Ma et al., 2022 - Google Patents
Multi-scale thermal modeling of RRAM-based 3D monolithic-integrated computing-in-memory chipsMa et al., 2022
- Document ID
- 17463989638802072325
- Author
- Ma A
- Gao B
- Liu Y
- Yao P
- Liu Z
- Du Y
- Li X
- Xu F
- Hao Z
- Tang J
- Qian H
- Wu H
- Publication year
- Publication venue
- 2022 International Electron Devices Meeting (IEDM)
External Links
Snippet
Calculation of chip-scale temperature distribution with considering the device behaviors and integration structure is a challenging modeling task. In this paper, we demonstrated the first multi-scale thermal simulation for RRAM-based computing-in-memory chips. To achieve …
- 238000001816 cooling 0 abstract description 41
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING; COUNTING
- G06F—ELECTRICAL DIGITAL DATA PROCESSING
- G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
- G06F17/50—Computer-aided design
- G06F17/5009—Computer-aided design using simulation
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING; COUNTING
- G06F—ELECTRICAL DIGITAL DATA PROCESSING
- G06F2217/00—Indexing scheme relating to computer aided design [CAD]
- G06F2217/78—Power analysis and optimization
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
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