Nothing Special   »   [go: up one dir, main page]

Ramesham et al., 2009 - Google Patents

Review of vacuum packaging and maintenance of MEMS and the use of getters therein

Ramesham et al., 2009

Document ID
3847374549905324901
Author
Ramesham R
Kullberg R
Publication year
Publication venue
Journal of Micro/Nanolithography, MEMS and MOEMS

External Links

Snippet

Key types of microelectromechanical systems (MEMS) sensors need vacuum or other controlled ambients in order to operate properly. Examples include MEMS infrared sensors and sensitive MEMS gyros. Steps to attain and maintain the vacuum ambient include:(i) …
Continue reading at www.spiedigitallibrary.org (other versions)

Similar Documents

Publication Publication Date Title
Ramesham et al. Review of vacuum packaging and maintenance of MEMS and the use of getters therein
US8405021B2 (en) Ultracold-matter systems
JP5502465B2 (en) Micromechanical casing having at least two spaces having different internal pressures and / or different gas compositions and method for manufacturing the same
Sparks et al. Chip-level vacuum packaging of micromachines using nanogetters
US8415612B2 (en) Channel cell system
Gatzen et al. Micro and nano fabrication
US10509369B1 (en) Method of manufacturing a vapor cell for alkaline-earth-like atoms inside an ultrahigh vacuum chamber
Yamamoto et al. Low-temperature hermetic packaging for microsystems using Au–Au surface-activated bonding at atmospheric pressure
KR100554492B1 (en) Support with integrated deposit of gas absorbing material for manufacturing microelectronic, microoptoelectronic or micromechanical devices
US10384932B2 (en) Device including micromechanical components in cavities having different pressures and method for its manufacture
Abboud et al. Temperature-dependent in situ studies of volatile molecule trapping in low-temperature-activated Zr alloy-based getters
Sparks et al. Reliable vacuum packaging using nanogetters and glass frit bonding
Bosseboeuf et al. Effect of Environment on Activation and Sorption of Getter Alloys and Multilayers for Hybrid Wafer-level Vacuum Packaging.
Suurmeijer et al. Vacuum science and technology
US11685645B2 (en) Micro-electromechanical system and method for producing same
Ramesham Evaluation of non-evaporable getters for high vacuum hermetic packages
Wu et al. Oblique angle deposition of Au/Ti porous getter films
A Chuntonov et al. Getter films for small vacuum chambers
Paquet et al. Influence of ceramic package internal components on the performance of vacuum sealed uncooled bolometric detectors
Cao et al. Long-life micro vacuum chamber for a micromachined cryogenic cooler
Moraja et al. Getters films at wafer level for wafer to wafer bonded MEMS
Anderson et al. 14 Advances in WLCSP Technologies for Growing Market Needs
Dragoi et al. Wafer bonding technology for new generation vacuum MEMS: challenges and promises
Corazza et al. Vacuum maintenance in hermetically sealed MEMS packages
Rizzi et al. Outgassing and gettering