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Seungbae Park
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2020 – today
- 2020
- [i2]Irandokht Parviziomran, Shun Cao, Haeyong Yang, Seungbae Park, Daehan Won:
Optimization of Passive Chip Components Placement with Self-Alignment Effect for Advanced Surface Mounting Technology. CoRR abs/2001.09612 (2020) - [i1]Shun Cao, Irandokht Parviziomran, Haeyong Yang, Seungbae Park, Daehan Won:
Prediction of Component Shifts in Pick and Place Process of Surface Mount Technology Using Support Vector Regression. CoRR abs/2002.01527 (2020)
2010 – 2019
- 2018
- [j11]Yuling Niu
, Jing Wang, Shuai Shao
A comprehensive solution for electronic packages' reliability assessment with digital image correlation (DIC) method. Microelectron. Reliab. 87: 81-88 (2018) - 2017
- [j10]Jing Wang, Ruiyang Liu, Dapeng Liu, Seungbae Park:
Advancement in simulating moisture diffusion in electronic packages under dynamic thermal loading conditions. Microelectron. Reliab. 73: 42-53 (2017) - [j9]Shuai Shao
A Study on the Thermomechanical Reliability Risks of Through-Silicon-Vias in Sensor Applications. Sensors 17(2): 322 (2017) - 2016
- [j8]Yeonsung Kim
Prediction of deformation during manufacturing processes of silicon interposer package with TSVs. Microelectron. Reliab. 65: 234-242 (2016) - [j7]Ah-Young Park, Satish C. Chaparala, Seungbae Park:
Risk assessment of the crack propagation and delamination of the Cu-to-Cu direct bonded (CuDB) interface. Microelectron. Reliab. 66: 113-121 (2016) - 2011
- [j6]Da Yu, Abdullah Al-Yafawi, Tung T. Nguyen, Seungbae Park, Soonwan Chung:
High-cycle fatigue life prediction for Pb-free BGA under random vibration loading. Microelectron. Reliab. 51(3): 649-656 (2011) - [j5]Tung T. Nguyen, Seungbae Park:
Characterization of elasto-plastic behavior of actual SAC solder joints for drop test modeling. Microelectron. Reliab. 51(8): 1385-1392 (2011) - 2010
- [j4]Tung T. Nguyen, Donggun Lee, Jae B. Kwak, Seungbae Park:
Effect of glue on reliability of flip chip BGA packages under thermal cycling. Microelectron. Reliab. 50(7): 1000-1006 (2010) - [j3]Da Yu, Jae B. Kwak, Seungbae Park, John Lee:
Dynamic responses of PCB under product-level free drop impact. Microelectron. Reliab. 50(7): 1028-1038 (2010)
2000 – 2009
- 2008
- [j2]Changsoo Jang, Seungbae Park, Bill Infantolino, Lawrence Lehman, Ryan Morgan, Dipak Sengupta:
Failure analysis of contact probe pins for SnPb and Sn applications. Microelectron. Reliab. 48(6): 942-947 (2008) - 2006
- [j1]Sangjun Lee, Seungbae Park:
Improving Accessibility and Security for Mobile Phone Shopping. J. Comput. Inf. Syst. 46(3): 124-133 (2006)
Coauthor Index
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