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ATE356541T1 - Elektronisches leistungssystem mit passiver kühlung - Google Patents

Elektronisches leistungssystem mit passiver kühlung

Info

Publication number
ATE356541T1
ATE356541T1 AT04077881T AT04077881T ATE356541T1 AT E356541 T1 ATE356541 T1 AT E356541T1 AT 04077881 T AT04077881 T AT 04077881T AT 04077881 T AT04077881 T AT 04077881T AT E356541 T1 ATE356541 T1 AT E356541T1
Authority
AT
Austria
Prior art keywords
electronic device
power system
electronic power
passive cooling
thermally coupled
Prior art date
Application number
AT04077881T
Other languages
English (en)
Inventor
Gary E Oberlin
Bruce A Myers
Thomas A Degenkolb
Darrel E Peugh
Original Assignee
Delphi Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delphi Tech Inc filed Critical Delphi Tech Inc
Application granted granted Critical
Publication of ATE356541T1 publication Critical patent/ATE356541T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AT04077881T 2003-10-27 2004-10-20 Elektronisches leistungssystem mit passiver kühlung ATE356541T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/694,191 US7106588B2 (en) 2003-10-27 2003-10-27 Power electronic system with passive cooling

Publications (1)

Publication Number Publication Date
ATE356541T1 true ATE356541T1 (de) 2007-03-15

Family

ID=34423334

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04077881T ATE356541T1 (de) 2003-10-27 2004-10-20 Elektronisches leistungssystem mit passiver kühlung

Country Status (4)

Country Link
US (1) US7106588B2 (de)
EP (1) EP1528850B1 (de)
AT (1) ATE356541T1 (de)
DE (1) DE602004005126T2 (de)

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* Cited by examiner, † Cited by third party
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GB0308305D0 (en) * 2003-04-10 2003-05-14 Hewlett Packard Development Co Digital message encryption and authentication
US7068510B2 (en) * 2003-12-04 2006-06-27 International Business Machines Corporation Dissipating heat reliably in computer systems
US7168152B1 (en) * 2004-10-18 2007-01-30 Lockheed Martin Corporation Method for making an integrated active antenna element
US7623349B2 (en) * 2005-03-07 2009-11-24 Ati Technologies Ulc Thermal management apparatus and method for a circuit substrate
TWM278218U (en) * 2005-05-19 2005-10-11 Cooler Master Co Ltd Improved water-cooling radiator structure
CN101513151B (zh) * 2006-09-06 2012-07-04 株式会社安川电机 马达控制器
KR20090006244A (ko) * 2007-07-11 2009-01-15 삼성전자주식회사 반도체 모듈
JP5324773B2 (ja) * 2007-11-06 2013-10-23 インターナショナル・ビジネス・マシーンズ・コーポレーション 回路モジュールとその製造方法
CN101727151B (zh) * 2008-10-14 2012-11-21 富准精密工业(深圳)有限公司 便携式电脑及其导热枢纽
TWI447558B (zh) * 2008-10-31 2014-08-01 Foxconn Tech Co Ltd 可攜帶式電腦及其導熱樞紐
US9036351B2 (en) * 2009-06-22 2015-05-19 Xyber Technologies, Llc Passive cooling system and method for electronics devices
US8582298B2 (en) 2009-06-22 2013-11-12 Xyber Technologies Passive cooling enclosure system and method for electronics devices
JP5445507B2 (ja) * 2010-06-03 2014-03-19 株式会社デンソー 電力変換装置
DE202012101076U1 (de) * 2011-04-14 2012-04-19 Visteon Global Technologies, Inc. Vorrichtung zum Kühlen von Batterien, insbesondere für Kraftfahrzeuge
RU2474888C2 (ru) * 2011-04-29 2013-02-10 Общество с ограниченной ответственностью "Видео Интернет Технологии" (ООО "Видео Интернет Технологии") Охлаждающее устройство для электронных компонентов
US9036355B2 (en) 2012-03-29 2015-05-19 Hamilton Sundstrand Corporation Printed wiring board (PWB) for high amperage circuits
US9405335B1 (en) * 2014-02-21 2016-08-02 Google Inc. Heat pipe cooling arrangement
US9668334B2 (en) * 2014-05-23 2017-05-30 General Electric Company Thermal clamp apparatus for electronic systems
JP6428252B2 (ja) * 2014-12-23 2018-11-28 株式会社デンソー 電力変換装置
US20170023306A1 (en) * 2015-07-22 2017-01-26 Compulab Ltd. Layered heat pipe structure for cooling electronic component
FR3060941B1 (fr) * 2016-12-19 2019-07-05 Safran Module de puissance refroidi par caloduc et procede de fabrication d'un tel module
US11469155B2 (en) * 2020-01-09 2022-10-11 Landis+Gyr Innovations, Inc. Flexible thermal coupling for a heat pipe
CN115668488A (zh) 2020-05-26 2023-01-31 罗姆股份有限公司 半导体模块的安装结构
DE102020114116A1 (de) 2020-05-26 2021-12-02 Bayerische Motoren Werke Aktiengesellschaft Leiterplatte zum Führen und Übertragen von elektrischer Energie, insbesondere für ein Kraftfahrzeug, sowie Kraftfahrzeug

