Chowdhury et al., 2018 - Google Patents
Effects of mechanical cycling on the microstructure of SAC305 lead free solderChowdhury et al., 2018
View PDF- Document ID
- 13555549485788451080
- Author
- Chowdhury M
- Hoque M
- Ahmed S
- Suhling J
- Lall P
- et al.
- Publication year
- Publication venue
- 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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Failures in solder joints are responsible for about 70% of failures in electronic systems. The most common failure mode is fatigue failure due to cyclic thermal loading (eg power switching) or cyclic mechanical loading (eg vibration). To better design electronic products …
- 230000001351 cycling 0 title abstract description 59
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