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Ma et al., 2022 - Google Patents

Multi-scale thermal modeling of RRAM-based 3D monolithic-integrated computing-in-memory chips

Ma et al., 2022

Document ID
17463989638802072325
Author
Ma A
Gao B
Liu Y
Yao P
Liu Z
Du Y
Li X
Xu F
Hao Z
Tang J
Qian H
Wu H
Publication year
Publication venue
2022 International Electron Devices Meeting (IEDM)

External Links

Snippet

Calculation of chip-scale temperature distribution with considering the device behaviors and integration structure is a challenging modeling task. In this paper, we demonstrated the first multi-scale thermal simulation for RRAM-based computing-in-memory chips. To achieve …
Continue reading at ieeexplore.ieee.org (other versions)

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRICAL DIGITAL DATA PROCESSING
    • G06F17/00Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/50Computer-aided design
    • G06F17/5009Computer-aided design using simulation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRICAL DIGITAL DATA PROCESSING
    • G06F2217/00Indexing scheme relating to computer aided design [CAD]
    • G06F2217/78Power analysis and optimization
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements

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