Cited By
View all- Huang L(2022)Application Research of Manuscript Writing Robot Based upon Laser Sensor in News Dissemination FieldWireless Communications & Mobile Computing10.1155/2022/43725272022Online publication date: 17-Feb-2022
Direct laser writing to fabricate capacitively transduced resonating sensor
Authors: 
Vinayak Pachkawade, Delphine Cerica, Samuel Dricot, Serguei Stoukatch, Michael KraftAuthors Info & Claims
Pages 547 - 562
Abstract
This article reports on laser technology based fabrication approach to develop a micro-size capacitive gap based transducer useful for a variety of applications. A low-cost prototype has been fabricated via a rapid and advanced laser micro-milling technique to achieve a parallel kerf-width (capacitive gaps) of about 60 µm into a piece of aluminum and a stainless steel each of 1 and 2 mm thickness, respectively, thus leading to a high-aspect ratio (> 33) structure. A device is demonstrated to facilitate actuation via electrostatic means and sense a capacitive change across its electrode. Experiments have been performed with a structure made of aluminum. Results comprising analytical modeling, fabrication, and electrical characterization are presented. An applicability of a device as a two degree-of-freedom resonating mode-localization sensor that employs a weak electrostatic coupling is demonstrated to offer vibration amplitude based sensitivity to a relative change in the stiffness. This sensor is able to resolve a minimum stiffness perturbation (normalized), of the order of 7.98 × 10−4.
References
[1]
Adelmann B, Ngo C, and Hellmann R High aspect ratio cutting of metals using water jet guided laser Int J Adv Manuf Technol 2015
[2]
Al-Sulaiman FA, Yilbas BS, and Ahsan M CO2 laser cutting of a carbon/carbon multi-lamelled plain-weave structure J Mater Process Technol 2006
[3]
Aslam M (2013) Bulk etching of silicon wafer and development of a polyimide membrane. In: Journal of physics: conference series, vol 439. Institute of Physics Publishing. 10.1088/1742-6596/439/1/012029
[4]
Battaglia J, Perrottet D, Housh R, Richerzhagen B (2018) Synova has re-invented the laser: no heat damage, no beam divergence, no cutting gas, no deposition. Laser Institute of America, p M905. 10.2351/1.5060916
[5]
Baumeister M, Dickmann K, and Hoult T Fiber laser micro-cutting of stainless steel sheets Appl Phys A Mater Sci Process 2006
[6]
Bessonov A, Kirikova M, Haque S, et al. Highly reproducible printable graphite strain gauges for flexible devices Sens Actuators A Phys 2014
[7]
Booth HJ, Abbott CE, Allott RM, Boehlen KL, Fieret J, Greuters J, Trimble P, Pedder J (2005) Laser micromachining techniques for industrial MEMS applications. In: Photon processing in microelectronics and photonics IV, vol 5713. SPIE, p 190. 10.1117/12.599414
[8]
Chen KS, Ou KS (2015) MEMS residual stress characterization: methodology and perspective. In: Handbook of silicon based MEMS materials and technologies, 2nd edn. Elsevier Inc., pp 398–412. 10.1016/B978-0-323-29965-7.00017-8
[9]
Chen X, Wang Y, Wang Z, Liu H, Chi G (2018) Study on micro reciprocated wire-EDM for complex indexing structure. In: Procedia CIRP, vol 68. Elsevier B.V., pp 120–125. 10.1016/j.procir.2017.12.033
[10]
Di S, Chu X, Wei D, et al. Analysis of kerf width in micro-WEDM Int J Mach Tools Manuf 2009
[11]
Dupont F, Stoukatch S, Laurent P, et al. 355 nm UV laser patterning and post-processing of FR4 PCB for fine pitch components integration Opt Lasers Eng 2018
[12]
Fedder GK (2015) Capacitive resonators. In: Resonant MEMS: principles, modeling, implementation, and applications, pp 119–146. 10.1002/9783527676330.ch6
[13]
Fedosejevs R, Argument M, Sardarli A, et al. Laser micromachining for microfluidic, microelectronic and MEMS applications Proc Int Conf MEMS NANO Smart Syst 2003
[14]
Gao S and Huang HRecent advances in micro- and nano-machining technologiesFront Mech Eng201712118-32816877
[15]
Gaspar C, Olkkonen J, Passoja S, and Smolander M Paper as active layer in inkjet-printed capacitive humidity sensors Sensors (Switzerland) 2017
