Cohn et al., 2002 - Google Patents
MEMS packaging on a budget (fiscal and thermal)Cohn et al., 2002
- Document ID
- 3253671995778900036
- Author
- Cohn M
- Roehnelt R
- Xu J
- Shteinberg A
- Cheung S
- Publication year
- Publication venue
- 9th International Conference on Electronics, Circuits and Systems
External Links
Snippet
MEMS packaging poses novel constraints as compared to conventional IC packaging, and accounts for up to 80% of the cost of the device. A new type of package is proposed, addressing the problems of hermeticity and die singulation, as well as an alternative means …
- 238000004806 packaging method and process 0 title abstract description 20
Classifications
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- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICRO-STRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing micro-systems
- B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
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