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US3613778A (en) * 1969-03-03 1971-10-19 Northrop Corp Flat plate heat pipe with structural wicks
US4047198A (en) * 1976-04-19 1977-09-06 Hughes Aircraft Company Transistor cooling by heat pipes having a wick of dielectric powder
US5007478A (en) * 1989-05-26 1991-04-16 University Of Miami Microencapsulated phase change material slurry heat sinks
US5095404A (en) * 1990-02-26 1992-03-10 Data General Corporation Arrangement for mounting and cooling high density tab IC chips
DE4106185A1 (de) 1991-02-27 1992-09-03 Standard Elektrik Lorenz Ag Kuehlvorrichtung fuer elektronische einrichtungen
US5224356A (en) * 1991-09-30 1993-07-06 Triangle Research & Development Corp. Method of using thermal energy absorbing and conducting potting materials
US5206792A (en) * 1991-11-04 1993-04-27 International Business Machines Corporation Attachment for contacting a heat sink with an integrated circuit chip and use thereof
US5339214A (en) * 1993-02-12 1994-08-16 Intel Corporation Multiple-fan microprocessor cooling through a finned heat pipe
US5677048A (en) * 1996-03-04 1997-10-14 Gateway Technologies, Inc. Coated skived foam and fabric article containing energy absorbing phase change material
US6269866B1 (en) * 1997-02-13 2001-08-07 The Furukawa Electric Co., Ltd. Cooling device with heat pipe
US6082443A (en) * 1997-02-13 2000-07-04 The Furukawa Electric Co., Ltd. Cooling device with heat pipe
JP4290232B2 (ja) * 1997-02-24 2009-07-01 富士通株式会社 ヒートシンクとそれを使用する情報処理装置
US5847925A (en) * 1997-08-12 1998-12-08 Compaq Computer Corporation System and method for transferring heat between movable portions of a computer
US5949648A (en) 1998-02-26 1999-09-07 Compal Electronics Inc. Heat radiating device capable of reducing electromagnetic interference
US6084178A (en) * 1998-02-27 2000-07-04 Hewlett-Packard Company Perimeter clamp for mounting and aligning a semiconductor component as part of a field replaceable unit (FRU)
US6038128A (en) * 1998-07-14 2000-03-14 Dell U.S.A., L.P. Computer and computer/docking assembly with improved internal cooling
US6212074B1 (en) * 2000-01-31 2001-04-03 Sun Microsystems, Inc. Apparatus for dissipating heat from a circuit board having a multilevel surface
US6535396B1 (en) 2000-04-28 2003-03-18 Delphi Technologies, Inc. Combination circuit board and segmented conductive bus substrate
US6703128B2 (en) 2002-02-15 2004-03-09 Delphi Technologies, Inc. Thermally-capacitive phase change encapsulant for electronic devices
JP2003289191A (ja) 2002-03-28 2003-10-10 Denso Corp 電子制御装置
US6744640B2 (en) * 2002-04-10 2004-06-01 Gore Enterprise Holdings, Inc. Board-level EMI shield with enhanced thermal dissipation
US6665187B1 (en) * 2002-07-16 2003-12-16 International Business Machines Corporation Thermally enhanced lid for multichip modules
US6813153B2 (en) * 2002-09-18 2004-11-02 Intel Corporation Polymer solder hybrid

Also Published As

Publication number Publication date
US7106588B2 (en) 2006-09-12
DE602004005126D1 (de) 2007-04-19
EP1528850A1 (de) 2005-05-04
US20050088822A1 (en) 2005-04-28
EP1528850B1 (de) 2007-03-07
DE602004005126T2 (de) 2007-11-22

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties