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A fast block structure preserving model order reduction for inverse inductance circuits

Published: 05 November 2006 Publication History

Abstract

Most existing RCL-1 circuit reductions stamp inverse inductance L-1 elements by a second-order nodal analysis (NA). The NA formulation uses nodal voltage variables and describes inductance by nodal susceptance. This leads to a singular matrix stamping in general. We introduce a new circuit stamping for RCL-1 circuits using branch vector potentials. The new circuit stamping results in a first-order circuit matrix that is semi-positive definite and non-singular. We call this as vectorpotential based nodal analysis (VNA). It enables an accurate and passive reduction. In addition, to preserve the structure of state matrices such as sparsity and hierarchy, we represent the flat VNA matrix in a bordered-block diagonal (BBD) form. This enables us to build and simulate the macromodel efficiently. In experiments performed on several test cases, our method achieves up to 15X faster modeling building time, up to 33X faster simulation time, and as much as 67X smaller waveform error compared to SAPOR, the best existing second order RCL-1 reduction method.

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Cited By

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  • (2011)PartMORIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2010.209075130:3(374-387)Online publication date: 1-Mar-2011
  • (2011)Improving Model-Order Reduction Methods by Singularity ExclusionScientific Computing in Electrical Engineering SCEE 201010.1007/978-3-642-22453-9_41(387-394)Online publication date: 24-Oct-2011
  • (2008)Second-Order Balanced Truncation for Passive-Order Reduction of RLCK CircuitsIEEE Transactions on Circuits and Systems II: Express Briefs10.1109/TCSII.2008.92565555:9(942-946)Online publication date: Sep-2008
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  1. A fast block structure preserving model order reduction for inverse inductance circuits

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    cover image ACM Conferences
    ICCAD '06: Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design
    November 2006
    147 pages
    ISBN:1595933891
    DOI:10.1145/1233501
    Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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    Published: 05 November 2006

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    Author Tags

    1. inductance and interconnect modeling
    2. model order reduction

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    View all
    • (2011)PartMORIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2010.209075130:3(374-387)Online publication date: 1-Mar-2011
    • (2011)Improving Model-Order Reduction Methods by Singularity ExclusionScientific Computing in Electrical Engineering SCEE 201010.1007/978-3-642-22453-9_41(387-394)Online publication date: 24-Oct-2011
    • (2008)Second-Order Balanced Truncation for Passive-Order Reduction of RLCK CircuitsIEEE Transactions on Circuits and Systems II: Express Briefs10.1109/TCSII.2008.92565555:9(942-946)Online publication date: Sep-2008
    • (2008)Clock Skew Analysis via Vector Fitting in Frequency Domain9th International Symposium on Quality Electronic Design (isqed 2008)10.1109/ISQED.2008.4479780(476-479)Online publication date: Mar-2008
    • (2007)Off-chip decoupling capacitor allocation for chip package co-designProceedings of the 44th annual Design Automation Conference10.1145/1278480.1278635(618-621)Online publication date: 4-Jun-2007

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