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"Characterization of elasto-plastic behavior of actual SAC solder joints ..."

Tung T. Nguyen, Seungbae Park (2011)

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DOI: 10.1016/J.MICROREL.2011.03.019

access: closed

type: Journal Article

metadata version: 2020-02-22

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Tung T. Nguyen, Seungbae Park:
Characterization of elasto-plastic behavior of actual SAC solder joints for drop test modeling. Microelectron. Reliab. 51(8): 1385-1392 (2011)

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