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"Testing of TSV-Induced Small Delay Faults for 3-D Integrated Circuits."

Chun-Yi Kuo et al. (2014)

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DOI: 10.1109/TVLSI.2013.2250320

access: closed

type: Journal Article

metadata version: 2022-01-03

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  - https://dblp.org/rec/journals/tvlsi/KuoSLLC14
Chun-Yi Kuo, Chi-Jih Shih, Yi-Chang Lu, James Chien-Mo Li, Krishnendu Chakrabarty:
Testing of TSV-Induced Small Delay Faults for 3-D Integrated Circuits. IEEE Trans. Very Large Scale Integr. Syst. 22(3): 667-674 (2014)

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