research-article

On-line thermal aware dynamic voltage scaling for energy optimization with frequency/temperature dependency consideration

Authors:

Alexandru Andrei,

Zebo PengAuthors Info & Claims

DAC '09: Proceedings of the 46th Annual Design Automation Conference

Pages 490 - 495

https://doi.org/10.1145/1629911.1630039

Published: 26 July 2009 Publication History

Abstract

With new technologies, temperature has become a major issue to be considered at system level design. Without taking temperature aspects into consideration, no approach to energy or/and performance optimization will be sufficiently accurate and efficient. In this paper we propose an on-line temperature aware dynamic voltage and frequency scaling (DVFS) technique which is able to exploit both static and dynamic slack. The approach implies an offline temperature aware optimization step and on-line voltage/frequency settings based on temperature sensor readings. Most importantly, the presented approach is aware of the frequency/temperature dependency, by which important additional energy savings are obtained.

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Cited By

Pandey SSiddhu LPanda P(2023)NeuroCool: Dynamic Thermal Management of 3D DRAM for Deep Neural Networks through Customized PrefetchingACM Transactions on Design Automation of Electronic Systems10.1145/363001229:1(1-35)Online publication date: 18-Dec-2023
https://dl.acm.org/doi/10.1145/3630012
Siddhu LBagchi AKedia RAhmad IPandey SPanda P(2023)Dynamic Thermal Management of 3D Memory through Rotating Low Power States and Partial Channel ClosureACM Transactions on Embedded Computing Systems10.1145/362458122:6(1-27)Online publication date: 9-Nov-2023
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Yao Y(2023)Game-of-Life Temperature-Aware DVFS Strategy for Tile-Based Chip Many-Core ProcessorsIEEE Journal on Emerging and Selected Topics in Circuits and Systems10.1109/JETCAS.2023.324476313:1(58-72)Online publication date: Mar-2023
https://doi.org/10.1109/JETCAS.2023.3244763
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Index Terms

On-line thermal aware dynamic voltage scaling for energy optimization with frequency/temperature dependency consideration

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cover image ACM Conferences

DAC '09: Proceedings of the 46th Annual Design Automation Conference

July 2009

994 pages

ISBN:9781605584973

DOI:10.1145/1629911

Copyright © 2009 ACM.

Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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EDAC: Electronic Design Automation Consortium
SIGDA: ACM Special Interest Group on Design Automation
IEEE-CAS: Circuits & Systems

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Association for Computing Machinery

New York, NY, United States

Publication History

Published: 26 July 2009

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DAC '09: The 46th Annual Design Automation Conference 2009

July 26 - 31, 2009

California, San Francisco

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Overall Acceptance Rate 1,770 of 5,499 submissions, 32%

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Cited By

Pandey SSiddhu LPanda P(2023)NeuroCool: Dynamic Thermal Management of 3D DRAM for Deep Neural Networks through Customized PrefetchingACM Transactions on Design Automation of Electronic Systems10.1145/363001229:1(1-35)Online publication date: 18-Dec-2023
https://dl.acm.org/doi/10.1145/3630012
Siddhu LBagchi AKedia RAhmad IPandey SPanda P(2023)Dynamic Thermal Management of 3D Memory through Rotating Low Power States and Partial Channel ClosureACM Transactions on Embedded Computing Systems10.1145/362458122:6(1-27)Online publication date: 9-Nov-2023
https://dl.acm.org/doi/10.1145/3624581
Yao Y(2023)Game-of-Life Temperature-Aware DVFS Strategy for Tile-Based Chip Many-Core ProcessorsIEEE Journal on Emerging and Selected Topics in Circuits and Systems10.1109/JETCAS.2023.324476313:1(58-72)Online publication date: Mar-2023
https://doi.org/10.1109/JETCAS.2023.3244763
Ranjbar BEjlali AKumar ARanjbar BEjlali AKumar A(2023)Preliminaries and Related WorkQuality-of-Service Aware Design and Management of Embedded Mixed-Criticality Systems10.1007/978-3-031-38960-3_2(17-36)Online publication date: 24-Jul-2023
https://doi.org/10.1007/978-3-031-38960-3_2
Siddhu LKedia RPandey SRapp MPathania AHenkel JPanda P(2022)CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5D, and 3D Processor-Memory SystemsACM Transactions on Architecture and Code Optimization10.1145/353218519:3(1-25)Online publication date: 22-Aug-2022
https://dl.acm.org/doi/10.1145/3532185
Yuan ZShukla PChetoui SNemtzow SReda SCoskun A(2022)PACT: An Extensible Parallel Thermal Simulator for Emerging Integration and Cooling TechnologiesIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2021.307916641:4(1048-1061)Online publication date: Apr-2022
https://doi.org/10.1109/TCAD.2021.3079166
Ranjbar BNguyen TEjlali AKumar A(2021)Power-Aware Runtime Scheduler for Mixed-Criticality Systems on Multicore PlatformIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2020.303337440:10(2009-2023)Online publication date: Oct-2021
https://doi.org/10.1109/TCAD.2020.3033374
Medeiros TPereira LRossi FLuizelli MBeck ALorenzon A(2021)Mitigating the processor aging through dynamic concurrency throttlingJournal of Parallel and Distributed Computing10.1016/j.jpdc.2021.05.006156(86-100)Online publication date: Oct-2021
https://doi.org/10.1016/j.jpdc.2021.05.006
Geier MBrandle MFaller DChakraborty S(2020)Debugging FPGA-accelerated Real-time Systems2020 IEEE Real-Time and Embedded Technology and Applications Symposium (RTAS)10.1109/RTAS48715.2020.00010(350-363)Online publication date: Apr-2020
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Medeiros TPereira LRossi FLuizelli MBeck ALorenzon A(2019)Transparent Aging-Aware Thread Throttling2019 31st International Symposium on Computer Architecture and High Performance Computing (SBAC-PAD)10.1109/SBAC-PAD.2019.00014(1-8)Online publication date: Oct-2019
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