Nothing Special   »   [go: up one dir, main page]

Jiang et al., 2020 - Google Patents

High performance heat sink with counter flow diverging microchannels

Jiang et al., 2020

Document ID
736285932932460000
Author
Jiang X
Zhang S
Li Y
Pan C
Publication year
Publication venue
International Journal of Heat and Mass Transfer

External Links

Snippet

Effective thermal management of high-power electronics is urgently demanded for the further development of electric vehicles. Two-phase flow boiling in microchannels is well recognized as a prominent approach for high density heat dissipation. This study develops a …
Continue reading at www.sciencedirect.com (other versions)

Classifications

    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING ENGINES OR PUMPS
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING ENGINES OR PUMPS
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING ENGINES OR PUMPS
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING ENGINES OR PUMPS
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device

Similar Documents

Publication Publication Date Title
Jiang et al. High performance heat sink with counter flow diverging microchannels
Yin et al. Visualization of flow patterns and bubble behavior during flow boiling in open microchannels
Mathew et al. Experimental study of flow boiling in a hybrid microchannel-microgap heat sink
Ma et al. Flow boiling instability and pressure drop characteristics based on micro-pin-finned surfaces in a microchannel heat sink
Alam et al. A comparative study of flow boiling heat transfer and pressure drop characteristics in microgap and microchannel heat sink and an evaluation of microgap heat sink for hotspot mitigation
Li et al. Experimental investigation of flow boiling performance in microchannels with and without triangular cavities–A comparative study
Pi et al. Pool boiling performance of 3D-printed reentrant microchannels structures
Zhao et al. Visualization study of flow boiling characteristics in open microchannels with different wettability
Yin et al. Heat transfer coefficient and pressure drop of water flow boiling in porous open microchannels heat sink
US11991862B2 (en) Heat sink with counter flow diverging microchannels
Chien et al. Experimental study on convective boiling flow and heat transfer in a microgap enhanced with a staggered arrangement of nucleated micro-pin-fins
Zhang et al. Vascularized liquid metal cooling for thermal management of kW high power laser diode array
Mao et al. A critical review on measures to suppress flow boiling instabilities in microchannels
Jiang et al. Design of micro-nano structures for counter flow diverging microchannel heat sink with extraordinarily high energy efficiency
Han et al. Flow boiling in microgaps for thermal management of high heat flux microsystems
Zhang et al. Enhanced flow boiling in an interconnected microchannel net at different inlet subcooling
Chang et al. Enhanced flow boiling of HFE-7100 in silicon microchannels with nanowires coated micro-pinfins
Qiu et al. Experimental study of flow boiling heat transfer and pressure drop in stepped oblique-finned microchannel heat sink
Jiang et al. Achieving ultra-high coefficient of performance of two-phase microchannel heat sink with uniform void fraction
Mathew et al. Comparative study of the flow boiling performance of the hybrid microchannel-microgap heat sink with conventional straight microchannel and microgap heat sinks
Krishnan et al. The effect of heating area orientation on flow boiling performance in microchannels heat sink under subcooled condition
Yuan et al. Pool boiling enhancement through a guidance structure mounted above heating surface
Tan et al. Enhancement of flow boiling in the microchannel with a bionic gradient wetting surface
Wang et al. Improved flow boiling performance and temperature uniformity in counter-flow interconnected microchannel heat sink
Wang et al. Experimental study on flow boiling characteristics of R-1233zd (E) of counter-flow interconnected minichannel heat sink