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Session details: Paper Demonstrations

Published: 15 January 2015 Publication History

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cover image ACM Conferences
TEI '15: Proceedings of the Ninth International Conference on Tangible, Embedded, and Embodied Interaction
January 2015
766 pages
ISBN:9781450333054
DOI:10.1145/2677199
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Association for Computing Machinery

New York, NY, United States

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Published: 15 January 2015

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TEI '15
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Acceptance Rates

TEI '15 Paper Acceptance Rate 63 of 222 submissions, 28%;
Overall Acceptance Rate 345 of 1,231 submissions, 28%

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TEI '25

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