Coupling device for transponder and smart card with such device |
| FR2932910B1 (fr) | 2008-06-20 | 2011-02-11 | Smart Packaging Solutions Sps | Carte sans contact avec logo securitaire |
| US8474726B2 (en) | 2010-08-12 | 2013-07-02 | Feinics Amatech Teoranta | RFID antenna modules and increasing coupling |
-
2012
- 2012-08-20 AU AU2012306568A patent/AU2012306568A1/en not_active Abandoned
- 2012-08-20 CA CA2847968A patent/CA2847968A1/en not_active Abandoned
- 2012-08-20 KR KR1020147009470A patent/KR20140071423A/ko not_active Application Discontinuation
- 2012-08-20 CN CN201280044013.8A patent/CN103891045B/zh not_active Expired - Fee Related
- 2012-08-20 MX MX2014002897A patent/MX336040B/es unknown
- 2012-08-20 EP EP12753450.1A patent/EP2754204A1/en not_active Withdrawn
- 2012-08-20 BR BR112014005507A patent/BR112014005507A2/pt not_active IP Right Cessation
- 2012-08-20 WO PCT/EP2012/066183 patent/WO2013034426A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| EP2754204A1 (en) | 2014-07-16 |
| MX2014002897A (es) | 2014-10-14 |
| CN103891045B (zh) | 2016-08-17 |
| CA2847968A1 (en) | 2013-03-14 |
| WO2013034426A1 (en) | 2013-03-14 |
| AU2012306568A1 (en) | 2014-03-20 |
| KR20140071423A (ko) | 2014-06-11 |
| CN103891045A (zh) | 2014-06-25 |
| MX336040B (es) | 2016-01-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] | ||
| B08H | Application fees: decision cancelled [chapter 8.8 patent gazette] | ||
| B15I | Others concerning applications: loss of priority |
Free format text: PERDA DAS PRIORIDADES US 61/533.228, US 13/310.718, US 13/294.578, US 61/561.938, US 61/569.317, US 61/586.781, US 61/595.088, US 61/624.384, US 61/624.412, US 61/646.369 E US 61/660.668 REIVINDICADAS NO PCT/EP2012/066183, CONFORME AS DISPOSICOES PREVISTAS NA LEI 9.279 DE 14/05/1996 (LPI) ART. 16 7O, ITEM 28 DO ATO NORMATIVO 128/97 E NO ART. 29 DA RESOLUCAO INPI-PR 77/2013. ESTA PERDA SE DEU PELO FATO DE O DEPOSITANTE CONSTANTE DA PETICAO DE REQUERIMENTO DO PEDIDO PCT SER DISTINTO DAQUELES QUE DEPOSITARAM A PRIORIDADE REIVINDICADA E NAO APRESENTOU DOCUMENTO DE CESSAO REGULARIZADO DENTRO DO PRAZO DE 60 DIAS A CONTAR DA DATA DA PUBLICACAO DA EXIGENCIA, CONFORME AS DISPOSICOES PREVISTAS NA LE |
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| B06F | Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette] | ||
| B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE AS ANUIDADES EM DEBITO |
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| B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2536 DE 13/08/2019. |
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| B350 | Update of information on the portal [chapter 15.35 patent gazette] |