Session details: System-level power and thermal estimation

To effectively design a computer system for the worst case power consumption scenario, system architects often use hand-crafted maximum power consuming benchmarks at the assembly language level. These stressmarks, also called power viruses, are very ...

Chip manufacturers provide the Thermal Design Power (TDP) for a specific chip. The cooling solution is designed to dissipate this power level. But because TDP is not necessarily the maximum power that can be applied, chips are operated with Dynamic ...