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FR2882174B1 - Procede de fabrication d'un dispositif microelectronique a fonctionnement sans contact notamment pour passeport electronique - Google Patents

Procede de fabrication d'un dispositif microelectronique a fonctionnement sans contact notamment pour passeport electronique

Info

Publication number
FR2882174B1
FR2882174B1 FR0501378A FR0501378A FR2882174B1 FR 2882174 B1 FR2882174 B1 FR 2882174B1 FR 0501378 A FR0501378 A FR 0501378A FR 0501378 A FR0501378 A FR 0501378A FR 2882174 B1 FR2882174 B1 FR 2882174B1
Authority
FR
France
Prior art keywords
manufacturing
microelectronic device
cavity
electronic passport
microelectronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0501378A
Other languages
English (en)
Other versions
FR2882174A1 (fr
Inventor
Olivier Brunet
Jean Francois Salvo
Ivan Peytavin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Smart Packaging Solutions SAS
Original Assignee
Smart Packaging Solutions SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR0501378A priority Critical patent/FR2882174B1/fr
Application filed by Smart Packaging Solutions SAS filed Critical Smart Packaging Solutions SAS
Priority to PCT/FR2006/000271 priority patent/WO2006084984A1/fr
Priority to EP06709260A priority patent/EP1846875A1/fr
Priority to RU2007133794/08A priority patent/RU2464635C2/ru
Priority to CN200680011238.8A priority patent/CN101203869B/zh
Priority to US11/884,123 priority patent/US7992790B2/en
Publication of FR2882174A1 publication Critical patent/FR2882174A1/fr
Priority to MA30189A priority patent/MA29314B1/fr
Application granted granted Critical
Publication of FR2882174B1 publication Critical patent/FR2882174B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07758—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
  • Credit Cards Or The Like (AREA)
  • Devices For Checking Fares Or Tickets At Control Points (AREA)
FR0501378A 2005-02-11 2005-02-11 Procede de fabrication d'un dispositif microelectronique a fonctionnement sans contact notamment pour passeport electronique Expired - Fee Related FR2882174B1 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FR0501378A FR2882174B1 (fr) 2005-02-11 2005-02-11 Procede de fabrication d'un dispositif microelectronique a fonctionnement sans contact notamment pour passeport electronique
EP06709260A EP1846875A1 (fr) 2005-02-11 2006-02-03 Procede de fabrication d'un dispositif micro-electronique a fonctionnement sans contact, notamment pour passeport electronique
RU2007133794/08A RU2464635C2 (ru) 2005-02-11 2006-02-03 Способ изготовления микроэлектронного устройства бесконтактного действия, в частности, для электронного паспорта
CN200680011238.8A CN101203869B (zh) 2005-02-11 2006-02-03 用于电子护照等的非接触微电子装置的制造方法
PCT/FR2006/000271 WO2006084984A1 (fr) 2005-02-11 2006-02-03 Procede de fabrication d’un dispositif micro-electronique a fonctionnement sans contact, notamment pour passeport electronique
US11/884,123 US7992790B2 (en) 2005-02-11 2006-02-03 Method of producing a contactless microelectronic device, such as for an electronic passport
MA30189A MA29314B1 (fr) 2005-02-11 2007-08-31 Procede de fabrication d'un dispositif micro-electronique a fonctionnement sans contact, notamment pour passeport electronique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0501378A FR2882174B1 (fr) 2005-02-11 2005-02-11 Procede de fabrication d'un dispositif microelectronique a fonctionnement sans contact notamment pour passeport electronique

Publications (2)

Publication Number Publication Date
FR2882174A1 FR2882174A1 (fr) 2006-08-18
FR2882174B1 true FR2882174B1 (fr) 2007-09-07

Family

ID=34980170

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0501378A Expired - Fee Related FR2882174B1 (fr) 2005-02-11 2005-02-11 Procede de fabrication d'un dispositif microelectronique a fonctionnement sans contact notamment pour passeport electronique

Country Status (7)

Country Link
US (1) US7992790B2 (fr)
EP (1) EP1846875A1 (fr)
CN (1) CN101203869B (fr)
FR (1) FR2882174B1 (fr)
MA (1) MA29314B1 (fr)
RU (1) RU2464635C2 (fr)
WO (1) WO2006084984A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8344958B2 (en) 2007-07-26 2013-01-01 Smart Packaging Solutions (Sps) Secured document with a contactless chip with protection of date against unauthorized access

