Moradikazerouni et al., 2019 - Google Patents
Comparison of the effect of five different entrance channel shapes of a micro-channel heat sink in forced convection with application to cooling a supercomputer circuit …Moradikazerouni et al., 2019
View PDF- Document ID
- 10445427985060158350
- Author
- Moradikazerouni A
- Afrand M
- Alsarraf J
- Mahian O
- Wongwises S
- Tran M
- Publication year
- Publication venue
- Applied Thermal Engineering
External Links
Snippet
The use of an air-cooled micro-channel heat sink is becoming increasingly widespread to cool supercomputers. Passing air through micro-channels, which acts as an absorber, is the main heat transfer mechanism for cooling the main board of supercomputers. The present …
- 230000000694 effects 0 title abstract description 44
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING ENGINES OR PUMPS
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING ENGINES OR PUMPS
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING ENGINES OR PUMPS
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING ENGINES OR PUMPS
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular lements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Moradikazerouni et al. | Comparison of the effect of five different entrance channel shapes of a micro-channel heat sink in forced convection with application to cooling a supercomputer circuit board | |
Abdollahi et al. | Fluid flow and heat transfer of nanofluids in microchannel heat sink with V-type inlet/outlet arrangement | |
Arshad et al. | Graphene nanoplatelets nanofluids thermal and hydrodynamic performance on integral fin heat sink | |
Moradikazerouni et al. | Investigation of a computer CPU heat sink under laminar forced convection using a structural stability method | |
Shen et al. | Forced convection and heat transfer of water-cooled microchannel heat sinks with various structured metal foams | |
Alihosseini et al. | Thermo-hydraulic performance of wavy microchannel heat sink with oblique grooved finned | |
Li et al. | Numerical study on the heat transfer performance of non-Newtonian fluid flow in a manifold microchannel heat sink | |
Shen et al. | Computational optimization of counter-flow double-layered microchannel heat sinks subjected to thermal resistance and pumping power | |
Khan et al. | Investigation of heat transfer in wavy and dual wavy micro-channel heat sink using alumina nanoparticles | |
Siahchehrehghadikolaei et al. | A CFD modeling of CPU cooling by eco-friendly nanofluid and fin heat sink passive cooling techniques | |
Muhammad et al. | Comparison of pressure drop and heat transfer performance for liquid metal cooled mini-channel with different coolants and heat sink materials | |
Bakhti et al. | A comparison of mixed convective heat transfer performance of nanofluids cooled heat sink with circular perforated pin fin | |
Noh et al. | Numerical simulation of nanofluids for cooling efficiency in microchannel heat sink | |
Saadoon et al. | Numerical investigation of heat transfer enhancement using (Fe3O4 and Ag-H2O) nanofluids in (converge-diverge) mini-channel heat sinks | |
Rezania et al. | New configurations of micro plate-fin heat sink to reduce coolant pumping power | |
Luo et al. | Experimental investigation of liquid metal alloy based mini-channel heat exchanger for high power electronic devices | |
Khdair | Numerical simulation of heat transfer of two-phase flow in mini-channel heat sink and investigation the effect of pin-fin shape on flow maldistribution | |
Rajalingam et al. | Estimation of the thermohydraulic performance of a microchannel heat sink with gradual and sudden variation of the flow passage | |
Muhammad | A comparison of the heat transfer performance of a hexagonal pin fin with other types of pin fin heat sinks | |
Alqarni et al. | Numerical simulation and exergy analysis of a novel nanofluid-cooled heat sink | |
Qu et al. | Multi-objective optimisation of thermal and hydraulic performance with various concentrations of hybrid Fe3O4/graphene nanofluids in a microchannel heat sink | |
Mukherjee et al. | Theoretical modeling and optimization of microchannel heat sink cooling with TiO2-water and ZnO-water nanofluids | |
Liu et al. | Cooling Behavior in a Novel Heat Sink Based on Muitilayer Staggered Honeycomb Structure | |
Soundrapaman et al. | Numerical Investigation of Heat Transfer Enhancement of Al2O3 Nanofluid in Microchannel Heat Sink | |
Rostami et al. | Optimization of different pin-fins on heat transfer and pressure drop of a heat sink for antifreeze liquid case |