Ramesham et al., 2009 - Google Patents
Review of vacuum packaging and maintenance of MEMS and the use of getters thereinRamesham et al., 2009
- Document ID
- 3847374549905324901
- Author
- Ramesham R
- Kullberg R
- Publication year
- Publication venue
- Journal of Micro/Nanolithography, MEMS and MOEMS
External Links
Snippet
Key types of microelectromechanical systems (MEMS) sensors need vacuum or other controlled ambients in order to operate properly. Examples include MEMS infrared sensors and sensitive MEMS gyros. Steps to attain and maintain the vacuum ambient include:(i) …
- 238000009461 vacuum packaging 0 title description 6
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Ramesham et al. | Review of vacuum packaging and maintenance of MEMS and the use of getters therein | |
US8405021B2 (en) | Ultracold-matter systems | |
JP5502465B2 (en) | Micromechanical casing having at least two spaces having different internal pressures and / or different gas compositions and method for manufacturing the same | |
Sparks et al. | Chip-level vacuum packaging of micromachines using nanogetters | |
US8415612B2 (en) | Channel cell system | |
Gatzen et al. | Micro and nano fabrication | |
US10509369B1 (en) | Method of manufacturing a vapor cell for alkaline-earth-like atoms inside an ultrahigh vacuum chamber | |
Yamamoto et al. | Low-temperature hermetic packaging for microsystems using Au–Au surface-activated bonding at atmospheric pressure | |
KR100554492B1 (en) | Support with integrated deposit of gas absorbing material for manufacturing microelectronic, microoptoelectronic or micromechanical devices | |
US10384932B2 (en) | Device including micromechanical components in cavities having different pressures and method for its manufacture | |
Abboud et al. | Temperature-dependent in situ studies of volatile molecule trapping in low-temperature-activated Zr alloy-based getters | |
Sparks et al. | Reliable vacuum packaging using nanogetters and glass frit bonding | |
Bosseboeuf et al. | Effect of Environment on Activation and Sorption of Getter Alloys and Multilayers for Hybrid Wafer-level Vacuum Packaging. | |
Suurmeijer et al. | Vacuum science and technology | |
US11685645B2 (en) | Micro-electromechanical system and method for producing same | |
Ramesham | Evaluation of non-evaporable getters for high vacuum hermetic packages | |
Wu et al. | Oblique angle deposition of Au/Ti porous getter films | |
A Chuntonov et al. | Getter films for small vacuum chambers | |
Paquet et al. | Influence of ceramic package internal components on the performance of vacuum sealed uncooled bolometric detectors | |
Cao et al. | Long-life micro vacuum chamber for a micromachined cryogenic cooler | |
Moraja et al. | Getters films at wafer level for wafer to wafer bonded MEMS | |
Anderson et al. | 14 Advances in WLCSP Technologies for Growing Market Needs | |
Dragoi et al. | Wafer bonding technology for new generation vacuum MEMS: challenges and promises | |
Corazza et al. | Vacuum maintenance in hermetically sealed MEMS packages | |
Rizzi et al. | Outgassing and gettering |