Nothing Special   »   [go: up one dir, main page]

Muhammad et al., 2020 - Google Patents

Numerical investigation of laminar flow and heat transfer in a liquid metal cooled mini-channel heat sink

Muhammad et al., 2020

Document ID
4120602559447350423
Author
Muhammad A
Selvakumar D
Wu J
Publication year
Publication venue
International Journal of Heat and Mass Transfer

External Links

Snippet

With the recent trend of miniaturization and high-power output, effective heat dissipation has become the top priority in several industrial applications. This work contributes to the novel and efficient cooling technique that utilizes the liquid metal as working fluid. A numerical …
Continue reading at www.sciencedirect.com (other versions)

Classifications

    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L35/00—Thermo-electric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermo-electric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L35/28—Thermo-electric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermo-electric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof operating with Peltier or Seebeck effect only

Similar Documents

Publication Publication Date Title
Muhammad et al. Numerical investigation of laminar flow and heat transfer in a liquid metal cooled mini-channel heat sink
Moradikazerouni et al. Comparison of the effect of five different entrance channel shapes of a micro-channel heat sink in forced convection with application to cooling a supercomputer circuit board
Khattak et al. Air cooled heat sink geometries subjected to forced flow: A critical review
Muhammad et al. Comparison of pressure drop and heat transfer performance for liquid metal cooled mini-channel with different coolants and heat sink materials
Zhang et al. Experimental investigation of galinstan based minichannel cooling for high heat flux and large heat power thermal management
Yang et al. Numerical study on flow and heat transfer of a hybrid microchannel cooling scheme using manifold arrangement and secondary channels
Nimmagadda et al. Conjugate heat transfer analysis of micro-channel using novel hybrid nanofluids (Al2O3+ Ag/Water)
Ahmed et al. Optimization of thermal design of heat sinks: A review
Wan et al. Experimental study and optimization of pin fin shapes in flow boiling of micro pin fin heat sinks
Yang et al. Flow and thermal modeling and optimization of micro/mini-channel heat sink
Hussien et al. Single-phase heat transfer enhancement in micro/minichannels using nanofluids: theory and applications
Abdollahi et al. Fluid flow and heat transfer of nanofluids in microchannel heat sink with V-type inlet/outlet arrangement
Sakanova et al. Optimization and comparison of double-layer and double-side micro-channel heat sinks with nanofluid for power electronics cooling
Deng et al. Heat transfer and pressure drop of a periodic expanded-constrained microchannels heat sink
Lee et al. Thermal modeling of extreme heat flux microchannel coolers for GaN-on-SiC semiconductor devices
Chein et al. Thermoelectric cooler application in electronic cooling
Noh et al. Numerical simulation of nanofluids for cooling efficiency in microchannel heat sink
Chen et al. Local heat transfer distribution and effect of instabilities during flow boiling in a silicon microchannel heat sink
Kumar et al. Numerical study on mitigation of flow maldistribution in parallel microchannel heat sink: channels variable width versus variable height approach
Deng et al. Two-stage multichannel liquid–metal cooling system for thermal management of high-heat-flux-density chip array
Xiang et al. A comparison between cooling performances of water-based and gallium-based micro-channel heat sinks with the same dimensions
Leng et al. Heat transfer enhancement of microchannel heat sink using transcritical carbon dioxide as the coolant
Vaferi et al. Numerical simulation of cooling performance in microchannel heat sinks made of AlN ceramics
Zheng et al. Development of a hierarchical microchannel heat sink with flow field reconstruction and low thermal resistance for high heat flux dissipation
Abo-Zahhad et al. Flow boiling in a four-compartment heat sink for high-heat flux cooling: A parametric study