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Anderson et al., 2010 - Google Patents

14 Advances in WLCSP Technologies for Growing Market Needs

Anderson et al., 2010

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Document ID
4359825531311791354
Author
Anderson R
Chilukuri R
Tee T
Koo C
Ng H
Hsieh R
Fuchs D
Flack W
Ranjan M
Robl W
Meyer T
Parton E
Bosman E
Rae A
Cowan D
Thompson T
Gilleo K
Publication year

External Links

Snippet

Over a century ago, the vacuum tube was the most advanced form of electronics technology. These electronic parts were sealed in glass tubes under vacuum so that the hot filaments could survive a reasonable amount of time. It was quickly found that by flash evaporating a …
Continue reading at www.researchgate.net (PDF) (other versions)

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICRO-STRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing micro-systems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

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