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Pai et al., 2005 - Google Patents

The viability of anisotropic conductive film as a flip chip interconnect technology for MEMS devices

Pai et al., 2005

Document ID
12211876499256433909
Author
Pai R
Walsh K
Publication year
Publication venue
Journal of Micromechanics and Microengineering

External Links

Snippet

The use of anisotropic conductive film (ACF) and stud bumping to form interconnects between die and substrates is one variation of current flip chip technologies with potential applications to MEMS devices. The key concerns associated with ACF are its long-term …
Continue reading at iopscience.iop.org (other versions)

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    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
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    • H01L2924/1461—MEMS
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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