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"Thermal-mechanical reliability analysis of connection structure between ..."

Wei Meng et al. (2016)

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DOI: 10.1109/NEMS.2016.7758273

access: closed

type: Conference or Workshop Paper

metadata version: 2021-08-05

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  - conf/nems/MengZGCJ16
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Wei Meng, Qinghua Zeng, Yong Guan, Jing Chen, Yufeng Jin:
Thermal-mechanical reliability analysis of connection structure between redistribution layer and TSV for MEMS packaging. NEMS 2016: 384-387

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