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US8519905B2 (en) 2007-09-14 2013-08-27 Toppan Printing Co., Ltd. Antenna sheet, transponder, and booklet
FR2941316A1 (fr) * 2009-01-16 2010-07-23 Smart Packaging Solutions Sps Procede de fabrication d'un module electronique, notamment pour dispositif d'identification a puce electronique
US20100295286A1 (en) * 2009-05-13 2010-11-25 Goldstein Keith E Cover and method of manufacturing the same
WO2011019415A1 (fr) * 2009-08-10 2011-02-17 Saint-Gobain Performance Plastics Corporation Feuille de protection remplie de fluoropolymères/particules
US8474726B2 (en) 2010-08-12 2013-07-02 Feinics Amatech Teoranta RFID antenna modules and increasing coupling
US8366009B2 (en) 2010-08-12 2013-02-05 Féinics Amatech Teoranta Coupling in and to RFID smart cards
EP2369616A1 (fr) * 2010-03-22 2011-09-28 Gemalto SA Procédé de fabrication d'un module électronique comportant une puce électronique fixée sur un substrat contenant une antenne
US8991712B2 (en) 2010-08-12 2015-03-31 Féinics Amatech Teoranta Coupling in and to RFID smart cards
US8789762B2 (en) 2010-08-12 2014-07-29 Feinics Amatech Teoranta RFID antenna modules and methods of making
WO2012020073A2 (fr) 2010-08-12 2012-02-16 Féinics Amatech Teoranta Limited Modules d'antenne rfid et amélioration de couplage
US9112272B2 (en) 2010-08-12 2015-08-18 Feinics Amatech Teoranta Antenna modules for dual interface smart cards, booster antenna configurations, and methods
US9195932B2 (en) 2010-08-12 2015-11-24 Féinics Amatech Teoranta Booster antenna configurations and methods
US8870080B2 (en) 2010-08-12 2014-10-28 Féinics Amatech Teoranta RFID antenna modules and methods
US9033250B2 (en) 2010-08-12 2015-05-19 Féinics Amatech Teoranta Dual interface smart cards, and methods of manufacturing
CN102622639B (zh) * 2011-01-28 2014-09-17 中国机动车辆安全鉴定检测中心 电子护照元件层制作方法
DE102011001722A1 (de) * 2011-04-01 2012-10-04 Bundesdruckerei Gmbh Halbzeug zur Herstellung eines Chipkartenmoduls, Verfahren zur Herstellung des Halbzeuges sowie Verfahren zur Herstellung einer Chipkarte
MX2014001531A (es) 2011-08-08 2014-06-04 Féinics Amatech Teoranta Mejora de acoplamiento en y para tarjetas inteligentes de rfid.
US9390364B2 (en) 2011-08-08 2016-07-12 Féinics Amatech Teoranta Transponder chip module with coupling frame on a common substrate for secure and non-secure smartcards and tags
EP2742466B1 (fr) 2011-08-08 2017-07-19 Féinics AmaTech Teoranta Amélioration du couplage dans et sur des cartes intelligentes d'identification par radiofréquence (rfid)
CN103891045B (zh) 2011-09-11 2016-08-17 菲尼克斯阿美特克有限公司 射频识别天线模块及其制造方法
JP2015511353A (ja) 2012-02-05 2015-04-16 フェイニクス アマテック テオランタ Ｒｆｉｄアンテナ・モジュールおよび方法
EP2811427A1 (fr) 2013-06-07 2014-12-10 Gemalto SA Procédé de fabrication d'un dispositif électronique anti-fissuration
WO2017040973A1 (fr) * 2015-09-04 2017-03-09 The Trustees Of Columbia University In The City Of New York Étiquettes de détection d'identification d'ultrasons à échelle micrométrique
DE102016106698A1 (de) * 2016-04-12 2017-10-12 Infineon Technologies Ag Chipkarte und Verfahren zum Herstellen einer Chipkarte
JP6483927B2 (ja) * 2016-10-21 2019-03-13 京セラ株式会社 タグ用基板、ｒｆｉｄタグおよびｒｆｉｄシステム
DE102017103411A1 (de) * 2017-02-20 2018-08-23 Bundesdruckerei Gmbh Verfahren zur Herstellung eines Inlays für einen Folienverbund eines Sicherheits- und/oder Wertdokumentes sowie Inlay
US10282654B2 (en) * 2017-07-09 2019-05-07 Interlake Research, Llc Tag assembly methods

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US5528222A (en) * 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
FR2743649B1 (fr) * 1996-01-17 1998-04-03 Gemplus Card Int Module electronique sans contact, carte etiquette electronique l'incorporant, et leurs procedes de fabrication
FR2761497B1 (fr) * 1997-03-27 1999-06-18 Gemplus Card Int Procede de fabrication d'une carte a puce ou analogue
US6404643B1 (en) * 1998-10-15 2002-06-11 Amerasia International Technology, Inc. Article having an embedded electronic device, and method of making same
US6100804A (en) * 1998-10-29 2000-08-08 Intecmec Ip Corp. Radio frequency identification system
WO2001003188A1 (fr) * 1999-07-01 2001-01-11 Intermec Ip Corp. Procede de fixation de circuit integre et dispositif correspondant
RU2257614C2 (ru) * 1999-12-23 2005-07-27 Награид Са Электронная этикетка (варианты)
FR2824018B1 (fr) * 2001-04-26 2003-07-04 Arjo Wiggins Sa Couverture incorporant un dispositif d'identification radiofrequence
US20040062016A1 (en) * 2002-09-27 2004-04-01 Eastman Kodak Company Medium having data storage and communication capabilites and method for forming same
US7233498B2 (en) * 2002-09-27 2007-06-19 Eastman Kodak Company Medium having data storage and communication capabilities and method for forming same
US8286332B2 (en) * 2006-09-26 2012-10-16 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
CN104899080A (zh) 2014-03-05 2015-09-09 腾讯科技（深圳）有限公司 即时通讯切换实时画面的方法和装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8344958B2 (en) 2007-07-26 2013-01-01 Smart Packaging Solutions (Sps) Secured document with a contactless chip with protection of date against unauthorized access

Also Published As

Publication number Publication date
RU2464635C2 (ru) 2012-10-20
US20090057414A1 (en) 2009-03-05
RU2007133794A (ru) 2009-03-20
MA29314B1 (fr) 2008-03-03
WO2006084984A1 (fr) 2006-08-17
US7992790B2 (en) 2011-08-09
CN101203869B (zh) 2016-03-30
EP1846875A1 (fr) 2007-10-24
FR2882174A1 (fr) 2006-08-18
CN101203869A (zh) 2008-06-18

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