Nothing Special   »   [go: up one dir, main page]

Alam et al., 2013 - Google Patents

A comparative study of flow boiling heat transfer and pressure drop characteristics in microgap and microchannel heat sink and an evaluation of microgap heat sink for …

Alam et al., 2013

View PDF
Document ID
8127945037979631899
Author
Alam T
Lee P
Yap C
Jin L
Publication year
Publication venue
International Journal of Heat and Mass Transfer

External Links

Snippet

Two phase microgap heat sink has a large potential to minimize the drawbacks associated with two phase microchannel heat sink, especially flow instabilities, flow reversal and lateral variation of flow and wall temperature between channels. This new concept of the two-phase …
Continue reading at www.academia.edu (PDF) (other versions)

Classifications

    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING ENGINES OR PUMPS
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING ENGINES OR PUMPS
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING ENGINES OR PUMPS
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING ENGINES OR PUMPS
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING ENGINES OR PUMPS
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00

Similar Documents

Publication Publication Date Title
Alam et al. A comparative study of flow boiling heat transfer and pressure drop characteristics in microgap and microchannel heat sink and an evaluation of microgap heat sink for hotspot mitigation
Alam et al. Experimental investigation of local flow boiling heat transfer and pressure drop characteristics in microgap channel
Wan et al. Experimental study and optimization of pin fin shapes in flow boiling of micro pin fin heat sinks
Deng et al. Flow boiling performance in pin fin-interconnected reentrant microchannels heat sink in different operational conditions
Mathew et al. Experimental study of flow boiling in a hybrid microchannel-microgap heat sink
Harirchian et al. Microchannel size effects on local flow boiling heat transfer to a dielectric fluid
Alam et al. Effects of surface roughness on flow boiling in silicon microgap heat sinks
Harirchian et al. The critical role of channel cross-sectional area in microchannel flow boiling heat transfer
Law et al. Experimental investigation of flow boiling heat transfer in novel oblique-finned microchannels
Ma et al. Flow boiling instability and pressure drop characteristics based on micro-pin-finned surfaces in a microchannel heat sink
Hetsroni et al. Periodic boiling in parallel micro-channels at low vapor quality
Chien et al. Experimental and numerical study on convective boiling in a staggered array of micro pin-fin microgap
Chien et al. Experimental study on convective boiling flow and heat transfer in a microgap enhanced with a staggered arrangement of nucleated micro-pin-fins
Markal et al. Effect of gradually expanding flow passages on flow boiling of micro pin fin heat sinks
Sung et al. Single-phase and two-phase hybrid cooling schemes for high-heat-flux thermal management of defense electronics
Liao et al. Experimental study of boiling heat transfer in a microchannel with nucleated-shape columnar micro-pin-fins
Alam et al. Experimental investigation and flow visualization to determine the optimum dimension range of microgap heat sinks
Han et al. Flow boiling in microgaps for thermal management of high heat flux microsystems
Huang et al. Experimental investigation on flow boiling characteristics of a radial micro pin–fin heat sink for hotspot heat dissipation
McNeil et al. A comparison of flow boiling heat-transfer in in-line mini pin fin and plane channel flows
Hu et al. Experimental study of flow boiling of FC-72 in parallel minichannels under sub-atmospheric pressure
Li et al. Experimental and theoretical studies of critical heat flux of flow boiling in microchannels with microbubble-excited high-frequency two-phase oscillations
Ateş et al. On the effect of elliptical pin Fins, distribution pin Fins, and tip clearance on the performance of heat sinks in flow boiling
Krishnan et al. The effect of heating area orientation on flow boiling performance in microchannels heat sink under subcooled condition
Tamanna et al. Flow boiling heat transfer and pressure drop characteristics in expanding silicon microgap heat sink