[16]
Ghany KA and Newishy M Cutting of 1.2 mm thick austenitic stainless steel sheet using pulsed and CW Nd:YAG laser J Mater Process Technol 2005
[17]
Gower MC Industrial applications of laser micromachining Opt Express 2000
[18]
Harrey PM, Ramsey BJ, Evans PSA, and Harrison DJ Capacitive-type humidity sensors fabricated using the offset lithographic printing process Sens Actuators B Chem 2002
[19]
Herzog D, Jaeschke P, Meier O, and Haferkamp H Investigations on the thermal effect caused by laser cutting with respect to static strength of CFRP Int J Mach Tools Manuf 2008
[20]
Hsu W-T (2008) Recent progress in silicon MEMS oscillators. In: Proceedings of the 40th annual precise time and time interval systems and applications meeting, Reston, Virginia, December 2008, pp 135–146
[21]
Huff M MEMS fabrication Sens Rev 2002
[22]
Karatas C, Keles O, Uslan I, and Usta Y Laser cutting of steel sheets: influence of workpiece thickness and beam waist position on kerf size and stria formation J Mater Process Technol 2006
[23]
Knowles MRH, Rutterford G, Karnakis D, and Ferguson A Micro-machining of metals, ceramics and polymers using nanosecond lasers Int J Adv Manuf Technol 2007
[24]
LaFratta CN, Simoska O, Pelse I, et al. A convenient direct laser writing system for the creation of microfluidic masters Microfluid Nanofluidics 2015
[25]
Lau GK and Shrestha M Ink-jet printing of micro-electro-mechanical systems (MEMS) Micromachines 2017
[26]
Lee S, Park S, and Il Cho D Surface/bulk micromachining (SBM) process: a new method for fabricating released MEMS in single crystal silicon J Microelectromechanical Syst 1999
[27]
Li T, Zhou C, Liu Z, and Wang W Computational and experimental study of nanosecond laser ablation of crystalline silicon Int Commun Heat Mass Transf 2011
[28]
Liao Y, Song J, Li E, et al. Rapid prototyping of three-dimensional microfluidic mixers in glass by femtosecond laser direct writing Lab Chip 2012
[29]
Maeda R, Takahashi M, Sasaki S (2007) Commercialization of MEMS and nano manufacturing. In: Proceedings of the 6th international IEEE conference on polymers and adhesives in microelectronics and photonics, polytronic, pp 20–23. 10.1109/POLYTR.2007.4339130
[30]
Mai TA, Richerzhagen B, Stay K (2018) Recent advances in precision machining of various materials with the laser microjet®. Laser Institute of America, p M704. 10.2351/1.5061151
[31]
Meijer J Laser beam machining (LBM), state of the art and new opportunities J Mater Process Technol 2004 149 2-17
[32]
Molina-Lopez F, Briand D, and De Rooij NF All additive inkjet printed humidity sensors on plastic substrate Sens Actuators B Chem 2012
[33]
Montaseri MH, Xie J, Chang H, Chao Z, Wood G, Kraft M (2015) Atmospheric pressure mode localization coupled resonators force sensor. In: 2015 transducers—2015 18th international conference on solid-state sensors, actuators and microsystems, TRANSDUCERS 2015. Institute of Electrical and Electronics Engineers Inc., pp 1183–1186. 10.1109/TRANSDUCERS.2015.7181140
[34]
Müller F and Monaghan J Non-conventional machining of particle reinforced metal matrix composite Int J Mach Tools Manuf 2000
[35]
Okamoto Y, Ikeda T, Kurihara H, Okada A, Kido M (2018) Control of kerf width in multi-wire EDM slicing of semiconductors with circular section. In: Procedia CIRP, vol 68. Elsevier B.V., pp 100–103. 10.1016/j.procir.2017.12.030
[36]
Pahuja R, Ramulu M, Hashish M (2017) Abrasive waterjet profile cutting of thick titanium/graphite fiber metal laminate. In: ASME International, p V002T02A013. 10.1115/imece2016-67136
[37]
Park ES, Chen Y, Liu TJK, and Subramanian V A new switching device for printed electronics: inkjet-printed microelectromechanical relay Nano Lett 2013
[38]
Rahman MT, Rahimi A, Gupta S, and Panat R Microscale additive manufacturing and modeling of interdigitated capacitive touch sensors Sens Actuators A Phys 2016
[39]
Saari M, Cox B, Richer E, et al. Fiber encapsulation additive manufacturing: an enabling technology for 3D printing of electromechanical devices and robotic components 3D Print Addit Manuf 2015
