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Ito et al., 2020 - Google Patents

A back illuminated 10μm spad pixel array comprising full trench isolation and cu-cu bonding with over 14% pde at 940nm

Ito et al., 2020

Document ID
7246072951971193668
Author
Ito K
Otake Y
Kitano Y
Matsumoto A
Yamamoto J
Ogasahara T
Hiyama H
Naito R
Takeuchi K
Tada T
Takabayashi K
Nakayama H
Tatani K
Hirano T
Wakano T
Publication year
Publication venue
2020 IEEE International Electron Devices Meeting (IEDM)

External Links

Snippet

A state of the art Back Illuminated (BI) Single Photon Avalanche Diode (SPAD) array sensor realized via a 90nm CMOS compatible process on a 300 mm silicon platform is reported in the following. The array consists of 10 μm pixels, each using a 7μm thick silicon active layer …
Continue reading at ieeexplore.ieee.org (other versions)

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