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Temperature Variation Characterization and Thermal Management of Multicore Architectures

Published: 01 January 2009 Publication History

Abstract

Increased variability affects the efficiency of dynamic power and thermal management. Existing on-chip sensor infrastructure can be used to improve the inherent thermal imbalances among cores in a multicore architecture. Experimental analysis based on live measurements on a special test chip shows reduced on-chip heating with no performance loss.

Cited By

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  • (2018)Detecting Data Center Cooling Problems Using a Data-driven ApproachProceedings of the 9th Asia-Pacific Workshop on Systems10.1145/3265723.3265730(1-8)Online publication date: 27-Aug-2018
  • (2018)Potential effects on server power metering and modelingWireless Networks10.1007/s11276-018-1882-129:3(1077-1084)Online publication date: 29-Nov-2018
  • (2017)A Variation-Aware Adaptive Fuzzy Control System for Thermal Management of MicroprocessorsIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2016.259633825:2(683-695)Online publication date: 1-Feb-2017
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Information & Contributors

Information

Published In

cover image IEEE Micro
IEEE Micro  Volume 29, Issue 1
January 2009
145 pages

Publisher

IEEE Computer Society Press

Washington, DC, United States

Publication History

Published: 01 January 2009

Author Tags

  1. activity migration
  2. dynamic temperature management
  3. multicore architectures
  4. temperature-aware scheduling
  5. thermal imaging
  6. thermal variation

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Cited By

View all
  • (2018)Detecting Data Center Cooling Problems Using a Data-driven ApproachProceedings of the 9th Asia-Pacific Workshop on Systems10.1145/3265723.3265730(1-8)Online publication date: 27-Aug-2018
  • (2018)Potential effects on server power metering and modelingWireless Networks10.1007/s11276-018-1882-129:3(1077-1084)Online publication date: 29-Nov-2018
  • (2017)A Variation-Aware Adaptive Fuzzy Control System for Thermal Management of MicroprocessorsIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2016.259633825:2(683-695)Online publication date: 1-Feb-2017
  • (2017)Theorem proving based Formal Verification of Distributed Dynamic Thermal Management schemesJournal of Parallel and Distributed Computing10.1016/j.jpdc.2016.06.011100:C(157-171)Online publication date: 1-Feb-2017
  • (2016)Variability-aware 7T SRAM circuit with low leakage high data stability SLEEP modeIntegration, the VLSI Journal10.1016/j.vlsi.2015.12.00353:C(68-79)Online publication date: 1-Mar-2016
  • (2016)Low power and robust memory circuits with asymmetrical ground gatingMicroelectronics Journal10.1016/j.mejo.2015.11.00948:C(109-119)Online publication date: 1-Feb-2016
  • (2015)Near-Optimal Thermal Monitoring Framework for Many-Core Systems-on-ChipIEEE Transactions on Computers10.1109/TC.2015.239542364:11(3197-3209)Online publication date: 1-Nov-2015
  • (2014)Statistical Peak Temperature Prediction and Thermal Yield Improvement for 3D Chip MultiprocessorsACM Transactions on Design Automation of Electronic Systems10.1145/263360619:4(1-23)Online publication date: 29-Aug-2014
  • (2014)Seven recipes for setting your FPGA on fire - A cookbook on heat generatorsMicroprocessors & Microsystems10.1016/j.micpro.2013.12.00138:8(911-919)Online publication date: 1-Nov-2014
  • (2013)Cooperative boostingACM SIGARCH Computer Architecture News10.1145/2508148.248594741:3(285-296)Online publication date: 23-Jun-2013
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