[40]
Sekitani T, Takamiya M, Noguchi Y, Nakano S, Kato Y, Hizu K, Kawaguchi H, Sakurai T, Someya T (2006) A large-area flexible wireless power transmission sheet using printed plastic MEMS switches and organic field-effect transistors. In: Technical digest—International electron devices meeting, IEDM. 10.1109/IEDM.2006.346764
[41]
Senturia SD (2001) Lumped modeling with circuit elements. In: Microsystem design, pp 103–124. 10.1007/b117574
[42]
Skylar-Scott MA, Gunasekaran S, and Lewis JA Laser-assisted direct ink writing of planar and 3D metal architectures Proc Natl Acad Sci 2016
[43]
Spletzer M, Raman A, Wu AQ, et al. Ultrasensitive mass sensing using mode localization in coupled microcantilevers Appl Phys Lett 2006
[44]
Stoukatch S, Dupont F, Seronveaux L, Vandormael D, Kraft M (2018) Additive low temperature 3D printed electronic as enabling technology for IoT application. In: 2017 IEEE 19th electronics packaging technology conference, EPTC 2017, vol 2018. Institute of Electrical and Electronics Engineers Inc., pp 1–6. 10.1109/EPTC.2017.8277554
[45]
Thiruvenkatanathan P, Yan J, Seshia AA (2009a) Common mode rejection in electrically coupled MEMS resonators utilizing mode localization for sensor applications. In: 2009 IEEE international frequency control symposium joint with the 22nd European frequency and time forum, pp 358–363. 10.1109/FREQ.2009.5168201
[46]
Thiruvenkatanathan P, Yan J, Woodhouse J, and Seshia AA Enhancing parametric sensitivity in electrically coupled MEMS resonators J Microelectromechanical Syst 2009
[47]
Tsutsumi N, Hirota J, Kinashi K, and Sakai W Direct laser writing for micro-optical devices using a negative photoresist Opt Express 2017
[48]
Vaithilingam J, Saleh E, Körner L, et al. 3-Dimensional inkjet printing of macro structures from silver nanoparticles Mater Des 2018
[49]
Vescio G, López-Vidrier J, Leghrib R, et al. Flexible inkjet printed high-k HfO2-based MIM capacitors J Mater Chem C 2016
[50]
Wang Y, Zhao C, Wang C, Cerica D, Baijot M, Pachkawade V, Ghorbani A, Boutier M, Vanderplasschen A, Kraft M (2017) A reversible method to characterize the mass sensitivity of a 3-Dof mode localized coupled resonator under atmospheric pressure, proceedings. 10.3390/proceedings1040493
[51]
Wang Y, Zhao C, Wang C, et al. A mass sensor based on 3-DOF mode localized coupled resonator under atmospheric pressure Sens Actuators A Phys 2018
[52]
Wei J, Ye Y, Sun Z, et al. Control of the kerf size and microstructure in Inconel 738 superalloy by femtosecond laser beam cutting Appl Surf Sci 2016
[53]
Yokota T, Nakano S, Sekitani T, and Someya T Plastic complementary microelectromechanical switches Appl Phys Lett 2008
[54]
Zhang H, Huang J, Yuan W, and Chang H A high-sensitivity micromechanical electrometer based on mode localization of two degree-of-freedom weakly coupled resonators J Microelectromechanical Syst 2016
[55]
Zhao C, Wood GS, Xie J, et al. A three degree-of-freedom weakly coupled resonator sensor with enhanced stiffness sensitivity J Microelectromechanical Syst 2016
Index terms have been assigned to the content through auto-classification.
Recommendations
Comments
Please enable JavaScript to view thecomments powered by Disqus.Information & Contributors
Information
Published In
© Springer-Verlag GmbH Germany, part of Springer Nature 2019.
Publisher
Springer-Verlag
Berlin, Heidelberg
Publication History
Published: 01 February 2020
Accepted: 15 July 2019
Received: 04 May 2019
Qualifiers
- Research-article
Funding Sources
Contributors
Other Metrics
Bibliometrics & Citations
Bibliometrics
Article Metrics
- View Citations1Total Citations
- 0Total Downloads
- Downloads (Last 12 months)0
- Downloads (Last 6 weeks)0
Reflects downloads up to 05 Mar 2025
Other Metrics
Citations
Cited By
View all- Huang L(2022)Application Research of Manuscript Writing Robot Based upon Laser Sensor in News Dissemination FieldWireless Communications & Mobile Computing10.1155/2022/43725272022Online publication date: 17-Feb-2022