Nothing Special   »   [go: up one dir, main page]

Pak et al., 2014 - Google Patents

Electromigration study for multiscale power/ground vias in TSV-based 3-D ICs

Pak et al., 2014

View PDF
Document ID
5697358498394094049
Author
Pak J
Lim S
Pan D
Publication year
Publication venue
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

External Links

Snippet

Electromigration (EM) in power distribution networks (PDNs) is a major reliability issue in 3- D ICs. While the EM issues of local vias and through-silicon-vias (TSV) have been studied separately, the interplay of TSVs and conventional local vias in 3-D ICs has not been well …
Continue reading at gtcad.gatech.edu (PDF) (other versions)

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/50—Computer-aided design
    • G06F17/5009—Computer-aided design using simulation
    • G06F17/5036—Computer-aided design using simulation for analog modelling, e.g. for circuits, spice programme, direct methods, relaxation methods
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/50—Computer-aided design
    • G06F17/5068—Physical circuit design, e.g. layout for integrated circuits or printed circuit boards
    • G06F17/5081—Layout analysis, e.g. layout verification, design rule check
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/50—Computer-aided design
    • G06F17/5045—Circuit design
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/30—Information retrieval; Database structures therefor; File system structures therefor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F2217/00—Indexing scheme relating to computer aided design [CAD]
    • G06F2217/80—Thermal analysis and optimization
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer

Similar Documents

Publication Publication Date Title
Pak et al. Electromigration study for multiscale power/ground vias in TSV-based 3-D ICs
Im et al. Scaling analysis of multilevel interconnect temperatures for high-performance ICs
Huang et al. Physics-based electromigration assessment for power grid networks
Chen et al. Analytical modeling and characterization of electromigration effects for multibranch interconnect trees
Huang et al. Physics-based electromigration models and full-chip assessment for power grid networks
Sukharev Beyond Black’s equation: Full-chip EM/SM assessment in 3D IC stack
Lienig Electromigration and its impact on physical design in future technologies
Sun et al. EMSpice: Physics-based electromigration check using coupled electronic and stress simulation
Pathak et al. Electromigration modeling and full-chip reliability analysis for BEOL interconnect in TSV-based 3D ICs
Sai et al. Reliable 3-D clock-tree synthesis considering nonlinear capacitive TSV model with electrical–thermal–mechanical coupling
Sun et al. Fast electromigration immortality analysis for multisegment copper interconnect wires
Zhao et al. Transient modeling of TSV-wire electromigration and lifetime analysis of power distribution network for 3D ICs
Wang et al. Physics-based electromigration modeling and assessment for multi-segment interconnects in power grid networks
Abbasinasab et al. RAIN: a tool for reliability assessment of interconnect networks---physics to software
Li et al. T-VEMA: A temperature-and variation-aware electromigration power grid analysis tool
US20090164183A1 (en) Methodology for Thermal Modeling of On-Chip Interconnects Based on Electromagnetic Simulation Tools
Wang et al. Leveraging recovery effect to reduce electromigration degradation in power/ground TSV
He et al. Compact models of voltage drops in power delivery network for TSV-based three-dimensional integration
Todri-Sanial et al. Globally constrained locally optimized 3-D power delivery networks
Torosyan et al. Novel physics-based tool-prototype for electromigration assessment in commercial-grade power delivery networks
Sukharev et al. Experimental validation of a novel methodology for electromigration assessment in on-chip power grids
Zhong et al. Thermal-aware IR drop analysis in large power grid
He et al. Electromigration reliability of interconnections in RF low noise amplifier circuit
Sun et al. Saturation-volume estimation for multisegment copper interconnect wires
He et al. Circuit level interconnect reliability study using 3D circuit model